WO2009041142A1 - ニッケル粉末、またはニッケルを主成分とする合金粉末およびその製造方法、導電性ペースト、並びに積層セラミックコンデンサ - Google Patents

ニッケル粉末、またはニッケルを主成分とする合金粉末およびその製造方法、導電性ペースト、並びに積層セラミックコンデンサ Download PDF

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Publication number
WO2009041142A1
WO2009041142A1 PCT/JP2008/062380 JP2008062380W WO2009041142A1 WO 2009041142 A1 WO2009041142 A1 WO 2009041142A1 JP 2008062380 W JP2008062380 W JP 2008062380W WO 2009041142 A1 WO2009041142 A1 WO 2009041142A1
Authority
WO
WIPO (PCT)
Prior art keywords
powder
nickel
main component
ceramic capacitor
laminated ceramic
Prior art date
Application number
PCT/JP2008/062380
Other languages
English (en)
French (fr)
Inventor
Issei Okada
Keiji Koyama
Original Assignee
Sumitomo Electric Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries, Ltd. filed Critical Sumitomo Electric Industries, Ltd.
Priority to CN200880108685A priority Critical patent/CN101808767A/zh
Priority to EP08777989A priority patent/EP2210690A1/en
Priority to US12/678,684 priority patent/US20100208410A1/en
Priority to TW097136250A priority patent/TW200920857A/zh
Publication of WO2009041142A1 publication Critical patent/WO2009041142A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/007—Alloys based on nickel or cobalt with a light metal (alkali metal Li, Na, K, Rb, Cs; earth alkali metal Be, Mg, Ca, Sr, Ba, Al Ga, Ge, Ti) or B, Si, Zr, Hf, Sc, Y, lanthanides, actinides, as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B23/00—Obtaining nickel or cobalt
    • C22B23/04—Obtaining nickel or cobalt by wet processes
    • C22B23/0453—Treatment or purification of solutions, e.g. obtained by leaching
    • C22B23/0461—Treatment or purification of solutions, e.g. obtained by leaching by chemical methods
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B5/00—General methods of reducing to metals

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Ceramic Engineering (AREA)
  • Ceramic Capacitors (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

表面が平滑化されており、さらに電極途切れの発生を確実に防止できる内部電極を備える積層セラミックコンデンサ、それに用いられる導電性ペースト、ニッケル粉末、またはニッケルを主成分とする合金粉末およびその製造方法を提供する。 本発明のニッケル粉末、またはニッケルを主成分とする合金粉末は、球形状を有するとともに、平均粒子径Ｄ５０が１０～３００ｎｍであり、かつ平均粒子径Ｄ５０と粒子径の最大値Ｄｍａｘとの比（Ｄｍａｘ／Ｄ５０）が３以下である。
PCT/JP2008/062380 2007-09-25 2008-07-09 ニッケル粉末、またはニッケルを主成分とする合金粉末およびその製造方法、導電性ペースト、並びに積層セラミックコンデンサ WO2009041142A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN200880108685A CN101808767A (zh) 2007-09-25 2008-07-09 镍粉或含有镍作为主要成分的合金粉、制造所述粉末的方法、导电膏和多层陶瓷电容器
EP08777989A EP2210690A1 (en) 2007-09-25 2008-07-09 Nickel powder or alloy powder having nickel as main component, method for manufacturing the powder, conductive paste and laminated ceramic capacitor
US12/678,684 US20100208410A1 (en) 2007-09-25 2008-07-09 Nickel powder or alloy powder having nickel as main component, method for manufacturing the powder, conductive paste and laminated ceramic capacitor
TW097136250A TW200920857A (en) 2007-09-25 2008-09-22 Nickel powder or alloy powder comprising nickel as main component and manufacturing method thereof, conductive paste and multi-layer ceramic condenser

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-247598 2007-09-25
JP2007247598A JP2009079239A (ja) 2007-09-25 2007-09-25 ニッケル粉末、またはニッケルを主成分とする合金粉末およびその製造方法、導電性ペースト、並びに積層セラミックコンデンサ

Publications (1)

Publication Number Publication Date
WO2009041142A1 true WO2009041142A1 (ja) 2009-04-02

Family

ID=40511040

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062380 WO2009041142A1 (ja) 2007-09-25 2008-07-09 ニッケル粉末、またはニッケルを主成分とする合金粉末およびその製造方法、導電性ペースト、並びに積層セラミックコンデンサ

Country Status (7)

Country Link
US (1) US20100208410A1 (ja)
EP (1) EP2210690A1 (ja)
JP (1) JP2009079239A (ja)
KR (1) KR20100047881A (ja)
CN (1) CN101808767A (ja)
TW (1) TW200920857A (ja)
WO (1) WO2009041142A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019053992A (ja) * 2018-10-30 2019-04-04 住友電気工業株式会社 金属微粒子分散液、金属微粒子分散液の製造方法及び金属被膜の製造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010053409A (ja) * 2008-08-28 2010-03-11 Sumitomo Electric Ind Ltd 金属粉末の製造方法および金属粉末、導電性ペースト、積層セラミックコンデンサ
CN102470437B (zh) * 2009-07-09 2014-11-05 株式会社东芝 高纯度钼粉末及其制造方法
KR101771019B1 (ko) * 2013-12-10 2017-08-24 가부시키가이샤 무라타 세이사쿠쇼 적층 세라믹 콘덴서 및 적층 세라믹 콘덴서의 제조 방법
CA2974483C (en) 2015-01-22 2018-05-29 Sumitomo Metal Mining Co., Ltd. Method for producing nickel powder
JP2017155265A (ja) * 2016-02-29 2017-09-07 住友金属鉱山株式会社 ニッケル粉の製造方法
JP6427541B2 (ja) * 2016-09-16 2018-11-21 本田技研工業株式会社 亜鉛−ニッケル複合めっき浴及びめっき方法
JP6986361B2 (ja) * 2017-04-05 2021-12-22 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
JP6986360B2 (ja) 2017-04-05 2021-12-22 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
KR102278500B1 (ko) * 2017-07-05 2021-07-15 도호 티타늄 가부시키가이샤 금속 분말 및 그 제조 방법
JP7348890B2 (ja) * 2020-10-30 2023-09-21 太陽誘電株式会社 セラミック電子部品およびその製造方法

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JPS4974160A (ja) * 1972-10-20 1974-07-17
JPH0578716A (ja) * 1991-09-20 1993-03-30 Murata Mfg Co Ltd 微粉末の製造方法
JPH07207307A (ja) * 1994-01-12 1995-08-08 Murata Mfg Co Ltd ニッケル粉末の製造方法
JP2004139838A (ja) 2002-10-17 2004-05-13 Noritake Co Ltd 導体ペーストおよびその利用
JP2004332047A (ja) * 2003-05-08 2004-11-25 Sumitomo Electric Ind Ltd 連鎖状金属粉末とその製造方法、及びそれを用いた導電性付与材
WO2006062186A1 (ja) * 2004-12-10 2006-06-15 Mitsui Mining & Smelting Co., Ltd. ニッケル粉及びその製造方法並びに導電性ペースト
JP2006161128A (ja) * 2004-12-09 2006-06-22 Mitsui Mining & Smelting Co Ltd ニッケルスラリー及びその製造方法並びに該ニッケルスラリーを用いたニッケルペースト又はニッケルインキ

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US5435830A (en) * 1991-09-20 1995-07-25 Murata Manufacturing Co., Ltd. Method of producing fine powders
US5958284A (en) * 1997-12-29 1999-09-28 Hitachi Metals, Ltd. Ferrite magnet and method for producing same
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KR100480866B1 (ko) * 1999-11-10 2005-04-07 미츠이 긴조쿠 고교 가부시키가이샤 니켈 분말, 그 제조 방법 및 도전 페이스트
JP3597098B2 (ja) * 2000-01-21 2004-12-02 住友電気工業株式会社 合金微粉末とその製造方法、それを用いた成型用材料、スラリーおよび電磁波シールド材料
JP3508766B2 (ja) * 2002-06-14 2004-03-22 住友電気工業株式会社 金属微粉末の製造方法
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JP4799881B2 (ja) * 2004-12-27 2011-10-26 三井金属鉱業株式会社 導電性インク
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4974160A (ja) * 1972-10-20 1974-07-17
JPH0578716A (ja) * 1991-09-20 1993-03-30 Murata Mfg Co Ltd 微粉末の製造方法
JPH07207307A (ja) * 1994-01-12 1995-08-08 Murata Mfg Co Ltd ニッケル粉末の製造方法
JP2004139838A (ja) 2002-10-17 2004-05-13 Noritake Co Ltd 導体ペーストおよびその利用
JP2004332047A (ja) * 2003-05-08 2004-11-25 Sumitomo Electric Ind Ltd 連鎖状金属粉末とその製造方法、及びそれを用いた導電性付与材
JP2006161128A (ja) * 2004-12-09 2006-06-22 Mitsui Mining & Smelting Co Ltd ニッケルスラリー及びその製造方法並びに該ニッケルスラリーを用いたニッケルペースト又はニッケルインキ
WO2006062186A1 (ja) * 2004-12-10 2006-06-15 Mitsui Mining & Smelting Co., Ltd. ニッケル粉及びその製造方法並びに導電性ペースト

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019053992A (ja) * 2018-10-30 2019-04-04 住友電気工業株式会社 金属微粒子分散液、金属微粒子分散液の製造方法及び金属被膜の製造方法

Also Published As

Publication number Publication date
CN101808767A (zh) 2010-08-18
US20100208410A1 (en) 2010-08-19
KR20100047881A (ko) 2010-05-10
JP2009079239A (ja) 2009-04-16
EP2210690A1 (en) 2010-07-28
TW200920857A (en) 2009-05-16

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