TW202314909A - 用於有角基板的去塗層裝置 - Google Patents

用於有角基板的去塗層裝置 Download PDF

Info

Publication number
TW202314909A
TW202314909A TW111126649A TW111126649A TW202314909A TW 202314909 A TW202314909 A TW 202314909A TW 111126649 A TW111126649 A TW 111126649A TW 111126649 A TW111126649 A TW 111126649A TW 202314909 A TW202314909 A TW 202314909A
Authority
TW
Taiwan
Prior art keywords
substrate
head
decoating
stripping
stripping head
Prior art date
Application number
TW111126649A
Other languages
English (en)
Chinese (zh)
Inventor
皮爾明 莫夫勒
Original Assignee
德商奧西里斯國際股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102022117344.5A external-priority patent/DE102022117344A1/de
Application filed by 德商奧西里斯國際股份有限公司 filed Critical 德商奧西里斯國際股份有限公司
Publication of TW202314909A publication Critical patent/TW202314909A/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H10P70/54—Cleaning of wafer edges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32366—Localised processing
    • H01J37/32385—Treating the edge of the workpieces

Landscapes

  • Manufacturing Of Printed Circuit Boards (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW111126649A 2021-07-15 2022-07-15 用於有角基板的去塗層裝置 TW202314909A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102021118379.0 2021-07-15
DE102021118379 2021-07-15
DE102022117344.5A DE102022117344A1 (de) 2021-07-15 2022-07-12 Vorrichtung zum Entschichten von eckigen Substraten
DE102022117344.5 2022-07-12

Publications (1)

Publication Number Publication Date
TW202314909A true TW202314909A (zh) 2023-04-01

Family

ID=82851773

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111126649A TW202314909A (zh) 2021-07-15 2022-07-15 用於有角基板的去塗層裝置

Country Status (5)

Country Link
US (1) US20240326103A1 (enExample)
EP (1) EP4371149A1 (enExample)
JP (1) JP2024526780A (enExample)
TW (1) TW202314909A (enExample)
WO (1) WO2023285689A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12138745B2 (en) 2023-03-22 2024-11-12 Yield Engineering Systems, Inc. Apparatus and method for coating removal
US20260054350A1 (en) * 2024-08-21 2026-02-26 Yield Engineering Systems, Inc. Edge zone coating removal with warpage compensation

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3407835B2 (ja) * 1995-03-09 2003-05-19 東京応化工業株式会社 基板端縁部被膜の除去方法及び除去装置
US5993552A (en) * 1996-08-08 1999-11-30 Tokyo Electron Ltd Processing apparatus
JP3469788B2 (ja) * 1997-08-26 2003-11-25 東京エレクトロン株式会社 薄膜除去方法及びその装置
JPH1176908A (ja) * 1997-09-04 1999-03-23 Tokyo Electron Ltd 塗布膜形成装置及びその方法並びに基板搬送装置
JP4601452B2 (ja) * 2005-02-22 2010-12-22 大日本スクリーン製造株式会社 基板処理装置
JP4830523B2 (ja) * 2006-02-08 2011-12-07 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及びその方法を実施するためのコンピュータプログラム。
JP4761381B2 (ja) * 2006-08-01 2011-08-31 東京エレクトロン株式会社 薄膜除去装置及び薄膜除去方法
JP4720812B2 (ja) * 2007-10-09 2011-07-13 東京エレクトロン株式会社 塗布膜除去方法
DE102012103330A1 (de) 2012-03-29 2013-10-02 solar-semi GmbH Vorrichtung zum Entfernen einer Beschichtung von einem Substrat und Verfahren

Also Published As

Publication number Publication date
WO2023285689A1 (de) 2023-01-19
EP4371149A1 (de) 2024-05-22
US20240326103A1 (en) 2024-10-03
JP2024526780A (ja) 2024-07-19

Similar Documents

Publication Publication Date Title
CN104014497B (zh) 喷嘴组件、基板处理设备以及处理基板的方法
JP3405312B2 (ja) 塗布膜除去装置
TWI530364B (zh) 噴砂切削加工方法
US8343284B2 (en) Film removing device and film removing method
TW200534925A (en) Nozzle cleaning apparatus and substrate processing apparatus
US20240326103A1 (en) Apparatus for removing coatings from angular substrates
TW202546909A (zh) 基板處理方法、記錄媒體及基板處理裝置
TWI745830B (zh) 液處理裝置及液處理方法
JP2001284777A (ja) 基板処理装置及び基板処理方法
JP2004152849A (ja) 液処理装置及び液処理方法
JPH09289161A (ja) 処理液塗布装置
CN113823550B (zh) 一种晶圆边缘上的可旋涂硬掩模去除方法
JP2006026549A (ja) 洗浄方法及びそれを実施するための洗浄装置
CN117716482A (zh) 用于对有棱角的基体进行去涂层的设备
JP4147721B2 (ja) 洗浄装置及びエッチング装置並びに洗浄方法及びエッチング方法
JP2009289803A (ja) ウエット処理方法及びウエット処理装置
JP6814847B2 (ja) 現像方法
JP2002141269A (ja) 基板処理装置および基板処理方法
CN101266414A (zh) 液体处理装置
JP4363593B2 (ja) 薄膜除去装置
JP3165883B2 (ja) フォトレジスト除去方法および装置
KR100534099B1 (ko) 포토레지스트 현상장비
KR20020088589A (ko) 매엽식 반도체 웨이퍼용 약액 분사노즐
JP2020150190A (ja) 基板処理装置および基板処理方法
JPH08264923A (ja) 基板端面洗浄方法およびその装置