JP6918445B2 - 加熱接合用シート及びダイシングテープ付き加熱接合用シート - Google Patents
加熱接合用シート及びダイシングテープ付き加熱接合用シート Download PDFInfo
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- JP6918445B2 JP6918445B2 JP2016125322A JP2016125322A JP6918445B2 JP 6918445 B2 JP6918445 B2 JP 6918445B2 JP 2016125322 A JP2016125322 A JP 2016125322A JP 2016125322 A JP2016125322 A JP 2016125322A JP 6918445 B2 JP6918445 B2 JP 6918445B2
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Images
Classifications
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- C—CHEMISTRY; METALLURGY
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- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- C—CHEMISTRY; METALLURGY
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- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
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Description
前記前駆層は、焼結性金属粒子と有機成分とを含み、
大気雰囲気下、10℃/minの昇温速度の条件にて前記加熱接合用シートの熱重量測定を行った際の前記有機成分の95%重量消失温度が150℃以上300℃以下である。
ダイシングテープと、
前記ダイシングテープ上に積層された当該加熱接合用シートと
を有する。
本実施形態に係る加熱接合用シートは、以下に説明するダイシングテープ付き加熱接合用シートにおいて、ダイシングテープが貼り合わせられていない状態のものを挙げることができる。従って、以下では、ダイシングテープ付き加熱接合用シートについて説明し、加熱接合用シートについては、その中で説明することとする。図1は、本発明の一実施形態に係るダイシングテープ付き加熱接合用シートを示す断面模式図である。図2は、本発明の他の実施形態に係る他のダイシングテープ付き加熱接合用シートを示す断面模式図である。
加熱接合用シート3、3’は、シート状である。ペーストではなく、シートであるため、良好な厚み均一性とハンドリング性とを得られる。
また、本実施形態では、加熱接合用シートが、加熱により焼結層となる前駆層からなる場合について説明するが、本発明はこの例に限定されない。本発明の加熱接合用シートは、2層以上であってもよい。例えば、加熱により焼結層となる前駆層と、その他の層(加熱により焼結層とならない層)とが積層された構成であってもよい。
すなわち、本発明における加熱接合用シートは、少なくとも加熱により焼結層となる前駆層を有していればよく、その他の構成は特に限定されない。
加熱により焼結層となる前駆層31(以下、単に「前駆層31」ともいう)は、焼結性金属粒子と有機成分とを含む(各成分の詳細は後述)。前駆層31において、大気雰囲気下、10℃/minの昇温速度の条件にて前記加熱接合用シートの熱重量測定を行った際の前記有機成分の95%重量消失温度が150℃以上300℃以下である。前記95%重量消失温度は200℃以上が好ましく、250℃以上がより好ましい。一方、前記95%重量消失温度は280℃以下が好ましく、290℃以下がより好ましい。95%重量消失温度を上記範囲内の温度に加熱することにより前駆層中の有機成分の重量の少なくとも95%が消失することになる。有機成分が焼結性金属粒子の焼結温度と同等か、それより低い95%重量消失温度を有することで、焼結性金属粒子の焼結の前にほとんどの有機成分を分割消失させることができ、焼結性金属粒子の焼結をスムーズに進行させることができる。95%重量消失温度が低過ぎると、加熱接合までの熱負荷により有機成分の不用意な分解消失を引き起こしてしまい、所期のシート特性を得られないおそれがある。また、95%重量消失温度が高過ぎると、焼結性金属粒子の焼結時にも有機成分が存在することになって焼結を阻害してしまい、接合信頼性を低下させてしまう。
(1)試験試料として、厚み200μm、幅10mm、長さ40mmの加熱接合用シート(引張試験用加熱接合用シート)を準備し、
(2)チャック間距離10mm、引張速度50mm/分、23℃の条件で引張試験を行い、
(3)得られた応力−ひずみ線図の直線部分の傾きを引張弾性率とする。
前記焼結性金属粒子としては、金属微粒子の凝集体を好適に使用できる。金属微粒子としては、金属からなる微粒子などが挙げられる。前記金属としては、金、銀、銅、酸化銀、酸化銅などが挙げられる。なかでも、銀、銅、酸化銀、酸化銅からなる群より選ばれる少なくとも1種であることが好ましい。前記金属微粒子が、銀、銅、酸化銀、酸化銅からなる群より選ばれる少なくとも1種であると、より好適に加熱接合することができる。
前記有機成分は、有機バインダーと塩基性物質とを含むことが好ましい。塩基性物質の存在により有機バインダーの分解消失を促進させることができ、焼結性金属粒子をよりスムーズに焼結させることができる。
前記脂肪族ポリカーボネートとしては、例えば、ポリエチレンカーボネート、ポリプロピレンカーボネート等が挙げられる。なかでも、シート形成のためのワニス作製における有機溶剤への溶解性の観点から、ポリプロピレンカーボネートが好ましい。
前記芳香族ポリカーボネートとしては、例えば、主鎖にビスフェノールA構造を含むもの等が挙げられる。
前記ポリカーボネートの重量平均分子量は、10,000〜1,000,000の範囲内であることが好適である。なお、重量平均分子量は、GPC(ゲル・パーミエーション・クロマトグラフィー)により測定し、ポリスチレン換算により算出された値である。
また、アクリル樹脂のなかでも、200℃〜400℃で熱分解するアクリル樹脂が好ましい。
ダイシングテープ11は基材1上に粘着剤層2を積層して構成されている。
まず、基材1は、従来公知の製膜方法により製膜することができる。当該製膜方法としては、例えばカレンダー製膜法、有機溶媒中でのキャスティング法、密閉系でのインフレーション押出法、Tダイ押出法、共押出し法、ドライラミネート法等が例示できる。
ダイシングテープ付き加熱接合用シート10においては、加熱接合用シート3がセパレータで覆われていることが好ましい。例えば、ダイシングテープ11と加熱接合用シート3とを貼り合わせた後、加熱接合用シート3に積層されていた前記基材セパレータを剥離し、前基材セパレータを剥離した後のダイシングテープ付き加熱接合用シート10の加熱接合用シート3の露出面に、セパレータを貼り付ける方法が挙げられる。すなわち、ダイシングテープ11、加熱接合用シート3、及び、前記セパレータがこの順で積層された形態とすることが好ましい。
加熱接合用シートは、ダイシングテープが貼り合わせられていない形態とする場合、2枚のセパレータに挟まれた両面セパレータ付き加熱接合用シートとすることが好ましい。すなわち、第1のセパレータ、加熱接合用シート、及び、第2のセパレータがこの順で積層された両面セパレータ付き加熱接合用シートとすることが好ましい。
図3は、両面セパレータ付き加熱接合用シートの一実施形態を示す断面模式図である。
図3に示す両面セパレータ付き加熱接合用シート30は、第1のセパレータ32、加熱接合用シート3、及び、第2のセパレータ34がこの順で積層された構成を有する。第1のセパレータ32、及び、第2のセパレータ34としては、前記基材セパレータと同一のものを使用することができる。
なお、加熱接合用シートは、ダイシングテープが貼り合わせられていない形態とする場合、加熱接合用シートの一方の面にのみセパレータが積層された形態であってもよい。
本実施形態に係る半導体装置の製造方法は、前記加熱接合用シートを準備する工程と、
前記加熱接合用シートを介して、半導体チップを被着体上に加熱接合する加熱接合工程とを含む(以下、第1製法ともいう)。
また、本実施形態に係る半導体装置の製造方法は、前記に記載のダイシングテープ付き加熱接合用シートを準備する工程と、
前記ダイシングテープ付き加熱接合用シートの加熱接合用シートと、半導体ウェハの裏面とを貼り合わせる貼り合わせ工程と、
前記半導体ウェハを前記加熱接合用シートと共にダイシングして、チップ状の半導体チップを形成するダイシング工程と、
前記半導体チップを、前記ダイシングテープ付き加熱接合用シートから前記加熱接合用シートと共にピックアップするピックアップ工程と、
前記加熱接合用シートを介して、前記半導体チップを被着体上に加熱接合する加熱接合工程とを含むものでもある(以下、第2製法ともいう)。
第1製法に係る半導体装置の製造方法は、第2製法に係る半導体装置の製造方法が、ダイシングテープ付き加熱接合用シートを用いているのに対して、第1製法に係る半導体装置の製造方法では、加熱接合用シートを単体で用いている点で異なりその他の点で共通する。第1製法に係る半導体装置の製造方法においては、加熱接合用シートを準備した後、これをダイシングテープと貼り合わせる工程を行なえば、その後は、第2製法に係る半導体装置の製造方法と同様とすることができる。そこで、以下では、第2製法に係る半導体装置の製造方法について説明することとする。
また、本発明の加熱接合用シート、及び、ダイシングテープ付き加熱接合用シートは、上記に例示した用途に限定されず、2つのものを加熱接合するのに利用することができる。
焼結性金属粒子含有ペースト:応用ナノ粒子研究所製のANP−1
熱分解性バインダー:PPC(ポリプロピレンカーボネート樹脂)、Empower社製、「QPAC40」、23℃で固形
塩基性物質:トリエタノールアミン(TEA):東京化成工業株式会社製
塩基性物質:トリオクチルアミン(TOA):東京化成工業株式会社製
塩基性物質:トリブチルアミン(TBA):東京化成工業株式会社製
有機溶剤:メチルエチルケトン(MEK)
焼結性金属粒子含有ペースト、表1に示す熱分解性バインダー及び塩基性物質をそれぞれ表1に示す配合量にて、有機溶剤とともに自転・公転ミキサー(シンキー製、ARE−310)に投入し、2000rpmで8分撹拌し、ワニスを作製した。得られたワニスを、離型処理フィルム(三菱樹脂(株)製、「MRA38」)上に塗布・乾燥させた。塗布はアプリケーターを用い、乾燥後の塗膜の厚みが45μmとなるように行った。乾燥は防爆乾燥機にて行った。乾燥条件は110℃で5分とした。これにより、実施例及び比較例に係る厚み45μmの加熱接合用シートを得た。
以下の項目について、実施例及び比較例のサンプルを評価した。それぞれの結果を表1に示す。
熱重量測定法による有機成分の95%重量消失温度の測定には、Rigaku製のTG8120を用いた。加熱接合用シート(焼結前)を10mg、アルミ製の容器に入れ、大気雰囲気下、昇温速度10℃/minで、温度範囲25℃から500℃で測定を行い、試料の重量変化を測定した。有機成分の重量消失量として、500℃の時点での重量消失量を100%とし、これに対し重量の95%を消失する温度を読み取ることで95%重量消失温度とした。図5に実施例1の加熱接合用シートについての熱重量測定により得られたグラフを示す。
裏面にTi層(厚み50nm)とAg層(厚み100nm)とがこの順で形成されたシリコンチップ(シリコンチップの厚み350μm、縦5mm、横5mm)を準備した。準備したシリコンチップのAg層面に、作製した加熱接合用シートを重ねた。この状態で、ラミネーターに通した。ラミネーターの条件は、温度70℃、圧力0.3MPa、速度10mm/秒とした。
実施例1〜3では信頼性評価は良好であった。一方、比較例1〜2では信頼性評価が劣っていた。図6A及び6Bの超音波画像においても、実施例2では残存接合面積率が50%であるのに対し、比較例1では10%であった。これは、比較例1〜2のいずれも有機成分の95%重量消失温度が300℃を超えており、有機成分による焼結性金属粒子の焼結の阻害が生じたことに起因すると推察される。
2 粘着剤層
3、3’ 加熱接合用シート
4 半導体ウェハ
5 半導体チップ
6 被着体
7 ボンディングワイヤー
8 封止樹脂
10、12 ダイシングテープ付き加熱接合用シート
11 ダイシングテープ
30 両面セパレータ付き加熱接合用シート
31 加熱により焼結層となる前駆層
32 第1のセパレータ
34 第2のセパレータ
Claims (2)
- 加熱により焼結層となる前駆層を有する加熱接合用シートであって、
前記前駆層は、焼結性金属粒子と、有機成分として有機バインダーと塩基性物質とを含み、前記有機バインダーが23℃で固形の熱分解性バインダーであり、前記塩基性物質がトリオクチルアミンであり、
大気雰囲気下、10℃/minの昇温速度の条件にて前記加熱接合用シートの熱重量測定を行った際の前記有機成分の95%重量消失温度が150℃以上300℃以下である加熱接合用シート。 - ダイシングテープと、
前記ダイシングテープ上に積層された請求項1に記載の加熱接合用シートと
を有するダイシングテープ付き加熱接合用シート。
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US16/308,937 US20190311936A1 (en) | 2016-06-24 | 2017-05-23 | Thermal bonding sheet and thermal bonding sheet with dicing tape |
CN201780039011.2A CN109451762B (zh) | 2016-06-24 | 2017-05-23 | 加热接合用片及带有切割带的加热接合用片 |
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JP6000771B2 (ja) * | 2012-09-12 | 2016-10-05 | 住友精化株式会社 | 金属ペースト組成物 |
JP6542504B2 (ja) * | 2013-02-20 | 2019-07-10 | 日東電工株式会社 | フィルム状接着剤、フィルム状接着剤付きダイシングテープ、半導体装置の製造方法、及び半導体装置 |
CN105473257B (zh) * | 2013-09-05 | 2018-11-13 | 汉高知识产权控股有限责任公司 | 金属烧结膜组合物 |
JP6382228B2 (ja) * | 2014-08-29 | 2018-08-29 | 古河電気工業株式会社 | 導電性接着フィルム |
JP6682235B2 (ja) * | 2014-12-24 | 2020-04-15 | 日東電工株式会社 | 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート |
JP6505571B2 (ja) * | 2015-09-30 | 2019-04-24 | 日東電工株式会社 | 加熱接合用シート、及び、ダイシングテープ付き加熱接合用シート |
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US20190311936A1 (en) | 2019-10-10 |
EP3477689A1 (en) | 2019-05-01 |
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EP3477689A4 (en) | 2019-08-21 |
EP3477689B1 (en) | 2020-07-29 |
TWI773672B (zh) | 2022-08-11 |
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