JPWO2023204091A5 - - Google Patents
Info
- Publication number
- JPWO2023204091A5 JPWO2023204091A5 JP2024516209A JP2024516209A JPWO2023204091A5 JP WO2023204091 A5 JPWO2023204091 A5 JP WO2023204091A5 JP 2024516209 A JP2024516209 A JP 2024516209A JP 2024516209 A JP2024516209 A JP 2024516209A JP WO2023204091 A5 JPWO2023204091 A5 JP WO2023204091A5
- Authority
- JP
- Japan
- Prior art keywords
- discovered
- finding
- inventors
- words
- completed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022068374 | 2022-04-18 | ||
| PCT/JP2023/014629 WO2023204091A1 (ja) | 2022-04-18 | 2023-04-10 | 耐熱性粘着フィルム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023204091A1 JPWO2023204091A1 (https=) | 2023-10-26 |
| JPWO2023204091A5 true JPWO2023204091A5 (https=) | 2026-03-23 |
Family
ID=88419906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024516209A Pending JPWO2023204091A1 (https=) | 2022-04-18 | 2023-04-10 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023204091A1 (https=) |
| KR (1) | KR20250005962A (https=) |
| CN (1) | CN118525360A (https=) |
| TW (1) | TW202405125A (https=) |
| WO (1) | WO2023204091A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2024117021A1 (https=) * | 2022-11-29 | 2024-06-06 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4619486B2 (ja) * | 2000-06-01 | 2011-01-26 | 日東電工株式会社 | リードフレーム積層物および半導体部品の製造方法 |
| JP4357754B2 (ja) | 2000-10-02 | 2009-11-04 | 日東電工株式会社 | 半導体装置の製造方法 |
| JP4002736B2 (ja) * | 2001-03-21 | 2007-11-07 | 株式会社巴川製紙所 | 半導体装置組立用マスクシートおよび半導体装置の組み立て方法 |
| JP2012151360A (ja) | 2011-01-20 | 2012-08-09 | Nitto Denko Corp | 半導体パッケージ製造工程用耐熱性粘着テープ |
-
2023
- 2023-04-10 KR KR1020247023055A patent/KR20250005962A/ko active Pending
- 2023-04-10 CN CN202380016552.9A patent/CN118525360A/zh active Pending
- 2023-04-10 WO PCT/JP2023/014629 patent/WO2023204091A1/ja not_active Ceased
- 2023-04-10 TW TW112113364A patent/TW202405125A/zh unknown
- 2023-04-10 JP JP2024516209A patent/JPWO2023204091A1/ja active Pending
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