TW202328382A - 暫時保護材 - Google Patents

暫時保護材 Download PDF

Info

Publication number
TW202328382A
TW202328382A TW111134937A TW111134937A TW202328382A TW 202328382 A TW202328382 A TW 202328382A TW 111134937 A TW111134937 A TW 111134937A TW 111134937 A TW111134937 A TW 111134937A TW 202328382 A TW202328382 A TW 202328382A
Authority
TW
Taiwan
Prior art keywords
weight
acid
protective material
temporary protective
polyvinyl alcohol
Prior art date
Application number
TW111134937A
Other languages
English (en)
Chinese (zh)
Inventor
米田義和
山田佑
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW202328382A publication Critical patent/TW202328382A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/02—Homopolymers or copolymers of unsaturated alcohols
    • C09J129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Formation Of Insulating Films (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW111134937A 2021-09-16 2022-09-15 暫時保護材 TW202328382A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2021-151025 2021-09-16
JP2021151025 2021-09-16
JP2022-089670 2022-06-01
JP2022089670A JP7185086B1 (ja) 2021-09-16 2022-06-01 仮保護材

Publications (1)

Publication Number Publication Date
TW202328382A true TW202328382A (zh) 2023-07-16

Family

ID=84327875

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111134937A TW202328382A (zh) 2021-09-16 2022-09-15 暫時保護材

Country Status (3)

Country Link
JP (2) JP7185086B1 (https=)
TW (1) TW202328382A (https=)
WO (1) WO2023042839A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024068722A (ja) * 2022-11-09 2024-05-21 日東電工株式会社 保護シート、及び、電子部品装置の製造方法
KR20260042344A (ko) * 2023-07-21 2026-03-31 세키스이가가쿠 고교가부시키가이샤 가보호재 및 가보호재 용액

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60112875A (ja) * 1983-11-24 1985-06-19 Mitsubishi Rayon Co Ltd 保護シ−ト用糊剤及びそれを用いた表面保護合成樹脂成形品
JP2767196B2 (ja) * 1994-02-08 1998-06-18 日化精工株式会社 仮止め用接着剤
WO2010047253A1 (ja) * 2008-10-21 2010-04-29 株式会社クラレ 積層フィルム
JP5563341B2 (ja) * 2010-03-18 2014-07-30 株式会社クラレ 半導体ウエハーの分割方法
JP6242776B2 (ja) * 2014-09-26 2017-12-06 富士フイルム株式会社 保護膜組成物、半導体装置の製造方法およびレーザーダイシング方法
JP6055494B2 (ja) * 2015-01-27 2016-12-27 碁達科技股▲ふん▼有限公司 レーザーダイシング方法
JP6533149B2 (ja) * 2015-11-18 2019-06-19 日本酢ビ・ポバール株式会社 半導体レーザーダイシング用保護剤及びそれを用いた半導体の製造方法
JP6533150B2 (ja) * 2015-11-18 2019-06-19 日本酢ビ・ポバール株式会社 半導体レーザーダイシング用保護剤及びそれを用いた半導体の製造方法
EP3435156A1 (de) * 2017-07-26 2019-01-30 Covestro Deutschland AG Schutzschicht für photopolymer
TWM578701U (zh) * 2019-02-01 2019-06-01 吳坤發 Wafer protective film structure

Also Published As

Publication number Publication date
JP2023043826A (ja) 2023-03-29
JP7185086B1 (ja) 2022-12-06
JPWO2023042839A1 (https=) 2023-03-23
WO2023042839A1 (ja) 2023-03-23

Similar Documents

Publication Publication Date Title
TW202328382A (zh) 暫時保護材
JP5841536B2 (ja) 透明粘着テープ、金属薄膜付フィルム積層体、カバーパネル−タッチパネルモジュール積層体、カバーパネル−ディスプレイパネルモジュール積層体、タッチパネルモジュール−ディスプレイパネルモジュール積層体、及び、画像表示装置
TWI512073B (zh) 用於具抗靜電特性的保護膜之壓敏性黏合劑組成物及彼之製造方法
CN102791817B (zh) 光学构件用粘合剂组合物以及光学构件用粘合带
TW201026808A (en) Adhesive tape or sheet
JP4874896B2 (ja) 伝導性高分子コーティング組成物、それを利用したコーティングフィルムの製造方法及びそのコーティングフィルム
CN105531340B (zh) 丙烯酸酯乳液粘合剂及其制备方法
CN104114660B (zh) 粘合剂组合物以及粘合片
JP5563341B2 (ja) 半導体ウエハーの分割方法
TW201141882A (en) Polyvinyl alcohol-based polymer film
JP2007119646A (ja) 接着剤組成物および接着フィルム
CN116829298A (zh) 半导体转印用助焊剂片
CN118256125A (zh) 一种等离子体切割保护液及其制备方法和应用
TW202328383A (zh) 暫時保護材
CN103467890A (zh) 一种可剥离保护膜及其组合物配方
TW202330846A (zh) 暫時保護材
JP2023043860A (ja) 仮保護材
JP2023043859A (ja) 仮保護材
TWI797152B (zh) 黏著劑組成物、黏著帶及半導體裝置之保護方法
JP7190610B1 (ja) ワーク加工用シート
JP7675533B2 (ja) ワーク加工用シート
JP2023043861A (ja) 接着用プライマー、電子部品の製造方法
TWI897860B (zh) 黏著帶及黏著帶捲體
TW201200573A (en) Thermo-setting double-sided adhesive film excellent in adhesive property and heat resistance
CN118834637B (zh) 一种低残粘压敏胶黏剂的制备方法