TWI730708B - MEMS probe test head and probe card with 3D circuit - Google Patents

Abstract

The present invention is a microelectromechanical probe test head with 3D circuit and a probe card. The probe head includes a carrier and a plurality of probes. The carrier has an upper surface, a side surface and a lower surface. At least one set of 3D circuit, the 3D circuit is distributed by a plurality of lines and connected to the upper surface, the side surface and the upper surface, and the upper surface is provided with a plurality of upper pads, and the lower surface is provided with a plurality of lower pads; the probe consists of The top-down sequence includes the needle tail, the needle body and the needle tip. The needle tail is welded to the lower pad at the opposite position, so that the needle body extends below the window and the needle tip faces downward. The probe card further includes a carrier board, a circuit board and a lens assembly. The carrier board is provided with a plurality of carrying slots for the carrier to be installed in, the circuit board is mounted on the carrier board and electrically connected to the upper pads, and the lens set is arranged in the window, thereby making the manufacturing process simpler and suitable for testing Small size image sensor chip.

Description

MEMS probe test head and probe card with 3D circuit

The invention relates to the technical field of a probe test head with a 3D circuit and a probe card.

When semiconductor chips are tested, the test equipment is electrically connected to the object under test through a probe card device, and the test result of the object under test is obtained through signal transmission and signal analysis. The existing probe card device is provided with a plurality of probes corresponding to the electrical contacts of the object to be measured, and the required electronic signals are obtained by simultaneously contacting the corresponding electrical contacts of the object to be measured by the multiple probes.

As the size of the object under test (such as the image sensor chip) is getting smaller and smaller, the distance between the electrical contacts on the relative ground chip is getting smaller. Therefore, the probe card device used in this type of object under test uses micro probes. Manufactured by Microelectromechanical Systems (MEMS) technology, its appearance can be shaped according to the designer's needs. However, such probes are small in size and large in number. How to efficiently install multiple probes on a carrier and then electrically connect them to a circuit board via relative lines on the carrier is a subject of continuous research and consideration by manufacturers. In addition, if the object to be tested is an image sensing sensor chip, a lens set must be used together with the short back focus distance, which in turn limits the longitudinal size of the carrier and increases the difficulty of assembly and design.

Therefore, the inventors of the present invention focus on the above-mentioned problems, study with great concentration and cooperate with the application of scientific principles, and finally propose an invention that is reasonably designed and effectively improves the above-mentioned problems.

In order to solve the above-mentioned problems, the main purpose of the present invention is to provide a MEMS probe test head and a probe card with a 3D circuit, which are mainly formed on a carrier by using a 3D circuit, and a fixture can be used to assist in the assembly of multiple probes. And fix it to the carrier or use at least one probe set to fix it to the carrier, thereby completing the assembly of the carrier and the probe, and subsequently cooperating with the assembly of the carrier board, circuit board, and lens set to form a probe card structure, simplifying The assembly process is highly accurate, and the subsequent test operations can be performed more efficiently on the wafer under test composed of small-sized image sensor chips.

To achieve the above objective, the present invention is a MEMS probe test head with a 3D circuit, which includes a carrier and a plurality of probes. The carrier has an upper surface, a side surface, and a lower surface. The center has a window. The carrier is provided with at least one set of 3D circuits. The 3D circuits are distributed by multiple lines and connected to the upper surface, side surfaces and lower surface, and a plurality of upper surfaces are provided on the upper surface. The bottom surface is provided with multiple bottom pads; each probe includes a needle tail, a needle body and a needle tip in sequence from top to bottom. The needle tail is welded to the lower pad at the corresponding position, so that the needle body extends like a cantilever to Below the window with the needle tip facing down.

Furthermore, the present invention is a MEMS probe test head with a 3D circuit, which includes: a carrier and at least one probe set. The carrier has an upper surface, a side surface, and a lower surface. The center has a window. The carrier is provided with at least one set of 3D circuits. The 3D circuits are distributed by multiple lines and connected to the upper surface, the side surface and the lower surface, and the upper surface is provided with a plurality of 3D circuits. The upper contact pad is provided with a plurality of lower contact pads on the lower surface; the probe set includes an insulated tailstock, a needle body and a needle tip from top to bottom, and at least one conductor is provided in the insulated tailstock corresponding to the longitudinal position of each needle body tail section. The top surface of the conductor is exposed on the top surface of the insulated tailstock. When the probe set is adhered to the bottom surface, the top surface of the conductor is electrically connected to the lower pad at the corresponding position, and the bottom end of the conductor is connected to the corresponding needle body to make the needle The body extends below the window like a cantilever with the needle tip facing down.

In another aspect, the present invention is a microelectromechanical probe card with a 3D circuit, which includes a plurality of carriers, a plurality of probes, a carrier board, a circuit, and a lens group. The carrier has an upper surface, a side surface, and a lower surface. The center has a window. The carrier is provided with at least one set of 3D circuits. The 3D circuits are distributed by multiple lines and connected to the upper surface, side surfaces and lower surface, and a plurality of upper surfaces are provided on the upper surface. The connecting pads are provided with a plurality of lower connecting pads on the lower surface. Each probe includes a needle tail, a needle body, and a needle tip in sequence from top to bottom. The needle tail is welded to the lower pad at the opposite position, and the needle body extends to the bottom of the window like a cantilever with the needle tip facing down. The carrier board is provided with a plurality of carrying grooves, and each carrying groove is used for the carrier to be installed therein. The lower surface of the circuit board is provided with electrical contacts, the circuit board is provided with a carrier board, and the electrical contacts are electrically connected to the upper contact pads at the corresponding positions. The lens group is set in the window.

Another aspect of the present invention is a microelectromechanical probe card with a 3D circuit, which includes a plurality of carriers, at least one probe set, a carrier board, a circuit board, and a lens set. The carrier has an upper surface, a side surface, and a lower surface. The center has a window. The carrier is provided with at least one set of 3D circuits. The 3D circuits are distributed by multiple lines and connected to the upper surface, side surfaces and lower surface, and a plurality of upper surfaces are provided on the upper surface. The connecting pads are provided with a plurality of lower connecting pads on the lower surface. The probe set includes an insulated tailstock, a needle body and a needle tip from top to bottom. At least one conductor is provided in the insulated tailstock corresponding to the longitudinal position of the tail section of each needle body. The top surface of the conductor is exposed on the top surface of the insulated tailstock. When the assembly is adhered to the lower surface, the top surface of the conductor is electrically connected to the lower pad at the corresponding position, and the bottom end of the conductor is connected to the corresponding needle body, so that the needle body extends under the window like a cantilever with the needle tip facing down. The carrier board is provided with a plurality of carrying grooves, and each carrying groove is used for the carrier to be installed here; the lower surface of the circuit board is provided with electrical contacts, and the circuit board is provided on the carrier board, and the electrical contacts are connected to the corresponding upper contact pads. Sexual connection. The lens group is set in the window.

In a preferred embodiment of the present invention, the needle tip has a tip, and the tip is close to the side of the needle body.

In a preferred embodiment of the present invention, each probe set is formed by laser processing at least one hole in the insulating tailstock at a relative position, and the subsequent microelectromechanical manufacturing process sequentially deposits metal in the hole to form a conductor and The relative positions form a plurality of needle bodies and needle tip structures.

In a preferred embodiment of the present invention, at least one positioning protrusion is provided in the carrying groove, and the bottom of the carrier has a concave portion at a relative position. When the carrier is placed in the carrying groove, the positioning protrusion is located in the concave portion.

Based on the above, the present invention has the following advantages: 1. The present invention is composed of a carrier with a 3D circuit and a plurality of probes processed by a micro-electromechanical process. Such a structure is more convenient and easy when the component is produced, assembled, and subsequently installed as a probe card. Simplify the process, save manpower and reduce costs; 2. The probe set of the present invention can be processed by the micro-electromechanical manufacturing process, and it is more convenient and easy to assemble on the carrier, can greatly reduce the assembly man-hours, and has a higher accuracy; 3. When assembling the probe card, multiple carriers are installed on the carrier board. After calibration, it can be electrically connected or fixed to the circuit board later, which is convenient and fast; 4. It can be widely used in the test operation of the image sensor chip with small probe test interval and short back focus distance.

The technical solutions of the present invention will be clearly and completely described below in conjunction with specific embodiments and drawings. It should be noted that when a component is referred to as being “fixed to” or “installed on” another component, it means that it can be directly on the other component or a centered component may also exist. When an element is considered to be "connected" to another element, it means that it can be directly connected to the other element or there may be a central element at the same time. In the illustrated embodiment, the directions indicate that up, down, left, right, front and back, etc. are relative, and are used to explain that the structure and movement of different components in this case are relative. These representations are appropriate when the parts are in the positions shown in the figure. However, if the description of the component location changes, it is considered that these representations will also change accordingly.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention. The terminology used herein is only for the purpose of describing specific embodiments, and is not intended to limit the present invention. The term "and/or" as used herein includes any and all combinations of one or more related listed items.

As shown in Fig. 1 and Fig. 2, respectively are three-dimensional views of different angles of the probe test head of the present invention. The present invention is a microelectromechanical probe test head with 3D circuit, including: a carrier 1 and a plurality of probes 2.

The carrier 1 is used for mounting and fixing a plurality of probes 2 here, and is provided with a 3D circuit 10 as the electrical signal transmission of the probes 2. In this embodiment, the carrier 1 is a rectangular body with an upper surface 11, a side surface 12, and a lower surface 13, with a through window 14 in the center, and recessed recesses 15 in the four corners of the bottom. The window 14 can be used for a lens group to be installed here, and the recess 15 is used for subsequent assembly and positioning. In this example, the carrier 1 is fixed with many probes 2 and is provided with a 3D circuit 10. Therefore, the carrier 1 is made of high-strength and low thermal expansion materials, such as silicon nitride, silicon carbide, zirconia, and aluminum oxide. Wait for at least one of these materials.

The 3D circuit 10 is distributed and connected to the upper surface 11, the side surface 12 and the lower surface 13 by a multi-circuit 101 to form a three-dimensional circuit. Please also refer to FIG. 3 for a partial enlarged and exploded schematic view of some components. The 3D circuit 10 is provided with a plurality of upper pads 102 on the upper surface 11, and a plurality of lower pads 103 on the lower surface 13, and each circuit 101 is connected With the upper pad 102 and the lower pad 103 at the corresponding positions, the adjacent lines 101 do not touch each other. The formation method of the 3D circuit 10 in this example is different from the conventional method. The processing method is to use a 3D laser processing machine to form corresponding recessed circuit grooves on the upper surface 11, side 12 and lower surface 13 of the carrier 1 with a laser, and coat a thin metal layer in the grooves, and deposit them with chemical metals. The method is filled with metal, and then the surface is ground to form many adjacent but non-contacting three-dimensional lines. As shown in FIGS. 4A, 4B, and 4C, in the 3D circuit 10 formed by this method, the two adjacent lower pads 103 are not in contact with each other and have a small distance between them, so as to match the probe 2 to be installed here, and then through The line 101 is continuously offset and extended, so that the distance between two adjacent upper pads 102 is enlarged or arranged in a staggered manner, which is convenient for matching the corresponding electrical contact positions of the circuit board.

As shown in FIG. 3, the probe 2 includes a needle tail 21, a needle body 22, and a needle tip 23, and the whole is integrally formed from metal using a micro-electromechanical process. The needle tail 21 is thicker than the needle body 22, and the needle tail 21 is welded to the lower pad 103 at the corresponding position. The needle tip 23 extends downward from the front end of the needle body 22. In this example, the tip 231 of the needle tip 23 is close to the end of the needle body 22, as shown in Fig. 3 to the far left. This is to facilitate position calibration in the future. In the assembly process, for convenience, a jig (not shown in the figure) can be used to carry multiple probes 2 and weld them to multiple lower pads 103 corresponding to the lower surface 13 at a time to complete multiple probes. Pin 2 fixing operation. After assembly, the needle body 22 of the probe 2 extends below the window 14 like a cantilever with the needle tip 23 facing downwards, as shown in FIG. 2.

In the above structure, the method of fixing the probe 2 to the carrier 1 is to use a jig to support the multiple probes 2 to ensure the relative position of each probe 2, and then use the jig to hold the multiple probes 2 at once. The pin tail 21 is welded to the opposite lower pad 103, so that the welding procedure can be reduced, and the accuracy and man-hours of mounting the probe 2 to the carrier 1 can be accelerated. However, it is not limited to this, and the probe set structure shown in the following embodiments can also be used.

As shown in Fig. 5 and Fig. 6, are diagrams of the second embodiment of the present invention. This embodiment provides another way of combining the probe and the carrier. The present invention includes a carrier 1 and at least one probe set 2a. The structure of the carrier 1 is the same as the previous embodiment, so it will not be described again. The improvement is to use a probe set 2a, which includes an insulating tailstock 21a, a plurality of needle bodies 22, and a plurality of needle tips 23. As shown in Figure 7, the insulated tailstock 21a is provided with at least one conductor 24 connected to the longitudinal position of the tail section of each needle body 22. The top surface 241 of the conductor 24 is exposed on the top surface of the insulated tailstock 21a, and the bottom end is connected to the corresponding Needle body 22. In this embodiment, each probe set 2a is formed by laser processing a hole in the insulating tailstock 21a at a relative position, and the subsequent microelectromechanical manufacturing process sequentially forms the conductor 24 and the relative position with metal deposition in the hole. Multiple needle bodies 22 and needle tips 23 and other structures. In this way, each probe set 2a is provided with multiple probes 2 formed by the needle body 22 and the needle tip 23, and the single probe set 2a is directly adhered to the lower surface 13 of the carrier 1 during assembly, and The top surface 241 of each conductor 24 is electrically connected to the corresponding lower pad 103, which further simplifies the assembly work of the probe.

In the above-mentioned Figures 2 and 5, respectively are the perspective views of different implementations of the single structure of the MEMS probe test head with 3D circuit of the present invention, but in actual operation, a plurality of probe test heads are installed to form a probe card. , Used to test multiple wafers to be tested on the wafer. As shown in FIG. 8, it is a cross-sectional view of a microelectromechanical probe card with a 3D circuit of the present invention. The MEMS probe card with 3D circuit of the present invention includes: a plurality of carriers 1, a plurality of probes 2, a carrier board 3, a circuit board 4 and a lens group 5. The structure of the carrier 1 and the plurality of probes 2 is the same as the above-mentioned structure, and the description will not be repeated.

The circuit board 4 is mounted on the carrier 3, and will be combined with the test machine after subsequent assembly to provide telecommunications transmission and control of the test operation. The bottom surface of the circuit board 4 has a plurality of electrical contacts 41, and the electrical contacts 41 are electrically connected to the upper contact pads 102 at positions corresponding to the upper surface 11 of the carrier 1 during assembly. The electrical connection method can use anisotropic conductive adhesive, or add a piece of an intermediate connector (Interposer) mounted with multiple elastic thimble.

As shown in FIG. 9, it is an exploded view of the carrier 3 and part of the carrier 1. The carrier 3 may be a rectangular plate body with a plurality of carrying grooves 31 on it, and each carrying groove 31 is for the carrier 1 to be installed therein. The length of the carrier board 3 and the number of the carrying slots 31 are determined according to usage requirements. Each carrying slot 31 further has at least one positioning protrusion 311. In this embodiment, there are four positioning protrusions 311 and are located at the four corners of the groove. The location of the positioning protrusion 311 is the concave portion 15 corresponding to the four corners of the bottom of the carrier 1. In this embodiment, the size of the bearing groove 31 is slightly larger than that of the carrier 1. The purpose is to fine-tune individual positions after multiple carriers 1 are placed, and then apply glue to fix them. This type of test position requires high precision. Claim.

Next, the assembly method of the present invention will be explained. First, a plurality of probes 2 are fixed on the carrier 1. The fixing method can be the embodiment shown in Fig. 1 or Fig. 4, and then each carrier 1 is placed on the carrier plate 3. In the corresponding bearing groove 31, the position of each carrier 1 is confirmed and fixed after calibration. Place the circuit board 4 on the carrier 3, and electrically connect the electrical contacts 41 with the upper pad 102 on the upper surface 12 of the carrier 1. A set of lens sets 5 are installed in the window 14 of each carrier 1, and so on. Complete the overall assembly. Afterwards, the integral probe card is installed at a testing machine, and the image sensor chip on the wafer can be tested by cooperating with the light source and related control circuit of the testing machine.

In summary, the MEMS probe test head with 3D circuit of the present invention is composed of a carrier 1 with a 3D circuit and a plurality of probes 2. This structure forms a probe card in the production, assembly and processing of components. , Are extremely convenient and easy, and because the longitudinal dimension of the probe 2 can be reduced to less than 1mm, and the size of the carrier 1 can be less than 5mm, it can also be applied to the test of image sensor chips with extremely short back focus distance, which is in line with current semiconductors. The needs of the industry.

The above descriptions are only used to explain the preferred embodiments of the present invention, and are not intended to restrict the present invention in any form. Therefore, any modification or change related to the present invention is made under the same spirit of the invention. , Should still be included in the scope of the present invention's intended protection.

1: carrier 10: 3D circuit 101: Line 102: upper pad 103: lower pad 11: upper surface 12: side 13: lower surface 14: Windows 15: recess 2: Probe 21: Needle tail 22: Needle body 23: Needle tip 231: Tip 2a: Probe set 21a: insulated pin tail 24: Conductor 241: top face 3: carrier board 31: carrying trough 311: positioning bump 4: circuit board 41: Electrical contact

FIG. 1 is a perspective view of a top angle view of a microelectromechanical probe test head with a 3D circuit according to a first embodiment of the present invention;

FIG. 2 is a perspective view of a microelectromechanical probe test head with a 3D circuit according to the first embodiment of the present invention from an elevation view;

3 is a partial enlarged schematic diagram of a MEMS probe test head with a 3D circuit according to the first embodiment of the present invention;

Figure 4A is a top view of the carrier of the present invention;

Figure 4B is a side view of the carrier of the present invention;

Figure 4C is a bottom view of the carrier of the present invention;

FIG. 5 is a perspective view of a microelectromechanical probe test head with a 3D circuit according to a second embodiment of the present invention from an elevation perspective;

6 is a partial enlarged view of a microelectromechanical probe test head with a 3D circuit according to a second embodiment of the present invention;

Figure 7 is a schematic cross-sectional view of the probe set of the present invention;

FIG. 8 is a cross-sectional view of the microelectromechanical probe card with 3D circuit of the present invention;

Fig. 9 is an exploded view of the carrier board and part of the carrier of the present invention.

1: carrier

10: 3D circuit

101: Line

102: upper pad

11: upper surface

12: side

14: Windows

15: recess

2: Probe

Claims (7)

A microelectromechanical probe test head with a 3D circuit, comprising: a carrier with an upper surface, a side surface, and a lower surface, and a window in the center; the carrier is provided with at least one set of 3D circuits; the 3D circuits are distributed and connected by a plurality of lines Is embedded in the upper surface, the side surface and the lower surface, and is provided with a plurality of upper pad embeddings on the upper surface, and a plurality of lower pad embeddings are provided on the lower surface, so that the upper pad, the circuit and the Although the surface of the lower pad is exposed but does not protrude from the upper surface, the side surface and the lower surface, the carrier is made of at least one of silicon nitride, silicon carbide, zirconia, aluminum oxide, etc.; multiple probes , Includes a needle tail, a needle body, and a needle tip in sequence from top to bottom. The needle tail is welded to the lower pad at the opposite position, and the needle body extends below the window like a horizontal cantilever with the needle tip facing down. According to claim 1 of the MEMS probe test head with 3D circuit, the needle tip has a tip, and the tip is close to the side of the needle body. A microelectromechanical probe test head with a 3D circuit, comprising: a carrier with an upper surface, a side surface and a lower surface, and a window in the center. The carrier is provided with at least one set of 3D circuits, which are connected to each other by a plurality of lines. The upper surface, the side surface and the lower surface, and the upper surface is provided with a plurality of upper pads, the lower surface is provided with a plurality of lower pads; at least one probe set, from top to bottom, includes an insulating tailstock, The needle body and the needle tip, the insulating tail base is provided with at least one conductor corresponding to each longitudinal position of the needle body tail section, the top surface of the conductor is exposed on the top surface of the insulating tail base, and the probe set is fixed to the lower surface When the top surface is electrically connected to the lower pad at the corresponding position, the bottom end of the conductor is connected to the corresponding needle body, so that the needle body extends below the window like a horizontal cantilever and the needle tip faces downward, Each of the probe sets is processed by laser on the insulated tailstock At least one hole is formed at a relative position, and a subsequent microelectromechanical manufacturing process sequentially forms the conductor with metal deposition in the hole and forms a plurality of the needle body and the needle tip at the relative position. A microelectromechanical probe card with a 3D circuit, comprising: a carrier with an upper surface, a side surface, and a lower surface, and a window in the center; the carrier is provided with at least one set of 3D circuits, and the 3D circuits are distributed and connected to the The upper surface, the side surface and the lower surface, and the upper surface is provided with a plurality of upper pads, the lower surface is provided with a plurality of lower pads; a plurality of probes, from top to bottom, including a needle tail and a needle body And the needle tip, the needle tail is welded to the lower pad at the corresponding position, the needle body extends below the window like a horizontal cantilever and the needle tip faces downward; a carrier plate is provided with a plurality of carrier grooves, each of the carrier grooves The carrier is installed here; a circuit board with a plurality of electrical contacts on the lower surface, the circuit board is provided on the carrier board, and the electrical contacts are electrically connected to the upper pads at the corresponding positions; The lens group is installed in the window. According to claim 4, the micro-electromechanical probe card with 3D circuit is provided with at least one positioning bump in the carrying slot, and the bottom of the carrier has a recess at a relative position. When the carrier is installed in the carrying slot, the positioning The bump is located in the recess. A microelectromechanical probe card with a 3D circuit, comprising: a carrier with an upper surface, a side surface, and a lower surface, and a window in the center; the carrier is provided with at least one set of 3D circuits, and the 3D circuits are distributed and connected to the The upper surface, the side surface and the lower surface, and the upper surface is provided with a plurality of upper pads, the lower surface is provided with a plurality of lower pads; at least one probe set, including an insulated tailstock, a needle body and a needle tip, At least one conductor is provided in the insulated tailstock corresponding to the longitudinal position of the tail section of the needle body. The top surface of the conductor is exposed on the top surface of the insulated tailstock. When the probe set is fixed to the lower surface, the top end The surface is electrically connected to the lower pad at the corresponding position, and the The bottom end of the conductor is connected to the corresponding needle body, so that the needle body extends below the window like a horizontal cantilever with the needle tip facing down, and each of the probe sets is laser-processed on the insulated tailstock. At least one hole is formed in the relative position, and the subsequent micro-electromechanical manufacturing process sequentially deposits the metal in the hole to form the conductor and forms a plurality of the needle bodies and the needle tips at the relative positions; a carrier plate is provided with a plurality of carrier grooves, each The carrying slot is used for the carrier to be mounted here; a circuit board with a plurality of electrical contacts on the lower surface, the circuit board is provided on the carrier, and the electrical contacts are electrically connected to the upper pad at the opposite position of the carrier ; And a lens group installed in the window. According to claim 6, the microelectromechanical probe card with 3D circuit is provided with at least one positioning bump in the carrying slot, and the bottom of the carrier has a recess at a relative position. When the carrier is installed in the carrying slot, the positioning The bump is located in the recess.

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