JPWO2023042839A1 - - Google Patents
Info
- Publication number
- JPWO2023042839A1 JPWO2023042839A1 JP2022566150A JP2022566150A JPWO2023042839A1 JP WO2023042839 A1 JPWO2023042839 A1 JP WO2023042839A1 JP 2022566150 A JP2022566150 A JP 2022566150A JP 2022566150 A JP2022566150 A JP 2022566150A JP WO2023042839 A1 JPWO2023042839 A1 JP WO2023042839A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
- C09J129/02—Homopolymers or copolymers of unsaturated alcohols
- C09J129/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
- Formation Of Insulating Films (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021151025 | 2021-09-16 | ||
| JP2022089670A JP7185086B1 (ja) | 2021-09-16 | 2022-06-01 | 仮保護材 |
| PCT/JP2022/034337 WO2023042839A1 (ja) | 2021-09-16 | 2022-09-14 | 仮保護材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023042839A1 true JPWO2023042839A1 (https=) | 2023-03-23 |
| JPWO2023042839A5 JPWO2023042839A5 (https=) | 2024-06-07 |
Family
ID=84327875
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022089670A Active JP7185086B1 (ja) | 2021-09-16 | 2022-06-01 | 仮保護材 |
| JP2022566150A Pending JPWO2023042839A1 (https=) | 2021-09-16 | 2022-09-14 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022089670A Active JP7185086B1 (ja) | 2021-09-16 | 2022-06-01 | 仮保護材 |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP7185086B1 (https=) |
| TW (1) | TW202328382A (https=) |
| WO (1) | WO2023042839A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024068722A (ja) * | 2022-11-09 | 2024-05-21 | 日東電工株式会社 | 保護シート、及び、電子部品装置の製造方法 |
| KR20260042344A (ko) * | 2023-07-21 | 2026-03-31 | 세키스이가가쿠 고교가부시키가이샤 | 가보호재 및 가보호재 용액 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60112875A (ja) * | 1983-11-24 | 1985-06-19 | Mitsubishi Rayon Co Ltd | 保護シ−ト用糊剤及びそれを用いた表面保護合成樹脂成形品 |
| JP2767196B2 (ja) * | 1994-02-08 | 1998-06-18 | 日化精工株式会社 | 仮止め用接着剤 |
| WO2010047253A1 (ja) * | 2008-10-21 | 2010-04-29 | 株式会社クラレ | 積層フィルム |
| JP5563341B2 (ja) * | 2010-03-18 | 2014-07-30 | 株式会社クラレ | 半導体ウエハーの分割方法 |
| JP6242776B2 (ja) * | 2014-09-26 | 2017-12-06 | 富士フイルム株式会社 | 保護膜組成物、半導体装置の製造方法およびレーザーダイシング方法 |
| JP6055494B2 (ja) * | 2015-01-27 | 2016-12-27 | 碁達科技股▲ふん▼有限公司 | レーザーダイシング方法 |
| JP6533149B2 (ja) * | 2015-11-18 | 2019-06-19 | 日本酢ビ・ポバール株式会社 | 半導体レーザーダイシング用保護剤及びそれを用いた半導体の製造方法 |
| JP6533150B2 (ja) * | 2015-11-18 | 2019-06-19 | 日本酢ビ・ポバール株式会社 | 半導体レーザーダイシング用保護剤及びそれを用いた半導体の製造方法 |
| EP3435156A1 (de) * | 2017-07-26 | 2019-01-30 | Covestro Deutschland AG | Schutzschicht für photopolymer |
| TWM578701U (zh) * | 2019-02-01 | 2019-06-01 | 吳坤發 | Wafer protective film structure |
-
2022
- 2022-06-01 JP JP2022089670A patent/JP7185086B1/ja active Active
- 2022-09-14 JP JP2022566150A patent/JPWO2023042839A1/ja active Pending
- 2022-09-14 WO PCT/JP2022/034337 patent/WO2023042839A1/ja not_active Ceased
- 2022-09-15 TW TW111134937A patent/TW202328382A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023043826A (ja) | 2023-03-29 |
| JP7185086B1 (ja) | 2022-12-06 |
| WO2023042839A1 (ja) | 2023-03-23 |
| TW202328382A (zh) | 2023-07-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20221028 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250611 |