TW201447306A - 探針單元用基底構件、探針固持具、探針單元、探針單元用基底構件的製造方法及探針單元用積層構造體 - Google Patents

探針單元用基底構件、探針固持具、探針單元、探針單元用基底構件的製造方法及探針單元用積層構造體 Download PDF

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Publication number
TW201447306A
TW201447306A TW103104220A TW103104220A TW201447306A TW 201447306 A TW201447306 A TW 201447306A TW 103104220 A TW103104220 A TW 103104220A TW 103104220 A TW103104220 A TW 103104220A TW 201447306 A TW201447306 A TW 201447306A
Authority
TW
Taiwan
Prior art keywords
probe
probe unit
holder
probe holder
probes
Prior art date
Application number
TW103104220A
Other languages
English (en)
Chinese (zh)
Inventor
Toshio Kazama
Tomohiro Kawarabayashi
Kohei Hironaka
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of TW201447306A publication Critical patent/TW201447306A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW103104220A 2013-02-08 2014-02-10 探針單元用基底構件、探針固持具、探針單元、探針單元用基底構件的製造方法及探針單元用積層構造體 TW201447306A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013023788 2013-02-08

Publications (1)

Publication Number Publication Date
TW201447306A true TW201447306A (zh) 2014-12-16

Family

ID=51299825

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103104220A TW201447306A (zh) 2013-02-08 2014-02-10 探針單元用基底構件、探針固持具、探針單元、探針單元用基底構件的製造方法及探針單元用積層構造體

Country Status (3)

Country Link
JP (1) JP6286371B2 (ja)
TW (1) TW201447306A (ja)
WO (1) WO2014123235A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI831293B (zh) * 2022-07-14 2024-02-01 中華精測科技股份有限公司 晶片測試插座

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102479684B1 (ko) * 2021-02-05 2022-12-21 미르텍알앤디 주식회사 필름부재를 포함하는 반도체 테스트 소켓
CN114236199B (zh) * 2021-11-16 2024-08-30 嘉微科技股份有限公司 测试头

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3703748B2 (ja) * 2001-09-05 2005-10-05 山一電機株式会社 Ｉｃソケット
EP1496366A4 (en) * 2002-04-16 2005-09-14 Nhk Spring Co Ltd HOLDER FOR CONDUCTIVE CONTACT
JP4905876B2 (ja) * 2005-10-31 2012-03-28 日本発條株式会社 導電性接触子ホルダの製造方法および導電性接触子ホルダ
CN101454676B (zh) * 2006-04-28 2011-12-07 日本发条株式会社 导电性触头支架
US7601009B2 (en) * 2006-05-18 2009-10-13 Centipede Systems, Inc. Socket for an electronic device
JP4921344B2 (ja) * 2007-12-26 2012-04-25 株式会社ヨコオ 検査ソケット
KR101248114B1 (ko) * 2008-11-26 2013-03-27 니혼 하츠쵸 가부시키가이샤 프로브 유닛용 베이스 부재 및 프로브 유닛
JP5969217B2 (ja) * 2011-03-09 2016-08-17 日東電工株式会社 両面接着テープ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI831293B (zh) * 2022-07-14 2024-02-01 中華精測科技股份有限公司 晶片測試插座

Also Published As

Publication number Publication date
WO2014123235A1 (ja) 2014-08-14
JPWO2014123235A1 (ja) 2017-02-02
JP6286371B2 (ja) 2018-02-28

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