TW202129292A - 檢查用插座 - Google Patents

檢查用插座 Download PDF

Info

Publication number
TW202129292A
TW202129292A TW109145500A TW109145500A TW202129292A TW 202129292 A TW202129292 A TW 202129292A TW 109145500 A TW109145500 A TW 109145500A TW 109145500 A TW109145500 A TW 109145500A TW 202129292 A TW202129292 A TW 202129292A
Authority
TW
Taiwan
Prior art keywords
package
pressing
inspection target
contact probe
axis
Prior art date
Application number
TW109145500A
Other languages
English (en)
Chinese (zh)
Inventor
奥野剛欣
薄田光二
Original Assignee
日商友華股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商友華股份有限公司 filed Critical 日商友華股份有限公司
Publication of TW202129292A publication Critical patent/TW202129292A/zh

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for unleaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)
TW109145500A 2020-01-30 2020-12-22 檢查用插座 TW202129292A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-013689 2020-01-30
JP2020013689A JP2021120924A (ja) 2020-01-30 2020-01-30 検査用ソケット

Publications (1)

Publication Number Publication Date
TW202129292A true TW202129292A (zh) 2021-08-01

Family

ID=77078884

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109145500A TW202129292A (zh) 2020-01-30 2020-12-22 檢查用插座

Country Status (5)

Country Link
US (1) US20230050000A1 (https=)
JP (1) JP2021120924A (https=)
CN (1) CN115023865A (https=)
TW (1) TW202129292A (https=)
WO (1) WO2021153061A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102788961B1 (ko) * 2022-08-02 2025-04-01 주식회사 오킨스전자 반도체 패키지 테스트 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5476211A (en) * 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
JP2000195626A (ja) * 1998-12-25 2000-07-14 Yokowo Co Ltd Ｉｃソケットおよびｉｃソケットへのｉｃパッケ―ジの装着機構
US7247035B2 (en) * 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US6917525B2 (en) * 2001-11-27 2005-07-12 Nanonexus, Inc. Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
JP2002043004A (ja) * 2000-07-19 2002-02-08 Nec Yamagata Ltd Ｉｃソケット
TWM253096U (en) * 2003-10-31 2004-12-11 Hon Hai Prec Ind Co Ltd LGA socket
JP2006200975A (ja) * 2005-01-19 2006-08-03 Matsushita Electric Ind Co Ltd 半導体装置の検査方法および検査装置および接触端子
JP4825610B2 (ja) * 2006-07-27 2011-11-30 株式会社ヨコオ 検査用ソケット
US9766268B2 (en) * 2006-12-21 2017-09-19 Essai, Inc. Contactor with angled spring probes
US7479794B2 (en) * 2007-02-28 2009-01-20 Sv Probe Pte Ltd Spring loaded probe pin assembly
TWM361740U (en) * 2008-12-22 2009-07-21 Hon Hai Prec Ind Co Ltd Electrical connector
JP5636908B2 (ja) * 2010-11-24 2014-12-10 富士通株式会社 ソケットおよび電子装置
JP5991823B2 (ja) * 2012-02-14 2016-09-14 株式会社日本マイクロニクス 電気的接続装置及びその組立方法

Also Published As

Publication number Publication date
JP2021120924A (ja) 2021-08-19
WO2021153061A1 (ja) 2021-08-05
CN115023865A (zh) 2022-09-06
US20230050000A1 (en) 2023-02-16

Similar Documents

Publication Publication Date Title
KR101245837B1 (ko) 반도체 패키지 테스트용 소켓장치
KR100910196B1 (ko) 소켓
KR102520051B1 (ko) 테스트 소켓 및 반도체 패키지 테스트 방법
KR20020096892A (ko) 전기부품용 소켓
CN109406835B (zh) 电连接装置
CN101523229A (zh) 电连接装置
WO2017051625A1 (ja) インターフェース装置、インターフェースユニット、プローブ装置及び接続方法
KR102806902B1 (ko) 프로브 핀
US12158493B2 (en) Wafer inspection system and annular seat thereof
JP2016095141A (ja) 半導体デバイスの検査ユニット
JP2015121476A (ja) コンタクトプローブ及び電気部品用ソケット
JP2004309496A (ja) ボールグリッドアレイデバイスの取付装置
JP5673366B2 (ja) 半導体素子用ソケット
TW202129292A (zh) 檢查用插座
KR101041219B1 (ko) 검사용 컨택모듈
KR101212945B1 (ko) 수직형 프로브를 갖는 검사용 소켓
KR101778608B1 (ko) 전기 신호 연결용 마이크로 컨택터
KR20190114589A (ko) 반도체 디바이스 검사용 인서트, 베이스 및 테스트 소켓
CN112470011B (zh) 接触针及电子部件用插座
JPH08273777A (ja) Ｉｃソケット
JP7444659B2 (ja) コンタクトピン及びソケット
TW202321705A (zh) 具垂直逆止的外殼
KR200313240Y1 (ko) 볼 그리드 어레이(ｂｇａ) 패키지용 테스트 소켓
KR101498687B1 (ko) 검사장치
KR102738445B1 (ko) 카메라 모듈의 측면 저항 측정을 위한 사이드 컨텍 소켓