TW201816191A - 鎳鍍敷溶液 - Google Patents

鎳鍍敷溶液 Download PDF

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Publication number
TW201816191A
TW201816191A TW106134778A TW106134778A TW201816191A TW 201816191 A TW201816191 A TW 201816191A TW 106134778 A TW106134778 A TW 106134778A TW 106134778 A TW106134778 A TW 106134778A TW 201816191 A TW201816191 A TW 201816191A
Authority
TW
Taiwan
Prior art keywords
nickel
electroplating composition
composition
ion
semiconductor wafer
Prior art date
Application number
TW106134778A
Other languages
English (en)
Chinese (zh)
Inventor
今成真明
李一學
Original Assignee
羅門哈斯電子材料有限公司
羅門哈斯電子材料韓國公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 羅門哈斯電子材料有限公司, 羅門哈斯電子材料韓國公司 filed Critical 羅門哈斯電子材料有限公司
Publication of TW201816191A publication Critical patent/TW201816191A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
TW106134778A 2016-10-24 2017-10-11 鎳鍍敷溶液 TW201816191A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016208151A JP2018070907A (ja) 2016-10-24 2016-10-24 ニッケルめっき液
JP2016-208151 2016-10-24

Publications (1)

Publication Number Publication Date
TW201816191A true TW201816191A (zh) 2018-05-01

Family

ID=60162034

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106134778A TW201816191A (zh) 2016-10-24 2017-10-11 鎳鍍敷溶液

Country Status (6)

Country Link
US (1) US20180112319A1 (de)
EP (1) EP3312308A1 (de)
JP (1) JP2018070907A (de)
KR (1) KR20180044824A (de)
CN (1) CN107974698A (de)
TW (1) TW201816191A (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108754549B (zh) * 2018-06-12 2020-10-30 北京航空航天大学 一种镀镍层应力调节剂及其应用
KR102496247B1 (ko) * 2021-01-06 2023-02-06 와이엠티 주식회사 전기 도금 용액 첨가제 및 이를 포함하는 고속 도금 가능한 고전류 전기 니켈 도금 용액
JP7197933B2 (ja) * 2021-05-27 2022-12-28 石原ケミカル株式会社 アンダーバリアメタルとソルダー層とを含む構造体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3261676B2 (ja) 1999-12-16 2002-03-04 東京都 電気ニッケルめっき浴。
US20020135069A1 (en) * 2000-11-03 2002-09-26 Wood Robert L. Electroplating methods for fabricating microelectronic interconnects
GB2393037B (en) * 2002-09-11 2007-05-23 Tera View Ltd Method of enhancing the photoconductive properties of a semiconductor and method of producing a seminconductor with enhanced photoconductive properties
JP2004265253A (ja) 2003-03-03 2004-09-24 Matsushita Electric Works Ltd 遠隔監視制御装置
JP2008285732A (ja) * 2007-05-21 2008-11-27 Meltex Inc ニッケルめっき液及びそのニッケルめっき液を用いた電気めっき方法並びにその電気めっき方法でニッケルめっき皮膜を形成したチップ部品
JP4932872B2 (ja) 2009-05-18 2012-05-16 株式会社アイアールエフ 逆走防止装置
JP5452458B2 (ja) * 2010-12-14 2014-03-26 メルテックス株式会社 ニッケルめっき液及びニッケルめっき方法

Also Published As

Publication number Publication date
EP3312308A1 (de) 2018-04-25
CN107974698A (zh) 2018-05-01
KR20180044824A (ko) 2018-05-03
JP2018070907A (ja) 2018-05-10
US20180112319A1 (en) 2018-04-26

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