JP2018070907A - ニッケルめっき液 - Google Patents

ニッケルめっき液 Download PDF

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Publication number
JP2018070907A
JP2018070907A JP2016208151A JP2016208151A JP2018070907A JP 2018070907 A JP2018070907 A JP 2018070907A JP 2016208151 A JP2016208151 A JP 2016208151A JP 2016208151 A JP2016208151 A JP 2016208151A JP 2018070907 A JP2018070907 A JP 2018070907A
Authority
JP
Japan
Prior art keywords
nickel
sulfamate
electroplating composition
mol
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016208151A
Other languages
English (en)
Japanese (ja)
Inventor
眞明 今成
Masaaki Imanari
眞明 今成
イ，イル−ハク
Yil-Hak Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials KK
Rohm and Haas Electronic Materials Korea Ltd
Original Assignee
Rohm and Haas Electronic Materials KK
Rohm and Haas Electronic Materials Korea Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials KK, Rohm and Haas Electronic Materials Korea Ltd filed Critical Rohm and Haas Electronic Materials KK
Priority to JP2016208151A priority Critical patent/JP2018070907A/ja
Priority to US15/692,521 priority patent/US20180112319A1/en
Priority to TW106134778A priority patent/TW201816191A/zh
Priority to CN201710963553.0A priority patent/CN107974698A/zh
Priority to KR1020170137321A priority patent/KR20180044824A/ko
Priority to EP17197736.6A priority patent/EP3312308A1/de
Publication of JP2018070907A publication Critical patent/JP2018070907A/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2016208151A 2016-10-24 2016-10-24 ニッケルめっき液 Pending JP2018070907A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2016208151A JP2018070907A (ja) 2016-10-24 2016-10-24 ニッケルめっき液
US15/692,521 US20180112319A1 (en) 2016-10-24 2017-08-31 Nickel plating solution
TW106134778A TW201816191A (zh) 2016-10-24 2017-10-11 鎳鍍敷溶液
CN201710963553.0A CN107974698A (zh) 2016-10-24 2017-10-17 镍镀敷溶液
KR1020170137321A KR20180044824A (ko) 2016-10-24 2017-10-23 니켈 도금액
EP17197736.6A EP3312308A1 (de) 2016-10-24 2017-10-23 Nickelplattierungslösung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016208151A JP2018070907A (ja) 2016-10-24 2016-10-24 ニッケルめっき液

Publications (1)

Publication Number Publication Date
JP2018070907A true JP2018070907A (ja) 2018-05-10

Family

ID=60162034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016208151A Pending JP2018070907A (ja) 2016-10-24 2016-10-24 ニッケルめっき液

Country Status (6)

Country Link
US (1) US20180112319A1 (de)
EP (1) EP3312308A1 (de)
JP (1) JP2018070907A (de)
KR (1) KR20180044824A (de)
CN (1) CN107974698A (de)
TW (1) TW201816191A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022249500A1 (ja) * 2021-05-27 2022-12-01 石原ケミカル株式会社 アンダーバリアメタルとソルダー層とを含む構造体及び構造体の製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108754549B (zh) * 2018-06-12 2020-10-30 北京航空航天大学 一种镀镍层应力调节剂及其应用
KR102496247B1 (ko) * 2021-01-06 2023-02-06 와이엠티 주식회사 전기 도금 용액 첨가제 및 이를 포함하는 고속 도금 가능한 고전류 전기 니켈 도금 용액

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3261676B2 (ja) 1999-12-16 2002-03-04 東京都 電気ニッケルめっき浴。
US20020135069A1 (en) * 2000-11-03 2002-09-26 Wood Robert L. Electroplating methods for fabricating microelectronic interconnects
GB2393037B (en) * 2002-09-11 2007-05-23 Tera View Ltd Method of enhancing the photoconductive properties of a semiconductor and method of producing a seminconductor with enhanced photoconductive properties
JP2004265253A (ja) 2003-03-03 2004-09-24 Matsushita Electric Works Ltd 遠隔監視制御装置
JP2008285732A (ja) * 2007-05-21 2008-11-27 Meltex Inc ニッケルめっき液及びそのニッケルめっき液を用いた電気めっき方法並びにその電気めっき方法でニッケルめっき皮膜を形成したチップ部品
JP4932872B2 (ja) 2009-05-18 2012-05-16 株式会社アイアールエフ 逆走防止装置
JP5452458B2 (ja) * 2010-12-14 2014-03-26 メルテックス株式会社 ニッケルめっき液及びニッケルめっき方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022249500A1 (ja) * 2021-05-27 2022-12-01 石原ケミカル株式会社 アンダーバリアメタルとソルダー層とを含む構造体及び構造体の製造方法

Also Published As

Publication number Publication date
EP3312308A1 (de) 2018-04-25
CN107974698A (zh) 2018-05-01
KR20180044824A (ko) 2018-05-03
TW201816191A (zh) 2018-05-01
US20180112319A1 (en) 2018-04-26

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