TW202300241A - 清洗系統及清洗方法 - Google Patents
清洗系統及清洗方法 Download PDFInfo
- Publication number
- TW202300241A TW202300241A TW111106942A TW111106942A TW202300241A TW 202300241 A TW202300241 A TW 202300241A TW 111106942 A TW111106942 A TW 111106942A TW 111106942 A TW111106942 A TW 111106942A TW 202300241 A TW202300241 A TW 202300241A
- Authority
- TW
- Taiwan
- Prior art keywords
- cleaning
- substrate
- opening
- rollers
- cleaning unit
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 196
- 238000000034 method Methods 0.000 title claims description 31
- 239000000758 substrate Substances 0.000 claims abstract description 133
- 239000007788 liquid Substances 0.000 claims description 55
- 238000011144 upstream manufacturing Methods 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- 239000002245 particle Substances 0.000 description 13
- 238000009434 installation Methods 0.000 description 7
- 230000032258 transport Effects 0.000 description 7
- 239000010419 fine particle Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000006378 damage Effects 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000001154 acute effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/024332 WO2023275927A1 (ja) | 2021-06-28 | 2021-06-28 | 洗浄システム及び洗浄方法 |
WOPCT/JP2021/24332 | 2021-06-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202300241A true TW202300241A (zh) | 2023-01-01 |
Family
ID=84690996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111106942A TW202300241A (zh) | 2021-06-28 | 2022-02-25 | 清洗系統及清洗方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7348388B2 (ja) |
KR (1) | KR20230143999A (ja) |
CN (1) | CN219040417U (ja) |
TW (1) | TW202300241A (ja) |
WO (1) | WO2023275927A1 (ja) |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10296200A (ja) | 1997-04-30 | 1998-11-10 | Shibaura Eng Works Co Ltd | 超音波洗浄方法およびその洗浄装置 |
JP2000254605A (ja) * | 1999-03-11 | 2000-09-19 | Ricoh Co Ltd | 可撓性基板の洗浄装置 |
JP2001029908A (ja) * | 1999-07-23 | 2001-02-06 | Dainippon Screen Mfg Co Ltd | 超音波処理装置および超音波処理装置の動作監視方法 |
JP2001170583A (ja) * | 1999-12-15 | 2001-06-26 | Kanegafuchi Chem Ind Co Ltd | 超音波洗浄装置及び超音波洗浄方法 |
JP2001340820A (ja) * | 2000-05-31 | 2001-12-11 | Shibaura Mechatronics Corp | 超音波洗浄装置 |
JP2005309180A (ja) * | 2004-04-23 | 2005-11-04 | Seiko Epson Corp | 基板の洗浄方法、基板の製造方法および基板の洗浄装置 |
JP2020203234A (ja) * | 2019-06-14 | 2020-12-24 | 凸版印刷株式会社 | 現像処理装置、及びそれを用いた表示装置の製造方法 |
JP7293896B2 (ja) * | 2019-06-17 | 2023-06-20 | マックス株式会社 | ラベルプリンタ、プログラム |
-
2021
- 2021-06-28 JP JP2022515843A patent/JP7348388B2/ja active Active
- 2021-06-28 KR KR1020237011698A patent/KR20230143999A/ko active Search and Examination
- 2021-06-28 WO PCT/JP2021/024332 patent/WO2023275927A1/ja active Application Filing
- 2021-06-28 CN CN202190000377.0U patent/CN219040417U/zh active Active
-
2022
- 2022-02-25 TW TW111106942A patent/TW202300241A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JPWO2023275927A1 (ja) | 2023-01-05 |
WO2023275927A1 (ja) | 2023-01-05 |
KR20230143999A (ko) | 2023-10-13 |
CN219040417U (zh) | 2023-05-16 |
JP7348388B2 (ja) | 2023-09-20 |
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