TW202208449A - 光與濕氣硬化型樹脂組成物、電子零件用接著劑、硬化物及電子零件 - Google Patents

光與濕氣硬化型樹脂組成物、電子零件用接著劑、硬化物及電子零件 Download PDF

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TW202208449A
TW202208449A TW110117743A TW110117743A TW202208449A TW 202208449 A TW202208449 A TW 202208449A TW 110117743 A TW110117743 A TW 110117743A TW 110117743 A TW110117743 A TW 110117743A TW 202208449 A TW202208449 A TW 202208449A
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Taiwan
Prior art keywords
moisture
curable resin
meth
acrylate
resin composition
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TW110117743A
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English (en)
Chinese (zh)
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石立涼馬
塩島元美
河田晋治
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日商積水化學工業股份有限公司
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Publication of TW202208449A publication Critical patent/TW202208449A/zh

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/006Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30Low-molecular-weight compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30Low-molecular-weight compounds
    • C08G18/302Water
    • C08G18/307Atmospheric humidity
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymerisation Methods In General (AREA)
  • Materials For Photolithography (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
TW110117743A 2020-05-15 2021-05-17 光與濕氣硬化型樹脂組成物、電子零件用接著劑、硬化物及電子零件 TW202208449A (zh)

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JP2020086327 2020-05-15
JPJP2020-086327 2020-05-15

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TW202208449A true TW202208449A (zh) 2022-03-01

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TW110117744A TW202208582A (zh) 2020-05-15 2021-05-17 光與濕氣硬化型樹脂組成物、電子零件用接著劑、硬化物及電子零件
TW110117742A TW202208448A (zh) 2020-05-15 2021-05-17 光與濕氣硬化型樹脂組成物、電子零件用接著劑、硬化物及電子零件
TW110117743A TW202208449A (zh) 2020-05-15 2021-05-17 光與濕氣硬化型樹脂組成物、電子零件用接著劑、硬化物及電子零件

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TW110117744A TW202208582A (zh) 2020-05-15 2021-05-17 光與濕氣硬化型樹脂組成物、電子零件用接著劑、硬化物及電子零件
TW110117742A TW202208448A (zh) 2020-05-15 2021-05-17 光與濕氣硬化型樹脂組成物、電子零件用接著劑、硬化物及電子零件

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JP (3) JPWO2021230372A1 (ja)
KR (3) KR20230010619A (ja)
CN (4) CN115135676B (ja)
TW (3) TW202208582A (ja)
WO (3) WO2021230372A1 (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023112873A1 (ja) * 2021-12-13 2023-06-22 積水化学工業株式会社 接着剤組成物、電子部品用接着剤及び携帯電子機器用接着剤
JPWO2023153514A1 (ja) * 2022-02-14 2023-08-17
WO2024143421A1 (ja) * 2022-12-27 2024-07-04 積水化学工業株式会社 接着剤組成物、硬化体、及び電子機器用接着剤

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05171128A (ja) * 1991-12-25 1993-07-09 Sekisui Chem Co Ltd 湿気硬化型ホットメルト接着剤組成物
CN1524104A (zh) * 2001-04-09 2004-08-25 ��Ԩ��ѧ��ҵ��ʽ���� 光反应性组合物
JP5834606B2 (ja) * 2011-08-05 2015-12-24 Dic株式会社 紫外線硬化型粘着剤用樹脂組成物、粘着剤及び積層体
CN103450817B (zh) * 2012-06-01 2017-07-04 汉高股份有限公司 粘合剂组合物
WO2015056478A1 (ja) * 2013-10-15 2015-04-23 Dic株式会社 樹脂組成物
JP6510788B2 (ja) 2014-10-03 2019-05-08 積水化学工業株式会社 光湿気硬化型樹脂組成物
JP2016074891A (ja) * 2014-10-03 2016-05-12 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
JP2016147969A (ja) * 2015-02-12 2016-08-18 積水化学工業株式会社 光湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
MX2018007927A (es) * 2016-01-22 2018-08-09 Henkel IP & Holding GmbH Composiciones adhesivas opticamente transparentes de doble curado.
JP2019006854A (ja) 2017-06-21 2019-01-17 日立化成株式会社 反応性ホットメルト接着剤組成物及び被着体の接着方法
JP2020045403A (ja) * 2018-09-18 2020-03-26 積水化学工業株式会社 硬化性樹脂組成物、硬化体、電子部品及び組立部品
WO2020085284A1 (ja) * 2018-10-23 2020-04-30 積水化学工業株式会社 硬化性樹脂組成物、及び硬化体
CN113302249B (zh) * 2019-01-18 2023-07-07 积水化学工业株式会社 光湿固化性树脂组合物及固化体

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Publication number Publication date
JPWO2021230371A1 (ja) 2021-11-18
KR20230010619A (ko) 2023-01-19
KR20230013014A (ko) 2023-01-26
JPWO2021230372A1 (ja) 2021-11-18
KR20230013015A (ko) 2023-01-26
CN115175945B (zh) 2024-09-03
TW202208448A (zh) 2022-03-01
CN115135676A (zh) 2022-09-30
CN118271531A (zh) 2024-07-02
CN115135676B (zh) 2024-09-17
TW202208582A (zh) 2022-03-01
WO2021230373A1 (ja) 2021-11-18
JPWO2021230373A1 (ja) 2021-11-18
WO2021230372A1 (ja) 2021-11-18
WO2021230371A1 (ja) 2021-11-18
CN115151578B (zh) 2024-04-23
CN115175945A (zh) 2022-10-11
CN115151578A (zh) 2022-10-04

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