TW201246412A - Cylindrical packages, electronic apparatus including the same, and methods of fabricating the same - Google Patents

Cylindrical packages, electronic apparatus including the same, and methods of fabricating the same Download PDF

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Publication number
TW201246412A
TW201246412A TW100141992A TW100141992A TW201246412A TW 201246412 A TW201246412 A TW 201246412A TW 100141992 A TW100141992 A TW 100141992A TW 100141992 A TW100141992 A TW 100141992A TW 201246412 A TW201246412 A TW 201246412A
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Taiwan
Prior art keywords
cylindrical
substrate
flexible substrate
semiconductor wafer
package
Prior art date
Application number
TW100141992A
Other languages
English (en)
Inventor
Kang-Won Lee
Hyun-Joo Kim
Gyu-Jei Lee
Original Assignee
Hynix Semiconductor Inc
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Filing date
Publication date
Application filed by Hynix Semiconductor Inc filed Critical Hynix Semiconductor Inc
Publication of TW201246412A publication Critical patent/TW201246412A/zh

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    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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Description

201246412 六、發明說明： 【發明所屬之技#ί領域】 本發明係依據35 U.S.C 119(a)請求在2〇1〇年u月 19日對韓國智慧財產局所提出之韓國專利申請案第 1〇·2〇10-0115716號的優先權益，其在此全部併入如同完 整地敘述以作為參考。 70 本發明之例示具體實例係關於半導體封裝及其製造 方法，且更具體而言，係關於圓筒形封裝、含其之電子 裝置及其製造方法。 【先前技術】 半導體晶片在其中包括複數積體電路。然而半導體 晶片可能因外部物理及/或化學影響而易受損。因此半= 體晶片本身無法作為半導體最終產品。因而可使用各種 組裝方法將半導體晶片封裝。例如可將半導體晶片安裝 在基板（例如引線架或印刷電路板）上，且可將半導體 晶片電連接該基板。此外，可使用如環氧模塑化合物 (EMC)材料之材料將安裝在基板上之半導體晶片封裝， 以將半導體晶片隔離外部水分及/或外部汗染。 一些半導體封裝可設計成具有安裝在平坦基板上之 半導體晶片、及將該半導體晶片電連接該平坦基板之結 合电線（或凸塊），儘官半導體晶片會大幅扭曲。在此情 形會對半導體晶片及/或基板施加物理應力。然而隨資訊 工業發展急劇地加速，現在需要一些彎曲之電子產品。 因此未來可能越來越需要包括安裝在非平坦基板上的半 導體晶片之半導體封裝。 -3- 201246412 【發明内容】 些例示具體實例係關於適合用於彎曲電子產品之 圓筒形封裝。 °σ 其他之例示具體實例係關於製造用於彎曲電子產品 的圓筒形封裝之方法。 又其他之例示具體實例係關於具有該圓筒形封裝之 電子產品。 在一個例示具體實例中’該圓筒形封裝係包括其中 具有中空區域之圓筒形基板、及至少一個安裝在該圓筒 形基板的外圍上之半導體晶片。 該圓筒形基板可為撓性基板。 該圓琦形基板可包括至少一種聚對苯二曱酸乙二酯 (ΡΕΤ)、聚萘甲酸乙二酯（PEN)、聚醚砜（PES)、聚芳香酯 (PAR) '聚碳酸酯（pc)、環稀烴共聚物（c〇c)、聚苯乙烯 (Ps)、及聚醯亞胺（PI)。 該圓筒形封裝可進一步包括將至少一個半導體裝置 的晶片墊電連接該圓筒形基板的基板墊之結合電線。圓 筒形封裝可進一步包括在該圓筒形基板的外圍與至少一 個半導體晶片的底面之間的黏著劑。 該圓筒形封裝可進一步包括將至少一個半導體裝置 的晶片墊電連接該圓筒形基板的基板墊之互連部分。該 互連部分可包括金屬凸塊及焊料凸塊。該互連部分可包 括各向異性導電膜β 該圓筒形封裝可進一步包括覆蓋至少一個半導體晶 片之模塑材料。 -4 - 201246412 在另一個例示具體實例中，該電子產品係包括圓筒 形封裝，且該圓筒形封裝係包括其中具有中空區域之圓 筒形基板、及至少一個安裝在該圓筒形基板的外圍上之 半導體晶片。 該電子產品可進一步包括流經該圓筒形封裝的中空 區域之冷卻介質。 在又一個例示具體實例中，該方法係包括在具有第 一表面及與第一表面對立的第二表面之平坦撓性基板上 形成電路圖案，連接撓性基板兩端而形成圓筒形撓性基 板’及將至少一個半導體晶片安裝在該圓筒形撓性基板 的外圍上。 該撓性基板可包括至少一種聚對苯二曱酸乙二酯 (PET)、聚萘甲酸乙二酯（PEN)、聚醚硬（P£S)、聚芳香酯 (PAR)、聚碳酸酯（PC)、環烯烴共聚物（COC)、聚苯乙烯 (PS)、及聚醯亞胺（PI)。 連接該撓性基板兩端可包括使用黏著劑將該撓性基 板兩端結合。 連接該撓性基板兩端可包括使用熔化結合技術將該 撓性基板兩端結合。 該撓性基板兩端之一可具有凹模組態，且該撓性基 板兩端之另一端可具有凸模組態。 連接該撓性基板兩端可包括以結合帶包圍該撓性基 板兩端。 該方法可進一步包括在將至少一個半導體晶片安裝 在該圓筒形基板上之後，將該至少一個半導體晶片模 -5- 201246412 塑。該方法可進-步包括在將至少—個半導體晶片模塑 之後’切割該撓性基板而形成複數圓筒形封裝。 【實施方式】 以上及其他態樣、特點及其他優點由以上之詳細說 明結合附圖而明確地了解。 以下參考附圖而詳述例示具體實例。許多種不同形 式及具體實例為可行的而不悖離本揭示之精神及教示， 所以本揭示不應視為限於在此所述之具體實例。另外， 這些具體實例係提供以使本揭示完全而完整，且對熟悉 該技術領域之人士傳達本揭示之範圍。在圖式中，為了 明確而可能將層及區域之大小及相對大小誇大。其中同 樣之元件符號係指同樣之元件。 在此所使用的名詞「及/或」係包括一種以上之附帶 列出項目的任何及全部組合。 圖1為描述依照一個例示具體實例之圓筒形封裝的 橫切面圖。 參考圖1 ’依照一個例示具體實例之圓筒形封裝可 包括基板100、至少一個半導體晶片、及模塑構件300。 該至少一個半導體晶片可包括複數半導體晶片2〇〇、 202 、 204 、 206 、 208 、 210 、 212 、 & 214 ° 基板100可為其中具有中空區域Η之圓筒形基板。 如圖1所描述，基板100的橫切面可為圓形。然而基板 1 0 0的橫切面圖不限於圓形。例如在觀看橫切面圖時， 基板100可為橢圓形。基板1 〇〇應彎曲而使橫切面圖成 為封閉環形，如圓形或橢圓形。因此基板100可包括撓 -6- 201246412 性材料。例如基板1 〇〇可包括至少一種聚對苯二曱酸乙 二醋（PET)、聚萘曱酸乙二酯（pen)、聚醚颯（PES)、聚芳 香醋（PAR)、聚碳酸酯（PC)、環烯烴共聚物（COC)、聚苯 乙稀（PS)、及聚醯亞胺（PI)。然而基板1〇〇不限於以上之 材料。 ， 在另一個例示具體實例中，基板1 〇〇可包括彼此連 接之複數弧形次切面而組成橫切面圖為封閉環形之圓筒 形基板。在此情形，組成基板丨〇〇之各弧形次切面未必 為撓形材料。 如上所述，圓筒形封裝可包括複數半導體晶片200、 202 、 204 ' 206 、 208 、 210 、 212 、與 214 。然而為了易 於及便於解釋’以下僅以一個半導體晶片（例如半導體 晶片200 )揭述本發明之例示具體實例。半導體晶片2〇〇 可為半導體裝置，例如記憶體裝置、邏輯裝置、光電轉 化裝置、或動力裝置。該半導體裝置可包括至少一個被 動元件，例如至少一個電阻及/或至少一個電容。 其可在半導體晶片200的底面與基板1〇〇的一部分 外圍表面1 00a之間提供黏著劑i 5〇。黏著劑i 5〇可將半 導體晶片200固走於基板} 〇〇。此夕卜，其可將半導體晶 片200經由結合電線16〇而電連接基板1〇〇。即結合電 線160可將半導體晶片200之晶片塾（未示）電連㈣ 置於基板100的外圍表面100a上之基板墊1〇2。連接墊 104可配置於基板1〇〇的内圍表面l〇〇b上。連接墊1〇4 可用於將半導體晶4 200電連接另一電子產品。黏著劑 1 50可包括塗覆材料或雙面膠。然而黏著劑1 不限於 201246412 上列材料。將半導體晶片2〇〇固定於基板1〇〇之任何型 式黏著劑均可使用。 半導體晶片200可被模塑材料300覆蓋。模塑材料 3〇〇可將半導體晶片200隔離外部環境。模塑材料3〇〇 可為環氧模塑化合物（EMC)材料。 圖2為描述依照另一個例示具體實例之圓筒形封裝 的橫切面圖，及圖3A至3D為描述覆晶的互連部分之各 種實施例的橫切面圖。 參考圖2、3A、3B、3C、及3D，其可將複數半導體 晶片 200 、 202 、 204 、 206 、 208 、 210 、 212 、與 214 附 接基板1 00的外圍表面1 〇〇a。其可使用覆晶結合法將半 導體晶片200〜214安裝在外圍表面i〇〇a上。即可藉互連 部分400將各半導體晶片200〜2 14連接基板1〇〇。 互連部分400可包括金屬凸塊402，其將各半導體 晶片200〜214的晶片墊220電連接配置於基板1〇〇上的 基板塾102，如圖3A所描述。圓筒形封裝可進一步包括 填充半導體晶片200〜214與基板100之間的空間之下填 樹脂450。各金屬凸塊402可為單層凸塊或多層凸塊， 其係包括金（Au)、銀（Ag)、銅（Cu)、鋁（A1)、鎳（Ni)、鎢 (W)、鈦（Ti)、鉑（Pt)、鈀（Pd)、錫（Sn)、鉛（Pb)、鋅（Zn)、 銦（In)、鎘（Cd)、鉻（Cr)、與鉬（Mo)。各金屬凸塊402可 進一步包括導電有機材料。金屬凸塊402可使用無電鍍 法、電鍍法、蒸發法、或濺鍍法形成。各金屬凸塊402 可為金凸塊、金球凸塊或鎳凸塊。金凸塊可使用無電鍍 法或電鍍法形成。此外，金凸塊可使用凸塊下冶金術 -8- 201246412 (UBM)形成，其係由 Cr/Cu、Cr/Cu/Au、TiW/Au、或 Ti/Au 所形成。形成金球凸塊可包括使用引線接合機在各半導 體晶片200〜214的晶片墊220上形成球凸塊（例如金 球）。如此不必使用凸塊下冶金術（UBM)即可形成金球凸 塊。鎳凸塊可使用無電鍍法或電鍍法形成。 在一些具體實例中可在金屬凸塊402與基板墊1〇2 之間提供導電黏著劑4 0 4 ’如圖3 B所描述。導電黏著劑 404可改良金屬凸塊402與基板塾1〇2之間的黏著強度。 圓筒形封裝可進一步包括填充半導體晶片2〇〇〜214與基 板1 00之間的空間之下填樹脂450。 在一些具體實例中，各互連部分4〇〇可包括焊料凸 塊406、及將晶片墊220電連接基板墊1〇2之焊料4〇8 ’ 如圖3C所描述。圓筒形封裝可進一步包括填充半導體晶 片200〜214與基板1〇〇之間的空間之下填樹脂45〇。焊 料408可表示熔點等於或低於約攝氏45〇度之金屬合 金。焊料凸塊406可使用蒸發法、電鍍法或網版印刷I 形成’且可在焊料凸塊4〇6下方另外提供凸塊下冶金術 (UBM)。電鑛法可使用共晶焊料，且UBM彳包括欽-鶴 (TiW)合金。網版印刷法可對應經由模版遮罩形成焊料 (如 Pb/In/Ag 焊料、Sn/Pb/ln 焊料、或 Cu/Sb/Ag/Au 焊 料）之方法。網版印刷法可使用三種以上成分系統之益 鉛焊料。網版印刷法係具有方法簡單之優點。 在-些具體實例t，各互連部分·可包括金屬凸 塊410、及將晶片# 22。電連接基板墊⑽之各向里性 導電膜420’*圖扣所描述。金屬凸塊41〇可為單層凸 -9 - 201246412 塊或多層凸塊’其係包括金（An)、銀（Ag)、銅（cu)、在呂 (A1)、鎳（Ni)、鎢（W)、鈦（Ti)、鉑（Pt)、鈀（pd)、錫（Sn)、 鉛（Pb)、鋅（Zn)、銦（In)、錢（Cd)、鉻（Cr)、與鉬（M〇)。 各金屬凸塊410可進一步包括導電有機材料。金屬凸塊 410可使用無電鍍法、電嫂法、蒸發法、或濺鍍法形成。 各金屬凸塊410可為金凸塊、金球凸塊或鎳凸塊。各向 異性導電膜420可含有複數導電粒子42〇a。如果各向異 性導電膜420可被加熱及加壓，則金屬凸塊410可經由 導電粒子420a而電連接對應基板墊1〇2。導電粒子42〇& 可包括金屬粒子、塗有金屬之塑膠粒子、或塗有絕緣樹 脂之導電粒子。該金屬粒子可包括鎳粒子、焊料粒子或 銀粒子，且該塑膠粒子可包括碳粒子、聚苯乙烯粒子或 環氧樹脂粒子。然而該導電粒子不限於上列材料。各向 異性導電膜420可含有對各向異性導電膜42〇賦與黏著 性質之黏著劑。該黏著劑可包括至少一種熱塑性樹脂、 熱固性樹脂與紫外線可固化樹脂。該熱塑性樹脂可為聚 乙烯型樹脂或聚丙烯型樹脂，且該熱固性樹脂可包括環 氧型樹脂、聚胺基甲酸酯型樹脂或丙烯酸型樹脂。然而 該黏著劑不限於上列材料。 ★ 圖4A至4E為描述製造依照一個例示具體實例的圓 筒形封裝_之方法的圖式’及圖5A至5F為描述將撓性基 板兩端物理地彼此連接之方法之各種實施例的橫切面 圖。 參考圖4A’其可在基板1〇〇之中及之上形成例如穿 孔（未不）及導電墊的電路圖案。穿孔及導電墊可形成 -10- 201246412 以將半導體晶片電連接外部電子裝置。例如導電塾可包 括基板塾102及連接塾1〇4。基板墊1〇2可形成於基板 1〇〇的第一表面100a上，且可電連接配置於第一表面 100a上的半導體晶片，及連接墊ι〇4可形成於與第一表 面100a對立之基板1〇〇的第二表面i〇〇b上，且可電連 接外部電子裝置。基板1〇〇可由聚對苯二曱酸乙二醋 (PET)、聚萘甲酸乙二酯（PEN)、聚醚砜（pES)、聚芳香酯 (PAR)、聚碳酸酯（pc)、環烯烴共聚物（c〇C)、聚苯乙烯 (P S)、及聚醯亞胺（p I)之至少一種塑膠材料所形成。然而 基板1 0 0不限於上列塑膠材料。 參考圖4B及圖5A至5F，其可將圖4A所描述的平 坦基板100彎曲而將基板〗〇〇兩端（第一與第二端）物 理地彼此連接。結果平坦基板1 〇〇可變形成為其中具有 中空區域Η之圓筒形基板1〇〇。 在一些具體實例中，一端（例如第一端）1 0〇c與另 一端（例如第二端）1 〇〇d可使用黏著劑11 〇而物理地彼 此結合。此外，基板1 0 0兩端（例如第一與第二端）1 〇 〇 c 與100d可被結合帶112包圍而防止第一與第二端彼此脫 離（參考圖5A)。 在一些具體實例中，第一與第二端100c與l〇〇d可 彼此接觸’且可被加熱一段時間以將其物理地彼此連 接。即第一與第二端100c與I00d可彼此使用熔化結合 技術結合。在此情形可將第一與第二端100c與l〇〇d熔 化及彼此結合，因而在第一與第二端100c與10〇d之間 形成熔化結合界面1 〇〇e ^此外，熔化區114可鄰接熔化 201246412 結合界面l〇〇e(參考圖5B)而形成。熔化區ii4可對應 將鄰接第一與第二端100c與l00d的部分基板1〇〇熔化 及冷卻之區域。 在一些具體實例中，各第一與第二端100c與1〇〇d 可包括具有大表面積以增強第—與第二端l〇〇C與1〇〇d 之間的黏著強度之結構。例如第一端1 〇〇c可具有r L」 形橫切面且第二端l〇〇d可具有「Ί」形橫切面，如圖5C 所描述》第一與第二端l〇〇c與l〇〇d可藉配置於其間的 黏著劑11 0而物理地彼此結合。 在一些具體實例中，第一端100c可具有「L」形橫
切面且第二端l〇〇d可具有「1」形橫切面，如參考圖5C 所揭述。此外’第一與第二端100c與l〇〇d可使用參考 圖5B所揭述的熔化結合技術而物理地彼此結合。如此可 在第一與第二端l〇〇c與l〇〇d之間形成熔化結合界面 1〇〇e，且熔化區114可相鄰熔化結合界面1〇〇e而形成（參 考圖5D)。 在一些具體實例中，第一端100c可具有「L」形橫 切面且第二端l〇〇d可具有「Ί」形橫切面，如參考圖5c 所揭述》此外，第一與第二端l〇〇c與1〇〇d可使用固定 構件12 0而物理地彼此組合（參考圖5 e )。 在一些具體實例中，第一端100c可具有凹模組態且 第一端100d可具有凸模組態。或者第一端1〇〇c可具有 凸模組態且第二端1 0 0 d可具有凹模組態。其可將第一與 第一端1 00c與1 00d之一（具有凸模組態）插入另一（具 有凹模組態）之中而彼此組合。另外，第一與第二端1〇〇c -12- 201246412 與100d可使用固定構件12〇而更緊密地彼此組合（參考 圖 5F )。 在其他具體實例中，第一與第二端100c與l〇〇d之 結合方法可使用參考圖5A至5F所揭述的具體實例之組 合而實行。例如在將具有凸模與凹模組態之第一與第二 端100c與100d彼此組合之後，第一與第二端100c與 1 〇〇d可使用參考圖5B所揭述的熔化結合技術，使用參 考圖5A所揭述的結合帶112，及/或使用參考圖5E所揭 述的固定構件12〇而更緊密地結合。 參考圖4C，其可將至少一個半導體晶片，例如複數 半導體晶片 200 、 202 、 204 、 206 、 208 、 210 、 212 、與 214’安裝在圓筒形基板1〇〇的外圍表面i〇〇a上。其可 使用導線結合技術或覆晶結合技術將至少一個半導體晶 片女裝在外圍表面100&上。具體而言，其可在圓筒形基 板100之中空區域H裴設轉軸（未示），且可在圓筒形基 板100轉動時將至少—個半導體晶片安裝在圓筒形基板 100的外圍表面iOOah*者可不必轉動圓筒形基板 而使用轉動晶片安裝裝置將至少一個半導體晶片安裝在 圓筒形基板100的外園表面1〇〇a上。 夕一個半導體晶片可被覆蓋模
爹哼圖4D 料。該模塑材料可包括产β ^ 何针j匕括％軋樹脂。該模塑材料可進一 包括至少一種硬化劍、s 巧产邀谢日匕Hn及其他添加 川。衣氧樹知可包括至少一種 清漆型環氧基、f & + & ^ t + 衣氧基、酚糸酚醛 丞甲紛系盼酸清漆型環氧基 氧基、胺型環氧基、含雜 夕目此基％ 3雜％%氧基、經取代環氧基、蔡 201246412 酚型環氧基、及其衍生物。然 ^ 氧祕脂未必限於上列
材料。硬化劑可包括至少一 .工夕J 夕種胺硬化劑、酸酐硬化劑、 聚醯胺樹脂、聚硫樹脂、及酿樹 及酚树爿曰。然而硬化劑未必限 於上列材料。硬化加速劑·5ρ帛> # $ & 浏7用於將^氧樹脂與硬化劑之 間的硬化反應加速，且可佶用 J ^ .^使用任何將该硬化反應加速之 材料。例如硬化加速劑可兔眙彳μ人 Τ為妝化合物材料（例如三乙胺、 土-甲胺、α·曱基卞基二甲胺、或1，8-二氮雙環十一 ㈣十坐化合物材料（例如2_甲基咪唾、2_苯基咪唾、 ::2-苯基-4-甲基味唾）、或有機碟化合物材料（例如柳 、酚、三苯膦、三丁膦、三（對甲基苯基）膦、三苯 鱗二本基棚酸S旨、或四策敝四^其跏缺 本膦四本基硼酸酯）。然而硬化加 速劑未必限於上列材料。填料 a栝至少一種有機填料 及.、，、機填料。無機填料可包括至少一種滑石、砂、矽石 碳酸約、石英、玻璃纖維、石墨、氧化銘、氧化録、BaT103、 及膨土。有機填料可包括至少-種齡樹脂及脲甲酸。缺 而填料未必限於上列材料。該模塑材料可進—步包㈣ T膠（具有膠體相之矽石）及/或膨土型黏土填料，以對 環氧樹脂賦與搖變性f。其他之添加劑可包括著色劑（例 如有機染料或無機染料）、偶合劑及/或消泡劑。 ^參考圖4E’其可對包括所模塑的半導體晶片之圓筒 形基板施加分割程序。該分割程序係對應將包括所模塑 的半導體晶片之圓筒形基板分開成為複數圓筒形封裝
Pi、P2、P3、P4、與P5的切割程序。在僅將單一半導 體阳片安裝在圓筒形基板丨〇〇上之情況則可省略分割程 序。 。 -14- 201246412 依照圖4A至4E所描述的例示具體實例，至少一個 半導體晶片係在形成圓筒形基板1〇〇之後安裝在圓筒形 基板1 00上。然而本發明不限於圖4A至4E所播述的例 示具體實例。例如在將至少一個半導體晶片安裝在平坦 撓性基板1 00上之後可將平坦撓性基板1 〇〇彎曲，而形 成橫切面圖為封閉環形（如圓形或橢圓形）的圓筒形基 板 100。 圖6為描述包括依照一個例示具體實例之圓筒形封 裝之電子產品的正視圖’及圖7為沿圖6之線A-A，所取 的水平橫切面圖。 參考圖6及7 ’其可將電子模組5〇〇配置在依照一 個例示具體實例之圓筒形封裝的内部區域（例如中空區 域）。電子模組500可電連接該圓筒形封裝。電子模组 5〇〇中亦可具有中空區域’且冷卻介質600可流經電子 模組500的中空區域以將被加熱之圓筒形封裝及電子模 組5 0 0冷卻。由於先刖之具體實例已揭述圓筒形封裝， 所以以下省略圓筒形封裝之說明。冷卻介質6〇〇可包括 水，如去離手水（或蒸餾水）’或其他之冷卻劑。 依照上述之例示具體實例可提供圓筒形封裝以包括 圓琦形基板、及女裝在圓笱形基板的外圍上之至少一個 半導體晶片。如此即使半導體晶片扭曲，該圓筒形封裝 仍可承受半導體晶片之扭曲而降低半導體晶片與圓筒形 基板之機的物理應力。結果該圓筒形封裝可增加半導體 晶片之設計彈性’且可用於彎曲之電子產品。 以上已為了例證而揭示本發明之例示具體實例。熟 -15- 201246412 悉該技術領域之人士應 -5J- 4- /A _ 解，各種修改、添加及卷成达 可仃的，而不悖離如 及替代為 之範圍及精神。 附申請專利範圍所揭示的本發明 【圖式簡單說明】 圖1 橫切面圖 為描述依照 —個例示具體實例之圓 筒形封裝的 圖2為描站_ _^日g g 攸 <、、、另一個例示具體實例之圓筒形封裝 的橫切面圖； 圖3A至3D為描述覆晶的互連部分之各種實施例的 橫切面圖； 圖4A至4E為描述製造依照一個例示具體實例的圓 筒形封裝之方法的圖式； 圖5 A至5F為描述將換性基板兩端物理地彼此連接 之方法之各種實施例的橫切面圖； 圖6為描述包括依照/個例示具體實例之圓筒形封 裝之電子產品的正視圖；及 圖7為沿圖6之線a-A，所取的水平橫切面圖。 【主要元件符號說明】 100 100a 100b 100c 100d lOOe 圓筒形基板 外圍表面 内圍表面 第一端 第二端 熔化結合界面 基板墊 102 201246412 104 連接墊 no 黏著劑 112 結合帶 114 溶化區 150 黏著劑 160 結合電線 200 半導體晶片 202 半導體晶片 204 半導體晶片 206 半導體晶片 208 半導體晶片 210 半導體晶片 212 半導體晶片 214 半導體晶片 220 晶片塾 300 模塑構件 400 互連部分 402 金屬凸塊 404 導電黏著劑 406 焊料凸塊 408 焊料 410 金屬凸塊 420 各向異性導電膜 420a 導電粒子 450 下填樹脂 201246412 500 電 子 模 組 600 冷卻 介 質 Η 中 空 區 域 PI 圓 筒 形 封 裝 Ρ2 圓 筒 形 封 裝 Ρ3 圓 筒 形 封 裝 Ρ4 圓 筒 形 封 裝 Ρ5 圓 筒 形 封 裝 -18-

Claims (1)

  1. 201246412 七、申請專利範圍·· 1 · 一種圓筒形封裝，其係包含： 其中具有中空區域之圓筒形基板 至少一個安裝在該圓筒形基板以 體晶片。 2.如申請專利範圍第1項之圓筒形封裝 基板為换性基板。 3 ·如申請專利範圍第1項之圓筒形封裝 板係包括至少一種聚對苯二曱酸乙二 甲酸乙二酯（PEN)、聚醚石風（PES)、聚 聚碳酸酯（P C)、環烯烴共聚物（c 〇 c)、 及聚醯亞胺（PI)。 4. 如申請專利範圍第1項之圓筒形封裝 將至少一個半導體裝置的晶片墊電^ 的基板塾之結合電線。 5. 如申請專利範圍第4項之圓筒形封裝 在圓筒形基板的外圍與至少一個半专 之間的黏著劑。 6. 如申請專利範圍第1項之圓筒形封裝 將至少一個半導體裝置的晶片墊電i 的基板墊之互連部分。 7. 如申請專利範圍第6項之圓筒形封裳 分係包括金屬凸塊及焊料凸塊。 8 _如申凊專利範圍第6項之圓筒形封裝 分係包括各向異性導電膜。 ;及 丨外圍上之半導 ，其中該圓筒形 ，其中圓筒形基 酯（PET)、聚萘 芳香酯（PAR)、 聚笨乙烯（PS)、 ’其進一步包含 L接圓筒形基板 ’其進一步包含 卜體晶片的底面 ，其進一步包含 ^接圓筒形基板 其中该互連部 其中§玄互連部 -19- 201246412 9·如申請專利範圍第1項之圓筒形封裝，其進一步包含 覆蓋至少一個半導體晶片之模塑材料。 10· 一種電子產品，其係包含： 圓筒形封裝， 其中該圓筒形封裝係包含： 其中具有中空區域之圓筒形基板；及 至少一個安裝在該圓筒形基板的外圍上之 半導體晶片。 11.如申睛專利範圍第10項之電子產品，其進一步包含 流經圓筒形封裝的中空區域之冷卻介質。 1 2. —種製造圓筒形封裝之方法，該方法係包含： 在具有第一表面及與第一表面對立的第二表面 之平坦撓性基板上形成電路圖案； 連接撓性基板兩端而形成圓筒形撓性基板；及 將至少一個半導體晶片安裝在該圓筒形撓性基 板的外圍上。 1 3.如申請專利範圍第1 2項之方法，其中該撓性基板係 包括至少一種聚對苯二曱酸乙二酯（ΡΕτ)、聚萘甲酸 乙二醋（PEN)、聚醚砜（PES)、聚芳香酯（PAR)、聚碳 酸酯（PC)、環烯烴共聚物（C0C)、聚苯乙烯（PS)、及 聚醯亞胺（PI)。 1 4 _如申請專利範圍第12項之方法，其中連接該撓性基 板兩端係包括使用黏著劑將該撓性基板兩端結合。 1 5.如申請專利範圍第1 2項之方法，其中連接該撓性基 板兩端係包括使用熔化結合技術將該撓性基板兩端 -20- 201246412 結合。 1 6.如申請專利範圍第1 2項之方法，其中該撓性基板兩 端之一係具有凹模組態，且該撓性基板兩端之另一端 係具有凸模組態。 1 7.如申請專利範圍第12項之方法，其中連接該撓性基 板兩端係包括以結合帶包圍該撓性基板兩端。 18. 如申請專利範圍第12項之方法，其進一步包含在將 至少一個半導體晶片安裝在該圓筒形基板上之後，將 該至少一個半導體晶片模塑。 19. 如申請專利範圍第18項之方法，其進一步包含在將 至少一個半導體晶片模塑之後，切割該撓性基板而形 成複數圓筒形封裝。 -2 1 -
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