TW202106897A - 無方向性電磁鋼板及其製造方法 - Google Patents
無方向性電磁鋼板及其製造方法 Download PDFInfo
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Abstract
本發明提供一種即使減薄絕緣被膜,該被膜之密接性亦優良的無方向性電磁鋼板。本發明之無方向性電磁鋼板係在鋼板的至少單面具有絕緣被膜之電磁鋼板,其中前述絕緣被膜係在表面側及與基底鐵之界面側雙方,具有較前述基底鐵中的P濃度更高的P濃度的P增濃層。
Description
本發明係關於無方向性電磁鋼板及其製造方法。
無方向性電磁鋼板係廣泛使用於作為馬達等的鐵心材料之軟磁性材料的一種。近年來,電動車或油電混合車漸趨實用化,馬達的驅動系統愈來愈發達,而有馬達的驅動頻率逐年增加的傾向。目前驅動頻率一般為數百~數kHz,高頻區域之鐵心的鐵損特性愈來愈受重視。因此,有人探討藉由添加Si及Al等的合金元素或減少板厚等,來降低高頻區域的鐵損。此外,亦有人探討藉由控制板厚方向的Si濃度分布,來改善高頻區域的鐵損特性之技術等。
此等技術當中,減少板厚由於對改善高頻區域中的鐵損之效果極大,故近年來於電磁鋼板薄板化正在進展。另一方面,卻有因薄板化,而導致層合電磁鋼板所製成之馬達芯的佔空因數降低之課題,在製造馬達時發生轉矩降低等問題。其原因在於,形成於鋼板表面之絕緣被膜的厚度不變,板厚卻變薄,使得除絕緣被膜外之電磁鋼板部分佔鐵心中的相對比例降低。基於如上述之背景,為了不使佔空因數降低,形成於電磁鋼板的表面之絕緣被膜便要求比至今為止更薄。為了滿足絕緣被膜的薄膜化,有探討各種技術。
例如,專利文獻1中記載使絕緣被膜中含有20mg/m2
以上160mg/m2
以下的C,來製造絕緣被膜之密接性優良的電磁鋼板之技術。
先前技術文獻
專利文獻
專利文獻1:日本專利第3603385號公報
發明所欲解決之課題
然而,至今為止之技術,在減薄絕緣被膜時無法充分確保鋼板與絕緣被膜之密接性,而不足以改善板厚較薄之電磁鋼板的佔空因數。
本發明係有鑑於上述問題而完成者,其係以提供即使減薄絕緣被膜,該被膜之密接性亦優良的電磁鋼板及其製造方法為目的。
解決課題之手段
本案發明人等為解決上述課題而著眼於絕緣被膜的表面,以及電磁鋼板與絕緣被膜之界面的P(磷)之增濃狀態,致力進行研究。經研究的結果新發現,藉由在絕緣被膜之表面側,及與構成電磁鋼板的基底鐵之界面側雙方使P增濃,可獲得絕緣被膜之優良密接性,而終致完成本發明。就其機制,發明人等係如下推斷。藉由在絕緣被膜的表面側及與基底鐵之界面側雙方使P增濃,被膜本身即變得更強固,且在與基底鐵之界面側經增濃的P可發揮作為基底鐵及絕緣被膜間的黏結劑之作用。藉此效果,可獲得具有絕緣被膜本身即使較薄,但仍為強固且密接性高之絕緣被膜的電磁鋼板。與絕緣被膜為有機系、無機系或其混合等、種類或構造等無關,均可獲得此效果。
再者,作為在與絕緣被膜的基底鐵之界面側使P增濃之方法,可使以鋼胚為代表之出鋼成分含有0.005~0.20質量%的P並於1100℃以上進行最終精製退火,亦可使用最終冷軋之軋油中以1%以上之濃度含有磷酸酯型乳化劑的軋油,使P附著於鋼板表面。甚而,實施在最終精製退火與最終冷軋之間塗佈含有5質量份以上之磷酸化合物的水溶液並使其乾燥之步驟,亦能夠在與絕緣被膜的基底鐵之界面側形成P增濃層,可獲得發明之效果。
另一方面,絕緣被膜的表面側之P增濃層,在形成絕緣被膜的過程中,若塗佈液使用添加有1質量份以上之磷酸化合物等者,則在該液體的乾燥時P會浮起至絕緣被膜的表面,而能夠形成增濃層。
透過以上之組合,藉由在絕緣被膜的表面側及與基底鐵之界面側雙方形成P增濃層,可獲得絕緣被膜即使較薄,被膜密接性亦優良的電磁鋼板。
以下記載本發明之要旨構成。
(1)一種無方向性電磁鋼板,其係在鋼板的至少單面具有絕緣被膜之電磁鋼板,其中前述絕緣被膜係在表面側及與基底鐵之界面側雙方,具有較前述基底鐵中的P濃度更高的P濃度的P增濃層。
(2)如前述(1)之無方向性電磁鋼板,其中前述鋼板係具有以下成分組成:
含有以質量%計,
C:未達0.010%、
Si:1.5%以上10.0%以下、
Al:0.001%以上2.0%以下及
Mn:0.005%以上1.0%以下
,且其餘部分為Fe及無可避免之雜質。
(3)如前述(2)之無方向性電磁鋼板,其中前述鋼板進一步含有以質量%計,
P:0.005%以上0.20%以下。
(4)如前述(2)或(3)之無方向性電磁鋼板,其中前述成分組成進一步含有以質量%計,
Sn:0.002%以上0.10%以下、
Mo:0.005%以上0.10%以下、
Sb:0.005%以上0.30%以下、
Cu:0.01%以上0.50%以下、
Cr:0.01%以上0.50%以下、
Ni:0.010%以上1.0%以下
中的1種以上。
(5)如前述(1)至(4)中任一項之無方向性電磁鋼板,其中前述絕緣被膜係在前述與基底鐵之界面側具有Fe的增濃層。
(6)如前述(1)至(5)中任一項之無方向性電磁鋼板,其中前述鋼板的厚度為0.20mm以下。
(7)如前述(1)至(6)中任一項之無方向性電磁鋼板,其中前述鋼板係具有Si濃度從前述鋼板的表面側向前述鋼板的中心部側降低的濃度梯度,且該濃度梯度中之鋼板表層與鋼板中心層的Si濃度差為1.0~5.0質量%。
(8)一種無方向性電磁鋼板之製造方法,其係如前述(1)至(7)中任一項之電磁鋼板之製造方法,其中在對該電磁鋼板用之鋼胚實施熱軋、冷軋,之後最終精製退火而製成最終精製退火板,且於該最終精製退火板的表面形成絕緣被膜之步驟中,
前述冷軋係使用含有1%以上之磷酸酯型乳化劑的軋油來進行,
前述絕緣被膜的形成係塗佈含有1質量份以上之磷酸化合物的液體來進行。
(9)一種無方向性電磁鋼板之製造方法,其係如前述(1)至(7)中任一項之電磁鋼板之製造方法,其中在對該電磁鋼板用之鋼胚實施熱軋、冷軋,之後最終精製退火而製成最終精製退火板,且於該最終精製退火板的表面形成絕緣被膜之步驟中,
具有在前述冷軋後且前述最終精製退火前,對經過前述冷軋之鋼板的表面塗佈含有5質量份以上之磷酸化合物的水溶液並使其乾燥之步驟,
前述絕緣被膜的形成係塗佈含有1質量份以上之磷酸化合物的液體來進行。
(10)一種無方向性電磁鋼板之製造方法,其係如前述(1)至(7)中任一項之電磁鋼板之製造方法,其中在對該電磁鋼板用之鋼胚實施熱軋、冷軋,之後最終精製退火而製成最終精製退火板,且於該最終精製退火板的表面形成絕緣被膜之步驟中,
前述冷軋係使用含有1%以上之磷酸酯型乳化劑的軋油來進行,
具有在前述冷軋後且前述最終精製退火前,對經過前述冷軋之鋼板的表面塗佈含有5質量份以上之磷酸化合物的水溶液並使其乾燥之步驟,
前述絕緣被膜的形成係塗佈含有1質量份以上之磷酸化合物的液體來進行。
(11)一種無方向性電磁鋼板之製造方法,其係如前述(1)至(7)中任一項之電磁鋼板之製造方法,其中在對該電磁鋼板用之鋼胚實施熱軋、冷軋,之後最終精製退火而製成最終精製退火板,且於該最終精製退火板的表面形成絕緣被膜之步驟中,
使前述鋼胚含有0.005~0.20質量%的P,並將前述最終精製退火的退火溫度設為1100℃以上,
前述絕緣被膜的形成係塗佈含有1質量份以上之磷酸化合物的液體來進行。
(12)如前述(11)之電磁鋼板之製造方法,其中,
前述冷軋係使用含有1%以上之磷酸酯型乳化劑的軋油來進行。
(13)如前述(11)或(12)之電磁鋼板之製造方法,其中,
具有在前述冷軋後且前述最終精製退火前,對經過前述冷軋之鋼板的表面塗佈含有5質量份以上之磷酸化合物的水溶液並使其乾燥之步驟。
(14)如前述(8)至(13)中任一項之無方向性電磁鋼板之製造方法,其中在對前述電磁鋼板用之鋼胚實施熱軋、冷軋,之後最終精製退火而製成最終精製退火板,且於該最終精製退火板的表面形成絕緣被膜之步驟中,
在前述最終精製退火後實施滲矽處理,或使前述最終精製退火作為兼作滲矽處理的最終精製退火。
發明之效果
根據本發明,無方向性電磁鋼板由於具有無關絕緣被膜的種類,即使較薄也不會損及被膜密接性的絕緣被膜,對於板厚較薄的電磁鋼板,可改善習知問題之佔空因數低的情形。
[實施發明之形態]
本發明其特徵為在附絕緣被膜之無方向性電磁鋼板中,絕緣被膜具有以下所示構成,作為絕緣被膜之母板的電磁鋼板無需特別限定,只要依循一般的電磁鋼即可。
[絕緣被膜係在表面側及與基底鐵之界面側雙方,具有高於基底鐵的P濃度之P濃度的P增濃層]
藉由在絕緣被膜的表面側及與基底鐵之界面側雙方使P增濃,被膜即變得強固,且在與基底鐵之界面側經增濃的P可發揮作為基底鐵與絕緣被膜之間的黏結劑之作用。藉此效果,可獲得具有絕緣被膜本身即使較薄,但仍為強固且密接性高之絕緣被膜的電磁鋼板。
此外,絕緣被膜中之P的增濃可利用輝光放電發光光譜儀(Glow Discharge Spectroscopy:GDS)來評定。本實施形態中的GDS評定係利用堀場製作所製GDS-Profiler2,在Ar氣體壓力600Pa、高頻輸出35W的條件下實施,但只要是可進行同等之評定的裝置則不拘其機種。於此,有無P增濃層,只要如下判斷即可。
圖1示出滿足本發明之要件的附絕緣被膜之鋼板之P與Fe的GDS分布測定結果的一例。首先,絕緣被膜之與基底鐵之界面側係指Fe強度朝向絕緣被膜的表面側(換言之,圖1之圖形之分析深度的左側)急遽減少的區域。於此,係將基底鐵區域中之P的寬幅檢測強度設為Ia、絕緣被膜中與基底鐵之界面側的P檢測強度峰值設為Ib、絕緣被膜的表面側的P檢測強度峰值設為Ic。絕緣被膜之與基底鐵之界面側的P增濃層係指滿足下述式(1)的層;絕緣被膜的表面側的P增濃層則指滿足下述式(2)的層。此外,上述之「基底鐵中的P濃度」為上述Ia。從而,P增濃係指滿足下述式(1)及式(2)兩者:
Ib>Ia・・・(1)
Ic>Ia・・・(2)。
[絕緣被膜厚及組成]
絕緣被膜厚較佳為2.0μm以下。膜厚愈薄愈可提升佔空因數,因此更佳為1.0μm以下。雖無較佳之膜厚下限,但只要依據待形成之絕緣被膜的種類而僅限於可確保層間絕緣的薄度即可。作為上述絕緣被膜,可使用有機成分單獨或無機成分單獨、由有機-無機複合物等所構成者。具體而言,有機成分可舉出丙烯酸系、丙烯酸矽系、聚酯系、環氧系、氟系之樹脂等。無機成分可舉出鉻酸鹽系、重鉻酸鹽系、硼酸鹽系、矽酸鹽系等。此外,有機-無機複合物(半有機)可舉出前述之有機成分與無機成分的複合物等。
本發明之無方向性電磁鋼板的成分組成,只要依循一般的電磁鋼板即可,以下就較佳之成分組成加以說明。
C:未達0.010質量%
由於C會引起磁性衰減而使磁特性劣化,故含量愈少愈佳。然而,C量過低則會導致製造成本上升。因此,C量係以定為磁性衰減實用上無問題的未達0.010質量%為宜。C量更佳為未達0.0050質量%。
Si:1.5質量%以上10.0質量%以下
Si係可提高鋼的比電阻,而改善鐵損特性之元素;於本發明中,為了獲得鐵損特性改善效果,較佳含有1.5質量%以上。然而,若使Si含有超過10.0質量%,則飽和磁通密度會顯著降低,在製造馬達時反而會導致轉矩大幅降低。從而,於本發明中,Si量較佳取1.5質量%以上,更佳取2.0質量%以上;較佳取10.0質量%以下,更佳取7.0質量%以下。又,Si量更佳取1.5~10.0質量%的範圍,再更佳取2.0~7.0質量%。此外,此處所稱Si量,係指相對於板厚方向之Si含量的平均值。
Al:0.001質量%以上2.0質量%以下
Al係與Si同樣地可提高鋼的比電阻,而能夠有效改善鐵損之元素。另一方面,若過量添加Al,不僅會使飽和磁通密度降低,其還會與鋼中的N或者去應力退火時因鋼板氮化而產生的N結合而析出AlN,因此較佳取2.0質量%以下,更佳取0.50質量%以下。為了獲得有效改善鐵損的比電阻增加,Al量較佳取0.001質量%以上,更佳取0.002質量%以上。又更佳的是,Al量為0.002~0.50質量%。
Mn:0.005質量%以上1.0質量%以下
為了改善熱軋時的加工性,Mn較佳含有0.005質量%以上,較佳含有1.0質量%以下,更佳以0.005~1.0質量%的範圍含有。這是因為,Mn量若未達0.005質量%,上述加工性改善效果較小;另一方面,若超過1.0質量%,則飽和磁通密度會降低之故。更佳的是,Mn量為0.01質量%以上,為0.30質量%以下,再更佳為0.010~0.30質量%。
P:0.005質量%以上0.20質量%以下
P如後述,為藉由添加於鋼胚中進行熱處理,而在絕緣被膜中之與基底鐵之界面側形成P增濃層的手段之一。又,由於其不僅會影響被膜,對集合組織的改善或比電阻的增加所致之磁特性的改善亦有效地作用,故較佳使P含有0.005質量%以上,更佳含有0.030質量%以上。另一方面,P量若超過0.20質量%則會急遽脆化,而損及製造性或加工性,因此較佳取0.20質量%以下,更佳取0.10質量%以下。P量又更佳為0.030~0.10質量%。
又,作為在絕緣被膜中之與基底鐵之界面側形成P增濃層的手段,亦可舉出使用包含磷酸酯型乳化劑的軋油或對鋼板表面塗佈包含磷酸化合物的水溶液並使其乾燥。此時,未必有使鋼胚中含有P之必要,惟,此時,為了改善集合組織,亦較佳添加0.001質量%以上的P,更佳添加0.10質量%以下,再更佳添加0.001~0.10質量%。
除上述較佳基本成分外,亦可視需求添加以下成分。
Sn:0.002質量%以上、0.10質量%以下;Mo:0.005質量%以上、0.10質量%以下;Sb:0.005質量%以上、0.30質量%以下;Cu:0.01質量%以上、0.50質量%以下;Cr:0.01質量%以上、0.50質量%以下;Ni:0.010質量%以上、1.0質量%以下
由於上述成分皆是為了改善磁特性而有效添加之元素,因此,上述成分中的1種以上更期望以各元素的下限值以上來添加。惟,由於添加過量會導致磁特性劣化或製造性惡化,因此宜在各者所示上限值以下的範圍內添加。
[在與絕緣被膜的基底鐵之界面側具有Fe的增濃層]
如圖1所示實例,在絕緣被膜之與基底鐵之界面側,由於Fe會與P同時增濃,Fe與P之化合物會發揮作為基底鐵與絕緣被膜的黏結劑之作用,於電磁鋼板上成為更強固地形成之絕緣被膜。於此,Fe有無增濃可藉由GDS來評定,當可獲得Fe的峰強度之分析深度與可獲得P的峰強度Ib之分析深度的差為0.5μm以下時,視為絕緣被膜之與基底鐵之界面側具有Fe的增濃層。
[電磁鋼板的厚度]
板厚愈薄則愈有佔空因數降低的問題,因此板厚薄於0.25mm以下時容易獲得本發明之效果。再者,本發明中,板厚為0.20mm以下時可發揮更高的效果。基於此效果之觀點,雖無需設定板厚的下限,但板厚若為0.05mm以下則在芯的製造時所耗費之衝切等的成本會大幅增大,因此較佳為超過0.05mm。
於此,「電磁鋼板的厚度」或簡稱「板厚」,亦包含絕緣被膜的厚度。
[具有Si濃度從鋼板的表面側向鋼板的中心部側降低的濃度梯度,且該濃度梯度中之鋼板表層與鋼板中心層的Si濃度差為1.0~5.0質量%]
藉由在鋼板的板厚方向具有Si濃度梯度,可改善高頻下的鐵損。作為用以實現此濃度梯度中之方法,例如可在含有SiCl4
環境中進行滲矽處理,亦可為採用積層Si濃度不同之材料而使用之包層的製造方法。於此,就Si的濃度差,為了充分獲得渦電流損失的改善效果,下限值較佳取1.0質量%,更佳取1.5質量%。又,就Si的濃度差,為了抑制磁滯損失的劣化,上限值較佳取5.0質量%,更佳取3.5質量%。更佳的是,Si的濃度差為1.5~3.5%。
此外,就「鋼板表層」及「鋼板中心層」,具體而言,係以從鋼板的兩表面(絕緣被膜除外)各達板厚1/3的區域作為「鋼板表層」,並將其餘之板厚1/3的區域定義為「鋼板中心層」。又,鋼板中心層的Si濃度係定為所屬區域中的平均濃度;鋼板表層的Si濃度係定為在兩表面,各自所屬之區域中的平均濃度進一步經過平均的值(換言之,兩表層的平均濃度)。而且,對於上述平均濃度,可使用EPMA測定板厚方向的Si濃度,並由其濃度分布來評定。
[製造方法]
本發明之電磁鋼板可依循常用方法,藉由對電磁鋼板用之鋼胚實施熱軋、冷軋,之後最終精製退火而製成最終精製退火板,且於該最終精製退火板的表面形成絕緣被膜之步驟來製造。
[在與絕緣被膜中的基底鐵之界面側形成P增濃層之方法]
為了在與絕緣被膜中的基底鐵之界面側形成P的增濃層,在上述製造步驟中,需要下述之任一項處理。
・於冷軋時,使用含有1%以上之磷酸酯型乳化劑的軋油
・在前述冷軋後且前述最終精製退火(或滲矽處理)前,對經過前述冷軋之鋼板的表面塗佈含有5質量份以上之磷酸化合物的水溶液並使其乾燥
・使鋼胚含有0.005質量%以上0.20質量%以下的P,並將最終精製退火中的退火溫度設為1100℃以上
[在絕緣被膜的表面側形成P的增濃層之方法]
又,為了在絕緣被膜的表面側形成P的增濃層,而需要下述之處理。
・在絕緣被膜形成步驟中,塗佈含有1質量份以上之磷酸化合物的液體
[滲矽處理]
為了生成前述Si濃度差,可進一步在最終精製退火後進行滲矽處理,或基於降低成本之理由,而使前述最終精製退火作為兼作滲矽處理的最終精製退火。於此,進行滲矽處理時的環境氣體,可使用四氯化矽與氮氣的混合氣體。進行滲矽處理時的熱處理溫度宜為1100~1300℃,退火時間係依據所需之滲矽量而宜為30~120秒。
[形成Fe增濃層之方法]
為了在絕緣被膜中形成Fe增濃層,較佳將滲矽處理溫度或者最終精製退火溫度設為1000℃以上。基於減少高頻下的渦電流損失之理由而需避免使粒徑變大,因此較佳為1300℃以下。
實施例1
將表1所示成分之鋼胚加熱至1200℃並藉由熱軋而得到1.8mm的熱軋板。其次實施1050℃的熱軋板退火後,藉由冷軋分別進行軋製至表1所示板厚(製品板厚)。於此,就部分條件,於冷軋時作為磷酸酯型乳化劑係使用含有1%之ADEKA COL PS807的軋油(稱軋油A),就其他條件,則使用不含磷酸酯型乳化劑之一般的鐵用冷軋油(稱軋油B)。就部分條件,進一步進行在冷軋後最終精製退火前塗佈作為含有5質量份以上之磷酸化合物的水溶液之磷酸Al並使其乾燥之前處理,將其有無在表1之「退火前處理」一欄中表示為「有」、「無」。
其次,在20%H2
-80%N2
乾燥環境下以1000℃×10s之條件施最終精製退火。此外,表1之No.21、23及24係以1100℃×10s之條件,No.25係以950℃×10s之條件實施最終精製退火。
進而,為了形成絕緣被膜,而塗佈含有鉻酸及丙烯酸樹脂之有機・無機複合塗液中添加有1質量份之磷酸Mg的液體後,以300℃進行烘烤而製成電磁鋼板製品。此外,僅有表1之No.22,為了比較而在塗液中未添加磷酸Mg。對由以上所得之電磁鋼板製品評定佔空因數、絕緣被膜之密接性(被膜剝離)及鐵損W10/1000
。佔空因數係以依循JIS C 2550-5,磁特性則以依循JIS C 2550-1之方法來評定。絕緣被膜之密接性的評定係依循JIS K 5600-5-6(交叉切割法),以截切刀對鋼板表面以1mm之間隔劃出6條切痕並黏貼透明膠帶後,藉由將其撕除來評定被膜剝離的狀態。剝離面積相對於交叉切割部分之面積的比例若未達10%係評為良好,若為10%以上則評為不良。進而以GDS評定鋼板表面的被膜構造,進行是否滿足上述式1及式2此兩項之判定,將滿足兩項者表示為○、未滿足其中任一項者表示為×。此外,在具有Fe的峰強度,且Fe的峰強度與P的峰強度Ib之深度差為0.5μm以下時視為具有Fe的增濃層者(Fe峰:有)。
表1示出其結果。除塗佈有機・無機複合塗液中添加有1質量份之磷酸Mg者外,並使用作為磷酸酯型乳化劑之含有1%之ADEKA COL PS807的軋油、進行在冷延後最終精製退火前塗佈作為含有5質量份以上之磷酸化合物的水溶液之磷酸Al並使其乾燥之前處理,或使用使P含有0.005質量%以上0.20質量%以下的鋼胚且在1100℃以上的最終精製退火之任一者時,可獲得滿足式1及式2此兩項的被膜構造,結果可獲得良好的被膜剝離試驗結果。
實施例2
將表2所示成分之鋼胚加熱至1200℃並藉由熱軋而得到1.7mm的熱軋板。其次實施1050℃的熱軋板退火後,藉由冷軋分別進行軋製至表2所示板厚(製品板厚)。於冷軋時,作為磷酸酯型乳化劑係使用含有1%之ADEKA COL PS807的軋油(軋油A)。其次藉由對冷延板在四氯化矽+N2
氣體中實施1200℃×60s的熱處理,來進行兼作滲矽處理的最終精製退火。於此滲矽處理中,係藉由控制爐內的四氯化矽氣體流量,來控制鋼板表層中的Si濃度(表層Si濃度)。板厚方向的Si濃度梯度係藉由EPMA來確認。獲得於鋼板的中心部側之鋼板中心層為母材成分單純的Si濃度,且沿板厚方向具有Si濃度從鋼板的表面側向鋼板的中心部側降低的Si濃度梯度中之鋼板。
進而,塗佈以磷酸Al為主的無機複合塗液中添加有1質量份之磷酸Mg的液體後,以320℃進行烘烤而製成電磁鋼板製品。將對由以上所得之電磁鋼板製品進行與實施例1相同之評定的結果彙整示於表2。
表2示出其結果。與實施例1相同,就具有滿足式1及式2此兩項之被膜構造的無方向性電磁鋼板,可獲得良好的被膜剝離試驗結果。而且,藉由滲矽處理使Si濃度差成為1.0~5.0質量%,可改善鐵損。
[圖1]為表示發明例之GDS測定分布(profile)的圖。
Claims (14)
- 一種無方向性電磁鋼板,其係在鋼板的至少單面具有絕緣被膜之電磁鋼板,其中前述絕緣被膜係在表面側及與基底鐵之界面側雙方,具有較前述基底鐵中的P濃度更高的P濃度的P增濃層。
- 如請求項1之無方向性電磁鋼板,其中前述鋼板係具有以下成分組成: 含有以質量%計, C:未達0.010%、 Si:1.5%以上10.0%以下、 Al:0.001%以上2.0%以下及 Mn:0.005%以上1.0%以下 ,且其餘部分為Fe及無可避免之雜質。
- 如請求項2之無方向性電磁鋼板,其中前述鋼板進一步含有以質量%計, P:0.005%以上0.20%以下。
- 如請求項2或3之無方向性電磁鋼板,其中前述成分組成進一步含有以質量%計, Sn:0.002%以上0.10%以下、 Mo:0.005%以上0.10%以下、 Sb:0.005%以上0.30%以下、 Cu:0.01%以上0.50%以下、 Cr:0.01%以上0.50%以下、 Ni:0.010%以上1.0%以下 中的1種以上。
- 如請求項1至4中任一項之無方向性電磁鋼板,其中前述絕緣被膜係在前述與基底鐵之界面側具有Fe的增濃層。
- 如請求項1至5中任一項之無方向性電磁鋼板,其中前述鋼板的厚度為0.20mm以下。
- 如請求項1至6中任一項之無方向性電磁鋼板,其中前述鋼板係具有Si濃度從前述鋼板的表面側向前述鋼板的中心部側降低的濃度梯度,且該濃度梯度中之鋼板表層與鋼板中心層的Si濃度差為1.0~5.0質量%。
- 一種無方向性電磁鋼板之製造方法,其係如請求項1至7中任一項之電磁鋼板之製造方法,其中在對該電磁鋼板用之鋼胚實施熱軋、冷軋,之後最終精製退火而製成最終精製退火板,且於該最終精製退火板的表面形成絕緣被膜之步驟中, 前述冷軋係使用含有1%以上之磷酸酯型乳化劑的軋油來進行, 前述絕緣被膜的形成係塗佈含有1質量份以上之磷酸化合物的液體來進行。
- 一種無方向性電磁鋼板之製造方法,其係如請求項1至7中任一項之電磁鋼板之製造方法,其中在對該電磁鋼板用之鋼胚實施熱軋、冷軋,之後最終精製退火而製成最終精製退火板,且於該最終精製退火板的表面形成絕緣被膜之步驟中, 具有在前述冷軋後且前述最終精製退火前,對經過前述冷軋之鋼板的表面塗佈含有5質量份以上之磷酸化合物的水溶液並使其乾燥之步驟, 前述絕緣被膜的形成係塗佈含有1質量份以上之磷酸化合物的液體來進行。
- 一種無方向性電磁鋼板之製造方法,其係如請求項1至7中任一項之電磁鋼板之製造方法,其中在對該電磁鋼板用之鋼胚實施熱軋、冷軋,之後最終精製退火而製成最終精製退火板,且於該最終精製退火板的表面形成絕緣被膜之步驟中, 前述冷軋係使用含有1%以上之磷酸酯型乳化劑的軋油來進行, 具有在前述冷軋後且前述最終精製退火前,對經過前述冷軋之鋼板的表面塗佈含有5質量份以上之磷酸化合物的水溶液並使其乾燥之步驟, 前述絕緣被膜的形成係塗佈含有1質量份以上之磷酸化合物的液體來進行。
- 一種無方向性電磁鋼板之製造方法,其係如請求項1至7中任一項之電磁鋼板之製造方法,其中在對該電磁鋼板用之鋼胚實施熱軋、冷軋,之後最終精製退火而製成最終精製退火板,且於該最終精製退火板的表面形成絕緣被膜之步驟中, 使前述鋼胚含有0.005~0.20質量%的P,並將前述最終精製退火的退火溫度設為1100℃以上, 前述絕緣被膜的形成係塗佈含有1質量份以上之磷酸化合物的液體來進行。
- 如請求項11之電磁鋼板之製造方法,其中, 前述冷軋係使用含有1%以上之磷酸酯型乳化劑的軋油來進行。
- 如請求項11或12之電磁鋼板之製造方法,其中, 具有在前述冷軋後且前述最終精製退火前,對經過前述冷軋之鋼板的表面塗佈含有5質量份以上之磷酸化合物的水溶液並使其乾燥之步驟。
- 如請求項8至13中任一項之無方向性電磁鋼板之製造方法,其中在對前述電磁鋼板用之鋼胚實施熱軋、冷軋,之後最終精製退火而製成最終精製退火板,且於該最終精製退火板的表面形成絕緣被膜之步驟中, 在前述最終精製退火後實施滲矽處理,或使前述最終精製退火作為兼作滲矽處理的最終精製退火。
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- 2020-04-28 JP JP2020546181A patent/JP7044165B2/ja active Active
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- 2020-04-28 CN CN202080054575.5A patent/CN114207158A/zh active Pending
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TWI796983B (zh) * | 2021-03-31 | 2023-03-21 | 日商日本製鐵股份有限公司 | 無方向性電磁鋼板、馬達鐵芯、無方向性電磁鋼板的製造方法及馬達鐵芯的製造方法 |
TWI829403B (zh) * | 2021-11-02 | 2024-01-11 | 日商杰富意鋼鐵股份有限公司 | 無方向性電磁鋼板及其製造方法 |
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EP4006184A1 (en) | 2022-06-01 |
CN114207158A (zh) | 2022-03-18 |
EP4006184A4 (en) | 2022-08-31 |
WO2021019859A1 (ja) | 2021-02-04 |
MX2022001312A (es) | 2022-03-02 |
TWI736255B (zh) | 2021-08-11 |
US20220243298A1 (en) | 2022-08-04 |
JP7044165B2 (ja) | 2022-03-30 |
JPWO2021019859A1 (ja) | 2021-09-13 |
KR20220028054A (ko) | 2022-03-08 |
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