TW201249740A - Inorganic polysilazane, silica film-forming coating liquid containing same, and method for forming silica film - Google Patents

Inorganic polysilazane, silica film-forming coating liquid containing same, and method for forming silica film Download PDF

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Publication number
TW201249740A
TW201249740A TW101113655A TW101113655A TW201249740A TW 201249740 A TW201249740 A TW 201249740A TW 101113655 A TW101113655 A TW 101113655A TW 101113655 A TW101113655 A TW 101113655A TW 201249740 A TW201249740 A TW 201249740A
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TW
Taiwan
Prior art keywords
inorganic
nitrogen
ppm
coating liquid
polyfluorene
Prior art date
Application number
TW101113655A
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English (en)
Chinese (zh)
Inventor
Hiroshi Morita
Atsushi Kobayashi
Hiroo Yokota
Yasuhisa Furihata
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Adeka Corp
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Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of TW201249740A publication Critical patent/TW201249740A/zh

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69Inorganic materials
    • H10P14/692Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/69215Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00Nitrogen; Compounds thereof
    • C01B21/082Compounds containing nitrogen and non-metals and optionally metals
    • C01B21/087Compounds containing nitrogen and non-metals and optionally metals containing one or more hydrogen atoms
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/126Preparation of silica of undetermined type
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/60Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/62Nitrogen atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/16Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D1/00Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/16Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/30Coatings
    • H10F77/306Coatings for devices having potential barriers
    • H10F77/311Coatings for devices having potential barriers for photovoltaic cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326Deposition processes
    • H10P14/6342Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Paints Or Removers (AREA)
  • Silicon Polymers (AREA)
  • Formation Of Insulating Films (AREA)
  • Silicon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW101113655A 2011-06-13 2012-04-17 Inorganic polysilazane, silica film-forming coating liquid containing same, and method for forming silica film TW201249740A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011131146A JP2013001721A (ja) 2011-06-13 2011-06-13 無機ポリシラザン、これを含有してなるシリカ膜形成用塗布液及びシリカ膜の形成方法

Publications (1)

Publication Number Publication Date
TW201249740A true TW201249740A (en) 2012-12-16

Family

ID=47356858

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101113655A TW201249740A (en) 2011-06-13 2012-04-17 Inorganic polysilazane, silica film-forming coating liquid containing same, and method for forming silica film

Country Status (6)

Country Link
US (1) US20140106576A1 (https=)
JP (1) JP2013001721A (https=)
KR (1) KR20140024342A (https=)
CN (1) CN103502318A (https=)
TW (1) TW201249740A (https=)
WO (1) WO2012172860A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI601764B (zh) * 2013-12-09 2017-10-11 Az電子材料盧森堡有限公司 全氫聚矽氮烷、及含其之組成物、以及使用其之矽石質膜之形成方法
US11201052B2 (en) 2019-05-17 2021-12-14 Samsung Sdi Co., Ltd. Composition for forming silica layer, silica layer and electronic device incorporating silica layer

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JP5692736B2 (ja) * 2009-10-05 2015-04-01 株式会社Adeka 絶縁膜形成用塗布液、それを用いた絶縁膜
CN103910885A (zh) * 2012-12-31 2014-07-09 第一毛织株式会社 制备间隙填充剂的方法、用其制备的间隙填充剂和使用间隙填充剂制造半导体电容器的方法
JP6134576B2 (ja) * 2013-04-30 2017-05-24 サムスン エスディアイ カンパニー,リミテッドSamsung Sdi Co.,Ltd. 改質シリカ膜の製造方法、塗工液、及び改質シリカ膜
CN105939959A (zh) * 2014-02-07 2016-09-14 柯尼卡美能达株式会社 改性聚硅氮烷、含有该改性聚硅氮烷的涂布液及使用该涂布液而制造的气体阻隔性膜
KR101497500B1 (ko) * 2014-06-16 2015-03-03 한국과학기술연구원 파장변환층을 구비하는 태양전지 및 그의 제조 방법
US10020185B2 (en) 2014-10-07 2018-07-10 Samsung Sdi Co., Ltd. Composition for forming silica layer, silica layer, and electronic device
KR101837971B1 (ko) 2014-12-19 2018-03-13 삼성에스디아이 주식회사 실리카계 막 형성용 조성물, 실리카계 막, 및 전자 디바이스
KR101833800B1 (ko) 2014-12-19 2018-03-02 삼성에스디아이 주식회사 실리카계 막 형성용 조성물, 실리카계 막의 제조방법 및 상기 실리카계 막을 포함하는 전자 소자
KR20160134290A (ko) 2015-05-15 2016-11-23 삼성에스디아이 주식회사 실리카 막 형성용 조성물, 실리카 막의 제조방법 및 실리카 막
KR20170014946A (ko) * 2015-07-31 2017-02-08 삼성에스디아이 주식회사 실리카 막 형성용 조성물, 실리카 막의 제조방법 및 실리카 막
KR20170100987A (ko) * 2016-02-26 2017-09-05 삼성에스디아이 주식회사 실리카 막 형성용 조성물, 실리카 막의 제조방법 및 실리카 막
US10316216B2 (en) 2016-08-31 2019-06-11 Samsung Sdi Co., Ltd. Composition for forming silica layer, and silica layer
JP2018083736A (ja) * 2016-11-24 2018-05-31 アーゼッド・エレクトロニック・マテリアルズ(ルクセンブルグ)ソシエテ・ア・レスポンサビリテ・リミテ シロキサザン化合物、およびそれを含む組成物、ならびにそれを用いたシリカ質膜の形成方法
KR102015404B1 (ko) 2016-12-08 2019-08-28 삼성에스디아이 주식회사 실리카 막 형성용 조성물, 실리카 막의 제조방법 및 실리카 막을 포함하는 전자소자
KR102192462B1 (ko) * 2017-12-14 2020-12-17 삼성에스디아이 주식회사 실리카 막 형성용 조성물, 실리카 막, 및 전자소자
JP7033667B2 (ja) * 2018-02-21 2022-03-10 レール・リキード-ソシエテ・アノニム・プール・レテュード・エ・レクスプロワタシオン・デ・プロセデ・ジョルジュ・クロード ペルヒドロポリシラザン組成物及びそれを使用する酸化物膜の形成方法
TWI793262B (zh) * 2018-02-21 2023-02-21 法商液態空氣喬治斯克勞帝方法研究開發股份有限公司 全氫聚矽氮烷組成物和用於使用其形成氮化物膜之方法
KR102446983B1 (ko) * 2018-04-27 2022-09-22 삼성에스디아이 주식회사 실리카 막 형성용 조성물 및 실리카 막
KR102395487B1 (ko) * 2019-08-21 2022-05-06 삼성에스디아이 주식회사 실리카 막 형성용 조성물 및 실리카 막
JP2022036556A (ja) * 2020-08-24 2022-03-08 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング ポリシラザン、およびそれを含むシリカ質膜形成組成物、ならびにそれを用いたシリカ質膜の製造方法
KR102822386B1 (ko) * 2022-07-05 2025-06-17 삼성에스디아이 주식회사 실리카 막 형성용 조성물, 그로부터 형성된 실리카 막, 및 상기 실리카 막을 포함하는 전자 소자
KR102930141B1 (ko) 2023-04-24 2026-02-25 한국광기술원 내전압성이 개선된 절연막 조성물 및 그를 이용한 절연금속기판의 제조 방법

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI601764B (zh) * 2013-12-09 2017-10-11 Az電子材料盧森堡有限公司 全氫聚矽氮烷、及含其之組成物、以及使用其之矽石質膜之形成方法
US11201052B2 (en) 2019-05-17 2021-12-14 Samsung Sdi Co., Ltd. Composition for forming silica layer, silica layer and electronic device incorporating silica layer
TWI777165B (zh) * 2019-05-17 2022-09-11 南韓商三星Sdi股份有限公司 用於形成二氧化矽層的組成物、二氧化矽層及電子裝置

Also Published As

Publication number Publication date
WO2012172860A1 (ja) 2012-12-20
JP2013001721A (ja) 2013-01-07
KR20140024342A (ko) 2014-02-28
US20140106576A1 (en) 2014-04-17
CN103502318A (zh) 2014-01-08

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