TW202000829A - 切晶-黏晶一體型膜及其使用的黏著膜 - Google Patents

切晶-黏晶一體型膜及其使用的黏著膜 Download PDF

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Publication number
TW202000829A
TW202000829A TW108120787A TW108120787A TW202000829A TW 202000829 A TW202000829 A TW 202000829A TW 108120787 A TW108120787 A TW 108120787A TW 108120787 A TW108120787 A TW 108120787A TW 202000829 A TW202000829 A TW 202000829A
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TW
Taiwan
Prior art keywords
adhesive
meth
adhesive layer
acrylate
film
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Application number
TW108120787A
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English (en)
Chinese (zh)
Inventor
木村尚弘
大久保恵介
山中大輔
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日商日立化成股份有限公司
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Application filed by 日商日立化成股份有限公司 filed Critical 日商日立化成股份有限公司
Publication of TW202000829A publication Critical patent/TW202000829A/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09J201/06—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
TW108120787A 2018-06-15 2019-06-14 切晶-黏晶一體型膜及其使用的黏著膜 TW202000829A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018114667A JP7159633B2 (ja) 2018-06-15 2018-06-15 ダイシング・ダイボンディング一体型フィルム及びこれに用いる粘着フィルム
JP2018-114667 2018-06-15

Publications (1)

Publication Number Publication Date
TW202000829A true TW202000829A (zh) 2020-01-01

Family

ID=68842194

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108120787A TW202000829A (zh) 2018-06-15 2019-06-14 切晶-黏晶一體型膜及其使用的黏著膜

Country Status (6)

Country Link
JP (1) JP7159633B2 (ja)
KR (1) KR20210020942A (ja)
CN (1) CN112292431B (ja)
SG (1) SG11202012277UA (ja)
TW (1) TW202000829A (ja)
WO (1) WO2019240234A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202137308A (zh) * 2020-03-27 2021-10-01 日商琳得科股份有限公司 半導體裝置製造用片的製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101127104B1 (ko) * 2008-12-30 2012-03-22 제일모직주식회사 대전방지성 점착제 조성물, 이를 이용한 점착제 필름 및 그 제조방법
CN101768415B (zh) * 2008-12-30 2013-03-27 第一毛织株式会社 抗静电粘合剂组合物、粘合膜及其制备方法
US8853290B2 (en) * 2009-06-08 2014-10-07 Sanyo Chemical Industries, Ltd. Photosensitive composition
KR101710319B1 (ko) * 2011-03-07 2017-02-24 산요가세이고교 가부시키가이샤 감광성 조성물, 경화물, 및, 활성 광선 경화물의 제조 방법
JP5786505B2 (ja) * 2011-07-08 2015-09-30 日立化成株式会社 ダイシング・ダイボンディング一体型テープ
JP6297786B2 (ja) * 2012-12-10 2018-03-20 日東電工株式会社 接着シート、ダイシングテープ一体型接着シート、半導体装置の製造方法、及び、半導体装置
JP6129629B2 (ja) * 2012-12-10 2017-05-17 日東電工株式会社 ダイシングテープ一体型接着シート、及び、ダイシングテープ一体型接着シートを用いた半導体装置の製造方法
KR102108102B1 (ko) * 2012-12-10 2020-05-11 닛토덴코 가부시키가이샤 다이싱 테이프 일체형 접착 시트, 다이싱 테이프 일체형 접착 시트를 이용한 반도체 장치의 제조 방법 및 반도체 장치
JP2014135469A (ja) * 2012-12-10 2014-07-24 Nitto Denko Corp 接着シート、ダイシングテープ一体型接着シート、半導体装置の製造方法、及び、半導体装置
US10192768B2 (en) * 2013-08-30 2019-01-29 Lintec Corporation Sheet for semiconductor processing
JP6140066B2 (ja) 2013-12-10 2017-05-31 リンテック株式会社 半導体加工用シート
JP2015140341A (ja) * 2014-01-30 2015-08-03 Ｋｊケミカルズ株式会社 不飽和第四級アンモニウム塩
JP6656222B2 (ja) * 2015-03-03 2020-03-04 リンテック株式会社 半導体加工用シート
JP2017092365A (ja) * 2015-11-16 2017-05-25 日東電工株式会社 ダイシングテープ一体型接着シート、及び、半導体装置の製造方法
JP6217872B2 (ja) * 2017-01-12 2017-10-25 日立化成株式会社 ダイシング・ダイボンディング一体型テープ用ダイシングテープ

Also Published As

Publication number Publication date
WO2019240234A1 (ja) 2019-12-19
CN112292431A (zh) 2021-01-29
CN112292431B (zh) 2022-09-02
JP7159633B2 (ja) 2022-10-25
KR20210020942A (ko) 2021-02-24
SG11202012277UA (en) 2021-01-28
JP2019218428A (ja) 2019-12-26

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