KR102995155B1 - 반도체 제조 장치를 위한 온도 조절 장치, 및 반도체 제조 시스템 - Google Patents

반도체 제조 장치를 위한 온도 조절 장치, 및 반도체 제조 시스템

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Publication number
KR102995155B1
KR102995155B1 KR1020230039647A KR20230039647A KR102995155B1 KR 102995155 B1 KR102995155 B1 KR 102995155B1 KR 1020230039647 A KR1020230039647 A KR 1020230039647A KR 20230039647 A KR20230039647 A KR 20230039647A KR 102995155 B1 KR102995155 B1 KR 102995155B1
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KR
South Korea
Prior art keywords
cooling
heating
liquid
temperature
semiconductor manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020230039647A
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English (en)
Korean (ko)
Other versions
KR20230141544A (ko
Inventor
유키히로 후쿠스미
신이치 닛타
노리오 고쿠보
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
시케이디 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 가부시키가이샤 에바라 세이사꾸쇼, 시케이디 가부시키가이샤 filed Critical 가부시키가이샤 에바라 세이사꾸쇼
Publication of KR20230141544A publication Critical patent/KR20230141544A/ko
Application granted granted Critical
Publication of KR102995155B1 publication Critical patent/KR102995155B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/01—Control of temperature without auxiliary power
    • G05D23/13—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures
    • G05D23/1306—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures for liquids
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/01—Control of temperature without auxiliary power
    • G05D23/13—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures
    • G05D23/1306—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures for liquids
    • G05D23/1313—Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures for liquids without temperature sensing element
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Combustion & Propulsion (AREA)
  • Control Of Temperature (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020230039647A 2022-03-31 2023-03-27 반도체 제조 장치를 위한 온도 조절 장치, 및 반도체 제조 시스템 Active KR102995155B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2022-058188 2022-03-31
JP2022058188A JP7707119B2 (ja) 2022-03-31 2022-03-31 半導体製造装置のための温度調節装置、および半導体製造システム

Publications (2)

Publication Number Publication Date
KR20230141544A KR20230141544A (ko) 2023-10-10
KR102995155B1 true KR102995155B1 (ko) 2026-07-24

Family

ID=88193509

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020230039647A Active KR102995155B1 (ko) 2022-03-31 2023-03-27 반도체 제조 장치를 위한 온도 조절 장치, 및 반도체 제조 시스템

Country Status (5)

Country Link
US (1) US12648393B2 (enExample)
JP (1) JP7707119B2 (enExample)
KR (1) KR102995155B1 (enExample)
CN (1) CN116895557A (enExample)
TW (1) TW202341322A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7707119B2 (ja) * 2022-03-31 2025-07-14 株式会社荏原製作所 半導体製造装置のための温度調節装置、および半導体製造システム
WO2025058041A1 (ja) 2023-09-14 2025-03-20 キヤノン株式会社 記録装置
JP7864678B2 (ja) * 2023-11-16 2026-05-25 株式会社荏原製作所 熱媒体供給装置
WO2026155002A1 (ja) * 2025-01-16 2026-07-23 東京エレクトロン株式会社 コンピュータプログラム、情報処理方法及び情報処理装置

Citations (1)

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JP2025081992A (ja) * 2023-11-16 2025-05-28 株式会社荏原製作所 熱媒体供給装置

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JP2002168551A (ja) * 2000-11-30 2002-06-14 Tokyo Electron Ltd 処理装置の電極用冷却装置
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JP5172615B2 (ja) * 2008-11-12 2013-03-27 Ｃｋｄ株式会社 温度制御装置
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JP7707119B2 (ja) * 2022-03-31 2025-07-14 株式会社荏原製作所 半導体製造装置のための温度調節装置、および半導体製造システム

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Also Published As

Publication number Publication date
US20230317482A1 (en) 2023-10-05
JP7707119B2 (ja) 2025-07-14
TW202341322A (zh) 2023-10-16
JP2023149554A (ja) 2023-10-13
KR20230141544A (ko) 2023-10-10
CN116895557A (zh) 2023-10-17
US12648393B2 (en) 2026-06-02

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