SG11202012277UA - Dicing-die bonding integrated film and tackifier film used for same - Google Patents

Dicing-die bonding integrated film and tackifier film used for same

Info

Publication number
SG11202012277UA
SG11202012277UA SG11202012277UA SG11202012277UA SG11202012277UA SG 11202012277U A SG11202012277U A SG 11202012277UA SG 11202012277U A SG11202012277U A SG 11202012277UA SG 11202012277U A SG11202012277U A SG 11202012277UA SG 11202012277U A SG11202012277U A SG 11202012277UA
Authority
SG
Singapore
Prior art keywords
film
dicing
same
tackifier
die bonding
Prior art date
Application number
SG11202012277UA
Inventor
Naohiro Kimura
Keisuke Ohkubo
Daisuke Yamanaka
Original Assignee
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Materials Co Ltd filed Critical Showa Denko Materials Co Ltd
Publication of SG11202012277UA publication Critical patent/SG11202012277UA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09J201/06—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
SG11202012277UA 2018-06-15 2019-06-13 Dicing-die bonding integrated film and tackifier film used for same SG11202012277UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018114667A JP7159633B2 (en) 2018-06-15 2018-06-15 Dicing/die bonding integrated film and adhesive film used therefor
PCT/JP2019/023557 WO2019240234A1 (en) 2018-06-15 2019-06-13 Dicing-die bonding integrated film and tackifier film used for same

Publications (1)

Publication Number Publication Date
SG11202012277UA true SG11202012277UA (en) 2021-01-28

Family

ID=68842194

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202012277UA SG11202012277UA (en) 2018-06-15 2019-06-13 Dicing-die bonding integrated film and tackifier film used for same

Country Status (6)

Country Link
JP (1) JP7159633B2 (en)
KR (1) KR20210020942A (en)
CN (1) CN112292431B (en)
SG (1) SG11202012277UA (en)
TW (1) TW202000829A (en)
WO (1) WO2019240234A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202137308A (en) * 2020-03-27 2021-10-01 日商琳得科股份有限公司 Manufacturing method for semiconductor device manufacturing sheet

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101127104B1 (en) * 2008-12-30 2012-03-22 제일모직주식회사 Antistatic adhesive composition, adhesive film using the same and method for preparing the adhesive film
CN101768415B (en) * 2008-12-30 2013-03-27 第一毛织株式会社 Antistatic adhesive composition, adhesive film using the same, method for producing the adhesive film, and method of fabricating liquid crystal display
US8853290B2 (en) * 2009-06-08 2014-10-07 Sanyo Chemical Industries, Ltd. Photosensitive composition
KR101710319B1 (en) * 2011-03-07 2017-02-24 산요가세이고교 가부시키가이샤 Photosensitive composition, cured article, and method for producing actinically cured article
JP5786505B2 (en) * 2011-07-08 2015-09-30 日立化成株式会社 Dicing and die bonding integrated tape
JP6297786B2 (en) * 2012-12-10 2018-03-20 日東電工株式会社 Adhesive sheet, dicing tape integrated adhesive sheet, semiconductor device manufacturing method, and semiconductor device
JP6129629B2 (en) * 2012-12-10 2017-05-17 日東電工株式会社 Dicing tape integrated adhesive sheet and manufacturing method of semiconductor device using dicing tape integrated adhesive sheet
KR102108102B1 (en) * 2012-12-10 2020-05-11 닛토덴코 가부시키가이샤 Dicing tape integrated adhesive sheet, manufacturing method of semiconductor device using dicing tape integrated adhesive sheet, and semiconductor device
JP2014135469A (en) * 2012-12-10 2014-07-24 Nitto Denko Corp Adhesive sheet, dicing tape integrated adhesive sheet, method for manufacturing semiconductor device, and semiconductor device
US10192768B2 (en) * 2013-08-30 2019-01-29 Lintec Corporation Sheet for semiconductor processing
JP6140066B2 (en) 2013-12-10 2017-05-31 リンテック株式会社 Semiconductor processing sheet
JP2015140341A (en) * 2014-01-30 2015-08-03 Ｋｊケミカルズ株式会社 unsaturated quaternary ammonium salt
JP6656222B2 (en) * 2015-03-03 2020-03-04 リンテック株式会社 Semiconductor processing sheet
JP2017092365A (en) * 2015-11-16 2017-05-25 日東電工株式会社 Dicing tape integrated adhesive sheet, and manufacturing method of semiconductor device
JP6217872B2 (en) * 2017-01-12 2017-10-25 日立化成株式会社 Dicing tape for dicing and die bonding integrated tape

Also Published As

Publication number Publication date
WO2019240234A1 (en) 2019-12-19
CN112292431A (en) 2021-01-29
TW202000829A (en) 2020-01-01
CN112292431B (en) 2022-09-02
JP7159633B2 (en) 2022-10-25
KR20210020942A (en) 2021-02-24
JP2019218428A (en) 2019-12-26

Similar Documents

Publication Publication Date Title
EP3596184A4 (en) Adhesive bonding composition and electronic components prepared from the same
EP3533849A4 (en) Dielectric-heating bonding film and bonding method using dielectric-heating bonding film
EP3844810A4 (en) Bonded memory device and fabrication methods thereof
EP3845152A4 (en) Adhesive device
EP3766422A4 (en) Inspection chip and inspection device
EP3656830A4 (en) Adhesive composition and adhesive film
EP3442010A4 (en) Adhesive film for use in semiconductor device manufacturing, and semiconductor device manufacturing method
EP3705547A4 (en) Adhesive film for semiconductor
EP3187557A4 (en) Adhesive film and semiconductor package using adhesive film
EP3238239A4 (en) Sinterable bonding material and semiconductor device using the same
EP3238238A4 (en) Sinterable bonding material and semiconductor device using the same
EP3826050A4 (en) Substrate bonding device
EP3904231A4 (en) Water-soluble film and package
EP3904435A4 (en) Water-soluble film and package
ZA201800270B (en) Pressure-sensitive adhesive film and the use thereof for protecting surfaces
EP3561010A4 (en) Bonding film and tape for wafer processing
EP3904232A4 (en) Water-soluble film and package
SG11202007053XA (en) Manufacturing method for semiconductor device, and adhesive film
EP3831905A4 (en) Adhesive agent and adhesive tape using said adhesive agent
EP3778234A4 (en) Laminate and package using same
EP3553144C0 (en) Fibre-matrix adhesive tape
EP3689778A4 (en) Package and film
PL3569622T3 (en) Multilayer pressure-sensitive adhesive assembly
SG11202012277UA (en) Dicing-die bonding integrated film and tackifier film used for same
GB2580211B (en) Single-sided pressure-sensitive adhesive tape