JP2009170835A5 - - Google Patents
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- Publication number
- JP2009170835A5 JP2009170835A5 JP2008010121A JP2008010121A JP2009170835A5 JP 2009170835 A5 JP2009170835 A5 JP 2009170835A5 JP 2008010121 A JP2008010121 A JP 2008010121A JP 2008010121 A JP2008010121 A JP 2008010121A JP 2009170835 A5 JP2009170835 A5 JP 2009170835A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- external electrode
- main body
- electronic component
- ceramic electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims 6
- 229920005989 resin Polymers 0.000 claims 6
- 239000000919 ceramic Substances 0.000 claims 4
- 230000001590 oxidative Effects 0.000 claims 3
- 238000007747 plating Methods 0.000 claims 3
- 239000011521 glass Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008010121A JP5071118B2 (ja) | 2008-01-21 | 2008-01-21 | セラミック電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008010121A JP5071118B2 (ja) | 2008-01-21 | 2008-01-21 | セラミック電子部品 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009170835A JP2009170835A (ja) | 2009-07-30 |
JP2009170835A5 true JP2009170835A5 (zh) | 2011-03-03 |
JP5071118B2 JP5071118B2 (ja) | 2012-11-14 |
Family
ID=40971654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008010121A Active JP5071118B2 (ja) | 2008-01-21 | 2008-01-21 | セラミック電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5071118B2 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5246207B2 (ja) | 2010-06-04 | 2013-07-24 | 株式会社村田製作所 | チップ型電子部品 |
US9202640B2 (en) | 2011-10-31 | 2015-12-01 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and manufacturing method thereof |
US9490055B2 (en) | 2011-10-31 | 2016-11-08 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and manufacturing method thereof |
US8988855B2 (en) | 2011-10-31 | 2015-03-24 | Murata Manufacturing Co., Ltd. | Method of manufacturing ceramic electronic component including heating an electrode layer to form a conductive layer including an alloy particle |
JP6673273B2 (ja) * | 2016-09-28 | 2020-03-25 | 株式会社村田製作所 | 電子部品 |
KR20190116158A (ko) * | 2019-08-23 | 2019-10-14 | 삼성전기주식회사 | 적층형 전자 부품 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3887870B2 (ja) * | 1997-04-02 | 2007-02-28 | 松下電器産業株式会社 | 導電接続構造体 |
JP2005217126A (ja) * | 2004-01-29 | 2005-08-11 | Kyocera Corp | コンデンサの製造方法 |
JP2007073883A (ja) * | 2005-09-09 | 2007-03-22 | Rohm Co Ltd | チップ型コンデンサ |
TWI408702B (zh) * | 2005-12-22 | 2013-09-11 | Namics Corp | 熱硬化性導電性糊膏及具有使用該導電性糊膏而形成之外部電極之積層陶瓷質電子組件 |
-
2008
- 2008-01-21 JP JP2008010121A patent/JP5071118B2/ja active Active
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