TW202028357A - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
TW202028357A
TW202028357A TW108137404A TW108137404A TW202028357A TW 202028357 A TW202028357 A TW 202028357A TW 108137404 A TW108137404 A TW 108137404A TW 108137404 A TW108137404 A TW 108137404A TW 202028357 A TW202028357 A TW 202028357A
Authority
TW
Taiwan
Prior art keywords
resin composition
resin
mass
epoxy resin
manufactured
Prior art date
Application number
TW108137404A
Other languages
English (en)
Chinese (zh)
Inventor
鶴井一彦
渡邊真俊
Original Assignee
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW202028357A publication Critical patent/TW202028357A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
TW108137404A 2018-11-05 2019-10-17 樹脂組成物 TW202028357A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-208432 2018-11-05
JP2018208432A JP7119920B2 (ja) 2018-11-05 2018-11-05 樹脂組成物

Publications (1)

Publication Number Publication Date
TW202028357A true TW202028357A (zh) 2020-08-01

Family

ID=70516923

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108137404A TW202028357A (zh) 2018-11-05 2019-10-17 樹脂組成物

Country Status (3)

Country Link
JP (1) JP7119920B2 (ja)
CN (1) CN111138856B (ja)
TW (1) TW202028357A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022065507A (ja) * 2020-10-15 2022-04-27 味の素株式会社 樹脂組成物、硬化物、シート状積層材料、樹脂シート、プリント配線板及び半導体装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60112834A (ja) * 1983-11-23 1985-06-19 Sumitomo Electric Ind Ltd 含油ふつ素樹脂成型品
JPS6172025A (ja) * 1984-09-18 1986-04-14 Toshiba Chem Corp 成形用耐熱性樹脂組成物
JPH01121353A (ja) * 1987-11-06 1989-05-15 Sumitomo Bakelite Co Ltd 絶縁層形成用ペースト組成物
JPH01123848A (ja) * 1987-11-10 1989-05-16 Asahi Glass Co Ltd 積層材用樹脂組成物及び金属箔張積層板
JP3968835B2 (ja) * 1996-12-20 2007-08-29 日本メクトロン株式会社 シロキサンポリイミドを含有する耐熱性接着剤
JPH1197578A (ja) * 1997-09-22 1999-04-09 Hitachi Ltd 半導体装置及び製造方法
JP4455114B2 (ja) * 2004-03-25 2010-04-21 タムラ化研株式会社 ビルドアップ基板層間絶縁材料用の熱硬化性樹脂組成物、樹脂フィルム、製品およびビルドアップ基板の層間絶縁材料
CN102030987B (zh) * 2009-09-30 2013-12-04 E.I.内穆尔杜邦公司 抗腐蚀膜和包含该抗腐蚀膜的制品
CN102558858B (zh) * 2011-12-22 2014-03-26 云南云天化股份有限公司 覆铜层压板用树脂组合物及半固化片
JP5534378B2 (ja) * 2012-02-24 2014-06-25 荒川化学工業株式会社 ポリイミド系接着剤組成物、硬化物、接着シート、積層体、フレキシブルプリント基板
JP2014058592A (ja) * 2012-09-14 2014-04-03 Tamura Seisakusho Co Ltd 熱硬化性樹脂組成物、ｂステージ化した樹脂フィルム、金属箔、銅張板および多層ビルドアップ基板
JP6834155B2 (ja) * 2016-03-16 2021-02-24 味の素株式会社 樹脂組成物
JP6828510B2 (ja) * 2017-02-27 2021-02-10 味の素株式会社 樹脂組成物
JP2019104843A (ja) * 2017-12-13 2019-06-27 Ａｇｃ株式会社 樹脂組成物、積層体、金属積層板及びプリント配線板

Also Published As

Publication number Publication date
CN111138856A (zh) 2020-05-12
JP7119920B2 (ja) 2022-08-17
CN111138856B (zh) 2024-01-23
JP2020075960A (ja) 2020-05-21

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