TW201614891A - Electrically conductive OLED carrier, OLED incorporating said carrier, and its manufacture - Google Patents

Electrically conductive OLED carrier, OLED incorporating said carrier, and its manufacture

Info

Publication number
TW201614891A
TW201614891A TW104122962A TW104122962A TW201614891A TW 201614891 A TW201614891 A TW 201614891A TW 104122962 A TW104122962 A TW 104122962A TW 104122962 A TW104122962 A TW 104122962A TW 201614891 A TW201614891 A TW 201614891A
Authority
TW
Taiwan
Prior art keywords
carrier
oled
layer
metal grid
region
Prior art date
Application number
TW104122962A
Other languages
English (en)
Inventor
Denis Guimard
Julien Booz
Original Assignee
Saint Gobain
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain filed Critical Saint Gobain
Publication of TW201614891A publication Critical patent/TW201614891A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H10K59/80516—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H10K50/824—Cathodes combined with auxiliary electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/854—Arrangements for extracting light from the devices comprising scattering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H10K59/80522—Cathodes combined with auxiliary electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/877—Arrangements for extracting light from the devices comprising scattering means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
TW104122962A 2014-07-17 2015-07-15 Electrically conductive OLED carrier, OLED incorporating said carrier, and its manufacture TW201614891A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1456880A FR3023979B1 (fr) 2014-07-17 2014-07-17 Support electroconducteur pour oled, oled l'incorporant, et sa fabrication.

Publications (1)

Publication Number Publication Date
TW201614891A true TW201614891A (en) 2016-04-16

Family

ID=51485776

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104122962A TW201614891A (en) 2014-07-17 2015-07-15 Electrically conductive OLED carrier, OLED incorporating said carrier, and its manufacture

Country Status (11)

Country Link
US (1) US9786849B2 (zh)
EP (1) EP3170214B1 (zh)
JP (1) JP2017521836A (zh)
KR (1) KR20170045210A (zh)
CN (1) CN106537625B (zh)
ES (1) ES2702713T3 (zh)
FR (1) FR3023979B1 (zh)
MY (1) MY179583A (zh)
RU (1) RU2690730C2 (zh)
TW (1) TW201614891A (zh)
WO (1) WO2016009132A1 (zh)

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FR3023979B1 (fr) * 2014-07-17 2016-07-29 Saint Gobain Support electroconducteur pour oled, oled l'incorporant, et sa fabrication.
WO2018102512A1 (en) * 2016-11-30 2018-06-07 Corning Incorporated Textured glass for light extraction enhancement of oled lighting
CN109429428B (zh) * 2017-08-29 2020-12-15 宏启胜精密电子(秦皇岛)有限公司 电路板及其制作方法
CN110112319B (zh) * 2019-05-27 2022-04-19 京东方科技集团股份有限公司 发光单元及其制造方法、显示装置
DE102019129832A1 (de) * 2019-11-05 2021-05-06 Heliatek Gmbh Optoelektronisches Bauelement, sowie Verfahren zur Kontaktierung eines optoelektronischen Bauelements
CN114868235A (zh) * 2019-11-21 2022-08-05 德克萨斯仪器股份有限公司 具有低电阻背面触点的封装电子器件
DE102021121491A1 (de) * 2020-09-03 2022-03-03 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Komponententrägerstruktur, verbindbar durch elektrisch leitendes verbindungsmedium in aussparung mit hohlraum mit oberflächenprofil
CN114171416B (zh) * 2022-02-14 2022-06-03 浙江里阳半导体有限公司 一种tvs芯片及其玻璃钝化方法、制造方法
CN116998253A (zh) * 2022-02-28 2023-11-03 京东方科技集团股份有限公司 导电网格的制备方法、薄膜传感器及其制备方法
CN115074799B (zh) * 2022-07-21 2024-04-26 日铭电脑配件(上海)有限公司 一种阳极氧化阴极板及其制备方法和应用

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GB9409538D0 (en) * 1994-05-12 1994-06-29 Glaverbel Forming a silver coating on a vitreous substrate
TW364275B (en) * 1996-03-12 1999-07-11 Idemitsu Kosan Co Organic electroluminescent element and organic electroluminescent display device
US6645645B1 (en) 2000-05-30 2003-11-11 The Trustees Of Princeton University Phosphorescent organic light emitting devices
JP2004513483A (ja) 2000-11-02 2004-04-30 スリーエム　イノベイティブ　プロパティズ　カンパニー 明るさおよびコントラスト増強直視型発光型ディスプレイ
FR2844364B1 (fr) 2002-09-11 2004-12-17 Saint Gobain Substrat diffusant
US6965197B2 (en) 2002-10-01 2005-11-15 Eastman Kodak Company Organic light-emitting device having enhanced light extraction efficiency
US20070013293A1 (en) * 2005-07-12 2007-01-18 Eastman Kodak Company OLED device having spacers
FR2892594B1 (fr) * 2005-10-21 2007-12-07 Saint Gobain Structure lumineuse comportant au moins une diode electroluminescente, sa fabrication et ses applications
US20070170846A1 (en) * 2006-01-23 2007-07-26 Choi Dong-Soo Organic light emitting display and method of fabricating the same
JP5207163B2 (ja) * 2007-03-30 2013-06-12 Ｎｌｔテクノロジー株式会社 埋込配線の形成方法、表示装置用基板及び当該基板を有する表示装置
JP5577012B2 (ja) * 2007-05-03 2014-08-20 株式会社カネカ 多層基板およびその製造方法
KR100889677B1 (ko) * 2007-06-19 2009-03-19 삼성모바일디스플레이주식회사 유기 전계 발광표시장치 및 그의 제조방법
WO2009017035A1 (ja) 2007-07-27 2009-02-05 Asahi Glass Co., Ltd. 透光性基板、その製造方法、有機ｌｅｄ素子及びその製造方法
FR2924274B1 (fr) 2007-11-22 2012-11-30 Saint Gobain Substrat porteur d'une electrode, dispositif electroluminescent organique l'incorporant, et sa fabrication
WO2009116531A1 (ja) * 2008-03-18 2009-09-24 旭硝子株式会社 電子デバイス用基板、有機ｌｅｄ素子用積層体及びその製造方法、有機ｌｅｄ素子及びその製造方法
JP5383219B2 (ja) 2009-01-23 2014-01-08 三菱重工業株式会社 レーザ溶接装置およびレーザ溶接方法
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KR20110113177A (ko) 2009-01-26 2011-10-14 아사히 가라스 가부시키가이샤 유기 ｌｅｄ 소자의 산란층용 유리 및 유기 ｌｅｄ 소자
FR2944145B1 (fr) 2009-04-02 2011-08-26 Saint Gobain Procede de fabrication d'une structure a surface texturee pour dispositif a diode electroluminescente organique et structure a surface texturee
US10581020B2 (en) * 2011-02-08 2020-03-03 Vitro Flat Glass Llc Light extracting substrate for organic light emitting diode
TW201123961A (en) * 2009-12-28 2011-07-01 Au Optronics Corp Organic light emitting diode (OLED) display device
FR2955575B1 (fr) * 2010-01-22 2012-02-24 Saint Gobain Substrat verrier revetu d'une couche haut indice sous un revetement electrode et dispositif electroluminescent organique comportant un tel substrat.
KR101818033B1 (ko) * 2011-11-01 2018-01-16 한국전자통신연구원 플렉시블 전극 기판의 제조방법
ES2548048T3 (es) 2012-09-28 2015-10-13 Saint-Gobain Glass France Método de para producir un sustrato OLED difusor transparente
KR101421024B1 (ko) * 2012-10-11 2014-07-22 코닝정밀소재 주식회사 유기발광소자용 금속산화물 박막 기판 및 그 제조방법
JP2014096334A (ja) * 2012-11-12 2014-05-22 Panasonic Corp 有機エレクトロルミネッセンス素子
FR3003084B1 (fr) * 2013-03-08 2015-02-27 Saint Gobain Support electroconducteur pour oled, oled l'incorporant, et sa fabrication
FR3023979B1 (fr) * 2014-07-17 2016-07-29 Saint Gobain Support electroconducteur pour oled, oled l'incorporant, et sa fabrication.

Also Published As

Publication number Publication date
EP3170214B1 (fr) 2018-09-19
WO2016009132A1 (fr) 2016-01-21
FR3023979B1 (fr) 2016-07-29
CN106537625A (zh) 2017-03-22
US20170207401A1 (en) 2017-07-20
ES2702713T3 (es) 2019-03-05
KR20170045210A (ko) 2017-04-26
JP2017521836A (ja) 2017-08-03
RU2017105085A3 (zh) 2018-12-14
MY179583A (en) 2020-11-11
CN106537625B (zh) 2019-08-13
RU2690730C2 (ru) 2019-06-05
FR3023979A1 (fr) 2016-01-22
RU2017105085A (ru) 2018-08-17
US9786849B2 (en) 2017-10-10
EP3170214A1 (fr) 2017-05-24

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