JP2009170835A5 - - Google Patents

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Publication number
JP2009170835A5
JP2009170835A5 JP2008010121A JP2008010121A JP2009170835A5 JP 2009170835 A5 JP2009170835 A5 JP 2009170835A5 JP 2008010121 A JP2008010121 A JP 2008010121A JP 2008010121 A JP2008010121 A JP 2008010121A JP 2009170835 A5 JP2009170835 A5 JP 2009170835A5
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JP
Japan
Prior art keywords
electrode
external electrode
main body
electronic component
ceramic electronic
Prior art date
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Granted
Application number
JP2008010121A
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Japanese (ja)
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JP2009170835A (en
JP5071118B2 (en
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Publication date
Application filed filed Critical
Priority to JP2008010121A priority Critical patent/JP5071118B2/en
Priority claimed from JP2008010121A external-priority patent/JP5071118B2/en
Publication of JP2009170835A publication Critical patent/JP2009170835A/en
Publication of JP2009170835A5 publication Critical patent/JP2009170835A5/ja
Application granted granted Critical
Publication of JP5071118B2 publication Critical patent/JP5071118B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (3)

本体と、この本体内において所定間隔で対向させた内部電極と、この内部電極に電気的に接続されると共に、前記本体の外部に設けられた外部電極とを備え、前記外部電極は、内部電極に電気的に接続されると共に、前記本体に接して設けられたガラスを含まない樹脂外部電極と、この樹脂外部電極の外表面に設けられためっき電極とを有したセラミック電子部品において、前記本体と前記樹脂外部電極の接合強度をＦ１、前記樹脂外部電極と前記めっき電極の接合強度をＦ２とした時、
Ｆ１＞Ｆ２
の関係を満たしていることを特徴とするセラミック電子部品。 A main body, an internal electrode opposed to the internal electrode at a predetermined interval, and an external electrode electrically connected to the internal electrode and provided outside the main body, the external electrode being an internal electrode A ceramic electronic component having a resin external electrode that is electrically connected to the main body and does not include glass provided in contact with the main body, and a plating electrode provided on an outer surface of the resin external electrode. When the bonding strength of the resin external electrode is F1, and the bonding strength of the resin external electrode and the plating electrode is F2,
F1> F2
A ceramic electronic component characterized by satisfying the above relationship. 前記樹脂外部電極は、少なくとも前記本体側とめっき電極側表面部分が実質的な非酸化劣化層を有していることを特徴とした請求項１に記載のセラミック電子部品。 2. The ceramic electronic component according to claim 1, wherein at least the main body side and the plating electrode side surface portion of the resin external electrode have a substantially non-oxidative deterioration layer. 前記樹脂外部電極中の実質的な非酸化劣化層部分における金属粉末は、酸化膨張による非粒成長状態であることを特徴とした請求項１に記載のセラミック電子部品。 2. The ceramic electronic component according to claim 1, wherein the metal powder in the substantially non-oxidative deterioration layer portion in the resin external electrode is in a non-granular growth state due to oxidative expansion.
JP2008010121A 2008-01-21 2008-01-21 Ceramic electronic components Active JP5071118B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008010121A JP5071118B2 (en) 2008-01-21 2008-01-21 Ceramic electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008010121A JP5071118B2 (en) 2008-01-21 2008-01-21 Ceramic electronic components

Publications (3)

Publication Number Publication Date
JP2009170835A JP2009170835A (en) 2009-07-30
JP2009170835A5 true JP2009170835A5 (en) 2011-03-03
JP5071118B2 JP5071118B2 (en) 2012-11-14

Family

ID=40971654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008010121A Active JP5071118B2 (en) 2008-01-21 2008-01-21 Ceramic electronic components

Country Status (1)

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JP (1) JP5071118B2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5246207B2 (en) * 2010-06-04 2013-07-24 株式会社村田製作所 Chip-type electronic components
US9490055B2 (en) 2011-10-31 2016-11-08 Murata Manufacturing Co., Ltd. Ceramic electronic component and manufacturing method thereof
US9202640B2 (en) 2011-10-31 2015-12-01 Murata Manufacturing Co., Ltd. Ceramic electronic component and manufacturing method thereof
US8988855B2 (en) 2011-10-31 2015-03-24 Murata Manufacturing Co., Ltd. Method of manufacturing ceramic electronic component including heating an electrode layer to form a conductive layer including an alloy particle
JP6673273B2 (en) * 2016-09-28 2020-03-25 株式会社村田製作所 Electronic components
KR20190116158A (en) * 2019-08-23 2019-10-14 삼성전기주식회사 Multilayered electronic component

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3887870B2 (en) * 1997-04-02 2007-02-28 松下電器産業株式会社 Conductive connection structure
JP2005217126A (en) * 2004-01-29 2005-08-11 Kyocera Corp Manufacturing method for capacitor
JP2007073883A (en) * 2005-09-09 2007-03-22 Rohm Co Ltd Chip capacitor
EP1965397B1 (en) * 2005-12-22 2019-03-20 Namics Corporation Thermosetting conductive paste and multilayer ceramic component having external electrode which is formed by using such thermosetting conductive paste

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