KR20250005962A - 내열성 점착 필름 - Google Patents

내열성 점착 필름 Download PDF

Info

Publication number
KR20250005962A
KR20250005962A KR1020247023055A KR20247023055A KR20250005962A KR 20250005962 A KR20250005962 A KR 20250005962A KR 1020247023055 A KR1020247023055 A KR 1020247023055A KR 20247023055 A KR20247023055 A KR 20247023055A KR 20250005962 A KR20250005962 A KR 20250005962A
Authority
KR
South Korea
Prior art keywords
heat
adhesive film
resistant adhesive
alkenyl group
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247023055A
Other languages
English (en)
Korean (ko)
Inventor
타카시 시미즈
카이시 쿠로사키
Original Assignee
후지 코피안 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지 코피안 가부시키가이샤 filed Critical 후지 코피안 가부시키가이샤
Publication of KR20250005962A publication Critical patent/KR20250005962A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H01L21/56—
    • H01L23/3142—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
KR1020247023055A 2022-04-18 2023-04-10 내열성 점착 필름 Pending KR20250005962A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022068374 2022-04-18
JPJP-P-2022-068374 2022-04-18
PCT/JP2023/014629 WO2023204091A1 (ja) 2022-04-18 2023-04-10 耐熱性粘着フィルム

Publications (1)

Publication Number Publication Date
KR20250005962A true KR20250005962A (ko) 2025-01-10

Family

ID=88419906

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247023055A Pending KR20250005962A (ko) 2022-04-18 2023-04-10 내열성 점착 필름

Country Status (5)

Country Link
JP (1) JPWO2023204091A1 (https=)
KR (1) KR20250005962A (https=)
CN (1) CN118525360A (https=)
TW (1) TW202405125A (https=)
WO (1) WO2023204091A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2024117021A1 (https=) * 2022-11-29 2024-06-06

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184801A (ja) 2000-10-02 2002-06-28 Nitto Denko Corp 半導体装置の製造方法
JP2012151360A (ja) 2011-01-20 2012-08-09 Nitto Denko Corp 半導体パッケージ製造工程用耐熱性粘着テープ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4619486B2 (ja) * 2000-06-01 2011-01-26 日東電工株式会社 リードフレーム積層物および半導体部品の製造方法
JP4002736B2 (ja) * 2001-03-21 2007-11-07 株式会社巴川製紙所 半導体装置組立用マスクシートおよび半導体装置の組み立て方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184801A (ja) 2000-10-02 2002-06-28 Nitto Denko Corp 半導体装置の製造方法
JP2012151360A (ja) 2011-01-20 2012-08-09 Nitto Denko Corp 半導体パッケージ製造工程用耐熱性粘着テープ

Also Published As

Publication number Publication date
TW202405125A (zh) 2024-02-01
JPWO2023204091A1 (https=) 2023-10-26
WO2023204091A1 (ja) 2023-10-26
CN118525360A (zh) 2024-08-20

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Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000