TW201334327A - 電路連接材料及電路構件的連接結構 - Google Patents

電路連接材料及電路構件的連接結構 Download PDF

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Publication number
TW201334327A
TW201334327A TW102113623A TW102113623A TW201334327A TW 201334327 A TW201334327 A TW 201334327A TW 102113623 A TW102113623 A TW 102113623A TW 102113623 A TW102113623 A TW 102113623A TW 201334327 A TW201334327 A TW 201334327A
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Taiwan
Prior art keywords
circuit
metal layer
conductive particles
connecting material
electrodes
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TW102113623A
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English (en)
Chinese (zh)
Inventor
Kazuyoshi Kojima
Kouji Kobayashi
Motohiro Arifuku
Nichiomi Mochizuki
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Hitachi Chemical Co Ltd
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Publication of TW201334327A publication Critical patent/TW201334327A/zh

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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • C—CHEMISTRY; METALLURGY
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
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    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0233—Deformable particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
TW102113623A 2007-10-31 2008-10-31 電路連接材料及電路構件的連接結構 TW201334327A (zh)

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JP5375374B2 (ja) * 2009-07-02 2013-12-25 日立化成株式会社 回路接続材料及び回路接続構造体
KR101342255B1 (ko) * 2009-11-16 2013-12-16 히타치가세이가부시끼가이샤 회로 접속 재료 및 이를 이용한 회로 부재의 접속 구조
JP4752986B1 (ja) * 2010-01-08 2011-08-17 日立化成工業株式会社 回路接続用接着フィルム及び回路接続構造体
JP2012003917A (ja) * 2010-06-16 2012-01-05 Sekisui Chem Co Ltd 導電性粒子、異方性導電材料及び接続構造体
JP5476221B2 (ja) * 2010-06-18 2014-04-23 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
JP6146302B2 (ja) * 2011-05-18 2017-06-14 日立化成株式会社 回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法
CN102623197B (zh) * 2012-03-30 2015-04-01 南通万德科技有限公司 软态金属面与高分子材料复合导电粒
JP5636118B2 (ja) * 2012-10-02 2014-12-03 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6263228B2 (ja) * 2016-06-09 2018-01-17 日本化学工業株式会社 導電性粒子及びそれを含む導電性材料
JPWO2018230470A1 (ja) * 2017-06-12 2020-03-19 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料、接着剤、接続構造体及び液晶表示素子
CN110783727A (zh) 2018-11-09 2020-02-11 广州方邦电子股份有限公司 一种连接器及制作方法
CN110783728A (zh) * 2018-11-09 2020-02-11 广州方邦电子股份有限公司 一种柔性连接器及制作方法
US11217557B2 (en) * 2019-05-14 2022-01-04 Innolux Corporation Electronic device having conductive particle between pads
JP7193512B2 (ja) * 2020-10-07 2022-12-20 デクセリアルズ株式会社 接続材料

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JPH0677408B2 (ja) * 1986-10-06 1994-09-28 日立化成工業株式会社 導電性粒子
JPH0750104A (ja) * 1993-08-05 1995-02-21 Hitachi Chem Co Ltd 導電性粒子及びこの導電性粒子を用いた接続部材
JP4032439B2 (ja) * 1996-05-23 2008-01-16 日立化成工業株式会社 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
JP3379456B2 (ja) * 1998-12-25 2003-02-24 ソニーケミカル株式会社 異方導電性接着フィルム
JP3696429B2 (ja) * 1999-02-22 2005-09-21 日本化学工業株式会社 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料
JP5247968B2 (ja) * 2003-12-02 2013-07-24 日立化成株式会社 回路接続材料、及びこれを用いた回路部材の接続構造
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CN105778815B (zh) 2018-03-20
KR101180571B1 (ko) 2012-09-06
JP5051221B2 (ja) 2012-10-17
TWI456852B (zh) 2014-10-11
JPWO2009057612A1 (ja) 2011-03-10
TW200939583A (en) 2009-09-16
KR20100008372A (ko) 2010-01-25
CN101682988A (zh) 2010-03-24
CN105778815A (zh) 2016-07-20
WO2009057612A1 (ja) 2009-05-07

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