CN101923105A - Probe card used for testing image sense chip - Google Patents

Probe card used for testing image sense chip Download PDF

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Publication number
CN101923105A
CN101923105A CN 200910149322 CN200910149322A CN101923105A CN 101923105 A CN101923105 A CN 101923105A CN 200910149322 CN200910149322 CN 200910149322 CN 200910149322 A CN200910149322 A CN 200910149322A CN 101923105 A CN101923105 A CN 101923105A
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circuit board
probe
fixing unit
surface
fixing
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CN 200910149322
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Chinese (zh)
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叶日嘉
陈星龙
黄世彬
黄郑隆
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励威电子股份有限公司
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Abstract

The invention discloses a probe card used for testing an image sense chip. The probe card comprises a circuit board, a first fixed unit, multiple probes, a second fixed unit, a lens group and a lighting unit, wherein the circuit board is provided with a window, and the first fixed unit is combined at the lower surface of the circuit board, but does not shield the window; the multiple probes are fixed below the circuit board by the first fixed unit; the second fixed unit is combined at the upper surface of the circuit board; the lens group is combined at the second fixed unit in an adjustable mode and corresponds to the position of the window; and the lighting unit is arranged at the top surface of the second fixed unit and can generate appropriate visible lights, thus the lights can penetrate through the lens group to be focused and project at a test area below the circuit board, and the lights meeting the test conditions can be provided at the position of the image sense chip to be tested, thereby improving the test quality.

Description

用于测试图像感测芯片的探针卡 A probe card of a test image sensing chip

技术领域 FIELD

[0001] 本发明涉及探针卡技术,特别是指一种有镜头组且用于测试图像感测芯片的探针卡。 [0001] The present invention relates to a probe card technology, particularly to a lens-group testing and a probe card of the image sensing chip.

背景技术 Background technique

[0002] 一般测试半导体芯片的探针卡,主要是作为测试机台与半导体芯片之间的连接对象,由测试机台提供电压使半导体芯片产生相对电性信号而进行测试。 [0002] Usually the semiconductor chip test probe card, mainly as a connection object between the test machine and the semiconductor chip, the voltage provided by the test machine opposite the semiconductor chip to generate electrical signals for testing. 但是若为图像感测芯片(例如CCD或CMOS)的测试,则须将测试光线照射到图像感测芯片的光学感应区,芯片因受光线的照射会产生电性变化,并产生电性信号至所连接的探针卡及测试机台处。 However, if a test image sensing chip (e.g. CCD or CMOS), the test shall be exposed to light to the image sensing chip of the optical sensing area, the chip due to the light irradiation will induce an electrical change of, and generate electrical signals to the probe card and the testing device is connected. 由于与现有的一般探针卡的要求不同,于是就有人设计了专用于图像感测芯片的探针卡。 Due to the different requirements of the general conventional probe card, so he was dedicated to the design of the image sensing chip card probe.

[0003] 此类用于图像感测芯片的探针卡,主要特殊之处是在电路板上具有一开口,使得外部的光线能照射至内部,并提供待测的图像感测芯片所需的光线。 [0003] Such a probe card image sensing chip, primarily special features having an opening in a circuit board such that the external light can be irradiated to the inside, and provide a desired test image sensing chip light. 目前外部光线的照射方式,是直接提供一光源于探针卡的上方位置,此光源内部具有特殊的结构,当光源发亮时光线呈似平行光照射,大部分光线除了会经预先设定路径由电路板的开口处进入,到达电路板下方的测试区,但乃有部分光线会照射至电路板表面后反射回去,干扰到原本正常路径的光线,形成干涉现象,影响到测试结果。 Currently external light irradiation method, a light source is provided at a position directly above the probe card, the internal light source has a special structure, when the light source was irradiated with light shining like a parallel light, most of the light path in addition to pre-set into the opening of the circuit board reaches the test zone under the circuit board, but there is the portion irradiated with light will be reflected back to the rear surface of the board, disturbance to the normal path of the original light, form an interference phenomenon, affecting the test results. 另外图像感测芯片有时也会对测试光线有特殊须求,例如是否能对不可见光(红外线)感应,此部分为了确保图像感测芯片在夜间仍能正常运作。 Further image sensing chip has sometimes need to seek special test light, invisible light such as whether energy (infrared) sensor, this section image sensing chip in order to ensure that it functions properly at night. 此时测试光源则必须进行更换或使用不同设备加以辅助,非常麻烦又不方便。 At this time, the test light source must be replaced or the use of different auxiliary equipment, is very troublesome and inconvenient. 因此本发明人则思考设计另一种结构,使得用于测试图像感测芯片的探针卡在使用上更为方便,质量更好。 Thus the present invention is designed Consideration another structure, such that a probe card for testing image sensing chip is more convenient in use, better quality.

发明内容 SUMMARY

[0004] 本发明的主要目的是提供一种具有镜头组且能用于测试图像感测芯片的探针卡, 主要是探针卡内部具有镜头组能将光线作有效的处理与聚焦,让最后投射于测试图像感测芯片的光线最符合测试条件,通过此,让图像感测芯片测试的准确度更加提高。 [0004] The main object of the present invention is to provide a lens group capable of having a probe card for testing the image sensing chips, the probe card having a main internal lens groups can be effectively treated with the light focused so that finally test image projected on the light sensing chip that best meet the test conditions, through this, so that the accuracy of the image sensor chip testing further improved.

[0005] 本发明的次要目的是提供一种用于测试图像感测芯片的探针卡,由于本发明的探针卡具有一镜头组,该镜头组能将光线作有效的处理及聚焦,因此灯光单元产生光线后,即光线不须再经特殊的处理,如此能简化灯光单元的结构,使探针卡在设计上更为简单。 [0005] Secondary object of the present invention is to provide a probe card for testing an image sensor chip, since the probe card of the present invention has a lens assembly, the lens groups can be effectively handled in the light focusing, Thus the lighting units to produce light, i.e. light not need special handling, so the structure can be simplified lighting units, the probe card is more simple in design.

[0006] 本发明的次要目的是提供一种用于测试图像感测芯片的垂直式探针卡,该探针卡内部可采用用弹簧式探针(spring probe)或垂直式可挠曲探针(Vertical Bending Probe),配合本发明所使用的镜头组,与位于电路板的窗口,构成一组用于测试图像感测芯片的创新的垂直式探针卡。 [0006] Secondary object of the present invention is to provide a vertical-type probe card for testing an image sensor chip, the probe card can be internal spring probes (spring probe) or vertical flexible probe needle (vertical Bending probe), with the lens group used in the present invention, with the window of the circuit board, constitutes a set of vertical type probe card for testing innovative image sensing chip.

[0007] 为达成前述的目的,本发明包含有一电路板、一第一固定单元、多个探针、一第二固定单元、以及一灯光单元。 [0007] achieve the above purpose, the present invention includes a circuit board, a first fixing unit, a plurality of probes, a second fixing unit, and a lighting unit. 该电路板具有一窗口,该第一固定单元结合于电路板下面,但未将该窗口遮蔽。 The circuit board having a window bonded to the first fixing unit under the circuit board, but the window shield. 前述多个探针是被第一固定单元定位于电路板下方位置。 The plurality of probes is positioned below the position of the circuit board of the first fixing unit. 该第二固定单元结合于电路板上面。 Bonded to the second fixing unit above the board. 该镜头组则受该第二固定单元固定而位于电路板的上方位置,该镜头组对应着前述窗口的所在位置。 The second lens group is affected by the fixing unit fixing the upper position of the circuit board, the lens group corresponds to the location of the window. 另外该灯光单元设置于第二固定单元顶面,灯光单元能产生适当的光线。 Further the lighting units provided in the top surface of the second fixing unit, the lighting unit can generate an appropriate light. 如此即为本发明用于测试图像感测芯片的探针卡。 Thus the present invention is the probe card for testing image sensor chip. [0008] 另外本发明的探针卡所采用用的的探针并非单一型式,可依不同的须求选用合适的探针,而所使用的探针则可为弹簧式探针、垂直式可挠曲探针、悬臂式探针(cantilever probe)等,通过此增加本发明的适用范围。 [0008] Further according to the present invention, the probe card is not a single type of the probe with the use, according to different requirements shall choose suitable probe, the probe can be used as a spring probe, may be vertical probe deflection, probe cantilever (cantilever probe) and the like, by increasing the scope of this invention.

附图说明 [0009] 图1为本发明第一种实施例的结构剖面示意图; [0010] 图2为本发明的探针卡用于测试图像感测芯片的较佳实施例图 [0011] 图3为本发明的第二 二种实施例的结构剖面示意图;[0012] 图4为本发明的第三 三种实施例的结构剖面示意图。 BRIEF DESCRIPTION [0009] FIG 1 a cross-sectional schematic view of a first embodiment of the present invention; FIG embodiment [0011] FIG probe card [0010] FIG. 2 of the present invention is preferably used for the test image sensing chip embodiment the second embodiment of the two configurations of the present invention 3 is a schematic cross-sectional view; a schematic view of a third three kinds [0012] FIG. 4 is a cross-sectional structure of the invention embodiment. [0013] 【主要元件符号说明 ][0014] A探针卡 [0015] 10电路板 11第一表面[0016] 12第二表面 13窗口[0017] 20第一固定单元 [0018] 21第一固定件 211第一定位孔[0019] 22第二固定件 221第二定位孔[0020] 23第三固定件 231第三定位孔[0021] 20A第一固定单元 [0022] 21A第一固定件 211A第一定位孔[0023] 22A第二固定件 [0024] 23A第三固定件 231A第三定位孔[0025] 20B第一固定单元 [0026] 24斜面 [0027] 30探针 [0028] 31第一接触件 32第二接触件[0029] 30A探针 [0030] 30B探针 [0031] 40第二固定单元 [0032] 41结合区块 411内螺纹孔[0033] 42间隙 43间隙[0034] 50镜头组 51外螺纹[0035] 60灯光单元 61灯源[0036] 90图像感测芯片 91光学感应区 [0013] The main element SIGNS LIST] [0014] A probe card [0015] 11 first surface 10 of the circuit board [0016] 12 surface of the second window 13 [0017] 20 of the first fixing units [0018] 21 first fixing positioning holes 211 of the first member [0019] 22 of the second fixing member 221 of the second positioning hole [0020] 23 the third fixing member 231 of the third positioning hole [0021] 20A of the first fixing units [0022] 21A of the first fixing member 211A [0023] 22A of the second fixing member [0024] 23A of the third fixing member 231A third positioning hole [0025] 20B of the first fixing units [0026] 24 ramp [0027] 30 probe [0028] 31 locating a first contact hole the second contact member 32 [0029] 30A probe [0030] 30B probe [0031] 40 second fixing unit [0032] 41 threaded hole 411 in conjunction with the inner zone [0033] 42 43 clearance gap [0034] 50 lens group external thread 51 [0035] 60 lighting units 61 light source [0036] 90 image sensing chip 91 of the optical sensing region

具体实施方式 detailed description

[0037] 兹配合下列的图示说明本发明的详细结构及其连结关系,以便使熟习该项技术领域者在研读本说明书后能据以实施。 [0037] hereby illustrated with the following detailed description of the structure of the present invention and its connection relationship, so that those skilled in the art upon examination of the art of the present specification can be implemented accordingly. [0038] 请参阅图1所示,为本发明的结构剖面示意图。 [0038] Please refer to FIG. 1, a schematic cross-sectional structure of the present invention. 本发明的探针卡A主要包含有一电路板10、一第一固定单元20、多根探针30、一第二固定单元40、一镜头组50、以及一灯光单元60所构成。 A probe card of the present invention mainly comprises 10, a first fixing unit 20, a plurality of probes 30, a second fixing unit 40, a lens group 50, a lighting unit 60 and a circuit board is constituted. 在图中镜头组50与灯光单元60并未以剖面图表示。 Lens group 50 and lighting unit 60 is not represented in sectional view in FIG. 该电路板10具有一第一表面11、一第二表面12及一窗口13,该第一表面11与第二表面12分别为电路板10 上下呈相对的表面,该窗口13则贯穿该电路板10。 The circuit board 10 has a first surface 11, a second surface 12, and a window 13, the first surface 11 and second surface 12 respectively form upper and lower opposed surfaces of the circuit board 10, a window 13 through which the circuit board 10. 该第一固定单元20结合于电路板10的第二表面12处。 The fixing unit 20 is first bonded to the second surface 10 of the circuit board 12. 该第一固定单元20邻近窗口13且未将窗口13遮蔽。 The first fixing unit 20 and not adjacent to the window 13 the window 13 will be masked. 多个探针30被第一固定单元20固定于电路板10的下方位置,但该探针30的一端(顶端)须与电路板10 的第二表面12的电路相电性连接,另一端(底端)则须延伸至第一固定单元20的下方位置。 30 is a first plurality of probe fixing unit 20 is fixed to the lower position of the circuit board 10, the circuit electrically connected to the other end of the second surface 12 of the probe 30 at one end (top) of the circuit board 10 to be ( bottom end) shall be extended to the lower position of the first fixing unit 20. 该第二固定单元40设置于电路板10的第一表面11处。 The second fixing unit 40 disposed on the first surface 11 of the circuit board 10. 该镜头组50采用可调整方式被结合固定于第二固定单元40处,位于电路板10的上方位置。 The lens group 50 is bonded using adjustably fixed to the second fixing unit 40, located above the position of the circuit board 10. 该镜头组50的位置并与窗口13相互对应。 The position of the lens group 50 and the window 13 correspond to each other. 该灯光单元60设置于第二固定单元40顶面,该灯光单元60能产生适当的光线,该光线为一可见光。 The light unit 60 is disposed on the second surface of the fixing unit 40, the light unit 60 can generate an appropriate light, the light beam is a visible light. 通过此,当本发明探针卡A用于图像感测芯片的测试时,光线能透过镜头组50聚焦投射于图像感测芯片处,使得图像感测芯片获得最佳的测试光线,提升芯片的测试质量。 By this, when the present invention is a probe card for testing the A image sensing chip, the light can be projected on the image sensing chip 50 through a focusing lens group, so that the best image sensing chip test light, improve chip test quality.

[0039] 以下就部分构件作更详细的说明: [0039] The following section member to be described in more detail:

[0040] 该第一固定单元20用以将多个探针30固定电路板10下方位置,但随着探针30的结构不同,该第一固定单元20也为不同的结构。 [0040] The first fixing unit 20 downward to the location of the plurality of probes 10 of the circuit board 30 is fixed, but with the different structure of the probe 30, the first fixing unit 20 is also different structures. 在图1实施例中,该探针30为一弹簧式探针(spring probe)。 In the embodiment of FIG. 1, the probe 30 is a spring probe (spring probe). 该弹簧式探针30两端分别具有外径较小的一第一接触件31及一第二接触件32,该第一接触件31与第二接触件32其中至少一个具有可伸缩的弹性。 The two ends of the spring-type probe 30 having a smaller outer diameter, respectively a first contact member 31 and a second contact member 32, the first contact member 31 and the second contact member 32 having at least one elastically stretchable. 在本实施中该第一接触件31具有可伸缩的弹性。 In the present embodiment the first contact member 31 has an elastically stretchable. 该第一固定单元20呈一环状,在本实施例中为似四方形中空的环形。 The fixing unit 20 has a first annular, square-like embodiment is an annular hollow in the present embodiment. 该第一固定单元20则是由一第一固定件21、一第二固定件22、以及一第三固定件23所构成,前述三构件采用堆叠方式结合在一起。 The first fixing unit 20 is constituted by a first fixing member 21, a second fixing member 22, and a third fixing member 23, the three members together using a stacked manner. 该第一固定件21具有多个第一定位孔211,该第一定位孔211小于前述弹簧式探针30身部的外径但大于第一接触件31的外径。 The first fixing member 21 having a plurality of first positioning holes 211, the first positioning hole 211 is smaller than that of the spring portion 30 but greater than the outer diameter of the probe 31 of the first contact member. 第二固定件22也具有多个第二定位孔221,该第二定位孔221对应于前述弹簧式探针30身部的外径。 The second fixing member 22 also has a plurality of second positioning hole 221, the second positioning hole 221 corresponding to the outer diameter of the spring portion 30 of the probe. 该第三固定件23也具有多个第三定位孔231,该第三定位孔231小于探针30身部的外径但略大于第二接触件32的外径。 The third fixing member 23 also has a plurality of third positioning hole 231, the third positioning hole 231 is smaller than the outer diameter of the probe 30 but slightly larger than the diameter of the second portion 32 of the contact member. 该弹簧式探针30虽固定于与第一固定单元20处,但两者之间无任何粘着剂辅助固定,正确说明是被弹簧式探针30被定位第一固定单元20的各定位孔内。 Although the spring 30 is fixed to the probe fixing unit 20 at the first, but without any adhesive between the two auxiliary fixed, is properly described spring probe 30 is positioned in each positioning hole 20 of the first fixing unit . 当在第一固定单元20各构件被堆叠组装在一起时,该弹簧式探针30身部、第一接触件31、以及第二接触件32则分别位于相对应的第二定位孔221、 第一定位孔211及第三定位孔231内,如此弹簧式探针30虽被固定于第一固定单元20处, 第一接触件21仍具可伸缩的弹性。 When assembled together in stacked each member of the first fixing unit 20, portion 30 of the spring probes 31, and a second contact of the first contact member 32 are located at the second positioning hole 221 corresponding to the first a positioning hole 211 and the third positioning hole 231, although such a spring probe 30 is fixed to the first fixing unit 20, the first contact member 21 can remain elastically stretchable.

[0041] 该镜头组50内部具有多片透镜,能将光线聚焦投射于电路板下方的测试区域,提供待测的图像感测芯片最适当的光线。 [0041] The inner lens group 50 having a plurality of lenses, to a test capable of focusing light projected region below the circuit board to be tested to provide the most appropriate image sensing chip light. 另外该镜头组50内部也能设置有许多功能不同的镜片,以过滤不必要的光波或使光波作适当的处理。 Further inside of the lens group 50 can also be provided with different functions of many lenses, in order to filter unwanted light waves or light waves for proper handling. 该第二固定单元40则用以将镜头组50 采用可调整高度的方式设置于电路板10的上方位置。 The fixing unit 40 to the second lens group 50 uses the adjusted height position is provided above the circuit board 10. 该第二固定单元40固定于电路板10 的第一表面11处。 The second fixing unit 40 is fixed to the first surface 11 of circuit board 10. 该第二固定单元40具有一调整区块41。 The fixing unit 40 has a second adjusting block 41. 在本实施例中,该调整区块41 是在第二固定单元40接近中心区域的上下表面皆呈凹陷状,形成一个厚度较薄的区块。 In the present embodiment, the adjusting block 41 is near the center were highly concave shape in a region of the upper and lower surface of the second fixing unit 40, to form a thin block. 该调整区块41的厚度较第二固定单元40的最大厚度薄。 The thickness of the adjustment block 41 of the second fixing unit than a maximum thickness of 40. 该调整区块41与上方的发光单元60及下方的第二表面12之间各存在一间隙42、43。 The adjustment block 41 and the light emitting unit 60 and the second surface of each of the above and below a gap exists between 42 and 43 12. 前述镜头组50则采用螺纹方式结合于调整区块41处。 The lens group 50 with screw adjustments incorporated in block 41. 该调整区块41中心区域具有一内螺纹孔411,该镜头组50圆周外围具有外螺纹51,该镜头组50是以外螺纹51与内螺纹孔411相螺合。 The central region of the adjustment block 41 having an internally threaded bore 411, the circumferential periphery of the lens group 50 having external threads 51, the lens 50 is a group other than the threads 51 and the female screw hole 411 is screwed. 当欲调整镜头组50的光线成像焦距时,转动该镜头组50即可产生上下的位移。 To adjust the lens group when the focal length of the imaging beam 50, the rotation of the lens group 50 can be displaced up and down.

[0042] 该灯光单元60结合于第二固定单元40的顶部,提供测试时所须的光线。 [0042] The lighting unit 60 is bonded to the top of the second fixing unit 40, the time required to provide the test light. 该光线以平行光及可见光为佳。 The parallel light is preferably light and visible light. 在本实施例中,该灯光单元60内部具有至少一个以上的灯源61, 该灯源61为发光二极管或其它光源,提供测试时亮度的光线。 In the present embodiment, the interior of the light unit 60 having at least one or more light source 61, the light source 61 is a light emitting diode or other light sources, providing light brightness test.

[0043] 如图2所示,本实施例的探针卡A用于测试图像感测芯片的较佳实施例图。 [0043] As shown in FIG. 2, the preferred embodiment of FIG embodiment A probe card for testing image sensing chip of the present embodiment. 本发明的探针卡A用于测试图像感测芯片90时,该弹簧式探针30是以第二接触件32与图像感测芯片90上表面的线路相接触。 A probe card for testing of the present invention, the image sensing chip 90, the probe 30 is a spring member 32 on the second contact with the image sensing chip 90 in contact with the surface of the line. 该灯光单元60由电路板10上方照射时,光线先经镜头组50聚焦后,能使光线会经窗口13投射到图像感测芯片90的光学感应区91,光线的亮度与质量最接近图像感测芯片90使用时的状态,最后图像感测芯片90因受光线的照射而产生电性变化,提供电性信号予探针30、电路板10、最后至测试机台,由测试机台进行相关的测试及数据处理。 The light irradiation unit 60 above the circuit board 10, after the first light focusing lens group 50, the light can be projected onto the image sensing chip 90 of the optical sensing region 91 by the window 13, the brightness and quality of the light closest to the image sensing state when using the sensor chip 90, and finally irradiated image sensing chip 90 due to light generated electrical changes, provides electrical signals to the probe 30, the circuit board 10, and finally to the testing apparatus, the testing apparatus related testing and data processing.

[0044] 如图3所示,为本发明的第二种实施例图。 [0044] FIG. 3, a second embodiment of the present invention FIG. 在本实施例中该探针30A改为垂直式可挠曲探针(Vertical Bending Probe)。 In the present embodiment, the probe 30A to the vertical flexible probe (Vertical Bending Probe). 因此该第一固定单元20A也有些改变。 20A so that the first fixing unit also some changes. 其余构件如电路板10、第二固定单元40、镜头组50及灯光单元60乃与前述实施例相同。 The remaining components of the circuit board 10, the second fixing unit 40, lens group 50 and the lighting unit 60 is the same as the previous embodiment. 该第一固定单元20A形状呈一环状,在本实施例中为似四方形中空的环形。 The first fixing unit 20A form an annular shape, like the embodiment of an annular hollow square in the present embodiment. 该第一固定单元20A是由一第一固定件21A、一第二固定件22A、以及一第三固定件23A所构成,该第一固定件21A 具有多个第一定位孔211A,而第三固定件23A则具有多个第三定位孔231A,该第一定位孔211A与第三定位孔231A的孔径及孔型分别与探针31A (垂直式可挠曲探针)接近两端的区段外形相对应。 The first fixing unit 20A is composed of 21A, 22A, and a third fixing member fixing a first member and a second fixing member 23A, 21A of the first fixing member having a first plurality of positioning holes 211A, while the third section shape having a plurality of fixing members 23A of the third positioning holes 231A, 211A of the first positioning hole and the third positioning hole and the hole 231A of each aperture of the probe 31A (vertical deflectable probe) closer to the ends Corresponding. 该第一定位孔211A与第三定位孔231A并不在同一中心线上。 The first positioning hole 211A and the third positioning hole 231A is not in the same center line. 组装时前述探针31A接近两端的区段外壁分别设置于该第一定位孔211A与第三定位孔231A内。 31A close to the two ends of the probe during assembly of the outer wall section are disposed in the first positioning hole 211A and the third positioning hole 231A. 使该探针31A的一端与该电路板10第二表面12的电路作电性连接,另一端则延伸出该第一固定单元20A的下方位置。 The second surface 10 of the probe 31A so that one end of the circuit board for electrically connecting the circuit, the other end extending out of the first position below the fixing unit 12, 20A.

[0045] 图4所示,为本发明第三种实施例图。 As shown in [0045] FIG. 4, a third embodiment of the present invention of FIG. 在本实施例中该探针30B为悬臂式探针(cantilever probe),因此该第一固定件20B也为不同的型态。 In the present embodiment, the probe 30B is a cantilever probe (cantilever probe), so that the first fixing member 20B is also different patterns. 在本实施例中第一固定单元20B呈环状且底部为斜面24,前述探针30B则被固定于第一固定单元20B的斜面24处。 In the present embodiment, the first fixing unit 20B and an annular bottom bevel 24, the probe 30B were fixed to the first fixing unit 24 at the inclined surface 20B. 悬臂式探针30B —端与该电路板10的第二表面12的电路作电性连接,另一端延伸至该第一固定单元20B的下方位置。 Cantilever probe 30B - end and the second surface 12 of the circuit board 10 for electrically connecting circuit, and the other end extending to a position below the first fixing unit 20B. 在本实施例中,该电路板10仍具有一窗口13,该窗口13上方位置乃具有镜头组50及灯光单元60。 In the present embodiment, the circuit board 10 having a window 13 remains, which is the position of the top of the window 13 has a lens group 50 and lighting unit 60.

[0046] 综合以上所述,本发明的用于测试图像感测芯片的探针卡,主要是在电路板处具有一窗口,窗口上方不同高度位置分别具有一可调整高度的镜头组、与能提供光源的灯光单元。 [0046] The synthesis of the above, the present invention is a probe card for testing image sensor chip, a window having a main circuit board at different heights above the position of each window having a height-adjustable lens group, and can providing a light source lighting unit. 如此一来,探针卡除了可进行图像感测芯片的测试外,光线经镜头组内部处理及聚焦后,光线能投射于图像感测芯片最适当范围内,提供最佳测试的光线亮度与质量。 Thus, the probe card may be made in addition to sensing a test image sensing chip, the light after internal processing and focusing lens group, the light can be projected in the most appropriate range of the image sensing chip, provides the best quality and light intensity of the test . 另外探针卡也能由弹簧式探针、垂直式可挠曲探针或悬臂式探针所构成,以满足不同使用者的需求。 Further the probe card can be constituted by a spring probes, vertical flexible cantilever probe or probes, to meet the needs of different users.

[0047] 以上所述,仅为本发明的较佳实施例,当不能以之限定本发明实施的范围,即大凡依本发明申请专利范围所作的均等变化与修饰,皆应仍属于本发明专利涵盖的范围内。 [0047] The above are only preferred embodiments of the present invention, when it is not to limit the scope of the embodiments of the present invention, i.e., under this almost all modifications and alterations made by the patent scope of the invention, all patents belonging to the present invention should remain within the range covered.

Claims (13)

  1. 一种用于测试图像感测芯片的探针卡,其特征在于包括:一电路板,该电路板具有一第一表面、一第二表面及一窗口,该第一表面与第二表面呈相对面设置,该窗口则贯穿于电路板;一第一固定单元,结合于前述电路板的第二表面;多个探针,被前述第一固定单元固定于电路板下方位置,该探针一端与电路板第二表面的电路相连接,另一端延伸至第一固定单元下方位置;一第二固定单元,设置于电路板的第一表面;一镜头组,被前述第二固定单元固定位电路板上方位置,该镜头组对应着前述窗口的所在位置;一灯光单元,设置于第二固定单元顶面,该灯光单元能产生光线,该光线能经镜头组聚焦投射至电路板下方的测试区域。 A method for testing a probe card of the image sensing chip, comprising: a circuit board, the circuit board having a first surface, a second surface and a window, which form opposing first and second surfaces surface is provided, through which window the circuit board; a first fixing unit coupled to the second surface of the circuit board; a plurality of probes, the first fixing unit is fixed to the lower position of the circuit board, one end of the probe the second surface of the circuit board is connected to the other end extending to a position below the first fixing unit; a second fixing unit, provided on a first surface of the circuit board; a lens group, a second fixing unit is the fixing position of the circuit board upper position of the lens group corresponds to the location of the window; a lighting unit disposed on a top surface of the second fixing unit, the lighting units to produce light, the light can be projected onto the test region below the circuit board via the focusing lens group.
  2. 2.如权利要求1所述的用于测试图像感测芯片的探针卡,其特征在于,该镜头组采用可调整方式结合于第二固定单元处。 A probe card for testing the image sensing chip as claimed in claim 1, wherein the adjustable lens group were incorporated in the second fixing unit.
  3. 3.如权利要求1所述的用于测试图像感测芯片的探针卡,其特征在于,该第二固定单元的中心区域具有一调整区块,该调整区块的厚度较第二固定单元的最大厚度薄,该镜头组则采用螺纹方式结合于调整区块处。 The probe card as claimed in image sensing chip for testing the adjustment of the thickness of the block 1 than the second fixing unit, characterized in that the central region of the second fixing unit having an adjusting block, the maximum thickness of the lens groups is incorporated to a threaded adjustment at the block.
  4. 4.如权利要求1所述的用于测试图像感测芯片的探针卡,其特征在于,该灯光单元具有至少一灯源。 A probe card for testing the image sensing chip as claimed in claim 1, wherein the light source unit having at least one lamp.
  5. 5.如权利要求1所述的用于测试图像感测芯片的探针卡,其特征在于,该探针为弹簧式探针,该弹簧式探针两端分别具有外径小的一第一接触件及一第二接触件,该第一接触件与第二接触件其中至少一个具有可伸缩的弹性。 5. A probe card for testing an image sensor chip according to claim 1, wherein the probe is a spring probes, each probe ends of the spring having a smaller outer diameter first a contact member and a second contact, the first contact and the second contact member having at least one elastically stretchable.
  6. 6.如权利要求5所述的用于测试图像感测芯片的探针卡,其特征在于,该第一固定单元由一第一固定件、一第二固定件、以及一第三固定件所采用堆叠方式结合在一起,该第一固定件具有多个第一定位孔,该第一定位孔小于前述弹簧式探针身部的外径且大于第一接触件的外径,第二固定件则具有多个第二定位孔,该第二定位孔对应于前述弹簧式探针身部的外径,该第三固定件则具有多个第三定位孔,该第三定位孔小于探针身部的外径且大于第二接触件的外径,该弹簧式探针身部、第一接触件、以及第二接触件则分于位于相对应的第二定位孔、第一定位孔及第三位孔内,使该弹簧探针则被定位于第一固定单元处。 6. The probe card for testing an image sensor chip according to claim 5, wherein the first fixing member fixing unit is composed of a first, a second fixing member, and a third fixing member that using stacking together, the first fixing member having a first plurality of positioning holes, the positioning holes is smaller than the outer diameter of the first spring probe body portion is larger than the outer diameter of the first contact member, a second fixing member having a plurality of the second positioning hole, the second positioning hole corresponding to the outer diameter of the spring portion of the probe body, the third fixing member having a plurality of the third positioning hole, the third positioning hole is smaller than the probe body an outer diameter portion and larger than the outer diameter of the second contact, the spring probe body portion, the first contact and the second contact points are located in the second positioning hole corresponding to the first and second positioning holes three hole, so that the spring probe were positioned in the first fixing unit.
  7. 7. 一种用于测试图像感测芯片的探针卡,其特征在于包括:一电路板,该电路板具有一第一表面、一第二表面及一窗口,该第一表面与第二表面呈相对面设置,该窗口则贯穿于电路板;一第一固定单元,结合于前述电路板的第二表面;多个弹簧式探针,被前述第一固定单元固定于电路板下方位置,该弹簧式探针两端分别具有一外径较小的第一接触件及第二接触件,第一接触件是与该电路板第二表面的电路作电性连接,第二接触件则是延伸出该固定单元的下方位置,该弹簧式探针是采用垂直于窗口的方向设置;一第二固定单元,设置于电路板的第一表面;一镜头组,被前述第二固定单元固定位电路板上方位置,该镜头组对应着前述窗口的所在位置;一灯光单元,设置于第二固定单元顶面,该灯光单元能产生适当光线,该光线并能经镜头组聚焦投射至 A probe card for testing an image sensor chip, comprising: a circuit board, the circuit board having a first surface, a second surface and a window, the first and second surfaces disposed in an opposing surface of the circuit board through the window; a first fixing unit coupled to the second surface of the circuit board; a plurality of spring-type probe, is fixed to the lower position of the circuit board a first fixing unit, the each probe having a spring at both ends of a smaller diameter of the first contact and the second contact, the first contact is electrically connected to the circuit as a second surface of the circuit board, the second contact member is an extension of the lower position of the fixing unit, the spring probe is arranged vertical to the direction of the window; a second fixing unit, provided on a first surface of the circuit board; a lens group, a second fixing unit is the fixing position circuit above board position, the lens group corresponds to the location of the window; a lighting unit disposed on a top surface of the second fixing unit, the lighting unit can generate an appropriate light, and the light beam can be projected through the focus lens group to 路板下方的测试区域。 Test area below the circuit board.
  8. 8.如权利要求1所述的用于测试图像感测芯片的探针卡,其特征在于,该探针为垂直式可挠曲探针。 A probe card for testing the image sensing chip as claimed in claim 1, wherein the vertical probe is flexible probe.
  9. 9.如权利要求8所述的用于测试图像感测芯片的探针卡,其特征在于,该第一固定单元由一第一固定件、一第二固定件、以及一第三固定件所构成,该第一固定件具有多个第一定位孔,而第三固定件则具有多个第三定位孔,该第一定位孔与第三定位孔的孔径及孔型分别与垂直式可挠曲探针接近两端的区段外形相对应,该垂直式可挠曲探针接近两端的区段外壁并分别设置于该第一定位孔与第三定位孔内。 9. The probe card of a test image sensing chip according to claim 8, wherein the first fixing member fixing unit is composed of a first, a second fixing member, and a third fixing member that configuration, the first fixing member having a plurality of first positioning hole, and the third fixing member having a plurality of third positioning hole, and the aperture of the first hole and the third positioning hole and the positioning hole are vertical flexible probe near the ends curved shape corresponding to the section, the vertical section of the flexible outer wall of the probe near the ends and respectively disposed in the first positioning hole and the third positioning hole.
  10. 10. 一种用于测试图像感测芯片的探针卡,其特征在于包括:一电路板,该电路板具有一第一表面、一第二表面及一窗口,该第一表面与第二表面呈相对面设置,该窗口则贯穿于电路板;一第一固定单元,结合于前述电路板的第二表面;多个垂直式可挠曲探针,被前述第一固定单元固定于电路板下方位置,该垂直式可挠曲探针一端与该电路板第二表面的电路作电性连接,另一端延伸出该第一固定单元的下方位置;一第二固定单元,设置于电路板的第一表面;一镜头组,被前述第二固定单元固定位电路板上方位置,该镜头组并对应着前述窗口的所在位置;一灯光单元,设置于第二固定单元顶面,该灯光单元能产生光线,该光线并能经镜头组聚焦投射至电路板下方的测试区域。 10. A probe card for testing an image sensor chip, comprising: a circuit board, the circuit board having a first surface, a second surface and a window, the first and second surfaces disposed in an opposing surface of the circuit board through the window; a first fixing unit coupled to the second surface of the circuit board; a plurality of vertical flexible probe, the first fixing unit is fixed to the circuit board below position, the vertical deflection of the probe may be an end surface of the second circuit is electrically connected to the circuit board, and the other end extending below the position of the first fixing unit; a second fixing unit, provided on the first circuit board a surface; a lens group, a second fixing unit is the fixing position of the bit above the circuit board, and the lens group corresponds to the location of the window; a lighting unit disposed on a top surface of the second fixing unit, the lighting unit can generate light, and the light can be projected through the focus lens group to the test area under the circuit board.
  11. 11.如权利要求1所述的用于测试图像感测芯片的探针卡,其特征在于,该探针为悬臂式探针。 11. A probe card for testing an image sensor chip according to claim 1, wherein the probe is a cantilever type probe.
  12. 12.如权利要求11所述的用于测试图像感测芯片的探针卡,其特征在于,该第一固定单元为一环状且底部具有斜面,前述悬臂式探针则被固定于第一固定单元底部。 12. The probe card of a test image sensing chip according to claim 11, wherein the first fixing unit is a ring-shaped and has a bottom inclined surface, the cantilever is fixed to the first probe were the bottom of the fixing unit.
  13. 13. 一用于测试图像感测芯片的探针卡,其特征在于包括:一电路板,该电路板具有一第一表面、一第二表面及一窗口,该第一表面与第二表面呈相对面设置,该窗口则贯穿于电路板;一第一固定单元,结合于前述电路板的第二表面;多个悬臂式探针,被固定于前述第一固定单元底部,该悬臂式探针一端与该电路板第二表面的电路作电性连接,另一端延伸出该第一固定单元的下方位置;一第二固定单元,设置于电路板的第一表面;一镜头组,被前述第二固定单元固定位电路板上方位置,该镜头组并对应着前述窗口的所在位置;一灯光单元,设置于第二固定单元顶面,该灯光单元能产生光线,该光线并能经镜头组聚焦投射至电路板下方的测试区域。 13. A probe card for testing an image sensor chip, comprising: a circuit board, the circuit board having a first surface, a second surface and a window, showing the first and second surfaces surface disposed opposite the window through the circuit board; a first fixing unit coupled to the second surface of the circuit board; a plurality of cantilever probes is fixed to the bottom of the first fixing unit, the cantilever probe one end of the second surface of the circuit for the circuit board is electrically connected to the other end extending below the position of the first fixing unit; a second fixing unit, provided on a first surface of the circuit board; a lens group, being the first two fixing unit fixing the position of the bit above the circuit board, and the lens group corresponds to the location of the window; a lighting unit disposed on a top surface of the second fixing unit, the lighting units to produce light, the light can be focused by the lens assembly and It is projected to the test region below the circuit board.
CN 200910149322 2009-06-16 2009-06-16 Probe card used for testing image sense chip CN101923105A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
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CN103267938A (en) * 2013-05-17 2013-08-28 嘉兴景焱智能装备技术有限公司 CIS wafer integration testing machine
CN103543298A (en) * 2012-07-13 2014-01-29 旺矽科技股份有限公司 Probe holding structure and its optical inspection device
CN103543372A (en) * 2012-07-13 2014-01-29 旺矽科技股份有限公司 Optical inspection device
CN104101480A (en) * 2013-04-03 2014-10-15 京元电子股份有限公司 Array type optical detection module
CN104535811A (en) * 2014-12-23 2015-04-22 惠州中城电子科技有限公司 Electricity meter inserting component

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103543372B (en) * 2012-07-13 2016-08-24 旺矽科技股份有限公司 Optical detection means
CN103543298A (en) * 2012-07-13 2014-01-29 旺矽科技股份有限公司 Probe holding structure and its optical inspection device
CN103543372A (en) * 2012-07-13 2014-01-29 旺矽科技股份有限公司 Optical inspection device
CN103543298B (en) * 2012-07-13 2016-03-23 旺矽科技股份有限公司 Probe holding structure and optical detection means
CN104101480A (en) * 2013-04-03 2014-10-15 京元电子股份有限公司 Array type optical detection module
CN104101480B (en) * 2013-04-03 2017-03-01 京元电子股份有限公司 Array optical detection module
CN103267938A (en) * 2013-05-17 2013-08-28 嘉兴景焱智能装备技术有限公司 CIS wafer integration testing machine
CN104535811A (en) * 2014-12-23 2015-04-22 惠州中城电子科技有限公司 Electricity meter inserting component
CN104535811B (en) * 2014-12-23 2018-02-27 惠州中城电子科技有限公司 One kind of meter docking module

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