TW201316404A - 電漿蝕刻方法 - Google Patents

電漿蝕刻方法 Download PDF

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Publication number
TW201316404A
TW201316404A TW101130461A TW101130461A TW201316404A TW 201316404 A TW201316404 A TW 201316404A TW 101130461 A TW101130461 A TW 101130461A TW 101130461 A TW101130461 A TW 101130461A TW 201316404 A TW201316404 A TW 201316404A
Authority
TW
Taiwan
Prior art keywords
gas
etching
protective film
semiconductor substrate
wide
Prior art date
Application number
TW101130461A
Other languages
English (en)
Chinese (zh)
Inventor
村上彰一
池本尚彌
Original Assignee
Spp科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Spp科技股份有限公司 filed Critical Spp科技股份有限公司
Publication of TW201316404A publication Critical patent/TW201316404A/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325—Silicon carbide
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials
    • H10P50/692—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group V materials or Group III-V materials characterised by their composition, e.g. multilayer masks or materials

Landscapes

  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
TW101130461A 2011-09-22 2012-08-22 電漿蝕刻方法 TW201316404A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011207114A JP5877982B2 (ja) 2011-09-22 2011-09-22 プラズマエッチング方法

Publications (1)

Publication Number Publication Date
TW201316404A true TW201316404A (zh) 2013-04-16

Family

ID=47914276

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101130461A TW201316404A (zh) 2011-09-22 2012-08-22 電漿蝕刻方法

Country Status (3)

Country Link
JP (1) JP5877982B2 (https=)
TW (1) TW201316404A (https=)
WO (1) WO2013042497A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI880420B (zh) * 2022-12-30 2025-04-11 大陸商江蘇魯汶儀器股份有限公司 一種刻蝕方法及刻蝕系統

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5889368B2 (ja) * 2013-09-05 2016-03-22 Ｓｐｐテクノロジーズ株式会社 プラズマエッチング方法
JP5967488B2 (ja) * 2013-11-18 2016-08-10 パナソニックＩｐマネジメント株式会社 ＳｉＣ基板のエッチング方法
KR102118405B1 (ko) 2014-03-31 2020-06-03 에스피피 테크놀로지스 컴퍼니 리미티드 플라즈마 처리 장치 및 플라즈마 처리 방법
JP6279498B2 (ja) * 2015-02-03 2018-02-14 Ｓｐｐテクノロジーズ株式会社 プラズマ処理装置及びプラズマ処理方法
JP6561804B2 (ja) * 2015-12-03 2019-08-21 三菱電機株式会社 半導体装置の製造方法
JP7022651B2 (ja) * 2018-05-28 2022-02-18 東京エレクトロン株式会社 膜をエッチングする方法及びプラズマ処理装置
JP7231683B1 (ja) * 2021-08-30 2023-03-01 株式会社Kokusai Electric 半導体装置の製造方法、基板処理装置およびプログラム

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JPH03196624A (ja) * 1989-12-26 1991-08-28 Sony Corp ドライエッチング方法
JPH04261017A (ja) * 1991-02-14 1992-09-17 Mitsubishi Electric Corp 薄膜トランジスタアレイ基板の製造方法
JP2002203841A (ja) * 2001-01-05 2002-07-19 Matsushita Electric Ind Co Ltd 薄膜の加工方法と薄膜トランジスタの製造方法および高密度プラズマエッチング装置
JP5037766B2 (ja) * 2001-09-10 2012-10-03 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP4781106B2 (ja) * 2003-06-13 2011-09-28 住友精密工業株式会社 シリコンエッチング方法及び装置並びにエッチングシリコン体
JP4672318B2 (ja) * 2004-09-22 2011-04-20 東京エレクトロン株式会社 エッチング方法
EP1786027A3 (en) * 2005-11-14 2009-03-04 Schott AG Plasma etching of tapered structures
JP5061506B2 (ja) * 2006-06-05 2012-10-31 富士電機株式会社 炭化珪素半導体装置の製造方法
JP2008135534A (ja) * 2006-11-28 2008-06-12 Toyota Motor Corp 有底の溝を有する半導体基板の製造方法
JP2008205436A (ja) * 2007-01-26 2008-09-04 Toshiba Corp 微細構造体の製造方法
JP5154260B2 (ja) * 2008-02-26 2013-02-27 パナソニック株式会社 ドライエッチング方法及びドライエッチング装置
JP5179455B2 (ja) * 2009-10-27 2013-04-10 Ｓｐｐテクノロジーズ株式会社 プラズマエッチング方法
JP5187705B2 (ja) * 2011-01-07 2013-04-24 独立行政法人科学技術振興機構 異方性エッチング方法、三次元構造体、及び、デバイス

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI880420B (zh) * 2022-12-30 2025-04-11 大陸商江蘇魯汶儀器股份有限公司 一種刻蝕方法及刻蝕系統

Also Published As

Publication number Publication date
JP2013069848A (ja) 2013-04-18
JP5877982B2 (ja) 2016-03-08
WO2013042497A1 (ja) 2013-03-28

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