JP7185086B1 - 仮保護材 - Google Patents

仮保護材 Download PDF

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Publication number
JP7185086B1
JP7185086B1 JP2022089670A JP2022089670A JP7185086B1 JP 7185086 B1 JP7185086 B1 JP 7185086B1 JP 2022089670 A JP2022089670 A JP 2022089670A JP 2022089670 A JP2022089670 A JP 2022089670A JP 7185086 B1 JP7185086 B1 JP 7185086B1
Authority
JP
Japan
Prior art keywords
protective material
weight
temporary protective
acid
polyvinyl alcohol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022089670A
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English (en)
Japanese (ja)
Other versions
JP2023043826A (ja
Inventor
義和 米田
佑 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2022566150A priority Critical patent/JPWO2023042839A1/ja
Priority to PCT/JP2022/034337 priority patent/WO2023042839A1/ja
Priority to TW111134937A priority patent/TW202328382A/zh
Application granted granted Critical
Publication of JP7185086B1 publication Critical patent/JP7185086B1/ja
Publication of JP2023043826A publication Critical patent/JP2023043826A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
    • C09J129/02—Homopolymers or copolymers of unsaturated alcohols
    • C09J129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
  • Formation Of Insulating Films (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2022089670A 2021-09-16 2022-06-01 仮保護材 Active JP7185086B1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022566150A JPWO2023042839A1 (https=) 2021-09-16 2022-09-14
PCT/JP2022/034337 WO2023042839A1 (ja) 2021-09-16 2022-09-14 仮保護材
TW111134937A TW202328382A (zh) 2021-09-16 2022-09-15 暫時保護材

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021151025 2021-09-16
JP2021151025 2021-09-16

Publications (2)

Publication Number Publication Date
JP7185086B1 true JP7185086B1 (ja) 2022-12-06
JP2023043826A JP2023043826A (ja) 2023-03-29

Family

ID=84327875

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022089670A Active JP7185086B1 (ja) 2021-09-16 2022-06-01 仮保護材
JP2022566150A Pending JPWO2023042839A1 (https=) 2021-09-16 2022-09-14

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022566150A Pending JPWO2023042839A1 (https=) 2021-09-16 2022-09-14

Country Status (3)

Country Link
JP (2) JP7185086B1 (https=)
TW (1) TW202328382A (https=)
WO (1) WO2023042839A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024101171A1 (ja) * 2022-11-09 2024-05-16 日東電工株式会社 保護シート、及び、電子部品装置の製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20260042344A (ko) * 2023-07-21 2026-03-31 세키스이가가쿠 고교가부시키가이샤 가보호재 및 가보호재 용액

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011198875A (ja) 2010-03-18 2011-10-06 Kuraray Co Ltd 半導体ウエハーの分割方法
JP2017098299A (ja) 2015-11-18 2017-06-01 日本酢ビ・ポバール株式会社 半導体レーザーダイシング用保護剤及びそれを用いた半導体の製造方法
JP3221770U (ja) 2019-02-01 2019-06-20 呉坤発 ウェハーの保護膜構造

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60112875A (ja) * 1983-11-24 1985-06-19 Mitsubishi Rayon Co Ltd 保護シ−ト用糊剤及びそれを用いた表面保護合成樹脂成形品
JP2767196B2 (ja) * 1994-02-08 1998-06-18 日化精工株式会社 仮止め用接着剤
WO2010047253A1 (ja) * 2008-10-21 2010-04-29 株式会社クラレ 積層フィルム
JP6242776B2 (ja) * 2014-09-26 2017-12-06 富士フイルム株式会社 保護膜組成物、半導体装置の製造方法およびレーザーダイシング方法
JP6055494B2 (ja) * 2015-01-27 2016-12-27 碁達科技股▲ふん▼有限公司 レーザーダイシング方法
JP6533149B2 (ja) * 2015-11-18 2019-06-19 日本酢ビ・ポバール株式会社 半導体レーザーダイシング用保護剤及びそれを用いた半導体の製造方法
EP3435156A1 (de) * 2017-07-26 2019-01-30 Covestro Deutschland AG Schutzschicht für photopolymer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011198875A (ja) 2010-03-18 2011-10-06 Kuraray Co Ltd 半導体ウエハーの分割方法
JP2017098299A (ja) 2015-11-18 2017-06-01 日本酢ビ・ポバール株式会社 半導体レーザーダイシング用保護剤及びそれを用いた半導体の製造方法
JP3221770U (ja) 2019-02-01 2019-06-20 呉坤発 ウェハーの保護膜構造

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024101171A1 (ja) * 2022-11-09 2024-05-16 日東電工株式会社 保護シート、及び、電子部品装置の製造方法

Also Published As

Publication number Publication date
JP2023043826A (ja) 2023-03-29
JPWO2023042839A1 (https=) 2023-03-23
WO2023042839A1 (ja) 2023-03-23
TW202328382A (zh) 2023-07-16

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