TW202348529A - 基板收納容器以及蓋體側基板支承部 - Google Patents

基板收納容器以及蓋體側基板支承部 Download PDF

Info

Publication number
TW202348529A
TW202348529A TW112119628A TW112119628A TW202348529A TW 202348529 A TW202348529 A TW 202348529A TW 112119628 A TW112119628 A TW 112119628A TW 112119628 A TW112119628 A TW 112119628A TW 202348529 A TW202348529 A TW 202348529A
Authority
TW
Taiwan
Prior art keywords
substrate
substrates
support
cover
opening
Prior art date
Application number
TW112119628A
Other languages
English (en)
Chinese (zh)
Inventor
久保田幸二
西坂幸一
Original Assignee
日商未來兒股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商未來兒股份有限公司 filed Critical 日商未來兒股份有限公司
Publication of TW202348529A publication Critical patent/TW202348529A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/14—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW112119628A 2022-05-31 2023-05-26 基板收納容器以及蓋體側基板支承部 TW202348529A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2022/022223 WO2023233554A1 (ja) 2022-05-31 2022-05-31 基板収納容器及び蓋体側基板支持部
WOPCT/JP2022/022223 2022-05-31

Publications (1)

Publication Number Publication Date
TW202348529A true TW202348529A (zh) 2023-12-16

Family

ID=89025941

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112119628A TW202348529A (zh) 2022-05-31 2023-05-26 基板收納容器以及蓋體側基板支承部

Country Status (6)

Country Link
US (1) US20260026299A1 (https=)
JP (1) JPWO2023233554A1 (https=)
KR (1) KR20250019627A (https=)
CN (1) CN119343766A (https=)
TW (1) TW202348529A (https=)
WO (1) WO2023233554A1 (https=)

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH069850Y2 (ja) * 1987-06-15 1994-03-16 日本板硝子株式会社 車両用窓ガラス
JPH062272Y2 (ja) * 1988-02-25 1994-01-19 信越ポリマー株式会社 ウェーハ容器の上部緩衝板
JP3778958B2 (ja) * 1994-05-12 2006-05-24 ミライアル株式会社 薄板用支持容器
JP3145252B2 (ja) * 1994-07-29 2001-03-12 淀川化成株式会社 基板支承用側板およびそれを用いたカセット
JP3180693B2 (ja) * 1996-11-21 2001-06-25 三菱マテリアル株式会社 ウェーハ収納容器のウェーハ押え部材
JPH11121601A (ja) * 1997-10-20 1999-04-30 Dainippon Ink & Chem Inc ウエハ収納容器
JP3938293B2 (ja) * 2001-05-30 2007-06-27 信越ポリマー株式会社 精密基板収納容器及びその押さえ部材
KR100964047B1 (ko) * 2001-11-14 2010-06-16 엔테그리스, 아이엔씨. 웨이퍼 보유 시스템을 구비한 웨이퍼 캐리어
EP1548820B1 (en) * 2002-09-11 2010-12-15 Shin-Etsu Polymer Co., Ltd. Substrate-storing container
JP4667769B2 (ja) * 2004-06-11 2011-04-13 信越ポリマー株式会社 基板収納容器
US7523830B2 (en) * 2004-11-23 2009-04-28 Entegris, Inc. Wafer container with secondary wafer restraint system
JP2006269771A (ja) * 2005-03-24 2006-10-05 Miraial Kk 気密容器
JP4668053B2 (ja) * 2005-12-07 2011-04-13 信越ポリマー株式会社 リテーナ及び基板収納容器
US8528738B2 (en) * 2006-06-13 2013-09-10 Entegris, Inc. Reusable resilient cushion for wafer container
KR101554375B1 (ko) * 2008-04-25 2015-09-18 신에츠 폴리머 가부시키가이샤 리테이너, 및 리테이너를 구비한 기판 수납 용기
TWI384577B (zh) * 2008-07-31 2013-02-01 家登精密工業股份有限公司 門上凹陷區域兩旁配置有晶圓限制件模組之前開式晶圓盒
TWD176128S (zh) * 2010-03-11 2016-06-01 安堤格里斯公司 用於晶圓載運器之襯墊
KR101899614B1 (ko) * 2010-10-20 2018-09-17 엔테그리스, 아이엔씨. 도어 가이드 및 밀봉부를 갖는 웨이퍼 컨테이너
JP6177248B2 (ja) * 2012-10-12 2017-08-09 ミライアル株式会社 基板収納容器
JP6166275B2 (ja) * 2012-11-20 2017-07-19 ミライアル株式会社 基板収納容器
KR20140092548A (ko) * 2013-01-16 2014-07-24 삼성전자주식회사 웨이퍼 보관 장치
WO2015145629A1 (ja) * 2014-03-26 2015-10-01 ミライアル株式会社 基板収納容器
JP6391333B2 (ja) * 2014-07-10 2018-09-19 ミライアル株式会社 基板収納容器及びリテーナ
US10559484B2 (en) * 2015-04-10 2020-02-11 Shin-Etsu Polymer Co., Ltd. Substrate storage container
KR102363033B1 (ko) * 2015-07-03 2022-02-15 미라이얼 가부시키가이샤 기판 수납 용기
KR102354123B1 (ko) * 2017-04-05 2022-01-21 미라이얼 가부시키가이샤 기판 수납 용기
CN120709206A (zh) * 2019-07-19 2025-09-26 恩特格里斯公司 晶片缓冲器及支撑晶片的方法
KR102829296B1 (ko) * 2020-05-19 2025-07-02 미라이얼 가부시키가이샤 기판수납용기
TWI855914B (zh) * 2023-05-04 2024-09-11 家登精密工業股份有限公司 基板容器保護裝置

Also Published As

Publication number Publication date
JPWO2023233554A1 (https=) 2023-12-07
WO2023233554A1 (ja) 2023-12-07
CN119343766A (zh) 2025-01-21
US20260026299A1 (en) 2026-01-22
KR20250019627A (ko) 2025-02-10

Similar Documents

Publication Publication Date Title
TWI878536B (zh) 基板收納容器
JP6177248B2 (ja) 基板収納容器
TWI796660B (zh) 基板收納容器
CN110574152B (zh) 基板收纳容器
TWI883193B (zh) 基板收納容器
CN110337713A (zh) 基板收纳容器
CN107735856B (zh) 基板收纳容器
TW202401636A (zh) 基板收納容器以及後部保持構件
TW202348529A (zh) 基板收納容器以及蓋體側基板支承部
TW202032700A (zh) 基板收納容器
TW202310702A (zh) 基板收納容器及其製造方法以及蓋體側基板支承部
TWI652211B (zh) Substrate storage container and holding member
TWI781205B (zh) 基板收納容器
TW202609965A (zh) 基板收納容器
KR102942671B1 (ko) 기판수납용기 및 그 뚜껑
WO2026047841A1 (ja) 基板収納容器
TW202514873A (zh) 基板收納容器
TW202522658A (zh) 基板收納容器
JP2016058629A (ja) 基板収納容器
WO2024105879A1 (ja) 収納容器及びアダプター部材
TW202448779A (zh) 基板收納容器
TW202516659A (zh) 基板收納容器
TW202516660A (zh) 基板收納容器