TWM552101U - Detection device - Google Patents

Description

Detection device

The present invention relates to a probe card, and more particularly to a detection device with a monitoring function.

At present, in the semiconductor process, before the wafer process is completed and the package is not yet cut, in order to ensure the yield of the wafer and avoid the waste of the package, the electrical test of the wafer stage must be performed first, and the probe on the probe card is probed. The needle directly contacts the pad or bump on the wafer to extract the wafer signal, and then cooperate with peripheral test instruments and software control to achieve automatic measurement.

The probe head of the existing probe card relies on a wafer probe (Prober) for needle position and height alignment. In operation, the load bearing platform (Chuck) carrying the wafer is precisely and precisely contacted with the probe head after the needle pressure is set by the operator. Since the probe tip is in contact with the wafer for a short stroke (possibly only 30~80μm), when the pressure applied to the probe exceeds the needle pressure limit (assuming about 120μm), the probe head will be lifted due to overpressure. The risk of being crushed. Although the current wafer needle measuring machine has the function of setting the needle pressure limit to prevent the probe head from over-pressing, the probe head still has the risk of being easily over-pressed and damaged only by the internal monitoring mechanism of the wafer needle measuring machine. .

Therefore, the creator felt that the above defects could be improved. He devoted himself to research and cooperated with the application of scientific principles, and finally proposed a creation that is reasonable in design and effective in improving the above defects.

The present invention provides a detection device that can effectively improve the defects that may be generated when an existing probe card is subjected to wafer needle measurement.

The present invention discloses a detecting device, comprising: a probe card, comprising: a circuit board; a frame (Jig) disposed on the circuit board; and a probe head mounted on the frame And the probe head includes a plate-shaped unit and a plurality of probes penetrating the plate-shaped unit; wherein each of the probes is electrically connected to the circuit board and away from the circuit board The ends of the plurality of probes are respectively formed with a plurality of heights corresponding to the circuit board, and the ends of the plurality of probes are used to press against an external component; and a detector is detachably Mounted on the probe card and electrically connected to the circuit board, the detector has an end away from the circuit board, and a maximum distance between the end and the circuit board is not more than a minimum height of the heights; wherein when the outer member is pressed against the ends of the plurality of probes, the outer member has a variable distance from the circuit board, and The detector can be used to monitor the variable distance and the minimum height The difference between a to be monitored.

In summary, the detecting device disclosed in the present embodiment can be designed by separately installing a detector on the probe card and connecting the detector card and the probe card to each other. The detector can be used to monitor the above-mentioned difference to be monitored, thereby effectively reducing the risk of overpressure of the probe head.

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings, but the drawings are only for reference and description, and are not intended to limit the scope of the present invention.

100‧‧‧Detection device

1‧‧‧ probe card

11‧‧‧ boards

12‧‧‧Frame

121‧‧‧Installation Department

122‧‧‧ accommodating space

123‧‧‧Perforation

124‧‧‧ screws

13‧‧‧Probe head

131‧‧‧plate unit

1311‧‧‧First guide board

1312‧‧‧Second guide

1313‧‧‧ Spacer

132‧‧‧ probe

1321‧‧‧ Connection section

1322‧‧‧Detection section

14‧‧‧Adapter plate

2‧‧‧Clamp switch (detector)

21‧‧‧Carrier

211‧‧‧Support

212‧‧‧First positioning piece

213‧‧‧Second positioning piece

214‧‧‧With holes

22‧‧‧pressure probe

221‧‧‧ middle section

222‧‧‧Detection section

223‧‧‧Connection section

2'‧‧‧Laser Sensor (Detector)

21’‧‧‧Laser Light Launch

3‧‧‧Fixed bracket

200‧‧‧ wafer needle tester

201‧‧‧ Carrying Module

202‧‧‧Drive Module

203‧‧‧Processing module

O‧‧‧External components

C‧‧‧ Wafer

D, D’‧‧‧ distance

DV, DV’‧‧‧changeable distance

HL, HL’‧‧‧ minimum height

S‧‧‧ alert signal

FIG. 1 is a perspective view of the detecting device of the first embodiment of the present invention.

Figure 2 is an exploded perspective view of Figure 1.

Figure 3 is a cross-sectional view taken along line III-III of Figure 1.

Figure 4 is a cross-sectional view taken along line IV-IV of Figure 1.

FIG. 5 is a schematic diagram of the external component being pressed against a plurality of probe detecting segments in the first embodiment of the present invention.

FIG. 6 is a schematic view showing the pressure switch of the first embodiment of the present invention disposed on a circuit board and positioned outside the frame.

FIG. 7 is a schematic diagram of the detecting device of the first embodiment of the present invention applied to a wafer needle measuring machine.

FIG. 8 is a schematic view showing the laser sensor disposed on the frame mounting portion in the second embodiment of the present invention.

FIG. 9 is a schematic diagram of the external component being pressed against a plurality of probe detecting segments in the second embodiment of the present invention.

FIG. 10 is a schematic view showing the laser sensor disposed on the circuit board and positioned outside the frame in the second embodiment of the present invention.

Please refer to FIG. 1 to FIG. 10 for the embodiments of the present invention. It should be noted that the related embodiments of the present invention are related to the related quantities and appearances mentioned in the drawings, and are only used to specifically describe the implementation of the present creation. Ways to understand the content of this creation, not to limit the scope of this creation.

[First Embodiment]

As shown in FIG. 1 and FIG. 2 , the first embodiment of the present disclosure discloses a detecting device 100 including a probe card 1 , a detector 2 , and a fixing bracket 3 . The detector 2 is mounted on the probe 2 . On the needle card 1, the probe card 1 is mounted on the fixed bracket 3. The specific structure of each component of the detecting device 100 of the present embodiment will be separately described below, and then the connection relationship between the respective components of the detecting device 100 will be described later.

It should be noted that, in order to facilitate the understanding of the present embodiment, the drawings only show the partial configuration of the detecting device 100 in order to clearly show the various component configurations and connection relationships of the detecting device 100.

1 to 4, the probe card 1 includes a circuit board 11 and a frame 12 (Jig), a probe head 13, and an adapter plate 14. The frame 12 is disposed on the circuit board 11 , and the probe head 13 is mounted on the frame 12 . The adapter plate 14 is disposed on the circuit board 11 and located inside the frame 12 .

More specifically, the frame 12 is annular (as shown in FIG. 2) and has a stepped mounting portion 121 formed on the inner upper edge thereof, and the shape of the mounting portion 121 corresponds to the probe head 13 The outer edge is such that the probe head 13 can be mounted on the mounting portion 121 and the probe head 13 can be disposed at a distance from the circuit board 11. An accommodating space 122 and a plurality of through holes 123 are formed on the outer side of the mounting portion 121 . The accommodating space 122 can be used for accommodating the detector 2 . A plurality of the perforations 123 are preferably spaced apart from the frame 12, and each of the perforations 123 can be used to pass a screw 124 (Fig. 3). Thereby, the frame 12 formed with a plurality of perforations 123 can be locked to the circuit board 11 through a plurality of corresponding screws 124. In addition, if it is required to reinforce the overall strength of the circuit board 11, a plurality of screws 124 can penetrate the circuit board 11 and be further locked to the fixing bracket 3, so that the circuit board 11 is clamped and fixed to the frame 12 and the fixing bracket. Between 3

As shown in FIG. 4, the probe head 13 includes a plate-shaped unit 131 and a plurality of probes 132 that are disposed through the plate-shaped unit 131. Preferably, the plate-shaped unit 131 further includes a first guiding plate 1311, a second guiding plate 1312, and an interval disposed between the first guiding plate 1311 and the second guiding plate 1312. Board 1313. The portion of the spacer 1313 corresponding to the probe 132 generally assumes a hollow state, so the probe 132 does not touch the spacer 1313.

Furthermore, each of the probes 132 is electrically connected to the circuit board 11, and the ends of the plurality of probes 132 remote from the circuit board 11 (such as the end of the detection section 1322 of the probe 132 described below) respectively correspond to A plurality of heights are formed on the circuit board 11. More specifically, in the embodiment, the opposite end portions of each of the probes 132 respectively pass through the first guiding plate 1311 and the second guiding plate 1312 of the plate-shaped unit 131, and can be respectively defined as A connecting segment 1321 and a detecting segment 1322. A connecting portion 1321 of the plurality of probes 132 is electrically connected to the circuit board 11. The detection section 1322 of the plurality of probes 132 can be used Pressed against an external component O. In addition, the ends of the plurality of detecting segments 1322 are respectively formed with a plurality of heights corresponding to the circuit board 11, that is, the plurality of the heights are the distance between the ends of the plurality of detecting segments 1322 and the circuit board 11. Defined. It should be noted that the probe head 13 of the present embodiment passes through the first guiding plate 1311 and the second guiding plate 1312 of the plate-shaped unit 131 at opposite ends of each of the probes 132, respectively, and For example, a connection segment 1321 and a detection segment 1322 are respectively defined. However, in practical applications, the structure of the probe 132 of the probe head 13 and the structure of the plate-like unit 131 and the connection relationship between the two have different variations. Therefore, this creation is not limited to this.

In the embodiment, the adapter board 14 is a signal transfer board (STB). The adapter plate 14 can be used to arbitrarily enlarge or reduce the corresponding proportion or distribution range of the electrical contacts (not labeled) between the circuit board 11 and the plurality of probes 132, that is, the circuit board 11 and the adapter board. The plurality of electrical contacts of 14 may have a distribution range greater than or less than a range of electrical contacts of the plurality of probes 132 and the adapter plate 14.

Further, the adapter plate 14 is disposed between the circuit board 11 and the probe head 13 and is located inside the frame 12. The connecting portion 1321 of the plurality of the probes 132 abuts against the interposer 14 to be electrically connected to the circuit board 11 through the interposer 14 , but the present invention is not limited thereto. For example, the circuit board 11 and the probe card 1 may not have an adapter board 14 (not shown), as long as the circuit board 11 and the probe card 1 can be electrically connected. Just fine.

As shown in FIG. 3 to FIG. 6, the detector 2 can be used to monitor whether the distance between the probe head 13 and the external component O is too close, so as to prevent the probe head 13 from being crushed due to overpressure. Card) risk. In this embodiment, the detector 2 uses a pressure touch switch 2 (see FIG. 3). The pressure contact switch 2 includes a carrier 21 and a pressure contact probe 22 disposed on the carrier 21 . The carrier 21 can further include a support body 211, a first positioning piece 212, and a second positioning piece 213.

The first positioning piece 212 and the second positioning piece 213 are spaced apart from each other. The support body 211 and the pressure contact probe 22 are disposed at the first positioning piece 212 and the second positioning piece 213. The pressure contact probe 22 has an intermediate section 221 , a detecting section 222 , and a connecting section 223 . The intermediate section 221 is located between the first positioning piece 212 and the second positioning piece 213 . The detecting segment 222 passes through the first positioning piece 212, and the free end of the detecting segment 222 is defined as an end. The connecting portion 223 passes through the second positioning piece 213 , and the connecting portion 223 is electrically connected to the circuit board 11 through the frame 12 . It is worth mentioning that the middle section 221 of the pressure-sensitive probe 22 is curved by the positioning of the first positioning piece 212 and the second positioning piece 213, so that the detecting section 222 and the connecting section 223 are mutually connected. The misalignment is provided whereby the pressure-sensitive probe 22 can be stably fixed to the carrier 21, thereby avoiding the risk of slipping.

The first positioning piece 212 and the second positioning piece 213 are made of a polyester film (Mylar) in the present embodiment, but the creation is not limited thereto. For example, in the embodiment not shown in the present invention, the material used for the first positioning piece 212 and the second positioning piece 213 may also be a rubber piece or a crepe film.

The material and structure of the pressure-sensitive probe 22 used in this embodiment may be the same as the material and configuration of any of the probes 132, but the present invention is not limited thereto. That is to say, when the pressure contact switch 2 is manufactured, it is not necessary to find another type of probe 132, and it is only necessary to use the same type as the probe 132 of the probe head 13. Thereby, the manufacturing cost of the pressure touch switch 2 can be saved and the ease of manufacture can be reduced.

Further, the pressure touch switch 2 is disposed in the accommodating space 122 of the frame 12 (as shown in FIG. 3), but the creation is not limited thereto. The position of the pressure touch switch 2 can be adjusted according to the needs of the designer. For example, the pressure touch switch 2 can also be mounted on the circuit board 11 and positioned outside the frame 12 (as shown in FIG. 6).

As shown in FIG. 3 , the accommodating space 122 of the frame 12 communicates with one of the plurality of through holes 123 . The bearing member 21 of the pressure contact switch 2 is formed with a fitting hole 214, and the position of the fitting hole 214 corresponds to the through hole 123 that communicates with the accommodating space 122. Thereby, the screw 124 can be sequentially passed through the corresponding matching hole 214 and the through hole 123, and locked to the circuit board 11 (and the fixing bracket 3), thereby pressing The touch switch 2 is detachably mounted on the probe card 1 and electrically connected to the circuit board 11. Further, by the fixing of the screw 124, the pressure contact switch 2 can be stably fixed to the probe card 1, and is not easily dropped by impact or pulling by an external force, thereby causing damage of the probe card 1.

As shown in FIG. 4 to FIG. 5 , the end of the detecting section 222 of the pressure detecting probe 22 corresponds to the distance D of the circuit board 11 is smaller than the end of the detecting section 1322 of the plurality of probes 132 corresponding to the circuit board 11 . A minimum height HL (fixed value) of the plurality of heights formed. Briefly, a maximum distance D between the end of the detecting section 222 of the pressure-sensitive probe 22 and the circuit board 11 is not greater than a minimum height HL of the plurality of heights.

As shown in FIG. 5, when the external component O is pressed against the detecting sections 1322 of the plurality of probes 132, the external component O and the circuit board 11 have a variable distance DV, and the pressure touch switch 2 can be used. A monitored difference between the variable distance DV and the minimum height HL is monitored. When the difference to be monitored monitored by the pressure touch switch 2 is greater than a threshold, the pressure switch 2 can trigger a warning signal S through the circuit board 11 (as shown in FIG. 7) to stop the relative relationship between the probe card 1 and the external component O. mobile. Wherein, the critical value is between 40 micrometers and 90 micrometers, and a difference between the maximum distance D and the minimum height HL is also between 40 micrometers and 90 micrometers.

In other words, when the external component O just touches the end of the probe 132 having the smallest height HL among the plurality of probes 132, the difference to be monitored monitored by the pressure touch switch 2 is substantially zero, and the probe All of the probes 132 of the head 13 begin to produce needle pressure, but the needle pressure is still within the tolerable range. At this time, the external element O has contacted all of the probes 132 in the probe head 13. Then, when the external component O continues to press the probe 132 of the probe head 13 in the direction of the circuit board 11, the difference to be monitored will continue to rise, and the needle pressure of the probe 132 will continue to rise, but the needle The pressure is still within the tolerable range. Finally, when the external component O contacts the end of the pressure touch probe 22 of the pressure touch switch 2, the difference to be monitored may be greater than a critical value (a value between 40 micrometers and 90 micrometers), at which time The needle pressure of the needle 132 is almost beyond the tolerable van However, if the probe 132 of the probe head 13 is continuously pressed, the probe head 13 may be at risk of being crushed. In order to solve this problem, the pressure touch switch 2 of the present embodiment can further trigger an alert signal S through the circuit board 11 to stop the relative movement of the probe card 1 and the external component O.

Therefore, the detector 2 of the embodiment can use the carrier 21 and the pressure-sensitive probe 22 to fabricate the pressure-contact switch 2, which has the advantages of low manufacturing cost, simple manufacturing method, and stable production quality. Furthermore, in the present embodiment, by providing the pressure contact switch 2 on the probe card 1 (external collision avoidance mechanism), not only the risk of the probe head 13 being crushed due to overpressure is effectively reduced, but also greatly improved. The reliability of the use of the probe card 1. In addition, since the pressure contact switch 2 is electrically connected to the circuit board 11 through the pressure contact probe 22 (internal wiring), the use of the external line is avoided, thereby reducing the pressure contact switch 2 may be hit or pulled by an external force. The risk of falling.

It should be noted that the pressure touch switch 2 of the present embodiment is described by the carrier 21 positioning the pressure touch probe 22, but the creation is not limited thereto. That is, when the probe card 1 is formed with a configuration capable of positioning the above-described pressure contact probe 22, the carrier 21 can also be omitted.

Please refer to FIG. 7 , which is a schematic diagram of the detecting device 100 of the present embodiment applied to a wafer testing machine 200 . The wafer testing machine 200 includes a carrying module 201 (corresponding to the external component O), the detecting device 100, a driving module 202, and a processing module 203. One side of the carrier module 201 is used to carry a wafer C. The detecting device 100 is located above the carrying module 201. The driving module 202 is connected to the other side of the carrying module 201. The processing module 203 is electrically connected to the circuit board 11 of the probe card 1 and the driving module 202. When the operator performs the alignment of the needle position and height of the probe head 13, the carrier module 201 (including the wafer C) will make precise contact with the probe head 13, and multiple probes of the probe head 13 The needle 132 will begin to produce a needle pressure. When the carrying module 201 contacts the end of the pressure touch probe 22 of the pressure touch switch 2, the needle 132 of the probe head 13 has a fast needle pressure Beyond the tolerable range. At this time, the pressure touch switch 2 can trigger an alert signal S through the circuit board 11 and transmit it to the processing module 203. The processing module 203 can stop the relative movement of the probe card 1 and the carrier module 201 according to the warning signal S, thereby preventing the probe head 13 from being crushed.

[Second embodiment]

As shown in FIG. 8 to FIG. 10 , a second embodiment of the present disclosure discloses a detecting apparatus 100 including a probe card 1 , a detector 2 ′, and a fixing bracket 3 , wherein the detector 2 ′ is installed. On the probe card 1, the probe card 1 is mounted on the fixed bracket 3. The probe card 1 and the fixing bracket 3 are the same as those in the first embodiment described above, and are not described herein.

The difference between the present embodiment and the first embodiment is that the detector 2' of the present embodiment employs a laser sensor 2'. The laser sensor 2' can be fixed to the probe card 1 by various means such as screwing, laminating, magnetically attracting, or snapping. Further, the laser sensor 2' may be disposed in the accommodating space 122 of the frame 12 (as shown in Fig. 8), but the creation is not limited thereto. The position of the laser sensor 2' can be adjusted according to the needs of the designer. For example, the laser sensor 2' can also be mounted on the circuit board 11 and located outside the frame 12 (Fig. 10). ).

As shown in Figures 8 through 9, a laser light emitting portion 21' of the laser sensor 2' is defined as an end. The distance D′ formed by the end of the laser sensor 2 ′ corresponding to the circuit board 11 is lower than the heights of the detection sections 1322 of the plurality of probes 132 corresponding to the plurality of heights formed by the circuit board 11 . A minimum height HL' in the middle. Briefly, a maximum distance D' between the end of the laser sensor 2' and the circuit board 11 is no more than a minimum height HL' of the plurality of said heights. Wherein, when the external component O is pressed against the detecting sections 1322 of the plurality of probes 132, the external component O and the circuit board 11 have a variable distance DV', and the laser sensor 2' It can be used to monitor a difference in to-be-monitored between the variable distance DV' and the minimum height HL'. When the difference to be monitored monitored by the laser sensor 2' is greater than a threshold, the laser sensor 2' can trigger an alert signal through the circuit board 11 to stop the relative proximity of the probe card 1 to the external component O. mobile. Wherein, the critical value is between 40 micrometers and 90 micrometers, and a difference between the maximum distance D' and the minimum height HL' is also between 40 micrometers and 90 micrometers.

In other words, when the external component O just touches the end of the probe 132 having the smallest height HL' among the plurality of probes 132, the difference to be monitored monitored by the laser sensor 2' is approximately Zero, all probes 132 of the probe head 13 begin to produce needle pressure, but the needle pressure is still within the tolerable range. Then, when the external component O continues to press the probe 132 of the probe head 13 in the direction of the circuit board 11, the difference to be monitored will continue to rise, and the needle pressure of the probe 132 will continue to rise, but the needle The pressure is still within the tolerable range. Finally, when the external component O continues to move toward the circuit board 11, the difference to be monitored may be greater than a critical value (a value between 40 micrometers and 90 micrometers), at which time the needle pressure of the probe 132 is almost instantaneous. Beyond the tolerable range, if the probe 132 of the probe head 13 is continuously pressed, the probe head 13 may be crushed by overpressure. In order to solve this problem, the laser sensor 2' of the present embodiment can further trigger an alert signal through the circuit board 11 to stop the relative movement of the probe card 1 and the external component O.

Thereby, the detector 2' of the present embodiment employs the laser sensor 2', and the laser sensor 2' is disposed on the probe card 1 (external anti-collision mechanism), thereby effectively reducing The probe head 13 is at risk of being crushed, and the reliability of use of the probe card 1 is greatly improved.

The above description is only the preferred and feasible embodiment of the present invention, and is not intended to limit the scope of protection of the present invention. Any changes and modifications made by the scope of the present application should be protected by the present invention.

100‧‧‧Detection device

1‧‧‧ probe card

11‧‧‧ boards

12‧‧‧Frame

121‧‧‧Installation Department

122‧‧‧ accommodating space

123‧‧‧Perforation

13‧‧‧Probe head

2‧‧‧Clamp switch (detector)

Claims (10)

A detecting device comprising: a probe card comprising: a circuit board; a frame (Jig) disposed on the circuit board; and a probe head mounted on the frame, and the probe The head includes a plate-shaped unit and a plurality of probes penetrating the plate-shaped unit; wherein each of the probes is electrically connected to the circuit board, and a plurality of the probes remote from the circuit board The ends of the pins are respectively formed with a plurality of heights corresponding to the circuit board, and the ends of the plurality of probes are used to press against an external component; and a detector is detachably mounted to the probe The pin card is electrically connected to the circuit board, the detector has an end away from the circuit board, and a maximum distance between the end and the circuit board is not more than a plurality of the heights a minimum height; wherein when the outer member is pressed against the end of the plurality of probes, the outer member has a variable distance from the circuit board, and the detector Can be used to monitor a to-be-monitored between the variable distance and the minimum height Value. The detecting device of claim 1, wherein the detector can trigger an alert signal through the circuit board when the difference to be monitored monitored by the detector is greater than a threshold value, To stop relative movement of the probe card to the external component; wherein the threshold is between 40 microns and 90 microns. The detecting device of claim 1, wherein a difference between the maximum distance and the minimum height is between 40 micrometers and 90 micrometers. The detecting device of claim 1, further comprising a fixing bracket, the probe card is mounted on the fixing bracket, and the circuit board is clamped and fixed between the frame and the fixing bracket . The detecting device of claim 1, wherein the probe card comprises an adapter plate, and the adapter plate is disposed on the circuit board and located inside the frame; wherein each The opposite ends of the probe respectively pass through the plate-shaped unit and are respectively defined as a connecting segment and a detecting segment, and the connecting segments of the plurality of probes abut against the adapter plate to Electrically connected to the circuit board through the adapter plate. The detecting device of any one of claims 1 to 5, wherein the detector is further defined as a laser sensor, and a laser light emitting portion of the laser sensor is defined as The end. The detecting device of any one of claims 1 to 5, wherein the detector is further defined as a pressure touch switch, wherein the external component is pressed against the plurality of the probes The touch switch can trigger the alert signal through the circuit board when the segment is touched and contacts the end of the pressure switch. The detecting device of claim 7, wherein the pressure touch switch comprises a carrier and a pressure contact probe disposed on the carrier, the pressure probe having opposite sides and penetrating a detecting section of the carrier and a connecting section, and a free end of the detecting section is defined as the end, and the connecting section is connected to the circuit board. The detecting device of claim 8, wherein the frame is formed with an accommodating space, and the accommodating space is formed by recessing from a surface of the frame remote from the circuit board, and the touch is The switch is disposed in the accommodating space of the frame. The detecting device of claim 9, wherein the frame is formed with a plurality of perforations, and each of the perforations is for a screw to pass through, and the receiving space is connected to a plurality of the perforations One of the through holes, and the carrier of the pressure contact switch is formed with a matching hole, and the position of the matching hole corresponds to the through hole that communicates with the accommodating space.