KR20250019627A - 기판수납용기 및 뚜껑측 기판지지부 - Google Patents
기판수납용기 및 뚜껑측 기판지지부 Download PDFInfo
- Publication number
- KR20250019627A KR20250019627A KR1020247037674A KR20247037674A KR20250019627A KR 20250019627 A KR20250019627 A KR 20250019627A KR 1020247037674 A KR1020247037674 A KR 1020247037674A KR 20247037674 A KR20247037674 A KR 20247037674A KR 20250019627 A KR20250019627 A KR 20250019627A
- Authority
- KR
- South Korea
- Prior art keywords
- lid
- substrates
- substrate
- support
- container body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H01L21/67383—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
-
- H01L21/67379—
-
- H01L21/67386—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/14—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/022223 WO2023233554A1 (ja) | 2022-05-31 | 2022-05-31 | 基板収納容器及び蓋体側基板支持部 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20250019627A true KR20250019627A (ko) | 2025-02-10 |
Family
ID=89025941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247037674A Pending KR20250019627A (ko) | 2022-05-31 | 2022-05-31 | 기판수납용기 및 뚜껑측 기판지지부 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20260026299A1 (https=) |
| JP (1) | JPWO2023233554A1 (https=) |
| KR (1) | KR20250019627A (https=) |
| CN (1) | CN119343766A (https=) |
| TW (1) | TW202348529A (https=) |
| WO (1) | WO2023233554A1 (https=) |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH069850Y2 (ja) * | 1987-06-15 | 1994-03-16 | 日本板硝子株式会社 | 車両用窓ガラス |
| JPH062272Y2 (ja) * | 1988-02-25 | 1994-01-19 | 信越ポリマー株式会社 | ウェーハ容器の上部緩衝板 |
| JP3778958B2 (ja) * | 1994-05-12 | 2006-05-24 | ミライアル株式会社 | 薄板用支持容器 |
| JP3145252B2 (ja) * | 1994-07-29 | 2001-03-12 | 淀川化成株式会社 | 基板支承用側板およびそれを用いたカセット |
| JP3180693B2 (ja) * | 1996-11-21 | 2001-06-25 | 三菱マテリアル株式会社 | ウェーハ収納容器のウェーハ押え部材 |
| JPH11121601A (ja) * | 1997-10-20 | 1999-04-30 | Dainippon Ink & Chem Inc | ウエハ収納容器 |
| JP3938293B2 (ja) * | 2001-05-30 | 2007-06-27 | 信越ポリマー株式会社 | 精密基板収納容器及びその押さえ部材 |
| KR100964047B1 (ko) * | 2001-11-14 | 2010-06-16 | 엔테그리스, 아이엔씨. | 웨이퍼 보유 시스템을 구비한 웨이퍼 캐리어 |
| EP1548820B1 (en) * | 2002-09-11 | 2010-12-15 | Shin-Etsu Polymer Co., Ltd. | Substrate-storing container |
| JP4667769B2 (ja) * | 2004-06-11 | 2011-04-13 | 信越ポリマー株式会社 | 基板収納容器 |
| US7523830B2 (en) * | 2004-11-23 | 2009-04-28 | Entegris, Inc. | Wafer container with secondary wafer restraint system |
| JP2006269771A (ja) * | 2005-03-24 | 2006-10-05 | Miraial Kk | 気密容器 |
| JP4668053B2 (ja) * | 2005-12-07 | 2011-04-13 | 信越ポリマー株式会社 | リテーナ及び基板収納容器 |
| US8528738B2 (en) * | 2006-06-13 | 2013-09-10 | Entegris, Inc. | Reusable resilient cushion for wafer container |
| KR101554375B1 (ko) * | 2008-04-25 | 2015-09-18 | 신에츠 폴리머 가부시키가이샤 | 리테이너, 및 리테이너를 구비한 기판 수납 용기 |
| TWI384577B (zh) * | 2008-07-31 | 2013-02-01 | 家登精密工業股份有限公司 | 門上凹陷區域兩旁配置有晶圓限制件模組之前開式晶圓盒 |
| TWD176128S (zh) * | 2010-03-11 | 2016-06-01 | 安堤格里斯公司 | 用於晶圓載運器之襯墊 |
| KR101899614B1 (ko) * | 2010-10-20 | 2018-09-17 | 엔테그리스, 아이엔씨. | 도어 가이드 및 밀봉부를 갖는 웨이퍼 컨테이너 |
| JP6177248B2 (ja) * | 2012-10-12 | 2017-08-09 | ミライアル株式会社 | 基板収納容器 |
| JP6166275B2 (ja) * | 2012-11-20 | 2017-07-19 | ミライアル株式会社 | 基板収納容器 |
| KR20140092548A (ko) * | 2013-01-16 | 2014-07-24 | 삼성전자주식회사 | 웨이퍼 보관 장치 |
| WO2015145629A1 (ja) * | 2014-03-26 | 2015-10-01 | ミライアル株式会社 | 基板収納容器 |
| JP6391333B2 (ja) * | 2014-07-10 | 2018-09-19 | ミライアル株式会社 | 基板収納容器及びリテーナ |
| US10559484B2 (en) * | 2015-04-10 | 2020-02-11 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container |
| KR102363033B1 (ko) * | 2015-07-03 | 2022-02-15 | 미라이얼 가부시키가이샤 | 기판 수납 용기 |
| KR102354123B1 (ko) * | 2017-04-05 | 2022-01-21 | 미라이얼 가부시키가이샤 | 기판 수납 용기 |
| CN120709206A (zh) * | 2019-07-19 | 2025-09-26 | 恩特格里斯公司 | 晶片缓冲器及支撑晶片的方法 |
| KR102829296B1 (ko) * | 2020-05-19 | 2025-07-02 | 미라이얼 가부시키가이샤 | 기판수납용기 |
| TWI855914B (zh) * | 2023-05-04 | 2024-09-11 | 家登精密工業股份有限公司 | 基板容器保護裝置 |
-
2022
- 2022-05-31 KR KR1020247037674A patent/KR20250019627A/ko active Pending
- 2022-05-31 US US18/870,597 patent/US20260026299A1/en active Pending
- 2022-05-31 CN CN202280096482.8A patent/CN119343766A/zh active Pending
- 2022-05-31 JP JP2024524051A patent/JPWO2023233554A1/ja active Pending
- 2022-05-31 WO PCT/JP2022/022223 patent/WO2023233554A1/ja not_active Ceased
-
2023
- 2023-05-26 TW TW112119628A patent/TW202348529A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2023233554A1 (https=) | 2023-12-07 |
| WO2023233554A1 (ja) | 2023-12-07 |
| CN119343766A (zh) | 2025-01-21 |
| US20260026299A1 (en) | 2026-01-22 |
| TW202348529A (zh) | 2023-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| D21 | Rejection of application intended |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| E13 | Pre-grant limitation requested |
Free format text: ST27 STATUS EVENT CODE: A-2-3-E10-E13-LIM-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11 | Amendment of application requested |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |