CN118525360A - 耐热性粘合膜 - Google Patents

耐热性粘合膜 Download PDF

Info

Publication number
CN118525360A
CN118525360A CN202380016552.9A CN202380016552A CN118525360A CN 118525360 A CN118525360 A CN 118525360A CN 202380016552 A CN202380016552 A CN 202380016552A CN 118525360 A CN118525360 A CN 118525360A
Authority
CN
China
Prior art keywords
heat
adhesive film
resistant adhesive
lead frame
alkenyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380016552.9A
Other languages
English (en)
Chinese (zh)
Inventor
清水隆史
黑崎海志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujicopian Co Ltd
Original Assignee
Fujicopian Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujicopian Co Ltd filed Critical Fujicopian Co Ltd
Publication of CN118525360A publication Critical patent/CN118525360A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
CN202380016552.9A 2022-04-18 2023-04-10 耐热性粘合膜 Pending CN118525360A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-068374 2022-04-18
JP2022068374 2022-04-18
PCT/JP2023/014629 WO2023204091A1 (ja) 2022-04-18 2023-04-10 耐熱性粘着フィルム

Publications (1)

Publication Number Publication Date
CN118525360A true CN118525360A (zh) 2024-08-20

Family

ID=88419906

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380016552.9A Pending CN118525360A (zh) 2022-04-18 2023-04-10 耐热性粘合膜

Country Status (5)

Country Link
JP (1) JPWO2023204091A1 (https=)
KR (1) KR20250005962A (https=)
CN (1) CN118525360A (https=)
TW (1) TW202405125A (https=)
WO (1) WO2023204091A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024117021A1 (https=) * 2022-11-29 2024-06-06

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4619486B2 (ja) * 2000-06-01 2011-01-26 日東電工株式会社 リードフレーム積層物および半導体部品の製造方法
JP4357754B2 (ja) 2000-10-02 2009-11-04 日東電工株式会社 半導体装置の製造方法
JP4002736B2 (ja) * 2001-03-21 2007-11-07 株式会社巴川製紙所 半導体装置組立用マスクシートおよび半導体装置の組み立て方法
JP2012151360A (ja) 2011-01-20 2012-08-09 Nitto Denko Corp 半導体パッケージ製造工程用耐熱性粘着テープ

Also Published As

Publication number Publication date
TW202405125A (zh) 2024-02-01
JPWO2023204091A1 (https=) 2023-10-26
WO2023204091A1 (ja) 2023-10-26
KR20250005962A (ko) 2025-01-10

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