CN116895557A - 半导体制造装置用的温度调节装置和半导体制造系统 - Google Patents

半导体制造装置用的温度调节装置和半导体制造系统 Download PDF

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Publication number
CN116895557A
CN116895557A CN202310296058.4A CN202310296058A CN116895557A CN 116895557 A CN116895557 A CN 116895557A CN 202310296058 A CN202310296058 A CN 202310296058A CN 116895557 A CN116895557 A CN 116895557A
Authority
CN
China
Prior art keywords
heating
cooling
liquid
temperature
semiconductor manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310296058.4A
Other languages
English (en)
Chinese (zh)
Inventor
福住幸大
新田慎一
国保典男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
CKD Corp
Original Assignee
CKD Corp
Ebara Refrigeration Equipment and Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CKD Corp, Ebara Refrigeration Equipment and Systems Co Ltd filed Critical CKD Corp
Publication of CN116895557A publication Critical patent/CN116895557A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/01—Control of temperature without auxiliary power
    • G05D23/13—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures
    • G05D23/1306—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures for liquids
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/01—Control of temperature without auxiliary power
    • G05D23/13—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures
    • G05D23/1306—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures for liquids
    • G05D23/1313—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures for liquids without temperature sensing element
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Control Of Temperature (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN202310296058.4A 2022-03-31 2023-03-24 半导体制造装置用的温度调节装置和半导体制造系统 Pending CN116895557A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022058188A JP7707119B2 (ja) 2022-03-31 2022-03-31 半導体製造装置のための温度調節装置、および半導体製造システム
JP2022-058188 2022-03-31

Publications (1)

Publication Number Publication Date
CN116895557A true CN116895557A (zh) 2023-10-17

Family

ID=88193509

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310296058.4A Pending CN116895557A (zh) 2022-03-31 2023-03-24 半导体制造装置用的温度调节装置和半导体制造系统

Country Status (5)

Country Link
US (1) US12648393B2 (enExample)
JP (1) JP7707119B2 (enExample)
KR (1) KR102995155B1 (enExample)
CN (1) CN116895557A (enExample)
TW (1) TW202341322A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7707119B2 (ja) * 2022-03-31 2025-07-14 株式会社荏原製作所 半導体製造装置のための温度調節装置、および半導体製造システム
WO2025058041A1 (ja) 2023-09-14 2025-03-20 キヤノン株式会社 記録装置
JP7864678B2 (ja) * 2023-11-16 2026-05-25 株式会社荏原製作所 熱媒体供給装置
WO2026155002A1 (ja) * 2025-01-16 2026-07-23 東京エレクトロン株式会社 コンピュータプログラム、情報処理方法及び情報処理装置

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US5802856A (en) * 1996-07-31 1998-09-08 Stanford University Multizone bake/chill thermal cycling module
JP3917237B2 (ja) * 1997-05-20 2007-05-23 東京エレクトロン株式会社 レジスト膜形成方法
US7374477B2 (en) * 2002-02-06 2008-05-20 Applied Materials, Inc. Polishing pads useful for endpoint detection in chemical mechanical polishing
US6447369B1 (en) * 2000-08-30 2002-09-10 Micron Technology, Inc. Planarizing machines and alignment systems for mechanical and/or chemical-mechanical planarization of microelectronic substrates
JP3485538B2 (ja) * 2000-10-30 2004-01-13 株式会社日立製作所 プラズマ処理装置
JP2002168551A (ja) * 2000-11-30 2002-06-14 Tokyo Electron Ltd 処理装置の電極用冷却装置
US8110044B2 (en) * 2003-03-07 2012-02-07 Tokyo Electron Limited Substrate processing apparatus and temperature control device
US6913514B2 (en) * 2003-03-14 2005-07-05 Ebara Technologies, Inc. Chemical mechanical polishing endpoint detection system and method
JP2005197471A (ja) * 2004-01-07 2005-07-21 Tokyo Electron Ltd 基板処理装置及び温度調節方法
JP4978928B2 (ja) * 2007-04-27 2012-07-18 シーケーディ株式会社 温度制御装置
JP5032269B2 (ja) * 2007-11-02 2012-09-26 東京エレクトロン株式会社 被処理基板の温度調節装置及び温度調節方法、並びにこれを備えたプラズマ処理装置
JP5172615B2 (ja) * 2008-11-12 2013-03-27 Ｃｋｄ株式会社 温度制御装置
US8430963B2 (en) * 2010-01-07 2013-04-30 Primestar Solar, Inc. Cool-down system and method for a vapor deposition system
US9338871B2 (en) * 2010-01-29 2016-05-10 Applied Materials, Inc. Feedforward temperature control for plasma processing apparatus
US8580693B2 (en) * 2010-08-27 2013-11-12 Applied Materials, Inc. Temperature enhanced electrostatic chucking in plasma processing apparatus
JP5993111B2 (ja) * 2010-09-24 2016-09-14 東京エレクトロン株式会社 温度制御システム
JP5912439B2 (ja) * 2011-11-15 2016-04-27 東京エレクトロン株式会社 温度制御システム、半導体製造装置及び温度制御方法
US20130240144A1 (en) * 2012-03-13 2013-09-19 Applied Materials, Inc. Fast response fluid temperature control system
JP5951384B2 (ja) * 2012-07-20 2016-07-13 東京エレクトロン株式会社 温度制御システムへの温調流体供給方法及び記憶媒体
JP6051036B2 (ja) * 2012-12-25 2016-12-21 株式会社Kelk 循環冷却加熱装置
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US9831111B2 (en) * 2014-02-12 2017-11-28 Applied Materials, Inc. Apparatus and method for measurement of the thermal performance of an electrostatic wafer chuck
JP6570390B2 (ja) * 2015-09-24 2019-09-04 東京エレクトロン株式会社 温度調整装置及び基板処理装置
JP2019528187A (ja) * 2016-08-31 2019-10-10 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 環状プラテン又は研磨パッドを有する研磨システム
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JP7864678B2 (ja) * 2023-11-16 2026-05-25 株式会社荏原製作所 熱媒体供給装置

Also Published As

Publication number Publication date
US20230317482A1 (en) 2023-10-05
JP7707119B2 (ja) 2025-07-14
TW202341322A (zh) 2023-10-16
JP2023149554A (ja) 2023-10-13
KR102995155B1 (ko) 2026-07-24
KR20230141544A (ko) 2023-10-10
US12648393B2 (en) 2026-06-02

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Legal Events

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PB01 Publication
PB01 Publication
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20240416

Address after: Tokyo, Japan

Applicant after: EBARA Corp.

Country or region after: Japan

Applicant after: CKD Corp.

Address before: Tokyo, Japan

Applicant before: EBARA REFRIGERATION EQUIPMENT & SYSTEMS Co.,Ltd.

Country or region before: Japan

Applicant before: CKD Corp.

SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination