TW202340488A - 銅合金板材及其製造方法 - Google Patents
銅合金板材及其製造方法 Download PDFInfo
- Publication number
- TW202340488A TW202340488A TW112103389A TW112103389A TW202340488A TW 202340488 A TW202340488 A TW 202340488A TW 112103389 A TW112103389 A TW 112103389A TW 112103389 A TW112103389 A TW 112103389A TW 202340488 A TW202340488 A TW 202340488A
- Authority
- TW
- Taiwan
- Prior art keywords
- copper alloy
- less
- range
- mass
- heat treatment
- Prior art date
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 141
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000000463 material Substances 0.000 title abstract description 49
- 238000004519 manufacturing process Methods 0.000 title abstract description 20
- 239000000956 alloy Substances 0.000 claims abstract description 40
- 238000005096 rolling process Methods 0.000 claims abstract description 37
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 32
- 239000000203 mixture Substances 0.000 claims abstract description 26
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 18
- 238000001887 electron backscatter diffraction Methods 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 11
- 239000012535 impurity Substances 0.000 claims abstract description 11
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000004615 ingredient Substances 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 239000013078 crystal Substances 0.000 abstract description 39
- 238000010438 heat treatment Methods 0.000 description 142
- 238000005097 cold rolling Methods 0.000 description 56
- 238000012545 processing Methods 0.000 description 42
- 238000005259 measurement Methods 0.000 description 30
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 22
- 230000000052 comparative effect Effects 0.000 description 19
- 238000001816 cooling Methods 0.000 description 16
- 238000004458 analytical method Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 14
- 238000005520 cutting process Methods 0.000 description 11
- 238000005266 casting Methods 0.000 description 10
- 238000005098 hot rolling Methods 0.000 description 10
- 238000002844 melting Methods 0.000 description 10
- 230000008018 melting Effects 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 239000011651 chromium Substances 0.000 description 9
- 239000011135 tin Substances 0.000 description 9
- 239000011777 magnesium Substances 0.000 description 8
- 239000011701 zinc Substances 0.000 description 8
- 238000000265 homogenisation Methods 0.000 description 7
- 238000004881 precipitation hardening Methods 0.000 description 7
- 238000007788 roughening Methods 0.000 description 7
- 238000002425 crystallisation Methods 0.000 description 6
- 230000008025 crystallization Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 229910018651 Mn—Ni Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910018645 Mn—Sn Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000003483 aging Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/10—Alloys based on copper with silicon as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-023778 | 2022-02-18 | ||
| JP2022023778 | 2022-02-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202340488A true TW202340488A (zh) | 2023-10-16 |
Family
ID=87578414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW112103389A TW202340488A (zh) | 2022-02-18 | 2023-02-01 | 銅合金板材及其製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW202340488A (ja) |
| WO (1) | WO2023157614A1 (ja) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010100890A (ja) * | 2008-10-23 | 2010-05-06 | Hitachi Cable Ltd | コネクタ用銅合金条 |
| JP6494681B2 (ja) * | 2017-03-27 | 2019-04-03 | Ｊｘ金属株式会社 | 電子材料用銅合金及び電子部品 |
| JP2019157153A (ja) * | 2018-03-07 | 2019-09-19 | Ｊｘ金属株式会社 | Ｃｕ−Ｎｉ−Ｓｉ系銅合金 |
| CN113454252B (zh) * | 2019-03-28 | 2022-06-24 | 古河电气工业株式会社 | 铜合金条材及其制造方法、使用其的电阻器用电阻材料以及电阻器 |
-
2023
- 2023-01-27 WO PCT/JP2023/002736 patent/WO2023157614A1/ja active Application Filing
- 2023-02-01 TW TW112103389A patent/TW202340488A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023157614A1 (ja) | 2023-08-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1873267B1 (en) | Copper alloy for electronic material | |
| JP4934759B2 (ja) | 銅合金板材及びこれを用いたコネクタ並びに銅合金板材の製造方法 | |
| TWI539013B (zh) | Copper alloy sheet and method of manufacturing the same | |
| JP4006460B1 (ja) | 高強度、高導電率および曲げ加工性に優れた銅合金およびその製造方法 | |
| JP4566020B2 (ja) | 異方性の小さい電気電子部品用銅合金板 | |
| KR101628583B1 (ko) | Cu－Ni－Si 계 합금 및 그 제조 방법 | |
| KR101455522B1 (ko) | 굽힘 가공성 및 내응력 완화 특성이 우수한 전기 전자 부품용 구리 합금판 | |
| EP2623619A1 (en) | Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCING SAME | |
| KR101917416B1 (ko) | 전자 재료용 Cu-Co-Si 계 합금 | |
| JP2013213237A (ja) | Ｃｕ−Ｚｎ−Ｓｎ−Ｎｉ−Ｐ系合金 | |
| TWI742587B (zh) | 銅合金條材及其製造方法、使用了該銅合金條材之電阻器用電阻材料以及電阻器 | |
| JP4813814B2 (ja) | Ｃｕ−Ｎｉ−Ｓｉ系銅合金及びその製造方法 | |
| JP7214930B1 (ja) | 銅合金材ならびにそれを用いた抵抗器用抵抗材料および抵抗器 | |
| JP7214931B1 (ja) | 銅合金材ならびにそれを用いた抵抗器用抵抗材料および抵抗器 | |
| JP5981866B2 (ja) | 銅合金 | |
| TW202340488A (zh) | 銅合金板材及其製造方法 | |
| JP7307297B1 (ja) | 銅合金板材およびその製造方法 | |
| CN113166850B (zh) | 铜合金板材及其制造方法 | |
| TW202009309A (zh) | 鈦銅板、壓制加工品以及壓制加工品的製造方法 | |
| TWI828212B (zh) | 銅合金材料以及使用該銅合金材料的電阻器用電阻材料及電阻器 | |
| TWI835180B (zh) | 銅合金材料以及使用該銅合金材料的電阻器用電阻材料及電阻器 | |
| JP7167385B1 (ja) | 銅合金材ならびにそれを用いた抵抗器用抵抗材料および抵抗器 | |
| JP5867861B2 (ja) | 銅合金 | |
| TW202332785A (zh) | 電子材料用銅合金以及電子部件 | |
| JP2020158818A (ja) | 曲げ加工性に優れ、曲げ肌が平滑なＣｕ−Ｃｏ−Ｓｉ系銅合金条 |