TW202128874A - 熱固性片材及切晶黏晶膜 - Google Patents
熱固性片材及切晶黏晶膜 Download PDFInfo
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- TW202128874A TW202128874A TW109137118A TW109137118A TW202128874A TW 202128874 A TW202128874 A TW 202128874A TW 109137118 A TW109137118 A TW 109137118A TW 109137118 A TW109137118 A TW 109137118A TW 202128874 A TW202128874 A TW 202128874A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019203291A JP7210421B2 (ja) | 2019-11-08 | 2019-11-08 | 熱硬化性シート及びダイシングダイボンドフィルム |
JP2019-203291 | 2019-11-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202128874A true TW202128874A (zh) | 2021-08-01 |
Family
ID=73059471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109137118A TW202128874A (zh) | 2019-11-08 | 2020-10-26 | 熱固性片材及切晶黏晶膜 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20210139745A1 (ja) |
EP (1) | EP3819349A1 (ja) |
JP (1) | JP7210421B2 (ja) |
CN (1) | CN112778694A (ja) |
TW (1) | TW202128874A (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7190418B2 (ja) * | 2019-11-08 | 2022-12-15 | 日東電工株式会社 | 熱硬化性シート及びダイシングダイボンドフィルム |
JP2022069969A (ja) * | 2020-10-26 | 2022-05-12 | 日東電工株式会社 | 熱硬化性シート、ダイシングダイボンドフィルム、及び、半導体装置 |
JP2023076124A (ja) | 2021-11-22 | 2023-06-01 | 日東電工株式会社 | ダイシングダイボンドフィルム |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0616524B2 (ja) | 1984-03-12 | 1994-03-02 | 日東電工株式会社 | 半導体ウエハ固定用接着薄板 |
JP2004303628A (ja) * | 2003-03-31 | 2004-10-28 | Sumitomo Osaka Cement Co Ltd | 金属被覆金属微粒子とその製造方法及びそれを含有する透明導電膜形成用塗料及び導電性接着材料、及びそれを用いた透明導電膜並びに表示装置 |
JP4895994B2 (ja) | 2006-12-28 | 2012-03-14 | 株式会社日立製作所 | 金属粒子を用いた接合方法及び接合材料 |
JP5859949B2 (ja) * | 2012-09-27 | 2016-02-16 | 三ツ星ベルト株式会社 | 導電性組成物 |
JP2017031227A (ja) * | 2013-12-13 | 2017-02-09 | 日立化成株式会社 | 接着剤組成物及びそれを用いた半導体装置 |
JP2015129227A (ja) * | 2014-01-08 | 2015-07-16 | 日東電工株式会社 | 導電性フィルム状接着剤及びフィルム状接着剤付きダイシングテープ |
JP6360157B2 (ja) | 2014-04-04 | 2018-07-18 | 京セラ株式会社 | 熱硬化性樹脂組成物、半導体装置及び電気・電子部品 |
JP6380792B2 (ja) * | 2014-09-04 | 2018-08-29 | 日立化成株式会社 | 銀ペースト及びそれを用いた半導体装置、並びに銀ペーストの製造方法 |
JP6396189B2 (ja) * | 2014-11-27 | 2018-09-26 | 日東電工株式会社 | 導電性フィルム状接着剤、フィルム状接着剤付きダイシングテープ及び半導体装置の製造方法 |
JP6505571B2 (ja) | 2015-09-30 | 2019-04-24 | 日東電工株式会社 | 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート |
JP6005313B1 (ja) * | 2016-02-10 | 2016-10-12 | 古河電気工業株式会社 | 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム |
JP6918445B2 (ja) * | 2016-06-24 | 2021-08-11 | 日東電工株式会社 | 加熱接合用シート及びダイシングテープ付き加熱接合用シート |
JP6858519B2 (ja) * | 2016-09-21 | 2021-04-14 | 日東電工株式会社 | 加熱接合用シート及びダイシングテープ付き加熱接合用シート |
JP2019021813A (ja) | 2017-07-19 | 2019-02-07 | 住友ベークライト株式会社 | ダイシング・ダイボンディングフィルムおよび熱硬化型ダイボンディングフィルム用フィルム状接着剤 |
CN111033640A (zh) | 2017-09-27 | 2020-04-17 | 京瓷株式会社 | 膏组合物、半导体装置以及电气电子部件 |
JP7266023B2 (ja) * | 2018-04-10 | 2023-04-27 | タツタ電線株式会社 | 導電性塗料及び該導電性塗料を用いたシールドパッケージの製造方法 |
US11594513B2 (en) | 2018-04-27 | 2023-02-28 | Nitto Denko Corporation | Manufacturing method for semiconductor device |
JP7190418B2 (ja) * | 2019-11-08 | 2022-12-15 | 日東電工株式会社 | 熱硬化性シート及びダイシングダイボンドフィルム |
-
2019
- 2019-11-08 JP JP2019203291A patent/JP7210421B2/ja active Active
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2020
- 2020-10-21 US US17/076,061 patent/US20210139745A1/en not_active Abandoned
- 2020-10-26 TW TW109137118A patent/TW202128874A/zh unknown
- 2020-10-30 CN CN202011185403.XA patent/CN112778694A/zh active Pending
- 2020-11-02 EP EP20205292.4A patent/EP3819349A1/en active Pending
Also Published As
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JP7210421B2 (ja) | 2023-01-23 |
US20210139745A1 (en) | 2021-05-13 |
CN112778694A (zh) | 2021-05-11 |
JP2021077765A (ja) | 2021-05-20 |
EP3819349A1 (en) | 2021-05-12 |
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