TW201447306A - Substrate member for probe unit, probe holder, probe unit, method for fabricating substrate member for probe unit and laminated structure for probe unit use - Google Patents

Abstract

This invention provides a substrate member for probe unit which is disposed in a probe unit in cluding conductive probes each having two ends to be contacted with different objects respectively, and a probe holder arranging and accommodating a plurality of probes with a predetermined pattern with two ends of each probe being exposed. The substrate member for probe unit is to hold and fix the probe holder and includes a substantially plate-shaped substrate which is constituted by a highly rigid material such as metallic or ceramic materials and is formed with an opening for accommodating the probe holder therein; and a coating formed of an insulating material and adhered to the substrate via an adhesive or a pressing shut to cover the two main surfaces of the substrate.

Description

Base member for probe unit, probe holder, probe unit, method for manufacturing base member for probe unit, and laminated structure for probe unit

The present invention relates to a probe unit provided with a conductive probe that is in contact with two different contact bodies at two ends, and a probe holder that accommodates a plurality of probes for holding the probe Base member for probe unit fixed and held, probe holder, probe unit including the base member for probe unit and/or probe holder, method for manufacturing base member for probe unit, and probe unit Use a laminated structure.

When inspecting electrical characteristics of an inspection object such as a semiconductor package, in order to achieve conduction between the inspection target and a tester that generates an inspection signal, a plurality of conductive probes are provided and The probe unit of the insulating probe holder that accommodates and holds the plurality of probes in accordance with the wiring pattern of the inspection object.

Conventionally, as for the technique of the probe unit, a metal having a high strength such as aluminum or stainless steel is known as a base material, and the surface of the base material is substantially covered. A technique in which a frame-shaped base member having an insulating layer (film) is attached to a probe holder to perform reinforcement is provided (see, for example, Patent Document 1). In this technique, a guide member for guiding the arrangement position of the semiconductor package with respect to the base member is bonded to reduce the labor and time of the screw.

[Previous Technical Literature] [Patent Literature]

Patent Document 1: International Publication No. 2010/061888

However, in the above-described conventional technique, since the insulating layer is provided on the substantially entire surface of the surface of the base member in the base member, there is a problem that labor is required in manufacturing the base member. Further, even in the case where an insulating layer is provided in the probe holder, the same problem occurs.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a base member for a probe unit, a probe holder, a probe unit, and a probe unit which can maintain high rigidity and insulation and can be easily manufactured in accordance with miniaturization. A method for producing a base member for a probe unit and a laminated structure for a probe unit.

In order to achieve the object of solving the above problems, the base member for a probe unit of the present invention is provided in a probe unit having a conductive probe which is in contact with two different contact bodies at both ends, And a plurality of the probes are arranged in a predetermined pattern to expose the two ends of the probes, and the probe holders are used for fixing the probe holders and maintain The base member for a probe unit includes a substantially plate-shaped substrate formed of a high-strength material such as metal or ceramic, and has an opening for accommodating the probe holder, and a film for use. The insulating material is formed and fixed to the substrate by an adhesive or a crimping piece to cover the two main faces of the substrate.

Further, in the probe holder of the present invention, a plurality of conductive probes which are respectively in contact with two different contact bodies at both ends are arranged in a predetermined pattern in such a manner that the both end portions of the probes are exposed. Further, the probe holder includes a first plate member and a second member which are formed in a substantially plate shape in a thickness direction, and at least one of the first member and the second member has a substantially plate shape 1 laminated member is formed using an insulating material; and a substantially plate-shaped second laminated member is formed using a high-strength material such as metal or ceramic, and laminated on the first laminated member by an adhesive or The first laminate member is fixed to the crimping piece.

Further, in the probe holder of the present invention, the second laminate member has an opening penetrating in a thickness direction in a region including the storage region of the probe.

Further, the probe unit of the present invention includes a conductive probe that is in contact with two different contact bodies at both ends, and a probe holder that exposes the plurality of probes to expose the probes. The two end portions are arranged in a predetermined pattern and housed; and the base member for the probe unit fixes and holds the probe holder; the probe holder and the base member for the probe unit are the inventions described above. A needle holder and/or a base member for a probe unit.

Further, in the method for manufacturing a base member for a probe unit according to the present invention, the base member for a probe unit is provided in a probe unit having a contact with two different contact bodies at both ends. Conductive probe, and a plurality of The probe is a probe holder that is received in a predetermined pattern by exposing the end portions of the probes, and the base member for the probe unit is used to fix and hold the probe holder. In the manufacturing method, the pre-processed member and the pre-processed film are fixed by an adhesive or a crimping piece, wherein the pre-processed member is a substantially plate-shaped substrate, and a high-strength material such as metal or ceramic is used. Further, the opening has an opening for accommodating the probe holder, and the pre-processed film is a film formed of an insulating material to cover the front surface and the back surface of the substrate.

Further, the laminated structure for a probe unit of the present invention is used in a probe unit which is in contact with two different contact bodies at both ends to separate the two contacted bodies. In the laminated structure for a probe unit, the first laminated member having a substantially plate shape is formed using an insulating material, and the second laminated member having a substantially plate shape is made of a metal or ceramic. The material is formed of a strength material, and is laminated on the first laminate member and fixed to the first laminate member by an adhesive or a crimping piece.

According to the present invention, it is possible to achieve high rigidity and insulation properties, and it is easy to carry out the production in accordance with the miniaturization.

1‧‧‧ probe unit

2‧‧‧ probe

3‧‧‧ Probe Holder

4‧‧‧Base member for base unit (base member)

5, 8‧‧‧ connection pin

6‧‧‧Locating pin

7‧‧‧Floating parts

8a‧‧‧ coil spring

9, 10‧‧‧ screws

21‧‧‧1st plunger

22‧‧‧2nd plunger

23‧‧‧Pipe components

31‧‧‧1st component

31a, 31b, 31c, 31d, 32a, 32c, 44, 45, 46, 72‧‧‧ insertion holes

32‧‧‧2nd component

32b‧‧‧ recess

33, 35‧‧‧1st laminated member

34, 36‧‧‧ second layered building blocks

34a, 36a, 43‧‧‧ openings

37, 38‧‧‧ retaining holes

37a, 38a‧‧‧ Small Trails Department

37b, 38b‧‧‧The Great Trails Department

41‧‧‧Substrate

42a, 42b‧‧‧ film

43a‧‧‧1st opening

43b‧‧‧2nd opening

43c‧‧‧3rd opening

70‧‧‧ Body Department

70a‧‧‧1st laminated member

70b‧‧‧2nd layered building block

71‧‧‧through holes

100‧‧‧Semiconductor package

101, 201‧‧‧ electrodes

200‧‧‧Wiring substrate

300‧‧‧Machining base metal before processing

300a‧‧‧ positive

300b‧‧‧back

301a, 301b‧‧ ‧ pre-process envelope

B‧‧‧Adhesive

S‧‧‧ hollow

Fig. 1 is a perspective view showing the configuration of a probe unit according to an embodiment of the present invention.

Fig. 2 is an exploded perspective view showing the configuration of a main part of a probe unit according to an embodiment of the present invention.

Fig. 3 is a cross-sectional view showing a cross section taken along line A-A of Fig. 1.

Fig. 4 is a perspective view showing the configuration of a main part of a probe unit according to an embodiment of the present invention.

Fig. 5 is a partial cross-sectional view showing the configuration of a main portion when the contacted body is brought into contact with the probe in the probe unit according to the embodiment of the present invention.

Fig. 6 is a view showing a method of manufacturing a base member of a probe unit according to an embodiment of the present invention.

The form for carrying out the invention will be described in detail below with reference to the drawings. Further, the present invention is not limited to the following embodiments. In addition, in the following description, each drawing referred to only schematically shows the shape, size, and positional relationship to the extent that it is sufficient to understand the contents of the present invention. Therefore, the present invention is not limited to the shapes and sizes illustrated in the respective drawings. And location relationship.

Fig. 1 is a perspective view showing the configuration of a probe unit 1 according to an embodiment of the present invention. Fig. 2 is an exploded perspective view showing the configuration of a main part of the probe unit 1 of the embodiment. Fig. 3 is a cross-sectional view showing a cross section taken along line A-A of Fig. 1. Fig. 4 is a perspective view showing a configuration of a main part of the probe unit 1 of the present embodiment, and is a view in which the base member shown in Fig. 2 is reversed. Fig. 5 is a partial cross-sectional view showing the configuration of a main portion when the probe 2 is brought into contact with the probe 2 in the probe unit 1 of the embodiment. The probe unit 1 shown in Fig. 1 is for electrically connecting two different contact bodies, that is, a semiconductor package belonging to the inspection object and electrodes connected to the wiring board of the test machine. s installation.

The probe unit 1 includes a conductive probe 2 that is in contact with two different contact bodies at two ends, and a probe holder 3 that connects the plurality of probes 2 according to the wiring pattern of the semiconductor package. Showing the states of the two ends of each probe 2 The probe unit base member 4 (hereinafter referred to as "base member 4") is used to fix and hold the probe holder 3 in a predetermined pattern. The probe holder 3 and the base member 4 are connected by two connecting pins 5. Further, the base member 4 is provided with a positioning pin 6 for positioning the object to be contacted.

Further, a floating portion 7 is disposed between the probe holder 3 and the base member 4 to limit the offset between the probe holder 3 and the semiconductor package. The probe holder 3 and the slider 7 are connected by two connection pins 8. The connecting pin 8 is for the coil spring 8a to be inserted, and the coil holder 8a is used to bias the probe holder 3 and the floating member 7 in a direction in which they are spaced apart from each other.

The probe 2 includes a first plunger 21 formed of a conductive material such as iron or copper, and in contact with the electrode 101 of the semiconductor package 100, and the second plunger 22 and the first column The plug 21 is formed of the same material, protrudes in a direction opposite to the first plunger 21, and is in contact with the electrode 201 of the wiring substrate 200, and a pipe member 23 for covering the first plunger 21 The outer circumference of a spring member (not shown) between the second plungers 22. The first plunger 21, the second plunger 22, and the line member 23 constituting the probe 2 have the same axis. When contacting the semiconductor package 100, the probe 2 is stretched in the axial direction by the spring member inside the pipe member 23 to alleviate the impact on the electrode 101 of the semiconductor package 100, and is applied to the semiconductor package 100 and the wiring substrate 200. Load. Further, since the first plunger 21 is in contact with, for example, the hemispherical electrode 101 (see FIG. 5) in the semiconductor package 100, it has a plurality of claw portions having a tapered tip shape.

The probe holder 3 is composed of a first member 31 located on the upper surface side of the second figure and a second member 32 located on the lower surface side. The probe holder 3 is in a state in which the first member 31 and the second member 32 are laminated, by means of four screws 9, 10 Connected and fixed separately. Further, the screw 9 has a longer axial length than the screw 10 and a longer thickness than the state in which the first member 31 and the second member 32 are laminated in the probe holder 3. Further, the length of the screw 10 in the axial direction is substantially the same as the thickness of the state in which the first member 31 and the second member 32 are laminated.

The first member 31 is formed by laminating a plate-shaped first laminated member 33 formed of an insulating material such as a resin or a machinable ceramic, and a high strength using a metal such as aluminum or stainless steel (SUS304) or ceramics. The plate-shaped second laminate member 34 formed of a material is formed. Further, in the first member 31, two insertion holes 31a through which the connection pins 5 are inserted are formed, and the connection pins 8 and the coil springs 8a are inserted, respectively, and the two cross-sections having the shape of the incident stage are inserted. The holes 31b are respectively four insertion holes 31c through which the screws 9 are inserted, and four insertion holes 31d through which the screws 10 are respectively inserted. Here, the insertion hole 31b is formed in a shape of an incidental stage by a large diameter portion slightly larger than the diameter of the coil spring 8a and a small diameter portion having a diameter smaller than that of the coil spring 8a and larger than the diameter of the connecting pin 8. .

On the other hand, the second member 32 is a plate-shaped first laminated member 35 formed by laminating an insulating material such as resin or machinable ceramic in the thickness direction, and a metal or ceramic using aluminum or stainless steel (SUS304). A plate-shaped second laminate member 36 formed of a high-strength material. Further, in the second member 32, two insertion holes 32a through which the connection pins 5 are inserted are formed, and four recesses 32b through which the screws 9 are inserted are recessed from the side faces of the second member 32; And four insertion holes 32c through which the screws 10 are respectively inserted.

In addition, the first member 31 and the second member 32 are laminated with the second laminate member 34 and the second surface so that the plate faces opposite to the plate faces of the first laminate members 33 and 35 face each other. The laminated member 36 is constructed.

In the first member 31 and the second member 32, the same number of holder holes 37, 38 for accommodating the plurality of probes 2 are formed, and the holder holes 37, 38 for accommodating the probe 2 are formed. Consistent with each other's axes. The formation positions of the holder holes 37 and 38 are determined in accordance with the wiring pattern of the semiconductor package 100. In addition, in the second laminated member 34 and the second laminated member 36, an opening provided in a region including the formation region (probe arrangement region) of the holder holes 37 and 38 and penetrating in the thickness direction is formed. 34a, 36a. In each of the openings 34a and 36a of the second laminated member 34 and the second laminated member 36, the hollow portion S is formed in a state in which the first member 31 and the second member 32 are laminated. Since the probe 2 is not in contact with the second laminated member 34 and the second laminated member 36 by the formation of the hollow portion S, electrical conduction between the probes 2 can be prevented. In addition, when the second laminated member 36 is an insulating material such as ceramics, since the probes 2 are not electrically connected to each other, the configuration in which the hollow portion S is not formed can be applied.

The holder holes 37 and 38 are formed in a shape of an incidental stage in which the diameters are different along the penetration direction. In other words, the holder hole 37 is composed of a small diameter portion 37a having an opening on the upper end surface of the probe holder 3 and a large diameter portion 37b having a larger diameter than the small diameter portion 37a. The small diameter portion 37a is a diameter slightly larger than the diameter of the first plunger 21. Further, the large diameter portion 37b is a diameter slightly larger than the diameter of the pipe member 23.

On the other hand, the holder hole 38 is composed of a small diameter portion 38a having an opening at the lower end surface of the probe holder 3 and a large diameter portion 38b having a larger diameter than the small diameter portion 38a. The small diameter portion 38a is slightly larger than the second plunger 22. Further, the large diameter portion 38b is a diameter slightly larger than the diameter of the pipe member 23. The shape of the retaining holes 37, 38 is determined by the configuration of the probe 2 accommodated therein.

When the semiconductor package 100 is inspected, it is provided from the semiconductor The contact load of the electrode 101 of the package 100 and the electrode 201 of the wiring substrate 200 causes the first plunger 21 and the second plunger 22 to enter the conduit member 23. The inspection signal supplied from the wiring substrate 200 to the semiconductor package 100 at the time of inspection is transmitted from the electrode 201 of the wiring substrate 200 via the second plunger 22 of the probe 2, the spring member inside the piping member 23, and the first plunger 21 The electrode 101 of the semiconductor package 100 is reached.

The base member 4 is formed in a substantially plate shape, and has a conductive substrate 41 constituting a base material, which is formed using a metal such as aluminum or stainless steel (SUS304), and a film 42a and 42b which is a PES (Poly Ether Sulfone, Polyether oxime), PEEK (Polyetheretherketone, polyetheretherketone) is an example of a resin such as engineering plastics, and an insulating high-strength material such as a machinable ceramic, and covers one surface of the substrate 41. Part. Specifically, the coatings 42a and 42b cover the two surfaces constituting the main surface. Further, the base member 4 is formed with an opening portion 43 penetrating in the thickness direction; two insertion holes 44 through which the connection pins 5 are respectively inserted; and two insertion holes 45 for respectively mounting the positioning pins 6; And four insertion holes 46 through which the screws 9 are respectively inserted.

The opening portion 43 is formed in a shape having a stepped state, and is provided with a first opening portion 43a through which the semiconductor package 100 can be inserted, and a second opening portion 43b that can communicate with the first opening portion 43a and can accommodate the floating member 7; The second opening portion 43b communicates with each other to accommodate the third opening portion 43c of the probe holder 3.

The opening area of the first opening portion 43a is set to be larger than that of the semiconductor package 100, and the outer edge shape is smaller than the outer edge shape of the floating member 7. The opening area of the second opening portion 43b is set to be larger than the opening area of the first opening portion 43a, and the outer edge shape is larger than the outer edge shape of the floating member 7. The opening area of the third opening portion 43c is set to be larger than the opening area of the second opening portion 43b, and the outer edge is The shape of the outer edge of the main surface of the probe holder 3 is larger than that of the outer surface of the probe holder 3.

In the base member 4, the slider 7 abuts on the segment portion (the surface substantially parallel to the main surface of the substrate 41) formed by the first opening portion 43a and the second opening portion 43b. Further, the probe holder 3 abuts on the segment portion (the surface substantially parallel to the main surface of the substrate 41) formed by the second opening portion 43b and the third opening portion 43c, and the connection pin 5 and the screw are inserted through 9 to fix. At this time, the probe holder 3 is formed to impart potential energy in a direction away from the base member 4 by the coil spring 8a disposed between the floating member 7, and the state in which the movement in the direction of the potential energy is restricted by the screw 9 is restricted. .

The floating member 7 has a body portion 70 that is formed in a substantially plate shape. The main body portion 70 is provided with a through hole 71 that penetrates in a direction orthogonal to the plate surface corresponding to the outer edge shape of the semiconductor package 100, and an insertion hole 72 through which the connection pin 8 is inserted. The through hole 71 is formed to have a side surface inclination so as to be smaller than the opening surface (upper surface) of one end and the opening surface (bottom surface) of the other end. The outer edge shape of the bottom surface of the through hole 71 is substantially the same as or slightly larger than that of the semiconductor package 100. Thereby, the semiconductor package 100 can be easily accommodated in the through hole 71 of the floating member 7.

Further, the main body portion 70 is formed by laminating a substantially lamellar first laminated member 70a and a substantially plate-shaped second laminated member 70b in the thickness direction, and the first laminated member 70a is provided on the upper surface side, and aluminum or stainless steel or the like is used. It is formed of a high-strength material such as metal or ceramics, and the second laminated member 70b is formed using an insulating material such as a resin or a workable ceramic.

Here, the base member 4 is constituted by the substrate 41 and the insulating coatings 42a and 42b being fixed by the adhesive B, respectively. Examples of the binder include a liquid, a sheet, a solid, and the like. Alternatively, a crimping piece can be used instead of the adhesive.

Figure 6 is a view for explaining the base of the probe unit 1 of the present embodiment. A diagram of a method of manufacturing the member 4. In the manufacturing method, first, the pre-processed films 301a and 301b to be the coating films 42a and 42b are adhered to the two main faces of the pre-processed base material 300 which is the plate-like shape of the substrate 41 by the adhesive agent B ( The front surface 300a and the back surface 300b) are used to produce a pre-process member (a laminated structure for a probe unit) in which the pre-processed films 301a and 301b are formed in the base material 300 before processing. Thereafter, the opening portion 43 and the insertion holes 44, 45, and 46 are formed for the pre-machined member.

In addition, the pre-processed film 301a (film 42a) which forms the hole which comprises the opening part 43 and the one part of the insertion hole 44, and the opening part 43, and the insertion hole 44, 45, 46 are formed by the adhesive agent B. The pre-processed base material 301b (film 42b) of a part of the holes is bonded to the pre-processed base material 300 (substrate 41) in which the holes constituting one of the opening portion 43 and the insertion holes 44, 45, 46 are formed.

In addition, the first member 31 of the probe holder 3 is also the same. First, the layer is formed into a plate shape of the second layered member 34 on the surface of one of the first pre-processed layered members which are the plate-like shape of the first layered member 33. The second pre-processed laminated member is bonded to the above-mentioned adhesive to prepare a first member (a laminated structure for a probe unit) before processing. Thereafter, the first member 31 is formed by forming the insertion holes 31a, 31b, 31c, and 31d, the holder hole 37, and the opening for the first member before the processing. The second member 32 and the body portion 70 are also produced by the same steps.

According to the above-described embodiment, since the insulating coatings 42a and 42b are adhered to the front surface and the back surface of the substrate 41 which is the base material by the adhesive, high rigidity and insulation properties can be maintained, and the production can be easily performed. Further, according to the above-described embodiment, since the manufacturing can be performed without using a screw, the arrangement area of the screws is not required, and the size can be reduced.

Further, according to the above embodiment, since the probe holder 3 is Further, the second laminated member 34 of the metal is adhered to the surface of one side of the insulating first laminated member 33 by the adhesive. Therefore, high rigidity and insulation between the probes 2 can be maintained, and manufacturing can be easily performed.

Further, according to the above-described embodiment, since the insulating coatings 42a and 42b are bonded to the main surface (front surface and back surface) of the substrate 41, the entire surface (including the side surface) of the base material is conventionally covered. The formation of the base member of the film can shorten the processing time of the base member 4.

Further, in the above-described embodiment, the first member 31 and the second member 32 of the probe holder 3 have been described as being formed of the first layered members 33 and 35 formed of an insulating material and using metal. The second laminated members 34 and 36 are configured. However, even if the first member 31 and the second member 32 are formed of only resin, they are applicable. Whether or not the hollow portion S is formed at this time can be arbitrarily designed.

Further, in the above-described embodiment, the first member 31 and the second member 32 of the probe holder 3 have been described as being formed of the first layered members 33 and 35 formed of an insulating material and using metal. The second laminate members 34 and 36 are configured as long as the rigidity of the probe holder 3 is not problematic, and any of the second laminate members 34 and 36 is pressure-bonded between the first laminate members 33 and 35. The second laminate is still applicable.

Further, in the above-described embodiment, the floating member 7 is disposed in the probe unit 1, but any structure is not provided as long as the offset between the probe holder 3 and the semiconductor package does not occur. It is not equipped with a floating member 7, and it is still applicable.

Further, in the above-described embodiment, the probe unit 1 may include at least one of the probe holder 3 or the base member 4 having the above configuration. It is easy to manufacture the probe unit 1. Further, in the above-described embodiment, the connecting pins 5, 8 and the screws 9, 10 may be press-fitted into the through hole, or may be screwed into the insertion hole.

Further, in the above-described embodiment, the main body portion 70 of the floating member 7 is formed by laminating the first laminated member 70a and the second laminated member 70b in the thickness direction, but may be selected from aluminum or stainless steel. A material such as a metal, or a material such as a resin or a processable ceramic.

[Industrial availability]

As described above, the probe member base member, the probe holder, the probe unit, the probe member base member manufacturing method, and the probe unit laminated structure have high rigidity and insulation properties. Further, it is easy to carry out the superiority of manufacturing in accordance with miniaturization.

1‧‧‧ probe unit

2‧‧‧ probe

3‧‧‧ Probe Holder

4‧‧‧Base member for base unit (base member)

6‧‧‧Locating pin

Claims (6)

A base member for a probe unit is provided in a probe unit, and the probe unit includes a conductive probe that is in contact with two different contact bodies at both ends, and a plurality of the probes are exposed a probe holder for accommodating the two end portions of the probes in a predetermined pattern for fixing and holding the probe holder, and the probe unit is used for the probe unit The base member includes a substantially plate-shaped substrate formed of a high-strength material such as metal or ceramic, and has an opening that can accommodate the probe holder, and the film is formed using an insulating material. An adhesive or a crimping piece is fixed to the substrate and covers the two main faces of the substrate. A probe holder is a plurality of conductive probes which are respectively in contact with two different contact bodies at both ends, and are arranged in a predetermined pattern to expose the two end portions of the probes. The probe holder includes a first plate member and a second member which are formed in a substantially plate shape in the thickness direction, and at least one of the first member and the second member has a substantially lamellar first laminate member. The second laminate member is formed of a high-strength material such as metal or ceramic, and is laminated on the first laminate member by an adhesive or a crimping piece. It is fixed to the first laminate member. The probe holder according to the second aspect of the invention, wherein the second laminate member has an opening penetrating in a thickness direction in a region including the storage region of the probe. A probe unit comprising: a conductive probe that is in contact with two different contact bodies at two ends; and a probe holder that exposes the plurality of probes to expose both ends of each probe And the base member for the probe unit is fixed and held by the probe holder; the probe holder and the base member for the probe unit are claimed in the first item. The probe holder and/or the base member for a probe unit according to any one of the preceding claims. A method for manufacturing a base member for a probe unit, wherein the probe unit is provided with a probe unit having a conductive probe that is in contact with two different contact bodies at both ends, And a probe holder for accommodating a plurality of the probes to be arranged in a predetermined pattern in a state in which both ends of the probes are exposed, and the base member for the probe unit is used for holding the probe holder In the manufacturing method, the pre-processing member and the pre-processed film are fixed by an adhesive or a crimping piece, wherein the pre-processed member is a substantially plate-shaped substrate, which is made of metal or ceramic. The high-strength material is formed to have an opening for accommodating the probe holder, and the pre-processed film is a film formed of an insulating material to cover the front and back surfaces of the substrate. A laminated structure for a probe unit is used in a probe unit, which is in contact with two different contact bodies at two ends, and electrically connects the two different contact bodies; In the laminated structure for a probe unit, the first laminated member having a substantially plate shape is formed using an insulating material, and the second laminated member having a substantially plate shape is made of a high-strength material such as metal or ceramic. The material is formed and laminated on the first laminate member and fixed to the first laminate member by an adhesive or a crimping piece.