CN101923105A - Probe card used for testing image sense chip - Google Patents
Probe card used for testing image sense chip Download PDFInfo
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- CN101923105A CN101923105A CN2009101493221A CN200910149322A CN101923105A CN 101923105 A CN101923105 A CN 101923105A CN 2009101493221 A CN2009101493221 A CN 2009101493221A CN 200910149322 A CN200910149322 A CN 200910149322A CN 101923105 A CN101923105 A CN 101923105A
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- probe
- circuit board
- fixed cell
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- lens group
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Abstract
The invention discloses a probe card used for testing an image sense chip. The probe card comprises a circuit board, a first fixed unit, multiple probes, a second fixed unit, a lens group and a lighting unit, wherein the circuit board is provided with a window, and the first fixed unit is combined at the lower surface of the circuit board, but does not shield the window; the multiple probes are fixed below the circuit board by the first fixed unit; the second fixed unit is combined at the upper surface of the circuit board; the lens group is combined at the second fixed unit in an adjustable mode and corresponds to the position of the window; and the lighting unit is arranged at the top surface of the second fixed unit and can generate appropriate visible lights, thus the lights can penetrate through the lens group to be focused and project at a test area below the circuit board, and the lights meeting the test conditions can be provided at the position of the image sense chip to be tested, thereby improving the test quality.
Description
Technical field
The present invention relates to probe card technology, be meant a kind of probe that lens group is arranged and be used for the test pattern sensor chip especially.
Background technology
The probe of general test semi-conductor chip mainly is as the connecting object between tester table and the semi-conductor chip, is provided voltage to make semi-conductor chip produce relative electrical signals and is tested by tester table.If but the test of image sensing chip (for example CCD or CMOS), then test light must be shone the optical sensor district of image sensing chip, chip can produce electrical variation because of the irradiation that is subjected to light, and produces electrical signals to the probe and the tester table place that are connected.Since with existing general probe require different, so just the someone has designed the probe that is exclusively used in image sensing chip.
This type of is used for the probe of image sensing chip, and main special character is to have an opening on circuit board, makes light from outside can expose to inside, and the required light of image sensing chip to be measured is provided.The radiation modality of present extraneous light, be that the top position of a light source in probe directly is provided, this light source inside has special structure, light is like directional light irradiation when light source is shinny, and most of light arrives the test section of circuit board below except meeting is entered by the opening part of circuit board through preestablishing the path, but be to have part light can expose to the circuit board surface back reflection to go back, interfere with the light of normal route originally, form interference, have influence on test result.Image sensing chip also can have special must asking to test light sometimes in addition, for example whether can be to invisible light (infrared ray) induction, and this part still can normal operation at night in order to ensure image sensing chip.Testing light source then must change or use distinct device to be assisted this moment, and very trouble is inconvenient again.Therefore the inventor then thinks deeply the another kind of structure of design, makes that the probe that is used for the test pattern sensor chip is more convenient in the use, better quality.
Summary of the invention
Fundamental purpose of the present invention provides a kind of probe that has lens group and can be used for the test pattern sensor chip, mainly be that probe inside has lens group and light can be done effectively to handle and focus on, allow the light that is projeced into the test pattern sensor chip at last meet most test condition, by this, allow the image sensing chip accuracy of test improve more.
Secondary objective of the present invention provides a kind of probe that is used for the test pattern sensor chip, because probe of the present invention has a lens group, this lens group can be made light effectively to handle and focus on, therefore after light unit produces light, be that light must be again through particular processing, so can simplify the structure of light unit, make probe more simple in design.
Secondary objective of the present invention provides a kind of vertical probe carb that is used for the test pattern sensor chip, this probe inside can be adopted with spring probe (spring probe) or rectilinear deflection probe (Vertical Bending Probe), cooperate lens group used in the present invention, with the window that is positioned at circuit board, constitute one group of vertical probe carb that is used for the innovation of test pattern sensor chip.
For reaching aforesaid purpose, the present invention includes a circuit board, one first fixed cell, a plurality of probe, one second fixed cell and a light unit.This circuit board has a window, and this first fixed cell is incorporated into below the circuit board, but this window is not covered.Aforementioned a plurality of probe is positioned the circuit board lower position by first fixed cell.This second fixed cell is incorporated into circuit board top.This lens group is fixed by this second fixed cell then and is positioned at the top position of circuit board, and this lens group correspondence the position of aforementioned window.This light unit is arranged at the second fixed cell end face in addition, and light unit can produce suitable light.So be the present invention and be used for the probe of test pattern sensor chip.
In addition usefulness that probe of the present invention adopts probe be not unimodality, can select suitable probe for use according to different must asking, employed probe then can be spring probe, rectilinear deflection probe, cantalever type probe (cantilever probe) etc., increases the scope of application of the present invention by this.
Description of drawings
Fig. 1 is the structural profile synoptic diagram of first kind of embodiment of the present invention;
Fig. 2 is used for the preferred embodiment figure of test pattern sensor chip for probe of the present invention;
Fig. 3 is the structural profile synoptic diagram of second kind of embodiment of the present invention;
Fig. 4 is the structural profile synoptic diagram of the third embodiment of the present invention.
[main element symbol description]
The A probe
10 circuit boards, 11 first surfaces
12 second surfaces, 13 windows
20 first fixed cells
21 first fixtures, 211 first pilot holes
22 second fixtures, 221 second pilot holes
23 the 3rd fixtures 231 the 3rd pilot hole
20A first fixed cell
The 21A first fixture 211A first pilot hole
22A second fixture
23A the 3rd fixture 231A the 3rd pilot hole
20B first fixed cell
24 inclined-planes
30 probes
31 first contact elements, 32 second contact elements
The 30A probe
The 30B probe
40 second fixed cells
41 in conjunction with block 411 internal thread holes
43 gaps, 42 gaps
50 lens group, 51 external threads
60 light units, 61 lamp sources
90 image sensing chips, 91 optical sensor districts
Embodiment
Now cooperate following detailed structure of the present invention and the connection relationship thereof of illustrating, have the knack of this technical field person and after studying this instructions carefully, can implement according to this so that make.
See also shown in Figure 1ly, be structural profile synoptic diagram of the present invention.Probe A of the present invention consists predominantly of a circuit board 10, one first fixed cell 20, many probes 30, one second fixed cell 40, a lens group 50 and light units 60 and constitutes.Lens group 50 is not represented with sectional view with light unit 60 in the drawings.This circuit board 10 has a first surface 11, a second surface 12 and a window 13, and this first surface 11 is respectively circuit board 10 with second surface 12 and is facing surfaces up and down, and 13 of this windows run through this circuit board 10.This first fixed cell 20 is incorporated into second surface 12 places of circuit board 10.This first fixed cell, 20 adjacent windows 13 and window 13 not being covered.A plurality of probes 30 are fixed in the lower position of circuit board 10 by first fixed cell 20, but an end (top) of this probe 30 must electrically connect mutually with the circuit of the second surface 12 of circuit board 10, and the other end (bottom) then must extend to the lower position of first fixed cell 20.This second fixed cell 40 is arranged at first surface 11 places of circuit board 10.This lens group 50 adopts combined second fixed cell, 40 places of being fixed in of adjustable perfect square formula, is positioned at the top position of circuit board 10.The position of this lens group 50 is also corresponding mutually with window 13.This light unit 60 is arranged at second fixed cell, 40 end faces, and this light unit 60 can produce suitable light, and this light is a visible light.By this, when probe A of the present invention was used for the test of image sensing chip, light can see through lens group 50 focusing and be projeced into the image sensing chip place, makes image sensing chip obtain best test light, promotes the test mass of chip.
Below be described in more detail with regard to partial component:
This first fixed cell 20 is in order to a plurality of probe 30 fixing circuit boards 10 lower positions, but along with the structure difference of probe 30, this first fixed cell 20 also is different structure.In Fig. 1 embodiment, this probe 30 is a spring probe (spring probe).These spring probe 30 two ends have one first less contact element 31 of external diameter and one second contact element 32 respectively, and wherein at least one has telescopic elasticity for this first contact element 31 and second contact element 32.This first contact element 31 has telescopic elasticity in this enforcement.This first fixed cell 20 is a ring-type, is the annular like square hollow in the present embodiment.20 of this first fixed cells are made of one first fixture 21, one second fixture 22 and one the 3rd fixture 23, and aforementioned three members adopt stack manner to combine.This first fixture 21 has a plurality of first pilot holes 211, and this first pilot hole 211 is less than the external diameter of aforementioned spring probe 30 body portions but greater than the external diameter of first contact element 31.Second fixture 22 also has a plurality of second pilot holes 221, and this second pilot hole 221 is corresponding to the external diameter of aforementioned spring probe 30 body portions.The 3rd fixture 23 also has a plurality of the 3rd pilot hole 231, the three pilot holes 231 less than the external diameter of probe 30 body portions but be slightly larger than the external diameter of second contact element 32.Though this spring probe 30 is fixed in and first fixed cell, 20 places, it is auxiliary fixing not have any sticker between the two, and correct explanation is positioned by spring probe 30 in each pilot hole of first fixed cell 20.When being stacked at first fixed cell, 20 each member when fitting together, these spring probe 30 body portions, first contact element 31 and 32 of second contact elements lay respectively in corresponding second pilot hole 221, first pilot hole 211 and the 3rd pilot hole 231, though so spring probe 30 is fixed in first fixed cell, 20 places, first contact element 21 is the telescopic elasticity of tool still.
These lens group 50 inside have the multi-disc lens, light focusing can be projeced into the test zone of circuit board below, and the optimal light of image sensing chip to be measured is provided.These lens group 50 inside also can be provided with the different eyeglass of many functions in addition, to filter unnecessary light wave or to make light wave do suitable processing.40 of this second fixed cells are in order to adopt height adjustable mode to be arranged at the top position of circuit board 10 lens group 50.This second fixed cell 40 is fixed in first surface 11 places of circuit board 10.This second fixed cell 40 has one and adjusts block 41.In the present embodiment, this adjustment block 41 is all to be recess at second fixed cell 40 near the upper and lower surface of central area, forms the block of a thinner thickness.This thickness of adjusting block 41 is thin than the maximum ga(u)ge of second fixed cell 40.Respectively there is a gap 42,43 between the luminescence unit 60 of this adjustment block 41 and top and the second surface 12 of below.50 of aforementioned lens group adopt engage thread to be incorporated into and adjust block 41 places.These adjustment block 41 central areas have an internal thread hole 411, and these lens group 50 periphery have external thread 51, and this lens group 50 is to be screwed with external thread 51 and internal thread hole 411.When desire is adjusted the image formation by rays focal length of lens group 50, rotate this lens group 50 and can produce displacement up and down.
This light unit 60 is incorporated into the top of second fixed cell 40, and the light of when test institute palpus is provided.This light is good with directional light and visible light.In the present embodiment, these light unit 60 inside have at least more than one lamp source 61, and this lamp source 61 is light emitting diode or other light source, the light of brightness when test is provided.
As shown in Figure 2, the probe A of present embodiment is used for the preferred embodiment figure of test pattern sensor chip.When probe A of the present invention was used for test pattern sensor chip 90, this spring probe 30 was to contact with the circuit of second contact element 32 with image sensing chip 90 upper surfaces.When this light unit 60 is shone by circuit board 10 tops, light is earlier after lens group 50 focuses on, can make light can project the optical sensor district 91 of image sensing chip 90 through window 13, state when the brightness of light and quality are used near image sensing chip 90, last image sensing chip 90 produces electrical variation because of the irradiation that is subjected to light, provide electrical signals give probe 30, circuit board 10, at last to tester table, the test and the data processing of being correlated with by tester table.
As shown in Figure 3, implement illustration for second kind of the present invention.This probe 30A changes rectilinear deflection probe (Vertical Bending Probe) in the present embodiment.Therefore also some change of this first fixed cell 20A.All the other members such as circuit board 10, second fixed cell 40, lens group 50 and light unit 60 are identical with previous embodiment.This first fixed cell 20A shape is a ring-type, is the annular like square hollow in the present embodiment.This first fixed cell 20A is made of one first fixture 21A, one second fixture 22A and one the 3rd fixture 23A, this first fixture 21A has a plurality of first pilot hole 211A, the 3rd fixture 23A then has a plurality of the 3rd pilot hole 231A, and this first pilot hole 211A is corresponding near the section profile at two ends with probe 31A (rectilinear deflection probe) respectively with aperture and the pass of the 3rd pilot hole 231A.This first pilot hole 211A and the 3rd pilot hole 231A be not on same center line.Aforementioned probe 31A is arranged at respectively in this first pilot hole 211A and the 3rd pilot hole 231A near the section outer wall at two ends during assembling.The end of this probe 31A and the circuit of this circuit board 10 second surfaces 12 are electrically connected, and the other end then extends the lower position of this first fixed cell 20A.
Shown in Figure 4, the third implements illustration for the present invention.This probe 30B is cantalever type probe (cantilever probe) in the present embodiment, so this first fixture 20B also is different kenel.In the present embodiment the first fixed cell 20B in the form of a ring and the bottom be inclined-plane 24, aforementioned probe 30B then is fixed in 24 places, inclined-plane of the first fixed cell 20B.The circuit of the second surface 12 of cantalever type probe 30B one end and this circuit board 10 electrically connects, and the other end extends to the lower position of this first fixed cell 20B.In the present embodiment, this circuit board 10 still has a window 13, and these window 13 top positions are to have lens group 50 and light unit 60.
Comprehensive the above, the probe that is used for the test pattern sensor chip of the present invention mainly is to have a window at the circuit board place, differing heights position, window top have respectively a height adjustable lens group, with the light unit that light source can be provided.Thus, probe be except can carrying out the test of image sensing chip, and light is through the lens group inter-process and after focusing on, and light can be projeced in the proper range of image sensing chip, and the light luminance and the quality of best test is provided.Probe also can be made of spring probe, rectilinear deflection probe or cantalever type probe in addition, to satisfy different users's demand.
The above only is preferred embodiment of the present invention, when can not with qualification scope of the invention process, promptly the equalization of being done according to the present patent application claim generally changes and modifies, and all should still belong in the scope that patent of the present invention contains.
Claims (13)
1. probe that is used for the test pattern sensor chip is characterized in that comprising:
One circuit board, this circuit board have a first surface, a second surface and a window, and this first surface and second surface are the opposite face setting, and this window is then through circuit board;
One first fixed cell is incorporated into the second surface of aforementioned circuit plate;
A plurality of probes are fixed in the circuit board lower position by aforementioned first fixed cell, and this probe one end is connected with the circuit of circuit board second surface, and the other end extends to the first fixed cell lower position;
One second fixed cell is arranged at the first surface of circuit board;
One lens group, by the aforementioned second fixed cell fixed bit circuit board top position, this lens group correspondence the position of aforementioned window;
One light unit is arranged at the second fixed cell end face, and this light unit can produce light, and this light can focus on the test zone that is projected to the circuit board below through lens group.
2. the probe that is used for the test pattern sensor chip as claimed in claim 1 is characterized in that, this lens group adopts adjustable perfect square formula to be incorporated into the second fixed cell place.
3. the probe that is used for the test pattern sensor chip as claimed in claim 1, it is characterized in that, the central area of this second fixed cell has one and adjusts block, this thickness of adjusting block is thin than the maximum ga(u)ge of second fixed cell, and this lens group then adopts engage thread to be incorporated into and adjusts the block place.
4. the probe that is used for the test pattern sensor chip as claimed in claim 1 is characterized in that, this light unit has at least one lamp source.
5. the probe that is used for the test pattern sensor chip as claimed in claim 1, it is characterized in that, this probe is the spring probe, these spring probe two ends have one first little contact element of external diameter and one second contact element respectively, and wherein at least one has telescopic elasticity for this first contact element and second contact element.
6. the probe that is used for the test pattern sensor chip as claimed in claim 5, it is characterized in that, this first fixed cell is by one first fixture, one second fixture, and one the 3rd stack manner that fixture adopts combine, this first fixture has a plurality of first pilot holes, this first pilot hole is less than the external diameter of aforementioned spring probe body portion and greater than the external diameter of first contact element, second fixture then has a plurality of second pilot holes, this second pilot hole is corresponding to the external diameter of aforementioned spring probe body portion, the 3rd fixture then has a plurality of the 3rd pilot holes, the 3rd pilot hole is less than the external diameter of probe body portion and greater than the external diameter of second contact element, this spring probe body portion, first contact element, and second contact element then divide in being positioned at corresponding second pilot hole, in first pilot hole and the 3rd hole, make this spring probe then be located in the first fixed cell place.
7. probe that is used for the test pattern sensor chip is characterized in that comprising:
One circuit board, this circuit board have a first surface, a second surface and a window, and this first surface and second surface are the opposite face setting, and this window is then through circuit board;
One first fixed cell is incorporated into the second surface of aforementioned circuit plate;
A plurality of spring probes, be fixed in the circuit board lower position by aforementioned first fixed cell, these spring probe two ends have the first less contact element of an external diameter and second contact element respectively, first contact element is that the circuit with this circuit board second surface electrically connects, second contact element then is the lower position that extends this fixed cell, and this spring probe is the direction setting of adopting perpendicular to window;
One second fixed cell is arranged at the first surface of circuit board;
One lens group, by the aforementioned second fixed cell fixed bit circuit board top position, this lens group correspondence the position of aforementioned window;
One light unit is arranged at the second fixed cell end face, and this light unit can produce suitable light, and this light also can focus on the test zone that is projected to the circuit board below through lens group.
8. the probe that is used for the test pattern sensor chip as claimed in claim 1 is characterized in that, this probe is rectilinear deflection probe.
9. the probe that is used for the test pattern sensor chip as claimed in claim 8, it is characterized in that, this first fixed cell is by one first fixture, one second fixture, and one the 3rd fixture constitute, this first fixture has a plurality of first pilot holes, the 3rd fixture then has a plurality of the 3rd pilot holes, this first pilot hole is corresponding near the section profile at two ends with rectilinear deflection probe respectively with the aperture and the pass of the 3rd pilot hole, and this rectilinear deflection probe also is arranged at respectively in this first pilot hole and the 3rd pilot hole near the section outer wall at two ends.
10. probe that is used for the test pattern sensor chip is characterized in that comprising:
One circuit board, this circuit board have a first surface, a second surface and a window, and this first surface and second surface are the opposite face setting, and this window is then through circuit board;
One first fixed cell is incorporated into the second surface of aforementioned circuit plate;
A plurality of rectilinear deflection probes are fixed in the circuit board lower position by aforementioned first fixed cell, and the circuit of this rectilinear deflection probe one end and this circuit board second surface electrically connects, and the other end extends the lower position of this first fixed cell;
One second fixed cell is arranged at the first surface of circuit board;
One lens group, by the aforementioned second fixed cell fixed bit circuit board top position, this lens group and corresponding the position of aforementioned window;
One light unit is arranged at the second fixed cell end face, and this light unit can produce light, and this light also can focus on the test zone that is projected to the circuit board below through lens group.
11. the probe that is used for the test pattern sensor chip as claimed in claim 1 is characterized in that, this probe is a cantalever type probe.
12. the probe that is used for the test pattern sensor chip as claimed in claim 11 is characterized in that, this first fixed cell is that a ring-type and bottom have the inclined-plane, and aforementioned cantalever type probe then is fixed in first fixed cell bottom.
13. one is used for the probe of test pattern sensor chip, it is characterized in that comprising:
One circuit board, this circuit board have a first surface, a second surface and a window, and this first surface and second surface are the opposite face setting, and this window is then through circuit board;
One first fixed cell is incorporated into the second surface of aforementioned circuit plate;
A plurality of cantalever type probes are fixed in aforementioned first fixed cell bottom, and the circuit of this cantalever type probe one end and this circuit board second surface electrically connects, and the other end extends the lower position of this first fixed cell;
One second fixed cell is arranged at the first surface of circuit board;
One lens group, by the aforementioned second fixed cell fixed bit circuit board top position, this lens group and corresponding the position of aforementioned window;
One light unit is arranged at the second fixed cell end face, and this light unit can produce light, and this light also can focus on the test zone that is projected to the circuit board below through lens group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101493221A CN101923105A (en) | 2009-06-16 | 2009-06-16 | Probe card used for testing image sense chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101493221A CN101923105A (en) | 2009-06-16 | 2009-06-16 | Probe card used for testing image sense chip |
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| Publication Number | Publication Date |
|---|---|
| CN101923105A true CN101923105A (en) | 2010-12-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101493221A Pending CN101923105A (en) | 2009-06-16 | 2009-06-16 | Probe card used for testing image sense chip |
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| Country | Link |
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| CN (1) | CN101923105A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103267938A (en) * | 2013-05-17 | 2013-08-28 | 嘉兴景焱智能装备技术有限公司 | CIS wafer integration testing machine |
| CN103543372A (en) * | 2012-07-13 | 2014-01-29 | 旺矽科技股份有限公司 | Optical detection device |
| CN103543298A (en) * | 2012-07-13 | 2014-01-29 | 旺矽科技股份有限公司 | Probe holding structure and optical detection device thereof |
| CN104101480A (en) * | 2013-04-03 | 2014-10-15 | 京元电子股份有限公司 | Array type optical detection module |
| CN104535811A (en) * | 2014-12-23 | 2015-04-22 | 惠州中城电子科技有限公司 | Electricity meter inserting component |
| CN107656107A (en) * | 2016-07-25 | 2018-02-02 | 旺矽科技股份有限公司 | Probe module with cantilever type micro-electromechanical probe and manufacturing method thereof |
| CN110261755A (en) * | 2019-05-28 | 2019-09-20 | 常州纵慧芯光半导体科技有限公司 | A kind of probe card, detection device and wafer detection method |
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| CN103543372A (en) * | 2012-07-13 | 2014-01-29 | 旺矽科技股份有限公司 | Optical detection device |
| CN103543298A (en) * | 2012-07-13 | 2014-01-29 | 旺矽科技股份有限公司 | Probe holding structure and optical detection device thereof |
| CN103543298B (en) * | 2012-07-13 | 2016-03-23 | 旺矽科技股份有限公司 | Probe holding structure and optical detection device thereof |
| CN103543372B (en) * | 2012-07-13 | 2016-08-24 | 旺矽科技股份有限公司 | Optical detection device |
| CN104101480A (en) * | 2013-04-03 | 2014-10-15 | 京元电子股份有限公司 | Array type optical detection module |
| CN104101480B (en) * | 2013-04-03 | 2017-03-01 | 京元电子股份有限公司 | Array type optical detection module |
| CN103267938A (en) * | 2013-05-17 | 2013-08-28 | 嘉兴景焱智能装备技术有限公司 | CIS wafer integration testing machine |
| CN104535811A (en) * | 2014-12-23 | 2015-04-22 | 惠州中城电子科技有限公司 | Electricity meter inserting component |
| CN104535811B (en) * | 2014-12-23 | 2018-02-27 | 惠州中城电子科技有限公司 | A kind of ammeter connecting element |
| CN107656107A (en) * | 2016-07-25 | 2018-02-02 | 旺矽科技股份有限公司 | Probe module with cantilever type micro-electromechanical probe and manufacturing method thereof |
| CN110967570A (en) * | 2018-09-30 | 2020-04-07 | 上海微电子装备（集团）股份有限公司 | Probe card, automatic optical detection device and method |
| CN111722093A (en) * | 2019-03-18 | 2020-09-29 | 中华精测科技股份有限公司 | Probe card testing device |
| CN110261755A (en) * | 2019-05-28 | 2019-09-20 | 常州纵慧芯光半导体科技有限公司 | A kind of probe card, detection device and wafer detection method |
| CN110261755B (en) * | 2019-05-28 | 2022-04-19 | 常州纵慧芯光半导体科技有限公司 | Probe card, detection device and wafer detection method |
| CN111089990A (en) * | 2019-12-25 | 2020-05-01 | 奥士康科技股份有限公司 | Three-head test needle |
| CN113495177A (en) * | 2020-04-07 | 2021-10-12 | 松翰股份有限公司 | Micro-electro-mechanical probe test head with 3D circuit and probe card |
| CN111624463A (en) * | 2020-05-12 | 2020-09-04 | 通富微电子股份有限公司 | Integrated circuit testing device |
| CN113471103A (en) * | 2021-06-09 | 2021-10-01 | 上海华虹宏力半导体制造有限公司 | Probe module |
| CN113471103B (en) * | 2021-06-09 | 2023-10-20 | 上海华虹宏力半导体制造有限公司 | Probe module |
| CN113687114A (en) * | 2021-08-02 | 2021-11-23 | 合肥芯测半导体有限公司 | Shareable vertical image sensor probe card |
| CN116046798A (en) * | 2023-03-30 | 2023-05-02 | 合肥新晶集成电路有限公司 | Automatic needle cleaning method, automatic needle cleaning system and wafer acceptance test method |
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Application publication date: 20101222 |