TW202226330A - 電子裝置積層體之透明基材之洗淨台、洗淨裝置及洗淨方法 - Google Patents

電子裝置積層體之透明基材之洗淨台、洗淨裝置及洗淨方法 Download PDF

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Publication number
TW202226330A
TW202226330A TW110118418A TW110118418A TW202226330A TW 202226330 A TW202226330 A TW 202226330A TW 110118418 A TW110118418 A TW 110118418A TW 110118418 A TW110118418 A TW 110118418A TW 202226330 A TW202226330 A TW 202226330A
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TW
Taiwan
Prior art keywords
electronic device
cleaning
outer peripheral
transparent substrate
device laminate
Prior art date
Application number
TW110118418A
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English (en)
Chinese (zh)
Other versions
TWI856250B (zh
Inventor
大江智久
羽渕浩三
寺野翔
岡本健太
Original Assignee
日商淀川美科股份有限公司
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Application filed by 日商淀川美科股份有限公司 filed Critical 日商淀川美科股份有限公司
Publication of TW202226330A publication Critical patent/TW202226330A/zh
Application granted granted Critical
Publication of TWI856250B publication Critical patent/TWI856250B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B5/00—Cleaning by methods involving the use of air flow or gas flow
    • B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Liquid Crystal (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW110118418A 2020-12-25 2021-05-21 電子裝置積層體之透明基材之洗淨台、洗淨裝置及洗淨方法 TWI856250B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020216712A JP6986781B1 (ja) 2020-12-25 2020-12-25 電子デバイス積層体の洗浄テーブル、洗浄装置及び洗浄方法
JP2020-216712 2020-12-25

Publications (2)

Publication Number Publication Date
TW202226330A true TW202226330A (zh) 2022-07-01
TWI856250B TWI856250B (zh) 2024-09-21

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Also Published As

Publication number Publication date
KR20230127866A (ko) 2023-09-01
WO2022137588A1 (ja) 2022-06-30
JP6986781B1 (ja) 2021-12-22
CN114981929A (zh) 2022-08-30
JP2022102149A (ja) 2022-07-07

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