TW201829808A - 用以測量一沈積率之測量組件、蒸發源、沈積設備、及用於其之方法 - Google Patents
用以測量一沈積率之測量組件、蒸發源、沈積設備、及用於其之方法 Download PDFInfo
- Publication number
- TW201829808A TW201829808A TW106135553A TW106135553A TW201829808A TW 201829808 A TW201829808 A TW 201829808A TW 106135553 A TW106135553 A TW 106135553A TW 106135553 A TW106135553 A TW 106135553A TW 201829808 A TW201829808 A TW 201829808A
- Authority
- TW
- Taiwan
- Prior art keywords
- hole
- oscillating crystal
- measuring
- measurement
- movable shutter
- Prior art date
Links
- 238000005259 measurement Methods 0.000 title claims abstract description 161
- 230000008021 deposition Effects 0.000 title claims abstract description 99
- 238000001704 evaporation Methods 0.000 title claims description 95
- 230000008020 evaporation Effects 0.000 title claims description 90
- 238000000034 method Methods 0.000 title claims description 26
- 239000013078 crystal Substances 0.000 claims abstract description 149
- 239000000463 material Substances 0.000 claims abstract description 134
- 230000000903 blocking effect Effects 0.000 claims abstract description 5
- 238000009826 distribution Methods 0.000 claims description 73
- 239000000758 substrate Substances 0.000 claims description 36
- 239000011364 vaporized material Substances 0.000 claims description 16
- 239000012530 fluid Substances 0.000 claims description 12
- 238000004891 communication Methods 0.000 claims description 8
- 230000010355 oscillation Effects 0.000 abstract description 7
- 238000000151 deposition Methods 0.000 description 86
- 238000010438 heat treatment Methods 0.000 description 48
- 239000011368 organic material Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000012423 maintenance Methods 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010549 co-Evaporation Methods 0.000 description 2
- 239000012809 cooling fluid Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011065 in-situ storage Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000003380 quartz crystal microbalance Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000006200 vaporizer Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
- C23C14/546—Controlling the film thickness or evaporation rate using measurement on deposited material using crystal oscillators
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
- G01B7/063—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using piezoelectric resonators
- G01B7/066—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness using piezoelectric resonators for measuring thickness of coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ??PCT/EP2016/075681 | 2016-10-25 | ||
| PCT/EP2016/075681 WO2018077388A1 (en) | 2016-10-25 | 2016-10-25 | Measurement assembly for measuring a deposition rate, evaporation source, deposition apparatus, and method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201829808A true TW201829808A (zh) | 2018-08-16 |
Family
ID=57208279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106135553A TW201829808A (zh) | 2016-10-25 | 2017-10-17 | 用以測量一沈積率之測量組件、蒸發源、沈積設備、及用於其之方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2018538429A (ko) |
| KR (1) | KR20180067463A (ko) |
| CN (1) | CN108291291A (ko) |
| TW (1) | TW201829808A (ko) |
| WO (1) | WO2018077388A1 (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI759913B (zh) * | 2020-10-16 | 2022-04-01 | 天虹科技股份有限公司 | 原子層沉積薄膜厚度的檢測系統及檢測方法 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019063061A1 (en) * | 2017-09-26 | 2019-04-04 | Applied Materials, Inc. | MATERIAL DEPOSITION ARRANGEMENT, VACUUM DEPOSITION SYSTEM, AND ASSOCIATED METHODS |
| WO2020108743A1 (en) * | 2018-11-28 | 2020-06-04 | Applied Materials, Inc. | Deposition source for depositing evaporated material, deposition apparatus, and methods therefor |
| CN114423881A (zh) * | 2019-09-19 | 2022-04-29 | 应用材料公司 | 蒸发源、遮板装置和蒸发方法 |
| DE102019128515A1 (de) * | 2019-10-22 | 2021-04-22 | Apeva Se | Verfahren zum Betrieb eines QCM-Sensors |
| CN113278918B (zh) * | 2021-05-19 | 2023-01-31 | 云谷（固安）科技有限公司 | 掩膜装置及蒸镀方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH537987A (de) * | 1971-02-10 | 1973-06-15 | Balzers Patent Beteilig Ag | Einrichtung zur Überwachung der Aufdampfung beim Vakuumaufdampfen von dünnen Schichten |
| JPH07257994A (ja) * | 1994-03-18 | 1995-10-09 | Matsushita Electric Ind Co Ltd | Ｍｂｅ装置 |
| JP4785269B2 (ja) * | 2000-05-02 | 2011-10-05 | 株式会社半導体エネルギー研究所 | 発光装置の作製方法及び成膜装置のクリーニング方法 |
| US6558735B2 (en) * | 2001-04-20 | 2003-05-06 | Eastman Kodak Company | Reusable mass-sensor in manufacture of organic light-emitting devices |
| US20080241367A1 (en) * | 2007-03-29 | 2008-10-02 | Intevac Corporation | Apparatus for and method of applying lubricant coatings to magnetic disks via a vapor flow path including a selectively opened and closed shutter |
| US20080241366A1 (en) * | 2007-03-29 | 2008-10-02 | Intevac Corporation | Apparatus for and method of applying lubricant coatings to magnetic disks via a vapor flow path including a selectively opened and closed shutter |
| JP2012126938A (ja) * | 2010-12-14 | 2012-07-05 | Ulvac Japan Ltd | 真空蒸着装置及び薄膜の製造方法 |
| JP2015117397A (ja) * | 2013-12-17 | 2015-06-25 | 株式会社日立ハイテクファインシステムズ | 蒸着装置 |
| DE102014102484A1 (de) * | 2014-02-26 | 2015-08-27 | Aixtron Se | Verwendung eines QCM-Sensors zur Bestimmung der Dampfkonzentration beim OVPD-Verfahren beziehungsweise in einem OVPD-Beschichtungssystem |
| CN104165573B (zh) * | 2014-05-13 | 2016-05-11 | 京东方科技集团股份有限公司 | 一种测量装置及镀膜设备 |
| JP6448279B2 (ja) * | 2014-09-30 | 2019-01-09 | キヤノントッキ株式会社 | 真空蒸着装置 |
-
2016
- 2016-10-25 JP JP2017560167A patent/JP2018538429A/ja active Pending
- 2016-10-25 WO PCT/EP2016/075681 patent/WO2018077388A1/en active Application Filing
- 2016-10-25 CN CN201680070126.3A patent/CN108291291A/zh active Pending
- 2016-10-25 KR KR1020177035240A patent/KR20180067463A/ko not_active Application Discontinuation
-
2017
- 2017-10-17 TW TW106135553A patent/TW201829808A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI759913B (zh) * | 2020-10-16 | 2022-04-01 | 天虹科技股份有限公司 | 原子層沉積薄膜厚度的檢測系統及檢測方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108291291A (zh) | 2018-07-17 |
| WO2018077388A1 (en) | 2018-05-03 |
| KR20180067463A (ko) | 2018-06-20 |
| JP2018538429A (ja) | 2018-12-27 |
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