JP5098339B2 - Manufacturing method of substrate inspection jig - Google Patents

Manufacturing method of substrate inspection jig Download PDF

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JP5098339B2
JP5098339B2 JP2007003277A JP2007003277A JP5098339B2 JP 5098339 B2 JP5098339 B2 JP 5098339B2 JP 2007003277 A JP2007003277 A JP 2007003277A JP 2007003277 A JP2007003277 A JP 2007003277A JP 5098339 B2 JP5098339 B2 JP 5098339B2
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hole
linear member
outer diameter
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JP2008170255A (en
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穣 加藤
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Nidec Read Corp
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本発明は、基板検査装置、基板検査装置に用いられる基板検査治具、およびその基板検査治具の製造方法に関し、特に、多数のプローブを被検査基板の検査点に接触させ、それらのプローブを介して電気信号を授受し、基板に形成された配線の導通、短絡の有無を検査したり、配線の抵抗値を測定するための所謂、多針式基板検査装置、基板検査治具及びその製造方法に関する。
尚、本発明は、プリント配線基板に限らず、例えば、フレキシブル基板、多層配線基板、液晶ディスプレイやプラズマディスプレイ用の電極板、及び半導体パッケージ用のパッケージ基板やフィルムキャリアなど種々の基板における電気的配線の検査に適用でき、本明細書では、それら種々の配線基板を総称して「基板」という。
The present invention relates to a substrate inspection apparatus, a substrate inspection jig used in the substrate inspection apparatus, and a method of manufacturing the substrate inspection jig, and in particular, a large number of probes are brought into contact with inspection points of a substrate to be inspected, So-called multi-needle type substrate inspection device, substrate inspection jig and its manufacture for inspecting the presence or absence of continuity and short circuit of wiring formed on the substrate, and measuring the resistance value of the wiring Regarding the method.
The present invention is not limited to a printed wiring board, but includes, for example, electrical wiring on various substrates such as flexible substrates, multilayer wiring substrates, electrode plates for liquid crystal displays and plasma displays, and package substrates and film carriers for semiconductor packages. In the present specification, these various wiring boards are collectively referred to as “substrates”.

従来、多針式基板検査装置においては、他数の線状プローブをそれらの各一端が被検査基板の配線の検査点に接触するよう保持体に保持し、前記プローブの他端は、保持体に接合する電極板の電極に接触するようになされ、それらの電極がリード線を介して演算・制御回路に接続され、これらの電極及びプローブを介して、演算・制御回路と基板の配線との間の、基板検査のための信号の授受が行われるようになっていた。しかしながら、従来の装置では、多数の電極と演算・制御回路との間をリード線で接続する必要があり、その接続作業に多くの工数を要していた。   Conventionally, in a multi-needle type substrate inspection apparatus, another number of linear probes are held on a holding body so that one end of each of them is in contact with an inspection point of wiring on a board to be inspected, and the other end of the probe is held on a holding body The electrodes are connected to the operation / control circuit via lead wires, and the operation / control circuit and the wiring of the substrate are connected via these electrodes and the probe. In the meantime, signals for substrate inspection were exchanged. However, in the conventional apparatus, it is necessary to connect a large number of electrodes and the arithmetic / control circuit with lead wires, and the connection work requires a lot of man-hours.

このような問題を解決する手段として、特許文献1に記載される公報には、リード線の一端を電極として利用すべく、電極板に形成した貫通孔にリード線を挿通し、リード線の一端を電極板から突出させると共に、封着材を貫通孔に充填してリード線を電極板に固着させた検査治具を提案している。   As a means for solving such a problem, in the publication described in Patent Document 1, in order to use one end of a lead wire as an electrode, the lead wire is inserted into a through hole formed in an electrode plate, and one end of the lead wire is inserted. And an inspection jig in which a lead wire is fixed to the electrode plate by filling the through hole with a sealing material.

特許第3690796号公報Japanese Patent No. 3690796

この特許文献1に開示された検査治具は、線状部材(リード線)の一端を電極として利用することにより、従来のような電極と線状部材との接続作業は回避できるものの、線状部材が電極板に固着されて一体化されているため、電極板が繰り返し使用され、電極として利用されている線状部材が、一つでもその先端が磨耗して機能しなくなった場合、電極板全体を取り替える必要があり、メインテナンスのコストがかかるとの問題を有していた。
本発明は、このような実情に鑑みてなされたもので、メインテナンスが容易で、しかも電極と線状部材との接続作業が不要な基板検査治具の製造方法を提供することを目的とする。
Although the inspection jig disclosed in Patent Document 1 uses one end of a linear member (lead wire) as an electrode, connection work between the conventional electrode and linear member can be avoided. Since the member is fixed and integrated with the electrode plate, the electrode plate is repeatedly used, and even if one of the linear members used as an electrode is worn out and does not function, the electrode plate It was necessary to replace the whole, and there was a problem that the maintenance cost was high.
The present invention has been made in view of such circumstances, maintenance is easy, moreover aims at connecting work between the electrode and the linear member to provide a method for producing unnecessary board inspection jig .

請求項記載の発明は、複数のプローブと、前記複数のプローブの一端を被検査基板の検査点に接触させるとともに他端を演算・制御装置に接続された電極に接触させて保持するプローブ保持体と、前記電極を複数備えるとともにプローブ保持体に組み合わせられる電極板とを備えた基板検査の製造方法において、線状の導電性芯部と該導電性芯部の周縁に亘って被覆される絶縁被覆部を有する線状部材から、該絶縁被覆部の一部を取り除いて導電性芯部が露出させ、前記露出された導電性芯部の周縁に、前記絶縁被覆部よりも大きな外径を有する導電性の外径部を電気鋳造により形成することによって前記電極を形成し、前記電極板の表面の前記電極が配置される所定位置に、前記プローブとの接触側に前記外径部と嵌合する第一孔部と、該第一孔部と連通連結するとともに前記絶縁被覆部と嵌合する第二孔部を有する段付貫通孔を形成し、前記線状部材を前記段付貫通孔に挿通して、前記第一孔部と前記外径部を嵌合させ、前記電極板の表面と前記線状部材が面一となるように、該表面に沿って該線状部材を切断することを特徴とする基板検査治具の製造方法を提供する。
請求項記載の発明は、複数のプローブと、前記複数のプローブの一端を被検査基板の検査点に接触させるとともに他端を演算・制御装置に接続された電極に接触させて保持するプローブ保持体と、前記電極を複数備えるとともにプローブ保持体に組み合わせられる電極板とを備えた基板検査の製造方法において、線状の導電性芯部と該導電性芯部の周縁に亘って被覆される絶縁被覆部を有する線状部材から、該絶縁被覆部の一部を取り除いて導電性芯部が露出させ、前記露出された導電性芯部の周縁に、前記絶縁被覆部よりも大きな外径を有する導電性の外径部を電気鋳造により形成することによって前記電極を形成し、前記電極板の表面の前記電極が配置される所定位置に、前記プローブとの接触側に前記外径部と嵌合する第一孔部と、該第一孔部と連通連結するとともに前記絶縁被覆部と嵌合する第二孔部を有する段付貫通孔を形成し、前記電極板の表面に、所定厚みを有するとともに前記所定位置に前記第一孔部と同じ径を有する第三貫通孔が設けられるシート部材が載置され、前記線状部材を、前記段付貫通孔と第三貫通孔に挿通して、前記第一孔部及び前記第三貫通孔と前記外径部を嵌合させ、前記シート部材の表面と前記線状部材が面一となるように、該表面に沿って該線状部材を切断することを特徴とする基板検査治具の製造方法を提供する。
これらの発明を提供することによって、上記課題を解決する。
According to the first aspect of the present invention, there are provided a plurality of probes and probe holding for holding one end of the plurality of probes in contact with an inspection point of a substrate to be inspected and the other end in contact with an electrode connected to a calculation / control device. body and, in the manufacturing method of substrate inspection jig and a combination is the electrode plate in the probe holding body together comprises a plurality of said electrodes, covering over the periphery of the linear conductive core and the conductive core A part of the insulating coating part is removed from the linear member having the insulating coating part to expose the conductive core part, and the outer periphery of the exposed conductive core part is larger than the insulating coating part. said electrode to form an outer diameter portion of the conductive having a diameter by forming the electroforming, the predetermined position where the electrode surface of the electrode plate are disposed, the outer diameter on the contact side of the probe 1st hole to be fitted with Forming a stepped through hole having a second hole portion that is connected to the first hole portion and is fitted to the insulating coating portion, and the linear member is inserted into the stepped through hole, A board inspection comprising: fitting one hole portion and the outer diameter portion, and cutting the linear member along the surface so that the surface of the electrode plate and the linear member are flush with each other. A method for manufacturing a jig is provided.
According to a second aspect of the present invention, there are provided a plurality of probes and probe holding for holding one end of the plurality of probes in contact with an inspection point of a substrate to be inspected and the other end in contact with an electrode connected to an arithmetic / control device. body and, in the manufacturing method of substrate inspection jig and a combination is the electrode plate in the probe holding body together comprises a plurality of said electrodes, covering over the periphery of the linear conductive core and the conductive core A part of the insulating coating part is removed from the linear member having the insulating coating part to expose the conductive core part, and the outer periphery of the exposed conductive core part is larger than the insulating coating part. said electrode to form an outer diameter portion of the conductive having a diameter by forming the electroforming, the predetermined position where the electrode surface of the electrode plate are disposed, the outer diameter on the contact side of the probe 1st hole to be fitted with And forming a stepped through hole having a second hole portion that is connected to the first hole portion and is fitted to the insulating covering portion, and has a predetermined thickness on the surface of the electrode plate and the predetermined position at the predetermined position. A sheet member provided with a third through hole having the same diameter as the first hole portion is placed, and the linear member is inserted through the stepped through hole and the third through hole, and the first hole portion and The third through hole and the outer diameter portion are fitted, and the linear member is cut along the surface so that the surface of the sheet member and the linear member are flush with each other. A method for manufacturing a substrate inspection jig is provided.
By providing these inventions, the above problems are solved.

請求項1に記載の発明によれば、線状部材の一端が電極として利用されているので、従来のような電極と線状部材との接続作業がなくなることに加え、線状部材は、電極板の貫通孔に挿通されているだけなので、個別に電極板から抜き出すことができる。
このため、いずれかの線状部材の外径部の表面が磨耗した場合には、その磨耗した線状部材のみを抜き取って取り替えることができるようになり、メインテナンスが容易になる。
請求項に記載の発明によれば、所定厚みのシート部材を用いて、電極板の表面から所定厚み分だけ突出するように線状部材を形成することができる。このため、このシート部材の厚みを調整することによって、所望する任意の突出量を調整することができる。
According to the first aspect of the present invention, since one end of the linear member is used as an electrode, in addition to the conventional operation of connecting the electrode and the linear member, the linear member is an electrode. Since it is only inserted through the through hole of the plate, it can be individually extracted from the electrode plate.
For this reason, when the surface of the outer diameter part of any linear member is worn out, only the worn linear member can be extracted and replaced, and maintenance is facilitated.
According to the second aspect of the present invention, the linear member can be formed so as to protrude from the surface of the electrode plate by a predetermined thickness using a sheet member having a predetermined thickness. For this reason, by adjusting the thickness of the sheet member, it is possible to adjust a desired amount of protrusion.

図1は、本発明に係る基板検査装置の概略構成図である。図1において、被検査基板10は、図示しない位置において支持体12に載置されて、図1で示される検査位置へと搬送される。搬送された被検査基板10は、図1で示す如く、被検査基板10の表面と裏面に配置されている検査治具で検査を行うことができるように、配置されることになる。
符号20は、被検査基板10の図において上面の検査点にプローブ22を接触させるべく、多数の線状プローブ20を保持している上側プローブ保持体である。
符号40は、被検査基板10の図において下面の検査点にプローブ42を接触させるべく、多数の線状プローブ42を保持している下側プローブ保持体である。
FIG. 1 is a schematic configuration diagram of a substrate inspection apparatus according to the present invention. In FIG. 1, a substrate 10 to be inspected is placed on a support 12 at a position (not shown) and conveyed to an inspection position shown in FIG. As shown in FIG. 1, the transferred substrate 10 to be inspected is arranged so that it can be inspected with inspection jigs arranged on the front and back surfaces of the substrate 10 to be inspected.
Reference numeral 20 denotes an upper probe holder that holds a number of linear probes 20 so that the probe 22 is brought into contact with an inspection point on the upper surface in the drawing of the substrate 10 to be inspected.
Reference numeral 40 denotes a lower probe holder that holds a large number of linear probes 42 so that the probes 42 are brought into contact with inspection points on the lower surface of the substrate 10 to be inspected.

上側プローブ保持体20は、スペーサを兼ねた支柱24,26に固定され、支持されている案内板28、支持板32を備え、それらの板にはそれぞれ所定位置に貫通孔が形成されている。プローブ22はそれらの貫通孔に挿通され、貫通孔内壁とプローブ22との摩擦、あるいは案内板の貫通孔が出口で縮径されてプローブ22の先端部の裸線部のみを通すなどの手段により、案内板28、支持板32および支柱から成る保持体に保持されている。   The upper probe holder 20 includes a guide plate 28 and a support plate 32 which are fixed to and supported by support columns 24 and 26 which also serve as spacers, and through holes are respectively formed at predetermined positions on these plates. The probes 22 are inserted into the through holes, and the friction between the inner walls of the through holes and the probes 22 or the through holes of the guide plate are reduced in diameter at the outlet so that only the bare wire portion at the tip of the probe 22 is passed. The guide plate 28, the support plate 32, and a support body made up of support columns are held.

符号34は、電極板であり、プローブを介して基板の検査点にテスト信号を送り、検査点から検出信号を受けて、配線の断線や短絡の有無を判定し、あるいは、配線の抵抗値を算出する演算制御回路36に接続される線状部材38の一端を保持し、それら線状部材38の先端をプローブ22の多端に接触させるよう、支持板32に接合されている。
この図1では、プローブ22が電極板34の電極と導通接触するように接続されている。また、実際の被検査基板10の検査が行われる場合には、プローブ22が被検査基板10上に設定される検査点と導通接触するように接続されている。
この図1では、電極板34と演算・制御回路36を電気的に接続するための導電性の線状部材38が示されている。この線状部材38は一の電極毎に設けられており、電極の数と同数の線状部材38が配設されている。
Reference numeral 34 denotes an electrode plate, which sends a test signal to an inspection point on the substrate through a probe, receives a detection signal from the inspection point, determines the presence or absence of a wire break or short circuit, or determines the resistance value of the wire. One end of the linear member 38 connected to the calculation control circuit 36 to be calculated is held, and the tip of the linear member 38 is joined to the support plate 32 so as to contact the multiple ends of the probe 22.
In FIG. 1, the probe 22 is connected so as to be in conductive contact with the electrode of the electrode plate 34. When an actual inspection of the inspected substrate 10 is performed, the probe 22 is connected so as to be in conductive contact with an inspection point set on the inspected substrate 10.
In FIG. 1, a conductive linear member 38 for electrically connecting the electrode plate 34 and the arithmetic / control circuit 36 is shown. This linear member 38 is provided for each electrode, and the same number of linear members 38 as the number of electrodes are provided.

図2は、本発明実施例の、電極板34と線状部材38を示す部分断面図である。尚、図2では2本の線状部材38のみを示しているが実際には、プローブの数に対応する数だけ線状部材38が設けられる。また、図2においては、図1とは上下関係が逆になっており、図2における電極板34の上面が図1の電極板34の下面に対応し、これらの面が、プローブ保持体に対向することになる。
本発明にかかる線状部材38は、円柱の導電性の芯部38aが配置され、この芯部38aの同軸周縁を絶縁性の素材により形成される絶縁層38bにより被覆されている。この線状部材38としては、たとえば、エナメルを絶縁層38bとして有するリード線を用いることができる。
図2で示される2つの電極39は、導電性の芯部38aとこの芯部38aの周縁に同心に配置される導電性の外径部38cにより形成されている。この電極39は、この図2で示す如く、芯部38aと外径部38cで形成される円柱を横断面に切断し、電極板34と面一となるように配置されている。この外径部38cが設けられる芯部38aの箇所は、絶縁層38bが剥ぎ取られており、芯部38aと外径部38cとは電気的に接続されている。このため、電極39は、平面視において、同心円となるように芯部38aと外径部38cが形成されることになる。この外径部38cは、絶縁層38bよりも大きい外径を有するように形成されている。このため、図2で示される如く、線状部材38は、外径部38cと絶縁層38bの相違する外径を有することになる。
FIG. 2 is a partial cross-sectional view showing the electrode plate 34 and the linear member 38 according to the embodiment of the present invention. In FIG. 2, only two linear members 38 are shown, but in actuality, as many linear members 38 as the number of probes are provided. Also, in FIG. 2, the vertical relationship is reversed from that in FIG. 1, and the upper surface of the electrode plate 34 in FIG. 2 corresponds to the lower surface of the electrode plate 34 in FIG. 1, and these surfaces serve as the probe holder. Will face each other.
In the linear member 38 according to the present invention, a cylindrical conductive core portion 38a is disposed, and the coaxial peripheral edge of the core portion 38a is covered with an insulating layer 38b formed of an insulating material. As the linear member 38, for example, a lead wire having enamel as the insulating layer 38b can be used.
The two electrodes 39 shown in FIG. 2 are formed by a conductive core portion 38a and a conductive outer diameter portion 38c disposed concentrically around the periphery of the core portion 38a. As shown in FIG. 2, the electrode 39 is disposed so as to be flush with the electrode plate 34 by cutting a column formed by the core portion 38 a and the outer diameter portion 38 c into a transverse section. The insulating layer 38b is stripped off from the portion of the core portion 38a where the outer diameter portion 38c is provided, and the core portion 38a and the outer diameter portion 38c are electrically connected. For this reason, the core part 38a and the outer-diameter part 38c are formed so that the electrode 39 may become a concentric circle in planar view. The outer diameter portion 38c is formed to have an outer diameter larger than that of the insulating layer 38b. Therefore, as shown in FIG. 2, the linear member 38 has different outer diameters of the outer diameter portion 38c and the insulating layer 38b.

電極板34は、プローブ側板部34aと装置側板部34bを有してなる。
電極板34のプローブ側板部34aには、段付き貫通孔341が形成されている。この段付き貫通孔341は、図2で示す如く、プローブに近傍する側の孔が大径に形成される大径孔34c、プローブから遠い側の孔が小径に形成される小径孔34dを有している。
大径孔34cは、外径部38cの外径と略同じ又は僅かに大きい径(内径)を有しており、この外径部38cと嵌合するように形成されている。
小径孔34dは、線状部材38の絶縁層38bの外径と略同じ又は僅かに大きい径(内径)を有しており、この絶縁層38bと嵌合するように形成されている。
この大径孔34cと小径孔34dは連通連結され、プローブ側板部34aを貫通するように形成されている。
The electrode plate 34 includes a probe side plate portion 34a and a device side plate portion 34b.
A stepped through hole 341 is formed in the probe side plate portion 34 a of the electrode plate 34. As shown in FIG. 2, the stepped through hole 341 has a large-diameter hole 34c in which a hole on the side near the probe is formed with a large diameter, and a small-diameter hole 34d in which a hole on the side far from the probe is formed with a small diameter. doing.
The large-diameter hole 34c has a diameter (inner diameter) that is substantially the same as or slightly larger than the outer diameter of the outer diameter portion 38c, and is formed to be fitted to the outer diameter portion 38c.
The small-diameter hole 34d has a diameter (inner diameter) substantially the same as or slightly larger than the outer diameter of the insulating layer 38b of the linear member 38, and is formed so as to be fitted to the insulating layer 38b.
The large-diameter hole 34c and the small-diameter hole 34d are connected so as to penetrate the probe side plate portion 34a.

装置側板部34bは、プローブ側板部34aと当接させて配置される。この装置側板部34bは、線状部材38の絶縁層38bと略同じ径又は僅かに大きい径(内径)を有する貫通孔34eが形成されている。この貫通孔34eは、図2で示す如く、線状部材38を内部に収容して、この線状部材38の絶縁層38bと嵌合する。
線状部材38の他端(図示せず)は、従来の装置と同様にして、適当なコネクタを介して演算・制御装置に接続されている。
尚、プローブ側板部34aの段付き貫通孔341と装置側板部34bの貫通孔34eは、連通連結されており、段付き貫通孔341の小径孔34dと貫通孔34eとは略同じ径を有するように形成される。
The apparatus side plate portion 34b is disposed in contact with the probe side plate portion 34a. The device side plate portion 34b is formed with a through hole 34e having substantially the same diameter as the insulating layer 38b of the linear member 38 or a slightly larger diameter (inner diameter). As shown in FIG. 2, the through hole 34 e accommodates the linear member 38 inside and fits with the insulating layer 38 b of the linear member 38.
The other end (not shown) of the linear member 38 is connected to an arithmetic / control device via an appropriate connector in the same manner as a conventional device.
The stepped through hole 341 of the probe side plate portion 34a and the through hole 34e of the device side plate portion 34b are connected in communication, and the small diameter hole 34d and the through hole 34e of the stepped through hole 341 have substantially the same diameter. Formed.

次に、上記実施例の線状部材38および電極板34の製造、組立について説明する。まず、図3(a)に示すように、線状部材38の絶縁層38bを一部剥離して、芯部38aを露出させる。この露出させる距離は、特に限定されないが、少なくとも大径孔34cの深さよりも長く形成される。
次いで、図3(b)に示すように、露出された芯部38aに導電性の素材を筒状に固着させるとともに、線状部材38の絶縁層38bの外径d2よりも大きな外径d1を有するように形成される。
この導電性の素材は、電気鋳造によって、露出された芯部38aに固着させることができることが好ましい。このように、電気鋳造により外径部38cを形成することによって、外径部38cの大きさを精度よく調整することができるからである。この素材には、例えばニッケル等の導電材料をメッキにより筒状に固着させることができる。
また、この外径部38cは、筒状の導電性の部材を形成し、この筒状内部に露出した芯部38aと当接する位置に配置する。
このとき、外径部38cは、後述するプローブ側板部34aの段付き貫通孔341の大径孔34cと嵌合するように形成される。
Next, production and assembly of the linear member 38 and the electrode plate 34 of the above embodiment will be described. First, as shown in FIG. 3A, the insulating layer 38b of the linear member 38 is partially peeled to expose the core portion 38a. The distance to be exposed is not particularly limited, but is formed to be longer than at least the depth of the large-diameter hole 34c.
Next, as shown in FIG. 3B, a conductive material is fixed in a cylindrical shape to the exposed core portion 38a, and an outer diameter d1 larger than the outer diameter d2 of the insulating layer 38b of the linear member 38 is set. Formed to have.
It is preferable that the conductive material can be fixed to the exposed core portion 38a by electroforming. This is because the size of the outer diameter portion 38c can be accurately adjusted by forming the outer diameter portion 38c by electrocasting. For this material, for example, a conductive material such as nickel can be fixed in a cylindrical shape by plating.
The outer diameter portion 38c forms a cylindrical conductive member, and is disposed at a position where the outer diameter portion 38c contacts the core portion 38a exposed inside the cylindrical shape.
At this time, the outer diameter portion 38c is formed so as to be fitted to a large diameter hole 34c of a stepped through hole 341 of the probe side plate portion 34a described later.

一方、電極板34には、図4(a)に示すように、段付き貫通孔341と貫通孔34eを形成する。
この段付き貫通孔341は、上記の如く、図4(a)において上側、即ちプローブに対向する側が大径(大径孔34c)になっていて、下側、即ち、プローブと反対側、換言すれば、演算・制御装置に通じる側は小径(小径孔34d)になっている。
また、貫通孔の数及び位置は、プローブの数および他端部の位置に対応している。
また、電極板34は、段付き貫通孔341が形成されたプローブ側板部34aに、段付き貫通孔341の小径孔34eと同じ内径の貫通孔34eが形成された基部板34bが、対応する貫通孔同士が整合するようにして張り合わせている。
本実施形態では、電極板34を2枚の板で構成し、その一方に段付き貫通孔341を形成し、他方に段付き貫通孔341の小径孔と同じ内径の貫通孔34eを形成して、両貫通孔を整合させることにより、段付き貫通孔341の小径孔34dを比較的に長く形成している。
このように段付き貫通孔341の小径孔34eを長くすることにより、線状部材38が電極板34により確実に保持される。
On the other hand, a stepped through hole 341 and a through hole 34e are formed in the electrode plate 34 as shown in FIG.
As described above, the stepped through hole 341 has a large diameter (large diameter hole 34c) on the upper side in FIG. 4A, that is, the side facing the probe, and the lower side, that is, the side opposite to the probe. In this case, the side leading to the arithmetic / control device has a small diameter (small diameter hole 34d).
The number and position of the through holes correspond to the number of probes and the position of the other end.
The electrode plate 34 has a probe side plate portion 34a in which a stepped through hole 341 is formed and a base plate 34b in which a through hole 34e having the same inner diameter as the small diameter hole 34e of the stepped through hole 341 is formed. The holes are laminated so that the holes are aligned.
In this embodiment, the electrode plate 34 is composed of two plates, one of which has a stepped through hole 341 and the other of which has a through hole 34e having the same inner diameter as the small diameter hole of the stepped through hole 341. By aligning both the through holes, the small diameter hole 34d of the stepped through hole 341 is formed relatively long.
Thus, the linear member 38 is reliably held by the electrode plate 34 by elongating the small diameter hole 34 e of the stepped through hole 341.

このように形成された貫通孔(段付き貫通孔341と貫通孔34e)に、上記のように外径部38cが形成された線状部材38を挿通し、図4(b)に示すごとく、その外径部38cを段付き貫通孔341の大径孔34cに嵌合させる。
このとき、大径孔34cの厚みは、外径部38cの長さよりも短く形成されているので、外径部38cはこの電極板34から突出して配置されることになる。
As shown in FIG. 4B, the linear member 38 having the outer diameter portion 38c formed as described above is inserted into the through holes thus formed (the stepped through holes 341 and the through holes 34e). The outer diameter portion 38 c is fitted into the large diameter hole 34 c of the stepped through hole 341.
At this time, since the thickness of the large-diameter hole 34c is shorter than the length of the outer diameter portion 38c, the outer diameter portion 38c is disposed so as to protrude from the electrode plate 34.

次いで、図4(c)に示すごとく、外径部38cの上面が、電極板34の上面と同一面(面一)となるように、外径部38c及び線状部材38の芯部38aの上方部分を切除する。このように切断することによって、電極板34と電極39が面一となるように形成されることになる。
なお、図4(c)には、符号6で示される切断手段が示されている。
Next, as shown in FIG. 4C, the outer diameter portion 38 c and the core portion 38 a of the linear member 38 are arranged so that the upper surface of the outer diameter portion 38 c is flush with the upper surface of the electrode plate 34. The upper part is excised. By cutting in this way, the electrode plate 34 and the electrode 39 are formed to be flush with each other.
FIG. 4C shows a cutting means indicated by reference numeral 6.

ここで、夫々の貫通孔の内径と線状部材38及び外径部38cの寸法関係は、線状部材38及び外径部38cが夫々の貫通孔に円滑に挿入できると共に、挿入後、貫通孔の内壁との摩擦力により貫通孔内に保持されるように設定されている。
このため、線状部材38を所定の貫通孔に挿入して配置した場合には、この貫通孔から線状部材38が抜け出ることがない。
例えば、線状部材38の絶縁被覆の外径が約200μmに形成され、外径部38cの外径が、約100μmに形成されるのに対して、段付き貫通孔341の小径孔34dの内径は約100μmに形成され、大径孔34cの内径は約200μmに形成される。
なお、大径孔34cと小径孔34dは、上記寸法よりも僅かに小さく形成することもできる。また、貫通孔34eは、小径孔34dと略同じ内径を有するように形成される。
貫通孔に挿通した線状部材38の他端は、夫々演算・制御回路に接続する。
Here, the dimensional relationship between the inner diameter of each through hole and the linear member 38 and the outer diameter portion 38c is such that the linear member 38 and the outer diameter portion 38c can be smoothly inserted into the respective through holes, and after the insertion, It is set to be held in the through hole by the frictional force with the inner wall.
For this reason, when the linear member 38 is inserted and disposed in a predetermined through hole, the linear member 38 does not come out of the through hole.
For example, the outer diameter of the insulating coating of the linear member 38 is formed to be about 200 μm, and the outer diameter of the outer diameter portion 38 c is formed to be about 100 μm, whereas the inner diameter of the small diameter hole 34 d of the stepped through hole 341 is Is formed to about 100 μm, and the inner diameter of the large-diameter hole 34 c is formed to about 200 μm.
The large diameter hole 34c and the small diameter hole 34d can be formed slightly smaller than the above dimensions. The through hole 34e is formed so as to have substantially the same inner diameter as the small diameter hole 34d.
The other end of the linear member 38 inserted through the through hole is connected to the calculation / control circuit.

下側のプローブ保持体40及び電極板54、演算・制御回路56は、上記上側のプローブ保持体20及び電極板34、演算・制御回路36と同じ構造である。
図1において、プローブ保持体40は支柱46に支持された案内板48、支持板52により線状のプローブ42を保持し、これに電極板54が接合されている。下側電極板54の上側電極板34の部品に対応する部品は、説明の都合上省略する。
The lower probe holder 40 and electrode plate 54 and the calculation / control circuit 56 have the same structure as the upper probe holder 20 and electrode plate 34 and the calculation / control circuit 36.
In FIG. 1, the probe holder 40 holds a linear probe 42 by a guide plate 48 and a support plate 52 supported by a support 46, and an electrode plate 54 is joined to the probe 42. Parts corresponding to the parts of the upper electrode plate 34 of the lower electrode plate 54 are omitted for convenience of description.

尚、上述の如く、プローブ保持体及び電極板からなる検査治具を上下で同じにする替わりに、一方を、例えば一対の移動式プローブを順次検査点に接触させるような検査治具にしてもよい。   As described above, instead of making the inspection jig consisting of the probe holder and the electrode plate the same in the upper and lower directions, one of the inspection jigs may be an inspection jig that sequentially brings a pair of movable probes into contact with the inspection points. Good.

次に、電極を製造するための他の方法について説明する。図5は、電極を製造する他の製造工程を示す概略説明図である。
この他の製造方法における電極の製造方法では、プローブ側板部34aと装置側板部34bを重ね、プローブ側板部34aの表面に、シート部材5を積層する。
このシート部材5は、大径孔34cと同じ内径を有する第三貫通孔51が形成されており、夫々対応する大径孔34cと整合する位置に配置されている。このため、シート部材5の厚みd3の長さ分だけ、外径部38cが長く形成される。
Next, another method for manufacturing the electrode will be described. FIG. 5 is a schematic explanatory view showing another manufacturing process for manufacturing an electrode.
In the electrode manufacturing method in this other manufacturing method, the probe side plate portion 34a and the device side plate portion 34b are overlapped, and the sheet member 5 is stacked on the surface of the probe side plate portion 34a.
The sheet member 5 is formed with third through holes 51 having the same inner diameter as the large-diameter hole 34c, and is arranged at a position aligned with the corresponding large-diameter hole 34c. For this reason, the outer diameter portion 38c is formed longer by the length of the thickness d3 of the sheet member 5.

図5(a)では、シート部材5が載置される電極板34の貫通孔に線状部材38が挿通される状態を示す。
まず、電極板34の貫通孔とシート部材5の第三貫通孔51が整合するように載置する。次いで、図5(a)で示される如く、夫々の貫通孔に線状部材38が挿通される。
次に、図5(b)に示される如く、切断手段6により線状部材38がシート部材5の表面と面一となるように切断される。
FIG. 5A shows a state in which the linear member 38 is inserted through the through hole of the electrode plate 34 on which the sheet member 5 is placed.
First, it mounts so that the through-hole of the electrode plate 34 and the 3rd through-hole 51 of the sheet | seat member 5 may match. Next, as shown in FIG. 5A, the linear member 38 is inserted into each through hole.
Next, as shown in FIG. 5B, the linear member 38 is cut by the cutting means 6 so as to be flush with the surface of the sheet member 5.

線状部材38が切断されると、次に、シート部材5を電極板34から取り除く(図5(c)参照)。このとき、電極は、シート部材5の厚み分だけ突出して形成されることになる。
このため、このシート部材5の厚みを調整することによって、電極の突出量を調整することができる。
When the linear member 38 is cut, the sheet member 5 is then removed from the electrode plate 34 (see FIG. 5C). At this time, the electrode is formed so as to protrude by the thickness of the sheet member 5.
For this reason, the protrusion amount of the electrode can be adjusted by adjusting the thickness of the sheet member 5.

次に、本発明に係る絶縁検査装置1の動作の説明を行う。不図示の駆動装置により、支持体12に支持された被検査基板10が図示の検査位置に搬送され位置決めされる。そうすると、夫々プローブ保持体と電極板からなる上下の検査治具が被検査基板に向かって駆動され、プローブ22および42の先端が被検査基板10の各検査点に当接し、プローブは撓んでそれ自身の弾力により、検査点に所定圧力で接触する。プローブ22および42の反対側はそれぞれ電極板34,54の貫通孔に挿通されている線状部材38の外径部38c及び/又は芯部38aの先端に弾接する(図6参照)。   Next, the operation of the insulation inspection apparatus 1 according to the present invention will be described. A substrate to be inspected 10 supported by the support 12 is conveyed and positioned at the inspection position shown by a driving device (not shown). Then, the upper and lower inspection jigs each composed of the probe holder and the electrode plate are driven toward the substrate to be inspected, the tips of the probes 22 and 42 are brought into contact with the inspection points of the substrate 10 to be inspected, Due to its own elasticity, it makes contact with the inspection point at a predetermined pressure. The opposite sides of the probes 22 and 42 are in elastic contact with the outer diameter portions 38c and / or the tips of the core portions 38a of the linear members 38 inserted through the through holes of the electrode plates 34 and 54, respectively (see FIG. 6).

この状態で、演算制御回路36,56から検査用入力信号が、線状部材38及びプローブを介して被検査基板の検査点に入力され、同じ経路の逆向きに検査用出力信号が演算制御回路に送られて、検査結果の判定や測定値の検出が行われる。   In this state, the inspection input signal is input from the arithmetic control circuits 36 and 56 to the inspection point of the substrate to be inspected via the linear member 38 and the probe, and the inspection output signal is reversed in the same path. The inspection result is judged and the measurement value is detected.

本発明に係る絶縁検査装置の一実施形態を示す概略構成図である。It is a schematic structure figure showing one embodiment of an insulation inspection device concerning the present invention. 図1中の符号Aの拡大図であり、電極と線状部材の断面図を示す。FIG. 2 is an enlarged view of a symbol A in FIG. 1, and shows a cross-sectional view of an electrode and a linear member. 線状部材の製造工程を示す概略図である。It is the schematic which shows the manufacturing process of a linear member. 電極の製造工程を示す概略図である。It is the schematic which shows the manufacturing process of an electrode. 電極を製造する他の製造工程を示す概略説明図である。なお、線状部材は説明の都合上断面を示していない。It is a schematic explanatory drawing which shows the other manufacturing process which manufactures an electrode. In addition, the linear member does not show the cross section for convenience of explanation. 本発明にかかる電極構造を実施した場合の概略断面図を示す。The schematic sectional drawing at the time of implementing the electrode structure concerning the present invention is shown.

符号の説明Explanation of symbols

20・・・・プローブ保持体
22・・・・プローブ
34・・・・電極板
34c・・・大径孔
34d・・・小径孔
34e・・・貫通孔
38・・・・線状部材
38a・・・芯部
38b・・・絶縁層
38c・・・外径部
39・・・・電極
5・・・・・シート部材
51・・・・第三貫通孔
20... Probe holder 22... Probe 34... Electrode plate 34 c... Large diameter hole 34 d... Small diameter hole 34 e. .... Core part 38b ... Insulating layer 38c ... Outer diameter part 39 ... Electrode 5 ... Sheet member 51 ... Third through hole

Claims (2)

複数のプローブと、前記複数のプローブの一端を被検査基板の検査点に接触させるとともに他端を演算・制御装置に接続された電極に接触させて保持するプローブ保持体と、前記電極を複数備えるとともにプローブ保持体に組み合わせられる電極板とを備えた基板検査の製造方法において、
線状の導電性芯部と該導電性芯部の周縁に亘って被覆される絶縁被覆部を有する線状部材から、該絶縁被覆部の一部を取り除いて導電性芯部が露出させ、
前記露出された導電性芯部の周縁に、前記絶縁被覆部よりも大きな外径を有する導電性の外径部を電気鋳造により形成することによって前記電極を形成し、
前記電極板の表面の前記電極が配置される所定位置に、前記プローブとの接触側に前記外径部と嵌合する第一孔部と、該第一孔部と連通連結するとともに前記絶縁被覆部と嵌合する第二孔部を有する段付貫通孔を形成し、
前記線状部材を前記段付貫通孔に挿通して、前記第一孔部と前記外径部を嵌合させ、
前記電極板の表面と前記線状部材が面一となるように、該表面に沿って該線状部材を切断することを特徴とする基板検査治具の製造方法。
A plurality of probes, a plurality of probes, a probe holder that holds one end of the plurality of probes in contact with an inspection point of a substrate to be inspected and the other end in contact with an electrode connected to an arithmetic / control device, and a plurality of the electrodes in manufacturing method of a substrate inspection jig and a combination is the electrode plate in the probe holding body together,
From a linear member having a linear conductive core and an insulating coating that covers the periphery of the conductive core, a portion of the insulating coating is removed to expose the conductive core,
Wherein the periphery of the exposed conductive core, the electrode is formed by forming by electroforming the outer diameter portion of the conductive having a larger outer diameter than the insulating coating part,
A first hole portion that fits the outer diameter portion on the contact side with the probe at a predetermined position on the surface of the electrode plate, and is connected to the first hole portion and is connected to the insulating coating. Forming a stepped through hole having a second hole to be fitted with the part,
Inserting the linear member through the stepped through-hole, fitting the first hole portion and the outer diameter portion,
A method for manufacturing a substrate inspection jig, comprising cutting the linear member along the surface so that the surface of the electrode plate and the linear member are flush with each other.
複数のプローブと、前記複数のプローブの一端を被検査基板の検査点に接触させるとともに他端を演算・制御装置に接続された電極に接触させて保持するプローブ保持体と、前記電極を複数備えるとともにプローブ保持体に組み合わせられる電極板とを備えた基板検査の製造方法において、
線状の導電性芯部と該導電性芯部の周縁に亘って被覆される絶縁被覆部を有する線状部材から、該絶縁被覆部の一部を取り除いて導電性芯部を露出させ、
前記露出された導電性芯部の周縁に、前記絶縁被覆部よりも大きな外径を有する導電性の外径部を電気鋳造により形成することによって前記電極を形成し、
前記電極板の表面の前記電極が配置される所定位置に、前記プローブとの接触側に前記外径部と嵌合する第一孔部と、該第一孔部と連通連結するとともに前記絶縁被覆部と嵌合する第二孔部を有する段付貫通孔を形成し、
前記電極板の表面に、所定厚みを有するとともに前記所定位置に前記第一孔部と同じ径を有する第三貫通孔が設けられるシート部材が載置され、
前記線状部材を、前記段付貫通孔と第三貫通孔に挿通して、前記第一孔部及び前記第三貫通孔と前記外径部を嵌合させ、
前記シート部材の表面と前記線状部材が面一となるように、該表面に沿って該線状部材を切断することを特徴とする基板検査治具の製造方法。
A plurality of probes, a plurality of probes, a probe holder that holds one end of the plurality of probes in contact with an inspection point of a substrate to be inspected and the other end in contact with an electrode connected to an arithmetic / control device, and a plurality of the electrodes in manufacturing method of a substrate inspection jig and a combination is the electrode plate in the probe holding body together,
From the linear member having a linear conductive core and an insulating coating that covers the periphery of the conductive core, a portion of the insulating coating is removed to expose the conductive core,
Wherein the periphery of the exposed conductive core, the electrode is formed by forming by electroforming the outer diameter portion of the conductive having a larger outer diameter than the insulating coating part,
A first hole portion that fits the outer diameter portion on the contact side with the probe at a predetermined position on the surface of the electrode plate, and is connected to the first hole portion and is connected to the insulating coating. Forming a stepped through hole having a second hole to be fitted with the part,
On the surface of the electrode plate, a sheet member having a predetermined thickness and provided with a third through hole having the same diameter as the first hole at the predetermined position is placed.
The linear member is inserted into the stepped through hole and the third through hole, and the first hole portion, the third through hole, and the outer diameter portion are fitted,
A method of manufacturing a substrate inspection jig, comprising: cutting a linear member along the surface so that the surface of the sheet member is flush with the linear member.
JP2007003277A 2007-01-11 2007-01-11 Manufacturing method of substrate inspection jig Active JP5098339B2 (en)

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JP2012251873A (en) * 2011-06-03 2012-12-20 Hioki Ee Corp Probe unit, circuit board inspection device and probe unit manufacturing method
JP7148212B2 (en) * 2017-04-27 2022-10-05 日本電産リード株式会社 Inspection jig and board inspection device
CN106932615B (en) * 2017-04-28 2024-02-13 尼得科精密检测设备(浙江)有限公司 Inspection jig and inspection apparatus provided with the same
TW202032137A (en) * 2019-02-22 2020-09-01 日商日本電產理德股份有限公司 Test jig
TWI679424B (en) * 2019-03-29 2019-12-11 矽品精密工業股份有限公司 Detection device and manufacturing method thereof
JP2021188947A (en) * 2020-05-27 2021-12-13 株式会社日本マイクロニクス Optical connector protection structure and connecting device

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JPH05307058A (en) * 1992-04-30 1993-11-19 Ibiden Co Ltd Inspection jig for printed circuit board
JPH06138146A (en) * 1992-10-27 1994-05-20 Ibiden Co Ltd Inspection jig of printed wiring board
JPH07294554A (en) * 1994-04-26 1995-11-10 Onishi Denshi Kk Probe for electric continuity inspection of printed-wiring board
JP3018064B2 (en) * 1995-02-24 2000-03-13 東洋電子技研株式会社 Contact device and manufacturing method thereof
JPH1164384A (en) * 1997-08-11 1999-03-05 Koyo Technos:Kk Manufacture of probe head
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JP3849948B1 (en) * 2005-11-16 2006-11-22 日本電産リード株式会社 Substrate inspection jig and inspection probe

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