JP2024526780A - 角形の基板からコーティングを除去するための装置 - Google Patents

角形の基板からコーティングを除去するための装置 Download PDF

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Publication number
JP2024526780A
JP2024526780A JP2024502110A JP2024502110A JP2024526780A JP 2024526780 A JP2024526780 A JP 2024526780A JP 2024502110 A JP2024502110 A JP 2024502110A JP 2024502110 A JP2024502110 A JP 2024502110A JP 2024526780 A JP2024526780 A JP 2024526780A
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JP
Japan
Prior art keywords
substrate
coating removal
coating
removal head
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024502110A
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English (en)
Japanese (ja)
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JP2024526780A5 (enExample
Inventor
ムフラー プリミン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osiris International GmbH
Original Assignee
Osiris International GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102022117344.5A external-priority patent/DE102022117344A1/de
Application filed by Osiris International GmbH filed Critical Osiris International GmbH
Publication of JP2024526780A publication Critical patent/JP2024526780A/ja
Publication of JP2024526780A5 publication Critical patent/JP2024526780A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H10P70/54—Cleaning of wafer edges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32366—Localised processing
    • H01J37/32385—Treating the edge of the workpieces

Landscapes

  • Manufacturing Of Printed Circuit Boards (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2024502110A 2021-07-15 2022-07-15 角形の基板からコーティングを除去するための装置 Pending JP2024526780A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102021118379.0 2021-07-15
DE102021118379 2021-07-15
DE102022117344.5A DE102022117344A1 (de) 2021-07-15 2022-07-12 Vorrichtung zum Entschichten von eckigen Substraten
DE102022117344.5 2022-07-12
PCT/EP2022/069938 WO2023285689A1 (de) 2021-07-15 2022-07-15 Vorrichtung zum entschichten von eckigen substraten

Publications (2)

Publication Number Publication Date
JP2024526780A true JP2024526780A (ja) 2024-07-19
JP2024526780A5 JP2024526780A5 (enExample) 2025-07-23

Family

ID=82851773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024502110A Pending JP2024526780A (ja) 2021-07-15 2022-07-15 角形の基板からコーティングを除去するための装置

Country Status (5)

Country Link
US (1) US20240326103A1 (enExample)
EP (1) EP4371149A1 (enExample)
JP (1) JP2024526780A (enExample)
TW (1) TW202314909A (enExample)
WO (1) WO2023285689A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12138745B2 (en) 2023-03-22 2024-11-12 Yield Engineering Systems, Inc. Apparatus and method for coating removal
US20260054350A1 (en) * 2024-08-21 2026-02-26 Yield Engineering Systems, Inc. Edge zone coating removal with warpage compensation

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3407835B2 (ja) * 1995-03-09 2003-05-19 東京応化工業株式会社 基板端縁部被膜の除去方法及び除去装置
US5993552A (en) * 1996-08-08 1999-11-30 Tokyo Electron Ltd Processing apparatus
JP3469788B2 (ja) * 1997-08-26 2003-11-25 東京エレクトロン株式会社 薄膜除去方法及びその装置
JPH1176908A (ja) * 1997-09-04 1999-03-23 Tokyo Electron Ltd 塗布膜形成装置及びその方法並びに基板搬送装置
JP4601452B2 (ja) * 2005-02-22 2010-12-22 大日本スクリーン製造株式会社 基板処理装置
JP4830523B2 (ja) * 2006-02-08 2011-12-07 東京エレクトロン株式会社 塗布、現像装置、塗布、現像方法及びその方法を実施するためのコンピュータプログラム。
JP4761381B2 (ja) * 2006-08-01 2011-08-31 東京エレクトロン株式会社 薄膜除去装置及び薄膜除去方法
JP4720812B2 (ja) * 2007-10-09 2011-07-13 東京エレクトロン株式会社 塗布膜除去方法
DE102012103330A1 (de) 2012-03-29 2013-10-02 solar-semi GmbH Vorrichtung zum Entfernen einer Beschichtung von einem Substrat und Verfahren

Also Published As

Publication number Publication date
WO2023285689A1 (de) 2023-01-19
TW202314909A (zh) 2023-04-01
EP4371149A1 (de) 2024-05-22
US20240326103A1 (en) 2024-10-03

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