TWI456852B - 電路構件的連接結構及電路構件的連接方法 - Google Patents

電路構件的連接結構及電路構件的連接方法 Download PDF

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Publication number
TWI456852B
TWI456852B TW097142071A TW97142071A TWI456852B TW I456852 B TWI456852 B TW I456852B TW 097142071 A TW097142071 A TW 097142071A TW 97142071 A TW97142071 A TW 97142071A TW I456852 B TWI456852 B TW I456852B
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Taiwan
Prior art keywords
circuit
metal layer
core body
conductive particles
electrodes
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TW097142071A
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English (en)
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TW200939583A (en
Inventor
Kazuyoshi Kojima
Kouji Kobayashi
Motohiro Arifuku
Nichiomi Mochizuki
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Hitachi Chemical Co Ltd
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Publication of TW200939583A publication Critical patent/TW200939583A/zh
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Publication of TWI456852B publication Critical patent/TWI456852B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
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    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0233—Deformable particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

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Claims (8)

  1. 一種電路構件的連接結構，其特徵為具備形成有電路電極且配置成前述電路電極呈對向的2個電路構件、與介於前述電路構件之間而將前述電路電極電性連接的電路連接構件；前述電路連接構件為含有黏著劑組成物及導電粒子之電路連接材料經加熱加壓而成之硬化物，前述導電粒子具備由有機高分子化合物所構成之核體及覆蓋該核體的金屬層，前述金屬層具有向著導電粒子的外側而突起之突起部，前述金屬層由鎳或鎳合金構成，前述核體之平均粒徑為2.5~3.5μm，前述金屬層之厚度為75~100nm；在前述電路連接材料所含有之導電粒子的突起部之內側部分，金屬層嵌入核體，且前述突起部之一部分咬入前述電路電極。
  2. 如申請專利範圍第1項之電路構件的連接結構，其中前述金屬層之維氏硬度(Vickers hardness)為400~1000。
  3. 一種電路構件的連接結構，其特徵為具備形成有電路電極且配置成前述電路電極呈對向的2個電路構件、與介於前述電路構件之間而將前述電路電極電性連接的電路連接構件；前述電路連接構件為含有黏著劑組成物及導電粒子之電路連接材料經加熱加壓而成之硬化物，前述導電粒子具 備由有機高分子化合物所構成之核體及覆蓋該核體的複數金屬層，前述金屬層具有向著導電粒子的外側而突起之突起部，前述金屬層的最外層由鎳或鎳合金構成，前述核體之平均粒徑為2.5~3.5μm，前述金屬層之厚度為75~100nm；在前述電路連接材料所含有之導電粒子的突起部之內側部分，金屬層嵌入核體，且前述突起部之一部分咬入前述電路電極。
  4. 如申請專利範圍第3項之電路構件的連接結構，其中前述金屬層的最外層的維氏硬度(Vickers hardness)為400~1000。
  5. 如申請專利範圍第1項至第4項中任一項之電路構件的連接結構，其中前述2個電路構件的電路電極之至少1方的表面係由銦-錫氧化物所成。
  6. 如申請專利範圍第1項至第4項中任一項之電路構件的連接結構，其中前述2個電路構件的電路電極之至少1方的表面係由銦-鋅氧化物所成。
  7. 一種電路構件的連接方法，其特徵為使電路連接材料介於形成有電路電極且配置成前述電路電極呈對向的2個電路構件之間，前述電路連接材料含有黏著劑組成物和導電粒子，前述導電粒子具備由有機高分子化合物所構成之核體及覆蓋該核體的金屬層，前述金屬層具有向著導電粒子的外側而突起之突起部，前述金屬層由鎳或鎳合金構成，前述核體 之平均粒徑為2.5~3.5μm，前述金屬層之厚度為75~100nm，經加熱加壓以使前述電路連接材料所含有之導電粒子的突起部的內側部分之金屬層嵌入核體，且前述突起部之一部分咬入前述電路電極，而將前述電路電極電性連接。
  8. 一種電路構件的連接方法，其特徵為使電路連接材料介於形成有電路電極且配置成前述電路電極呈對向的2個電路構件之間，前述電路連接材料含有黏著劑組成物和導電粒子，前述導電粒子具備由有機高分子化合物所構成之核體及覆蓋該核體的複數金屬層，前述金屬層具有向著導電粒子的外側而突起之突起部，前述金屬層的最外層由鎳或鎳合金構成，前述核體之平均粒徑為2.5~3.5μm，前述金屬層之厚度為75~100nm，經加熱加壓以使前述電路連接材料所含有之導電粒子的突起部的內側部分之金屬層嵌入核體，且前述突起部之一部分咬入前述電路電極，而將前述電路電極電性連接。
TW097142071A 2007-10-31 2008-10-31 電路構件的連接結構及電路構件的連接方法 TWI456852B (zh)

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WO2011059084A1 (ja) * 2009-11-16 2011-05-19 日立化成工業株式会社 回路接続材料及びそれを用いた回路部材の接続構造
KR101223350B1 (ko) 2010-01-08 2013-01-16 히다치 가세고교 가부시끼가이샤 회로 접속용 접착 필름 및 회로 접속 구조체
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JP5476221B2 (ja) * 2010-06-18 2014-04-23 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
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CN102623197B (zh) * 2012-03-30 2015-04-01 南通万德科技有限公司 软态金属面与高分子材料复合导电粒
KR102095823B1 (ko) * 2012-10-02 2020-04-01 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체
JP6263228B2 (ja) * 2016-06-09 2018-01-17 日本化学工業株式会社 導電性粒子及びそれを含む導電性材料
KR102391136B1 (ko) * 2017-06-12 2022-04-28 세키스이가가쿠 고교가부시키가이샤 수지 입자, 도전성 입자, 도전 재료, 접착제, 접속 구조체 및 액정 표시 소자
CN110783728A (zh) 2018-11-09 2020-02-11 广州方邦电子股份有限公司 一种柔性连接器及制作方法
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