TW202102361A - 附絕緣性樹脂層之銅箔、以及使用其之疊層體及疊層體之製造方法 - Google Patents

附絕緣性樹脂層之銅箔、以及使用其之疊層體及疊層體之製造方法 Download PDF

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Publication number
TW202102361A
TW202102361A TW109109892A TW109109892A TW202102361A TW 202102361 A TW202102361 A TW 202102361A TW 109109892 A TW109109892 A TW 109109892A TW 109109892 A TW109109892 A TW 109109892A TW 202102361 A TW202102361 A TW 202102361A
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TW
Taiwan
Prior art keywords
layer
copper foil
insulating resin
resin layer
insulating
Prior art date
Application number
TW109109892A
Other languages
English (en)
Chinese (zh)
Inventor
川下和晃
中村和宏
杉本憲明
平野俊介
喜多村慎也
Original Assignee
日商三菱瓦斯化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三菱瓦斯化學股份有限公司 filed Critical 日商三菱瓦斯化學股份有限公司
Publication of TW202102361A publication Critical patent/TW202102361A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
TW109109892A 2019-03-29 2020-03-25 附絕緣性樹脂層之銅箔、以及使用其之疊層體及疊層體之製造方法 TW202102361A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019067001 2019-03-29
JP2019-067001 2019-03-29

Publications (1)

Publication Number Publication Date
TW202102361A true TW202102361A (zh) 2021-01-16

Family

ID=72668076

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109109892A TW202102361A (zh) 2019-03-29 2020-03-25 附絕緣性樹脂層之銅箔、以及使用其之疊層體及疊層體之製造方法

Country Status (5)

Country Link
JP (1) JP7479596B2 (ja)
KR (1) KR20210149683A (ja)
CN (1) CN113573887A (ja)
TW (1) TW202102361A (ja)
WO (1) WO2020203418A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024210150A1 (ja) * 2023-04-03 2024-10-10 太陽ホールディングス株式会社 樹脂層付き銅箔、硬化物、プリント配線板および硬化物の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1222574A (en) 1982-03-04 1987-06-02 Economics Laboratory, Inc. Method and apparatus for manufacturing multi layer printed circuit boards
JP3327366B2 (ja) * 1994-12-26 2002-09-24 住友ベークライト株式会社 積層板の製造方法
JP3537651B2 (ja) * 1997-11-12 2004-06-14 京セラ株式会社 繊維強化樹脂複合材成形体の製造方法
JP2003324257A (ja) 2002-05-02 2003-11-14 Tomoegawa Paper Co Ltd フッ素樹脂プリント配線板及びその製造方法
CA2832652A1 (en) * 2011-04-08 2012-10-11 Teijin Limited Method of manufacturing a bonded body
JP6156020B2 (ja) * 2013-09-26 2017-07-05 味の素株式会社 樹脂組成物
JP6583035B2 (ja) * 2015-08-26 2019-10-02 王子ホールディングス株式会社 繊維強化プラスチック成形体用シート及び繊維強化プラスチック成形体用シートの製造方法

Also Published As

Publication number Publication date
JP7479596B2 (ja) 2024-05-09
CN113573887A (zh) 2021-10-29
KR20210149683A (ko) 2021-12-09
WO2020203418A1 (ja) 2020-10-08
JPWO2020203418A1 (ja) 2020-10-08

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