TW201448168A - 自基板移除之極薄經印刷發光二極體層 - Google Patents

自基板移除之極薄經印刷發光二極體層 Download PDF

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TW201448168A
TW201448168A TW103109775A TW103109775A TW201448168A TW 201448168 A TW201448168 A TW 201448168A TW 103109775 A TW103109775 A TW 103109775A TW 103109775 A TW103109775 A TW 103109775A TW 201448168 A TW201448168 A TW 201448168A
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Mark David Lowenthal
Jeffrey Baldridge
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Abstract

在一基板上之一釋放層上方形成極薄可撓性LED燈層。該等LED燈層包含：一第一導體層，其上覆於該釋放層；一垂直發光二極體(VLED)陣列，其被印刷在該第一導體層上方，其中該等VLED具有電接觸該第一導體層之一底部電極；及一第二導體層，其上覆於該等VLED且接觸該等VLED之一頂部電極。可形成其他層，諸如保護層、反射層及磷光體層。隨後，將該等LED燈層從該基板剝離，其中該釋放層提供該基板與該等LED燈層之間之一弱黏著性，以允許該等LED燈層與該基板分離而不損壞。該等所得LED燈層係極可撓性，使該等LED燈層能夠黏著至包含衣服之可撓性目標表面。

Description

自基板移除之極薄經印刷發光二極體層 [相關申請案之交叉參考]
本申請案係由Mark David Lowenthal等人於2014年2月11日申請之美國申請案第14/177,678號之一部分接續案且亦基於由Mark David Lowenthal等人於2013年3月15日申請之美國臨時申請案第61/790,094號，該兩個申請案被讓渡給本受讓人且以引用的方式併入本文中。
本發明係關於在一基板上方印刷一層發光二極體(LED)及導體且隨後移除基板以形成一極薄LED燈。
藉由申請人之先前工作已知在一可撓性基板上方印刷一導體層，接著在導體層上方以所要定向印刷微觀垂直LED之一單層，使得LED之底部電極歐姆接觸導體層。隨後，在導體層上方印刷一介電層，接著印刷一透明導體層以接觸LED之頂部電極且並聯連接LED。可在LED上方視情況地印刷一磷光體層以對LED光進行波長轉換。當將一足夠電壓施加至導體層時，LED透過透明導體層發射光。可於標題為Method of Manufacturing a Printable Composition of Liquid or Gel Suspension of Diodes之美國申請公開案US 2012/0164796中找到藉由印刷微觀垂直LED及控制其等在一基板上之定向而形成一光源之進一步細節，該案被讓渡給本受讓人且以引用的方式併入本文中。
基板之厚度可超過250微米。組合LED/導體層之厚度可薄如20微米。若包含磷光體層，則LED/導體/磷光體層之厚度可為大約60微米。
所得LED燈對一特定半徑可撓。但是，可撓性受限於基板，其比LED/導體層更堅硬，且在彎曲時由不同半徑之基板及LED/導體層形成之應力可拉伸或撕裂LED/導體層，從而可能損毀燈。此外，在燈之一些應用中(諸如用於將燈層壓至一件衣服)，基板導致燈比衣服硬得多，且導致燈之總厚度成問題。
此外，由於基板保留在最終LED燈產品上，故基板應針對最終產品最佳化而非針對製程(諸如捲軸式程序)最佳化。因此，存在最佳化可製造性與最佳化最終產品之間之取捨。基板亦增加最終產品之成本。
需要一種用於形成未遭受與基板相關之上述問題之一經印刷LED燈之技術。
最初提供用於形成一經印刷LED燈之一可撓性或剛性基板。若印刷程序係一捲軸式程序，則基板將為一可撓性膜，諸如聚碳酸酯。由於本發明係關於從基板釋放LED燈層，故基板可經最佳化以用於一捲軸式程序中，而非針對最終燈產品最佳化且可具有任意厚度。可重用基板以減小材料成本。
在基板上方印刷一釋放層。釋放層相對較強地黏著至基板，但僅弱黏著至形成LED燈之後續經印刷LED燈層。代替印刷釋放層，可將釋放層層壓至基板上。
在一實施例中，LED燈層未化學黏著至釋放層，而是僅藉由一光滑釋放層與光滑LED燈層之間之一真空或靜態黏著力固定。
在另一實施例中，釋放層非常薄，諸如小於60微米，且僅弱黏 著至基板，而更強地黏著至LED燈層。隨後，在移除基板後，釋放層被保留在LED燈上且可充當一保護層。
對於光旨在從頂部表面發射之一LED燈，隨後，在釋放層上方印刷一底部導體層、LED層、一介電層及一頂部透明導體層以形成LED燈層。若燈旨在從底部表面發射，則在一透明導體層上方印刷LED。
在固化後，從基板剝離或藉由真空移除LED燈層。取決於釋放層之特性，脫離可藉由施加熱或僅使用物理力將LED燈層拉離基板而執行。此係一捲軸式程序中之一簡單技術，其中藉由一旋轉LED燈輥捲取可撓性LED燈層，且藉由一單獨旋轉基板輥捲取分離的可撓性基板。可重用具有釋放層之基板。
若LED燈層將被層壓且強黏著至其目標表面，諸如一件衣服，則層壓可在將基板拉離LED燈層的同時發生。在此一情況中，LED燈層之頂部表面(當在基板上時)在分離前黏著至目標表面。因此，在此一情況中，LED燈層經設計使得光發射係來自與目標表面相對之LED燈層之底部表面。可將LED燈層製成實質上透明。
可使用一磷光體層或量子點或染料層以對LED光進行波長轉換。
描述各種其他實施例。
10‧‧‧垂直發光二極體(VLED)/發光二極體(LED)
12‧‧‧頂部金屬陽極電極
13‧‧‧反射層
14‧‧‧底部金屬陰極電極
16‧‧‧光線
20‧‧‧發光二極體(LED)
22‧‧‧反射陰極電極
26‧‧‧起始基板
28‧‧‧釋放層
29‧‧‧反射體層
30‧‧‧磷光體層
32‧‧‧透明導體層
36‧‧‧透明介電層
38‧‧‧頂部透明導體層
40‧‧‧金屬匯流排條
42‧‧‧金屬匯流排條
44‧‧‧發光二極體(LED)燈層
50‧‧‧保護透明層
52‧‧‧光線
53‧‧‧光線
54‧‧‧光線
55‧‧‧光線
60‧‧‧磷光體層
62‧‧‧反射體層
64‧‧‧透明保護層
66‧‧‧光線
67‧‧‧光線
68‧‧‧光線
69‧‧‧光線
V1‧‧‧電壓
V2‧‧‧電壓
圖1係經設計以僅從其底部表面及側表面發射光之一垂直LED之一截面圖。
圖2係經設計以僅從其頂部表面及側表面發射光之一垂直LED之一截面圖。
圖3係具有沈積在其表面上之一釋放層之一起始基板之一截面圖。
圖4A係從LED燈層移除基板之前之LED燈之一實施例之一截面圖。
圖4B係圖4A之結構之一俯視圖，其中圖4A係跨水平對分之圖4B取得。
圖5圖解說明經分離之完成之LED燈層及基板。
圖6圖解說明在已移除基板後之圖4A之燈，其中一磷光體層處在LED層下方且光透過透明頂部導體層離開。
圖7係在已移除基板後本發明燈之另一實施例之截面圖，其中磷光體層上覆於LED層且光透過透明底部導體層離開。
圖8類似於圖7，惟未形成頂部反射體層且光透過頂部層離開除外。
在各種圖式中，類似或相同之元件用相同數字標記。
本發明之實施例中所使用之基於GaN之微LED小於人類頭髮之直徑之三分之一且高度小於十分之一，從而使其等在LED跨一基板稀疏地散佈時對於裸眼本質上不可見。裝置之大小可在從大約10微米至200微米之範圍內。此屬性允許使用微LED製成之幾乎或部分透明光產生層之構造。每單位面積之微LED裝置之數目可在將微LED施加至基板時自由調整。跨表面之一完全分散隨機分佈可產生幾乎任意所要表面亮度。已由受讓人證實遠超過10,000cd/m2之燈。可使用網版印刷、膠版印刷或其他形式之印刷將LED印刷為墨水。可於標題為Method of Manufacturing a Printable Composition of Liquid or Gel Suspension of Diodes之美國申請公開案US 2012/0164796中找到藉由印刷微觀垂直LED及控制其等在一基板上之定向而形成一光源之進一步細節，該案被讓渡給本受讓人且以引用的方式併入本文中。
圖1係可用於本發明中之一垂直LED 10(VLED)之一截面圖。LED 10包含標準半導體GaN層，包含一n層、一主動層(例如，多井層)及一p層。LED 10係一異質接面LED。
在一實施例中，含有數千個垂直LED之一LED晶圓經製作使得各LED之頂部金屬陽極電極12包含LED 10之頂部陽極表面上方之一反射層13(一鏡)。反射層13應具有針對可見光超過90%之反射率。各LED之底部金屬陰極電極14(亦係反射性)小至允許幾乎所有LED光逸出陰極側。取決於LED之厚度，存在一些側光。陽極及陰極表面可與所展示的陽極及陰極表面相反。
在處理及移除生長基板以接達至用於金屬化之兩個LED表面期間，藉由使用憑藉一黏著層接合至LED晶圓的一或多個載體晶圓而在晶圓上完全形成LED，包含陽極及陰極金屬化。在晶圓上形成LED之後，圍繞各LED在晶圓之前表面中光微影界定溝槽且蝕刻溝槽至等於黏著層之深度，使得各LED具有小於50微米之一直徑及大約4微米至8微米之厚度，使得其等對於裸眼本質上不可見。各LED之一較佳形狀係六邊形。溝槽蝕刻暴露下伏晶圓接合黏著劑。隨後，將接合黏著劑溶解於一溶液中，以從載體晶圓釋放LED。可代替性地藉由薄化載體晶圓之後表面直至單件化LED來執行單件化。取決於金屬化設計，得到圖1或圖2之LED。隨後，將微觀LED均勻浸透於包含一黏度改質聚合物樹脂之一溶劑中，以形成用於印刷(諸如網版印刷或膠版印刷)之一LED墨水。
LED可代替性地使用許多其他技術形成，且可大得多或小得多。本文所述之燈可藉由除印刷以外的技術來建構。
在圖1中，陰極電極14僅使用至多LED 10之表面積的大約10%至30%。歸因於反射層13及電極14之反射性，甚至至多50%之覆蓋率係足夠的。可使用陰極半導體表面上方之一透明導體層以散佈來自陰極電極14之電流。
由於電極14周圍不存在光之阻擋，且主動層在兩個方向上發射光，故光線16主要從裸LED 10之底部表面發射。視情況地，底部陰 極電極14可被完全忽略且由一透明導體(諸如ITO)取代。
可藉由蝕刻粗糙化LED 10之表面以增大光提取(即，減小內部反射)。
若陽極電極12需在印刷後定向於與基板相反之一方向上，則將電極12製成高，使得LED 10在其等安定於基板表面上時，藉由液壓而在溶劑中旋轉。LED旋轉至最小電阻之一定向。已達成超過90%類似定向，而令人滿意的效能可在超過75%的LED處於相同定向的情況下達成。
圖2之LED 20與LED 10相同，惟一反射陰極電極22延伸於LED 20之整個底部表面上方除外。光線16因此透過陽極側離開。LED 10係用於圖4A及圖5之實施例中，且LED 20係用於圖7之實施例中。
在圖3中，提供一起始基板26。基板26可為不透明、透明或半透明的且較佳為了輕量、低成本及便於處理而係薄的。基板26可為一適當聚合物，諸如聚碳酸酯、PMMA或PET且可從一輥施配。基板26甚至可為一塗佈紙或布。基板26可為任意大小，此係因為製作燈無需真空處理且處理可使用一輸送器系統執行。基板26可針對程序而非最終產品最佳化，此係因為其並非最終產品之部分。
隨後，在基板26上方印刷一薄釋放層28。在一實施例中，釋放層28強黏著至基板26且弱黏著至LED燈層。更具體言之，LED燈層墨水因表面能失配而不良地黏著至經固化之釋放層28墨水。釋放層28因兩種材料之更佳匹配之表面能而更強地黏著至基板26。可取決於所使用之釋放層材料應用黏著力之差異之其他機制。
在一實施例中，釋放層28可為來自MacDermid Autotype Ltd.之可印刷清漆。「印刷且剝離」清漆係水性的且可印刷在多種基板上，諸如PET、PEN、聚碳酸酯等。程序可為如下。在基板26上印刷清漆層，諸如至介於6微米至15微米之間之一厚度且藉由熱而固化。隨 後，如下文所述般在清漆層上印刷LED燈層。在燈完成後，可將燈從其未良好黏著至之清漆層剝離。釋放之LED燈層可僅由用於印刷燈之墨水組成。清漆層保留在基板26上。若任意清漆層附著至燈層而非基板26，則在剝除燈層之後，可用一濕海綿洗掉殘餘物，此係因為清漆在水中高度可溶。
在另一實施例中，釋放層28容易從基板26剝離且在剝離後保留在LED燈層上。在一實施例中，一熱塑性聚胺基甲酸酯(TPU)內襯膜(作為釋放層28)被印刷在PET膜上，充當基板26。在一實施例中，TPU膜之厚度係介於10微米與100微米之間且基板26之厚度為至少175微米。隨後，在TPU膜上方印刷LED燈層。隨後，從基板26剝離TPU膜及LED燈層。保留在LED燈層上之薄TPU膜充當一保護層。
釋放層28可為透明或不透明。許多類型之適當釋放層材料係市售的。在另一實施例中，釋放層28僅藉由形成於相對光滑表面之間之真空黏著或藉由靜態黏著力黏著。
釋放層28可在一捲軸式程序期間施加及固化。
釋放層28可由複數個層組成，且一些層可保留在基板26上而其他層可保留在LED燈層上。
若光透過LED燈層面向基板26之側離開，則從基板26移除LED燈層亦可在基板26之折射率相對於空氣之折射率為高的情況下改良光提取。
LED燈層之下列實例獨立於釋放層28且LED燈層之許多不同實施例可根據本發明而使用。圖4A至圖8僅係實例且非限制性。
如圖4A中所示，諸如藉由印刷在釋放層28上沈積一反射體層29。反射體層29可為一鏡面膜(諸如一反射金屬)，或可為一漫射白層。
隨後，諸如藉由網版印刷或膠版印刷而在反射體層29上方沈積 一選用磷光體層30。若LED 10發射藍光，則磷光體層30可為YAG(黃光)磷光體及視情況一聚合物黏結劑中之紅色磷光體之一組合以產生白光，其中紅色磷光體產生一較暖白光。任意色彩可由磷光體之其他組合形成。代替性地可使用其他波長轉換材料，諸如量子點或染料。
可形成一選用透明間隙(stand-off)層，其將LED層與磷光體層30分離。藉由將LED與反射表面及磷光體層30分離，較少光將照射在LED上且被LED吸收。
在磷光體層30(或間隙層)之頂部上沈積一透明導體層32，諸如銦錫氧化物(ITO)層或含銀奈米纖維之一層。導體層32可具有1歐姆/平方至100歐姆/平方之導電率，此對於具有低電流之短跨度係足夠的。若電阻率歸因於光板之寬度而太高，則此金屬澆道可跨寬度印刷且連接至一或多個垂直金屬匯流排條以形成跨導體層32之一更均勻電壓。
隨後，諸如藉由膠版印刷或藉由使用一適當網之網版印刷而在導體層32上印刷LED 10以允許LED穿過且控制層之厚度。由於相對較低濃度，LED 10將被印刷為一鬆散單層且相當均勻地分佈在導體層32上方。可使用任意其他適當沈積程序。在圖4A之實例中，頂部陽極電極12形成為相對較高，使得LED 10藉由在安定於導體層32之表面上時採用最小電阻之旋轉定向而將其等定向在圖4A中所示之方向上。藉由頂部電極之適當構造，超過90%之LED 10可經定向使得其等陽極朝上。
隨後，藉由使用例如紅外線爐加熱而使溶劑蒸發。在固化後，LED 10保持附接至下伏透明導體層32，其中溶解在LED墨水中之少量殘餘樹脂作為一黏度改質劑。樹脂之黏著性質及在固化期間LED 10下方之樹脂之體積減小將底部LED電極14壓抵於下伏透明導體32，從而製成與其之歐姆接觸。
隨後，在表面上方選擇性地印刷一透明介電層36以囊封LED 10 且額外將其等固定在適當位置中而不覆蓋導體層32之至少一邊緣。介電層36中所使用之墨水經設計以在固化期間從LED 10之上表面拉回或去除潤濕以暴露頂部陽極電極12。
隨後，在介電層36上方印刷一頂部透明導體層38以電接觸電極12且在適於所使用之透明導體之類型之爐中固化頂部透明導體層38。
隨後，沿著透明導體層38及32之相對邊緣印刷金屬匯流排條40及42且金屬匯流排條40及42分別電終接在陽極及陰極引線(未展示)處。若匯流排條墨水係以溶劑為主，則其可在一爐中固化。若其係一輻射固化銀，則可藉由將其暴露於一UV光或電子束固化系統而將其固化。匯流排條40/42最終將使用適於特定應用之一連接器連接至一電源。
匯流排條40/42與電源引線之間之連接點可針對沿著各匯流排條40/42之均勻電流分佈而位於各匯流排條40/42之相對角隅處或可位於沿著各匯流排條40/42之多個點處以針對大型光板減小跨匯流排條40/42之電壓降以改良電效率。
若將一適當電壓差施加至陽極及陰極引線，則具有適當定向之所有LED 10將被照明。
隨著光板寬度增大，透明導體層32及38之中間附近之電壓差將歸因於導體層之電阻率而減小。因此，中間LED 10可能不如更靠近邊緣之LED般亮。
圖4A及圖4B中之匯流排條40/42之組態補償導體層32/38中之此電阻率。一金屬匯流排條40僅沿著頂部透明導體層38之一邊緣形成，且另一金屬匯流排條42沿著底部透明導體層32之一邊緣形成。
圖4B展示施加至匯流排條40之電壓V1如何跨頂部導體層38散佈且施加至匯流排條42之電壓V2如何跨底部導體層32散佈。若吾人假設施加至匯流排條40之電壓係+3V且施加至匯流排條42之電壓 係-3V，則沿著顶部導體層38之電壓將歸因於歐姆定律而在導體層38之相對端處減小至例如+2V。類似地，沿著底部導體層32之電壓將接近接地且歸因於歐姆定律而在導體層32之相對端處為例如-2V。但是，沿著導體層32/38之長度，垂直於層之差動電壓將為常數5V，其足以開啟LED 10，此係因為匯流排條40及42之電阻相對於導體層38及32低2至3個數量級。電壓可由一電流調節器控制。只要在匯流排條40及42中存在相對於透明導體層38及32低得多的電阻且透明導體層38及32具有匹配阻抗，則可跨燈之整個表面維持均勻電流密度及因此LED亮度。
在未展示之另一實施例中，藉由沿著導體層38/32之各者之水平金屬澆道(例如，跡線)在導體層38/32兩者上方供應一相等電位。導體層38/32上之金屬澆道不應彼此上覆，且導體層38上之澆道應與導體層32上之澆道大幅橫向間隔以在導體層38/32之間之所有點處達成實質上恆定電壓差。視情況地，在光板為大且存在所傳導之高電流之實施例中，為了更均勻之電位，一匯流排條可沿著各導體層之兩個邊緣形成且連接至陽極或陰極引線。
圖5圖解說明諸如藉由在一捲軸式製程中在相反方向上旋轉之捲取輥自釋放層28拉離LED燈層44而不損壞LED燈層44。在此一捲軸式程序中，基板26係連續的且提供在一輥上。一上捲取輥捲起可撓性LED燈層44且一下捲取輥捲起基板26及釋放層28用於可能重用。圖5中之各種箭頭指示LED燈層44與基板26之拉開及程序流程之方向。
若未使用反射體層，則所得LED燈層44可實質上透明。
在一實施例中，將目標材料(諸如布)提供於捲取輥上，且將一黏著劑施加至LED燈層44之頂部表面或至布。隨後，將布及LED燈層按壓在一起以附接布及LED燈層。當捲取輥旋轉時，布將LED燈層44拉離基板，從而僅在布表面上留下LED燈層44。在此情況中，LED燈層 44經設計使得光透過與布相對之表面離開燈。可圍繞用於連接至一電源之燈的電極而提供間隙。在一實施例中，將LED燈層44安裝至目標表面，將燈之電極對準至目標表面上之電連接器。此黏著劑可係壓敏、熱活化、化學活化、光活化或使用其他活化技術。隨後，可從捲取輥單件化LED燈層44及目標材料。在另一實施例中，LED燈層44在被單件化之後可貼附至一剛性平板或任意其他表面上。取決於特定應用，單件化LED燈層44無需安裝在任意其他表面上。
在另一實施例中，LED燈層44可在無黏著劑的情況下貼附至目標表面。例如，LED燈層44可藉由一上覆透明層壓板貼附至一目標表面或圍封在一透明模製封裝中。封裝允許接達至LED燈電極。
在一實施例中，LED燈層44具有額外層，諸如防潮層或彈性層，其等進一步保護LED燈層44及/或允許所得結構彎曲而不加應力於LED燈層44。
可將LED之電源直接供應至導體層，或導體層可與一整合感應迴路天線(其將一磁場轉換為驅動LED所需之電流，甚至轉換為脈衝)串聯連接。一脈衝LED層可充當衣服中之一夜間安全特徵。
在另一實施例中，釋放層28無需為一連續層，而是表示任意數量之材料(其用於減小LED燈層與基板之間的黏著力)。基板26與LED燈層之間之任意數量之此材料被稱作一釋放層。
圖6圖解說明在已移除基板後之圖4A/圖5之LED燈層44，其展示各種可能光線之不同路徑。圖6亦展示在與釋放層28分離之前形成在結構上方用於保護及增大光提取之一選用保護透明層50。一第二保護層(未展示)可形成在圖4A中之釋放層28上方用於保護LED燈層44之底部表面。保護層可由一半彈性材料形成(不同於基板26)，使得在燈撓曲的情況下在LED/導體層上存在較小應力。可將保護層製成非常薄。
為方便理解，將LED 10展示為相對於剩餘結構比其等在一實際實施例中原本之情況大得多，且展示為比其等在一實際實施例中原本之情況靠近得多。因此，LED 10未阻擋反射光。
光線52離開LED 10之底部，穿過磷光體層30而未被吸收且反射離開反射體層29。在透過磷光體層30返回的途中，光線52被一磷光體粒子吸收且轉換為磷光體波長，諸如黃色。因此，LED光具有由磷光體層30轉換之一增大概率。因此，相對於在觀看者與LED之間具有磷光體之一燈需要較少磷光體以達成一給定色溫。
光線53離開LED 10之底部且被一磷光體粒子直接吸收並轉換為磷光體波長。磷光體粒子恰好在燈之出射窗之方向上發射光。
光線54離開LED 10之底部且被一磷光體粒子直接吸收並轉換為磷光體波長。磷光體粒子恰好在反射體層29之方向上發射光。反射體層29隨後自燈反射光。
光線55離開LED 10之底部，穿過磷光體層30而未被吸收，且反射離開反射體層29。在透過磷光體層30返回的途中，光線55再次穿過磷光體層30而未被吸收且作為藍光離開燈。
離開LED 10之側壁之藍光在未轉換的情況下離開燈或被磷光體層30轉換。此光經廣泛散佈遍及燈且有助於跨燈形成一更均勻色彩。
由於不存在直接從LED 10之頂部表面發射之藍光，故不存在可感知之藍色熱點，從而改良色彩均勻度。
為了進一步增大色彩均勻度及效率，一透明間隔層(亦稱作一間隙層)可沈積在透明導體層32與磷光體層30之間。此允許LED光在供能給磷光體層30或反射離開反射體層29之前更廣泛地漫射，導致跨燈之更佳色彩均勻度。此外，藉由將LED與磷光體層及反射體層分離，存在一反射或再發射光線將被最近LED吸收之較小概率，從而增加燈之效率。或者，磷光體層30可藉由添加更多黏結劑而被製成更厚。
此外，藉由將反射體層29製成漫反射，諸如一白層，則反射光將經重導引遠離最近LED且未被LED吸收。
磷光體層30可由其他波長轉換材料(諸如量子點或染料)取代。
可將反射體層29黏著至一目標表面，諸如一件衣服、一面板或其他表面。
在另一實施例中，消除反射體層29且光離開底部表面。此在LED燈層44之頂部表面被貼附至一目標表面(諸如一件衣服)時係有用的。由於LED燈層44可係透明的，故下伏布透過LED燈層44可見。
圖7圖解說明其中使用來自圖2之LED 20且LED 20之定向與圖6中相同之一燈。在圖7中，LED 20主要向上發射其等之藍光。因此，磷光體層60上覆於頂部透明導體層38且反射體層62上覆於磷光體層60。反射體層62可為鏡面或漫射，諸如白色。形成在釋放層(未展示)上方之一薄透明保護層64保護裝置諸如不受濕氣影響。剩餘層、程序及各種替代物可與上文所述之層、程序及各種替代物相同。
在圖7中，光線66離開LED 20之頂部，穿過磷光體層60而未被吸收，且反射離開反射體層62。在透過磷光體層60返回的途中，光線66再次穿過磷光體層60而未被吸收且作為藍光離開燈。
光線67離開LED 20之頂部且被一磷光體粒子直接吸收且轉換為磷光體波長。磷光體粒子恰好在燈之出射窗之方向上發射光。
光線68離開LED 20之頂部且被一磷光體粒子直接吸收且轉換為磷光體波長。磷光體粒子恰好在反射體層62之方向上發射光。反射體層62隨後自燈反射光。
光線69離開LED 20之頂部，穿過磷光體層60而未被吸收且反射離開反射體層62。在透過磷光體層60返回的途中，光線69被一磷光體粒子吸收且轉換為磷光體波長。因此，LED光具有被磷光體層60轉換之一增大概率。因此，相對於在觀看者與LED之間具有磷光體之一 燈，需要較少磷光體，以達成一給定色溫。
圖7之燈具有與圖6之燈相同之有益屬性，其中改良色彩均勻度且需要較少磷光體。
可將反射層62黏著至一目標表面，諸如一件衣服、一面板或其他表面。
圖8圖解說明圖7之燈，惟未形成反射體層62，從而允許LED光(光線66、67)離開頂部表面除外。底部導體層32及保護層64可為透明或不透明。可將一反射體層添加至底部表面。可將層64黏著至一目標表面，諸如一件衣服、一面板或其他表面。或者，層64本身可表示其上貼附LED燈層之目標表面。若各種層係透明的，則目標表面透過LED燈層可見。
無磷光體層之所得LED燈可薄如20微米。磷光體層可增加30微米或更大。由於磷光體層可被印刷為一彈性黏結劑中之磷光體粒子，故磷光體層係可撓性的。
各種圖可表示整個燈或僅燈之一小重複區段。區段可以串聯及/或並聯之任意組合連接。在一實施例中，LED及導體被印刷為一薄保護層上方之條狀物。一單個條狀物中之LED藉由導體並聯連接。條狀物之間之導體之一圖案隨後可以串聯及並聯之任意組合連接條狀物以達成所要電特性。
可堆疊VLED之額外層，其中一透明導體處在該等額外層中間以形成以串聯及並聯之組合連接之VLED。
燈之所有層可藉由在大氣條件中使用簡單設備印刷且無任意精確對準及取置機構而形成。光板係可撓性的，在撓曲時無任意層離危險且非常薄且輕。
光板可被層壓在任意表面上，包含窗及衣服/織物或可經圖案化以形成字母數字符號或其他顯示。光板甚至可折叠或折皺。光板可由 一簡單框架支撐且從一天花板上懸掛下來或以其他方式使用。光板可諸如以一U形或一V形彎曲以輪廓化至彎曲壁或產生各種發射輪廓。光板可用於一般照明、安全燈、顯示器、背光、指示燈等。
漫射層或亮度增強層可被印刷或層壓在光板出射表面上以修改光發射圖案且避免炫光。
雖然已展示並描述本發明之特定實施例，但是熟習此項技術者應瞭解可進行改變及修改而不脫離本發明之較寬泛態樣，且因此隨附申請專利範圍將在其等之範疇內涵蓋落在本發明之真實精神及範疇內之所有此等改變及修改。
26‧‧‧起始基板
28‧‧‧釋放層
44‧‧‧發光二極體(LED)燈層

Claims (20)

  1. 一種形成一照明結構之方法，其包括：提供一基板；提供上覆於該基板之一釋放層；形成上覆於該釋放層之一第一導體層；在該第一導體層上方沈積一垂直發光二極體(VLED)陣列，該等VLED具有電接觸該第一導體層之一底部電極；形成上覆於該等VLED之一第二導體層，該等VLED具有電接觸該第二導體層之一頂部電極，其中該第一導體層、該等VLED及該第二導體層包括可撓性LED燈層；及從該基板移除該等LED燈層，其中該釋放層提供該基板與該等LED燈層之間之一黏著性，以允許該等LED燈層與該基板分離而不損壞。
  2. 如請求項1之方法，進一步包括介於該釋放層與該第一導體層之間之至少一中間層。
  3. 如請求項1之方法，其中該第一導體層或該第二導體層之至少一者係透明的，以允許來自該等VLED之光穿過。
  4. 如請求項1之方法，進一步包括在從該基板移除該等LED燈層後，將該等LED燈層黏著至一目標表面。
  5. 如請求項1之方法，進一步包括在從該基板移除該等LED燈層之前，將該等LED燈層黏著至一目標表面，隨後從該基板移除該等LED燈層。
  6. 如請求項1之方法，其中在從該基板移除該等LED燈層之後，該釋放層保持黏著至該等LED燈層。
  7. 如請求項1之方法，其中在從該基板移除該等LED燈層之後，該 釋放層保持黏著至該基板。
  8. 如請求項1之方法，其中該釋放層包括一清漆。
  9. 如請求項1之方法，其中該釋放層係一熱塑性塑膠。
  10. 如請求項1之方法，其中該等LED燈層與該基板相對之一表面係一底部表面，且該等LED燈層背離該基板之一表面係一頂部表面，該方法進一步包括在從該基板移除該等LED燈層之後，將該等LED燈層之該底部表面黏著至一目標表面，其中光離開該等LED燈層之該頂部表面。
  11. 如請求項1之方法，其中該等LED燈層與該基板相對之一表面係一底部表面，且該等LED燈層背離該基板之一表面係一頂部表面，該方法進一步包括在從該基板移除該等LED燈層之後，將該等LED燈層之該頂部表面黏著至一目標表面，其中光離開該等LED燈層之該底部表面。
  12. 如請求項1之方法，其中該基板及該等LED燈層係可撓性的。
  13. 如請求項1之方法，其中該基板及該等LED燈層係可撓性的，且形成該第一導體層、在該第一導體層上方沈積該VLED陣列及形成上覆於該等VLED之該第二導體層之該等步驟係在一捲軸式程序中執行。
  14. 如請求項13之方法，其中從該基板移除該等LED燈層之該步驟亦係在該捲軸式程序中執行。
  15. 如請求項1之方法，其中將在該第一導體層上方沈積該VLED陣列之該步驟包括在該第一導體層上方印刷該VLED陣列。
  16. 如請求項1之方法，其中從該基板移除該等LED燈層之該步驟包括將該等LED燈層從該基板剝離。
  17. 如請求項1之方法，進一步包括在該第一導體層與該第二導體層之間施加一電壓差以照明該等VLED。
  18. 如請求項1之方法，其中該等LED燈層係實質上透明的，該方法進一步包括將該等LED燈層黏著至一目標表面，使得該目標表面透過該等LED燈層可見。
  19. 一種照明結構，其包括：一第一導體層；一垂直發光二極體(VLED)陣列，其在該第一導體層上方，該等VLED具有電接觸該第一導體層之一底部電極；及一第二導體層，其上覆於該等VLED，該等VLED具有電接觸該第二導體層之一頂部電極，其中該第一導體層、該等VLED及該第二導體層構成可撓性LED燈層，其中已移除其上形成該第一導體層、該VLED陣列及該第二導體層之一支撐基板。
  20. 如請求項19之結構，其中該等LED燈層係實質上透明的，該結構進一步包括該等LED燈層所黏著至之一目標表面，使得該目標表面透過該等LED燈層可見。
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