TW202341322A - 用於半導體製造裝置之溫度調節裝置、及半導體製造系統 - Google Patents

用於半導體製造裝置之溫度調節裝置、及半導體製造系統 Download PDF

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Publication number
TW202341322A
TW202341322A TW112111457A TW112111457A TW202341322A TW 202341322 A TW202341322 A TW 202341322A TW 112111457 A TW112111457 A TW 112111457A TW 112111457 A TW112111457 A TW 112111457A TW 202341322 A TW202341322 A TW 202341322A
Authority
TW
Taiwan
Prior art keywords
heating
cooling
temperature
liquid
semiconductor manufacturing
Prior art date
Application number
TW112111457A
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English (en)
Chinese (zh)
Inventor
福住幸大
新田慎一
国保典男
Original Assignee
日商荏原冷熱系統股份有限公司
日商Ｃｋｄ股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商荏原冷熱系統股份有限公司, 日商Ｃｋｄ股份有限公司 filed Critical 日商荏原冷熱系統股份有限公司
Publication of TW202341322A publication Critical patent/TW202341322A/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/01—Control of temperature without auxiliary power
    • G05D23/13—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures
    • G05D23/1306—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures for liquids
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/01—Control of temperature without auxiliary power
    • G05D23/13—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures
    • G05D23/1306—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures for liquids
    • G05D23/1313—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures for liquids without temperature sensing element
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Control Of Temperature (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW112111457A 2022-03-31 2023-03-27 用於半導體製造裝置之溫度調節裝置、及半導體製造系統 TW202341322A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022058188A JP7707119B2 (ja) 2022-03-31 2022-03-31 半導体製造装置のための温度調節装置、および半導体製造システム
JP2022-058188 2022-03-31

Publications (1)

Publication Number Publication Date
TW202341322A true TW202341322A (zh) 2023-10-16

Family

ID=88193509

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112111457A TW202341322A (zh) 2022-03-31 2023-03-27 用於半導體製造裝置之溫度調節裝置、及半導體製造系統

Country Status (5)

Country Link
US (1) US12648393B2 (enExample)
JP (1) JP7707119B2 (enExample)
KR (1) KR102995155B1 (enExample)
CN (1) CN116895557A (enExample)
TW (1) TW202341322A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7707119B2 (ja) * 2022-03-31 2025-07-14 株式会社荏原製作所 半導体製造装置のための温度調節装置、および半導体製造システム
WO2025058041A1 (ja) 2023-09-14 2025-03-20 キヤノン株式会社 記録装置
JP7864678B2 (ja) * 2023-11-16 2026-05-25 株式会社荏原製作所 熱媒体供給装置
WO2026155002A1 (ja) * 2025-01-16 2026-07-23 東京エレクトロン株式会社 コンピュータプログラム、情報処理方法及び情報処理装置

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JP3485538B2 (ja) * 2000-10-30 2004-01-13 株式会社日立製作所 プラズマ処理装置
JP2002168551A (ja) * 2000-11-30 2002-06-14 Tokyo Electron Ltd 処理装置の電極用冷却装置
US8110044B2 (en) * 2003-03-07 2012-02-07 Tokyo Electron Limited Substrate processing apparatus and temperature control device
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JP2005197471A (ja) * 2004-01-07 2005-07-21 Tokyo Electron Ltd 基板処理装置及び温度調節方法
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JP5032269B2 (ja) * 2007-11-02 2012-09-26 東京エレクトロン株式会社 被処理基板の温度調節装置及び温度調節方法、並びにこれを備えたプラズマ処理装置
JP5172615B2 (ja) * 2008-11-12 2013-03-27 Ｃｋｄ株式会社 温度制御装置
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JP6051036B2 (ja) * 2012-12-25 2016-12-21 株式会社Kelk 循環冷却加熱装置
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JP6570390B2 (ja) * 2015-09-24 2019-09-04 東京エレクトロン株式会社 温度調整装置及び基板処理装置
JP2019528187A (ja) * 2016-08-31 2019-10-10 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 環状プラテン又は研磨パッドを有する研磨システム
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JP7864678B2 (ja) * 2023-11-16 2026-05-25 株式会社荏原製作所 熱媒体供給装置

Also Published As

Publication number Publication date
US20230317482A1 (en) 2023-10-05
JP7707119B2 (ja) 2025-07-14
JP2023149554A (ja) 2023-10-13
KR102995155B1 (ko) 2026-07-24
KR20230141544A (ko) 2023-10-10
CN116895557A (zh) 2023-10-17
US12648393B2 (en) 2026-06-02

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