TW202336201A - 接著劑組成物、電路連接用接著劑膜及連接結構體之製造方法 - Google Patents

接著劑組成物、電路連接用接著劑膜及連接結構體之製造方法 Download PDF

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Publication number
TW202336201A
TW202336201A TW112101212A TW112101212A TW202336201A TW 202336201 A TW202336201 A TW 202336201A TW 112101212 A TW112101212 A TW 112101212A TW 112101212 A TW112101212 A TW 112101212A TW 202336201 A TW202336201 A TW 202336201A
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TW
Taiwan
Prior art keywords
electrode
circuit
component
adhesive
connection
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TW112101212A
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English (en)
Chinese (zh)
Inventor
山崎裕太
富坂克彥
森谷敏光
小林亮太
Original Assignee
日商力森諾科股份有限公司
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Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202336201A publication Critical patent/TW202336201A/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
TW112101212A 2022-01-12 2023-01-11 接著劑組成物、電路連接用接著劑膜及連接結構體之製造方法 TW202336201A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022002747 2022-01-12
JP2022-002747 2022-01-12

Publications (1)

Publication Number Publication Date
TW202336201A true TW202336201A (zh) 2023-09-16

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ID=87279093

Family Applications (2)

Application Number Title Priority Date Filing Date
TW112101212A TW202336201A (zh) 2022-01-12 2023-01-11 接著劑組成物、電路連接用接著劑膜及連接結構體之製造方法
TW112101213A TW202341186A (zh) 2022-01-12 2023-01-11 接著劑組成物、電路連接用接著劑膜及連接結構體之製造方法

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Application Number Title Priority Date Filing Date
TW112101213A TW202341186A (zh) 2022-01-12 2023-01-11 接著劑組成物、電路連接用接著劑膜及連接結構體之製造方法

Country Status (5)

Country Link
JP (4) JPWO2023136273A1 (ja)
KR (3) KR20240134924A (ja)
CN (4) CN118742619A (ja)
TW (2) TW202336201A (ja)
WO (4) WO2023136274A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024099206A (ja) * 2023-01-12 2024-07-25 株式会社レゾナック 接着剤組成物、回路接続用接着剤フィルム、接続構造体及び接続構造体の製造方法
JP2024099217A (ja) * 2023-01-12 2024-07-25 株式会社レゾナック 接着剤組成物、回路接続用接着剤フィルム、接続構造体及び接続構造体の製造方法

Family Cites Families (21)

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JPS5549617B2 (ja) * 1972-11-20 1980-12-12
JPS60191228A (ja) 1984-10-29 1985-09-28 Seiko Epson Corp 表示装置の接続構造
JPH01251787A (ja) 1988-03-31 1989-10-06 Toshiba Corp 電子部品の接続装置
JPH01299803A (ja) * 1988-05-27 1989-12-04 Nippon Paint Co Ltd 熱硬化性樹脂組成物
JPH03109465A (ja) * 1989-04-10 1991-05-09 Dainippon Ink & Chem Inc 熱硬化性樹脂組成物
JP3137202B2 (ja) * 1990-10-30 2001-02-19 大日本インキ化学工業株式会社 エポキシ樹脂、その製造方法及びエポキシ樹脂組成物
JPH055006A (ja) * 1990-11-16 1993-01-14 Nippon Kayaku Co Ltd カチオン重合性有機材料組成物および当該組成物の安定化法
JP3269110B2 (ja) * 1991-04-12 2002-03-25 日本曹達株式会社 硬化性組成物
JP3907217B2 (ja) 1993-07-29 2007-04-18 日立化成工業株式会社 回路接続材料とその接続材料を用いた回路の接続方法
JPH08315885A (ja) * 1995-05-16 1996-11-29 Hitachi Chem Co Ltd 回路接続材料
JP3873310B2 (ja) * 1996-01-22 2007-01-24 東洋インキ製造株式会社 感エネルギー線酸発生剤、感エネルギー線酸発生剤組成物、硬化性組成物およびその硬化物
AU8648598A (en) * 1998-08-13 2000-03-06 Hitachi Chemical Company, Ltd. Adhesive for bonding circuit members, circuit board, and method of producing thesame
JP6007663B2 (ja) * 2012-08-10 2016-10-12 味の素株式会社 樹脂組成物
EP3275956B1 (en) * 2015-03-27 2019-07-24 Toray Industries, Inc. Adhesive composition sheet, process for producing same, and semiconductor device
JP7013638B2 (ja) * 2016-05-31 2022-02-01 昭和電工マテリアルズ株式会社 接着剤組成物及びフィルム状接着剤組成物
JP7039984B2 (ja) 2017-12-14 2022-03-23 昭和電工マテリアルズ株式会社 回路接続用接着剤組成物及び回路接続構造体
JP7396932B2 (ja) * 2020-03-02 2023-12-12 Ｍｃｐｐイノベーション合同会社 樹脂組成物及びその溶液
JP6950844B1 (ja) * 2020-09-25 2021-10-13 東洋インキＳｃホールディングス株式会社 硬化性組成物、硬化物およびその製造方法
WO2022124336A1 (ja) * 2020-12-09 2022-06-16 三菱ケミカル株式会社 接着剤、異種材料接着用接着剤、接着シート、および異種材料接着用接着シート
WO2022220285A1 (ja) * 2021-04-16 2022-10-20 昭和電工マテリアルズ株式会社 硬化剤、接着剤組成物、回路接続用接着剤フィルム、接続構造体及び接続構造体の製造方法
US20240209182A1 (en) * 2021-04-16 2024-06-27 Resonac Corporation Hardener, adhesive composition, adhesive film for circuit connection, connected structure, and method for producing connected structure

Also Published As

Publication number Publication date
JPWO2023136272A1 (ja) 2023-07-20
KR20240134151A (ko) 2024-09-06
WO2023136273A1 (ja) 2023-07-20
CN118525070A (zh) 2024-08-20
TW202341186A (zh) 2023-10-16
CN118742619A (zh) 2024-10-01
CN118510859A (zh) 2024-08-16
JPWO2023136286A1 (ja) 2023-07-20
WO2023136286A1 (ja) 2023-07-20
KR20240134938A (ko) 2024-09-10
CN118715300A (zh) 2024-09-27
JPWO2023136274A1 (ja) 2023-07-20
JPWO2023136273A1 (ja) 2023-07-20
WO2023136274A1 (ja) 2023-07-20
KR20240134924A (ko) 2024-09-10
WO2023136272A1 (ja) 2023-07-20

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