TW201529654A - 樹脂組成物的製造方法 - Google Patents
樹脂組成物的製造方法 Download PDFInfo
- Publication number
- TW201529654A TW201529654A TW103140189A TW103140189A TW201529654A TW 201529654 A TW201529654 A TW 201529654A TW 103140189 A TW103140189 A TW 103140189A TW 103140189 A TW103140189 A TW 103140189A TW 201529654 A TW201529654 A TW 201529654A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin composition
- filler
- producing
- composition according
- mass
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/20—Compounding polymers with additives, e.g. colouring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Polymerisation Methods In General (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014007383A JP6304803B2 (ja) | 2014-01-20 | 2014-01-20 | 樹脂組成物の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201529654A true TW201529654A (zh) | 2015-08-01 |
Family
ID=53554364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103140189A TW201529654A (zh) | 2014-01-20 | 2014-11-20 | 樹脂組成物的製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6304803B2 (ko) |
KR (1) | KR102226486B1 (ko) |
CN (1) | CN104789166A (ko) |
TW (1) | TW201529654A (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110300780A (zh) | 2017-03-06 | 2019-10-01 | 迪睿合株式会社 | 树脂组合物、树脂组合物的制备方法和结构体 |
JP7066998B2 (ja) | 2017-08-23 | 2022-05-16 | デクセリアルズ株式会社 | スペーサ含有テープ |
JP7162120B2 (ja) * | 2019-02-26 | 2022-10-27 | 富士フイルム株式会社 | 内視鏡用接着剤及びその硬化物、並びに内視鏡及びその製造方法 |
JP6744693B2 (ja) * | 2019-09-02 | 2020-08-19 | 日本化薬株式会社 | 樹脂組成物の製造方法 |
KR102519212B1 (ko) | 2020-08-19 | 2023-04-10 | 주식회사 엘지화학 | 반도체 접착용 수지 조성물 및 이를 이용한 반도체용 접착 필름 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2676849B2 (ja) * | 1988-11-19 | 1997-11-17 | 三菱化学株式会社 | シリカ質複合微粒子 |
JPH0558698A (ja) * | 1991-06-18 | 1993-03-09 | Isuzu Motors Ltd | 人工大理石の製造方法 |
JP2878497B2 (ja) | 1991-09-30 | 1999-04-05 | イビデン株式会社 | 無電解メッキ用接着剤の製造方法 |
JP3415292B2 (ja) | 1994-10-07 | 2003-06-09 | ジャパンエポキシレジン株式会社 | 半導体封止用エポキシ樹脂組成物 |
JP3737207B2 (ja) * | 1996-07-23 | 2006-01-18 | 京セラケミカル株式会社 | 粉粒体の混合方法 |
AU2003289247A1 (en) * | 2002-12-13 | 2004-07-09 | Dow Corning Toray Silicone Co., Ltd. | Composite cured silicone powder, method for production thereof and aqueous composition |
JP5343450B2 (ja) * | 2007-08-29 | 2013-11-13 | 日立化成株式会社 | 半導体素子固定用接着フィルム及び接着シート |
JP2010014771A (ja) * | 2008-07-01 | 2010-01-21 | Nippon Kayaku Co Ltd | 熱硬化型液晶滴下工法用液晶シール剤及びそれを用いた液晶表示セル |
JP5393292B2 (ja) * | 2009-06-26 | 2014-01-22 | 日本化薬株式会社 | 液晶滴下工法用液晶シール剤及びそれを用いた液晶表示セル |
WO2011001895A1 (ja) * | 2009-07-01 | 2011-01-06 | 日本化薬株式会社 | 液晶滴下工法用液晶シール剤及びそれを用いた液晶表示セル |
JP5589363B2 (ja) * | 2009-11-20 | 2014-09-17 | 住友ベークライト株式会社 | シリコーンゴム微粒子含有エポキシ樹脂組成物、プリプレグ、金属張積層板、プリント配線板及び半導体装置 |
JP5589364B2 (ja) * | 2009-11-20 | 2014-09-17 | 住友ベークライト株式会社 | シリコーンゴム微粒子含有エポキシ樹脂組成物、プリプレグ、金属張積層板、プリント配線板及び半導体装置 |
JP2011241279A (ja) * | 2010-05-17 | 2011-12-01 | Shin Kobe Electric Mach Co Ltd | エポキシ樹脂組成物並びにプリプレグ、積層板及び配線板 |
JP5943672B2 (ja) * | 2012-03-28 | 2016-07-05 | クラレノリタケデンタル株式会社 | 歯科用複合化無機充填材 |
-
2014
- 2014-01-20 JP JP2014007383A patent/JP6304803B2/ja active Active
- 2014-11-20 TW TW103140189A patent/TW201529654A/zh unknown
- 2014-12-19 KR KR1020140184414A patent/KR102226486B1/ko active IP Right Grant
-
2015
- 2015-01-19 CN CN201510025793.7A patent/CN104789166A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JP6304803B2 (ja) | 2018-04-04 |
JP2015134887A (ja) | 2015-07-27 |
KR20150087090A (ko) | 2015-07-29 |
CN104789166A (zh) | 2015-07-22 |
KR102226486B1 (ko) | 2021-03-10 |
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