CN115023865A - 检查用插座 - Google Patents

检查用插座 Download PDF

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Publication number
CN115023865A
CN115023865A CN202080094969.3A CN202080094969A CN115023865A CN 115023865 A CN115023865 A CN 115023865A CN 202080094969 A CN202080094969 A CN 202080094969A CN 115023865 A CN115023865 A CN 115023865A
Authority
CN
China
Prior art keywords
package
pressing
inspection target
inspection
socket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080094969.3A
Other languages
English (en)
Chinese (zh)
Inventor
奥野刚欣
薄田光二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokowo Co Ltd
Original Assignee
Yokowo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokowo Co Ltd filed Critical Yokowo Co Ltd
Publication of CN115023865A publication Critical patent/CN115023865A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for unleaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)
CN202080094969.3A 2020-01-30 2020-12-16 检查用插座 Pending CN115023865A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-013689 2020-01-30
JP2020013689A JP2021120924A (ja) 2020-01-30 2020-01-30 検査用ソケット
PCT/JP2020/046951 WO2021153061A1 (ja) 2020-01-30 2020-12-16 検査用ソケット

Publications (1)

Publication Number Publication Date
CN115023865A true CN115023865A (zh) 2022-09-06

Family

ID=77078884

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080094969.3A Pending CN115023865A (zh) 2020-01-30 2020-12-16 检查用插座

Country Status (5)

Country Link
US (1) US20230050000A1 (https=)
JP (1) JP2021120924A (https=)
CN (1) CN115023865A (https=)
TW (1) TW202129292A (https=)
WO (1) WO2021153061A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102788961B1 (ko) * 2022-08-02 2025-04-01 주식회사 오킨스전자 반도체 패키지 테스트 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195626A (ja) * 1998-12-25 2000-07-14 Yokowo Co Ltd Ｉｃソケットおよびｉｃソケットへのｉｃパッケ―ジの装着機構
JP2002043004A (ja) * 2000-07-19 2002-02-08 Nec Yamagata Ltd Ｉｃソケット
JP2006200975A (ja) * 2005-01-19 2006-08-03 Matsushita Electric Ind Co Ltd 半導体装置の検査方法および検査装置および接触端子
US20090230983A1 (en) * 2006-07-27 2009-09-17 Yokowo Co., Ltd Socket for inspection
US20180172730A1 (en) * 2006-12-21 2018-06-21 Essai, Inc. Contactor with angled depressible probes

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5476211A (en) * 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US7247035B2 (en) * 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US6917525B2 (en) * 2001-11-27 2005-07-12 Nanonexus, Inc. Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
TWM253096U (en) * 2003-10-31 2004-12-11 Hon Hai Prec Ind Co Ltd LGA socket
US7479794B2 (en) * 2007-02-28 2009-01-20 Sv Probe Pte Ltd Spring loaded probe pin assembly
TWM361740U (en) * 2008-12-22 2009-07-21 Hon Hai Prec Ind Co Ltd Electrical connector
JP5636908B2 (ja) * 2010-11-24 2014-12-10 富士通株式会社 ソケットおよび電子装置
JP5991823B2 (ja) * 2012-02-14 2016-09-14 株式会社日本マイクロニクス 電気的接続装置及びその組立方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195626A (ja) * 1998-12-25 2000-07-14 Yokowo Co Ltd Ｉｃソケットおよびｉｃソケットへのｉｃパッケ―ジの装着機構
JP2002043004A (ja) * 2000-07-19 2002-02-08 Nec Yamagata Ltd Ｉｃソケット
JP2006200975A (ja) * 2005-01-19 2006-08-03 Matsushita Electric Ind Co Ltd 半導体装置の検査方法および検査装置および接触端子
US20090230983A1 (en) * 2006-07-27 2009-09-17 Yokowo Co., Ltd Socket for inspection
US20180172730A1 (en) * 2006-12-21 2018-06-21 Essai, Inc. Contactor with angled depressible probes

Also Published As

Publication number Publication date
JP2021120924A (ja) 2021-08-19
WO2021153061A1 (ja) 2021-08-05
TW202129292A (zh) 2021-08-01
US20230050000A1 (en) 2023-02-16

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20220906

WD01 Invention patent application deemed withdrawn after publication