JPWO2023204091A1 - - Google Patents
Info
- Publication number
- JPWO2023204091A1 JPWO2023204091A1 JP2024516209A JP2024516209A JPWO2023204091A1 JP WO2023204091 A1 JPWO2023204091 A1 JP WO2023204091A1 JP 2024516209 A JP2024516209 A JP 2024516209A JP 2024516209 A JP2024516209 A JP 2024516209A JP WO2023204091 A1 JPWO2023204091 A1 JP WO2023204091A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022068374 | 2022-04-18 | ||
| PCT/JP2023/014629 WO2023204091A1 (ja) | 2022-04-18 | 2023-04-10 | 耐熱性粘着フィルム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023204091A1 true JPWO2023204091A1 (https=) | 2023-10-26 |
| JPWO2023204091A5 JPWO2023204091A5 (https=) | 2026-03-23 |
Family
ID=88419906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024516209A Pending JPWO2023204091A1 (https=) | 2022-04-18 | 2023-04-10 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023204091A1 (https=) |
| KR (1) | KR20250005962A (https=) |
| CN (1) | CN118525360A (https=) |
| TW (1) | TW202405125A (https=) |
| WO (1) | WO2023204091A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2024117021A1 (https=) * | 2022-11-29 | 2024-06-06 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4619486B2 (ja) * | 2000-06-01 | 2011-01-26 | 日東電工株式会社 | リードフレーム積層物および半導体部品の製造方法 |
| JP4357754B2 (ja) | 2000-10-02 | 2009-11-04 | 日東電工株式会社 | 半導体装置の製造方法 |
| JP4002736B2 (ja) * | 2001-03-21 | 2007-11-07 | 株式会社巴川製紙所 | 半導体装置組立用マスクシートおよび半導体装置の組み立て方法 |
| JP2012151360A (ja) | 2011-01-20 | 2012-08-09 | Nitto Denko Corp | 半導体パッケージ製造工程用耐熱性粘着テープ |
-
2023
- 2023-04-10 KR KR1020247023055A patent/KR20250005962A/ko active Pending
- 2023-04-10 CN CN202380016552.9A patent/CN118525360A/zh active Pending
- 2023-04-10 WO PCT/JP2023/014629 patent/WO2023204091A1/ja not_active Ceased
- 2023-04-10 TW TW112113364A patent/TW202405125A/zh unknown
- 2023-04-10 JP JP2024516209A patent/JPWO2023204091A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| TW202405125A (zh) | 2024-02-01 |
| WO2023204091A1 (ja) | 2023-10-26 |
| CN118525360A (zh) | 2024-08-20 |
| KR20250005962A (ko) | 2025-01-10 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20240930 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260312 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260312 |