201229621 六、發明說明： 【發明所屬之技術領域】 理裝祕她吻之基板處 【先前技術】 近來’平面顯示H(FPD)之製造處理中，微影製程 不、^理号板(例如玻璃基板)大型化有利之光阻塗佈法，係^一^ =二τ嘴使光阻液連續地從細管流出至基板，-邊使二且喷嘴 作相對移動，也就是說糊帚描，而於 板上—塗::賴=，非~^ ====上=阻喷嘴之“ 噴嘴長邊方向為“之水平= 嘴本體形成横向延長或寻尺壯 ifJ了使塗佈效率提高，噴 a74ulTim^1' [專利文獻1]日本特開平10—156255 【發明内容】 <發明欲解決之問題> 嘖嘴置’僅需使長尺型的光阻 从上之位置偏離，光阻塗佈膜會 201229621 無法精確地完全進入基板上之設定塗佈區域’導致可能產生留白 區，無法充份地確保，或於設定塗佈區域内，膜厚均句性變得不 好等問題。 、先前以來，使基板於台座上定位並載置有一些方法。代表者 於設定載置位置翻設置複數根導引構件，使基板被導引到 σ座上之設定載置位置(落入）。然而，該方式的問題為，導引構件 的位置設定非常地難。也就是說，欲將基板精確地導引至於台座 設ί載置位置’只需將導引構件配置於使基板差—點還能通 =位=可’但是如果這师密，會絲板接駁到輸送機器人 茭難。因此，只好將導引構件配置於留下某程度之多餘空 板落人之位置，但是錄(職)愈大，雜基板接 反地，絲料座上之錄麟也會變大， 方二於水平方向來回直進移動之推動機構，將基板於χ 向從兩側夹入之方式定位之基板定位裝置也用於各 絲处止裝置。然而，該種習知之基板定位裝置難以應用於非 之光阻塗佈裝置。亦即，直進型之推動機構需要相當大 ^用二間’會造成台座關之大型化或複雑化 和長尺型光阻喷嘴用之掃描機構干擾等難點。对‘，、、去避免 處理ΐΐίίΐΐ習ί技術的問題點而成，目的為提供一種基板 二。裝置及基板讀裝置’能省空間且有效麵將被處理基板定 位被種__，其兼具導引及定 於台與能使被處理基板 <解決問題之方式> 載置其t發明之第1基板處理裝置為使被處理基板 載置於。^“基板施以既定處理’包括:支持部，支持前述 201229621 基板使其於水平x方向在前述台座上表面或上方移位；旋轉體，具 有鉛直方向之旋轉中心線；旋轉驅動部，使該旋轉體旋轉；抵接 ，，與前述旋轉體以一體方式旋轉，利用前述旋轉驅動部之旋轉 驅動力與前述基板側面抵接，以將前述基板往x方向推壓；旋轉型 推壓部，對應於前述旋轉體之旋轉角度，使前述抵接部位置在X 方向移動；及承擋部，將於X方向被前述旋轉型推壓部推壓的前述 基板承擋於相反側的固定位置。 、於上述第1基板處理裴置中，只要在旋轉型推壓部之抵接部退 避至原位置的狀態下，基板被載置或配置於旋轉型推壓部與承浐 部之間即可。其後，—旦旋轉型推壓部令旋轉軸部作動了使^ 轉體繞旋轉中心線旋轉，則旋轉型推壓部之抵接部會從原位置朝 向巧沿X方向移動或移位’抵接於基板緣或側面，而後維持此— ΐ態沿同Γ方向將基板推人觀定位置，基板的相反側由承擋部 =擋住。藉此，使基板被夾持於旋轉型推壓部與承擋部之間，而 完成X方向的定位。 —依上述第1基板處理裝置的一較佳態様為：於基板到達夹 ，轉型推壓部之抵接部與承擋狀_狀態，使旋轉型推壓部往 ΐΐ部ΐ移動停止。以該構成，不需要對夹持狀態之基板施以過 大或必要以上之壓力即可，故能保障基板安全。 吉古祕減，旋轉獅壓部之旋轉體具有用於在錯 向V引基板之往上端逐漸變細的錐形部。又，承擋部亦可呈 ，用於在純方向導引基板之往上端逐漸變細的錐形部。依外蠢 ΐ其2型推壓部之旋轉體或承擔部與基板之相對位置關係了能 使基板平祕紅’能綠地發揮旋倾雌板 y。 ㈣較佳祕，旋轉型推_之旋轉體具有大致為圓 可使旋轉型賴部之旋轉體進行偏心_運動二 t用低限度之佔# 推壓基板 作用於該情形，可於㈣體外周面形成抵接部。 201229621 或者’依照旋轉型推厥细^ 可對旋轉體作相=較佳態様，可於旋轉體上安裝 抵接部。該構成中，！件，而於該環狀構件外周面形成 其繞旋轉體作旋轉“ 件與基板抵接並推壓之際，使 接部位不固定於同^置減小。又’尚有能使與基板抵 _L. _ 罝而母次變化之優點。 旋轉^可具壓部之另一較佳態様，旋轉型推壓部之 成抿接橢圓之横剖面輪廓形狀，於旋轉體外周面形 離的情种，旋轉體中心軸可以與旋射心線—致，也 照旋㈣缝部之另—較佳祕，可為具有從旋轉 J二門之S’於該臂部前端設置抵接部。該構成會 綠轉體具圓形横剖面形狀，且其中心轴與旋 接觸ΐίϊΓΐ任意形狀或構造’但是為使與基板之 =摩捧減小，較佳為具有以中心軸作為旋轉中心之可 柱或圓筒狀旋轉體。 w圓 兄本發明之第2絲處理裝置，係使被處理基板載置於台座 則述基板施以既定處理，包括:支持部，支持前述基板使立於水平 X方向在前述台座上表面或上方移位；第丨旋轉體，具有錯直方向 之旋轉中心；第1旋轉驅動部，使該第丨旋轉體旋轉；第丨抵 與前述第1旋轉體以-體方式旋轉，利用前述第域轉驅動部 轉驅動力與前述基板側面抵接，而將前述基板往水平X方向推芦· 第1旋轉型推壓部，依照前述第1旋轉體之旋轉角度，使前述^^'接 部位置在X方向移動；第1承擋部，使於X方向被前述第i旋轉型 壓部推壓的前述基板於相反侧的一定位置被承擋住；第2旋轉體， 具有錯直方向之旋轉中心，第2$疋轉驅動部，使該第2旋轉體旋 弟2抵接部’與前述第2方疋轉體以一體方式旋轉，利用前述第2旋 驅動部之旋轉驅動力與前述基板側面抵接，以將前述基板往水 方向推壓；第2旋轉型推壓部，依照前述第2旋轉體^旋轉^产， 201229621 ^前述抵接部位置在前述γ方向移動；第2承擋部，使朝 =第2旋轉餘壓部推_前述基板於相反_—定位置被承 上述第2基板處理裝置中，可於 fti ίί 旋轉型推壓部與第1及第2承擋部之 f 轉型推壓部分別使第1及第2旋轉驅動部作 動，而使弟1及苐2旋轉體繞著各自的旋轉中心線旋 = £^ ^狀悲/〇該同一方向將基板推壓到既定位置， 從顧置往基板側以¥方向移動細立，而盘基 板緣或側面抵接’鱗持此—狀態沿朗方向將基板推既 方向被第1承财承播住’歡方向被第2承擔部承 部之門二^基^反夹持於第1及第2旋轉型推壓部與第1及第 2承拉狀間的狀_，完成X方向及γ方向的定位。 美杯板^理裝置巾’—較佳騎為，基板戦四角形， 接之弟1及第2邊分別與第1及第2抵接部抵接，盘基板 之第1邊相對的第3邊被第〗承擋部推壓，與基板 邊1 推㈣構成中，以基板之；線= 刀為旋轉支推壓σ卩與承擋部分2部分。該情形中，較佳 ΪΪΪ第設置2個第2旋轉型推壓部’以使第2抵接部與 i邊厂〉、在個位置抵接。藉此，將基板之一邊於2個位置 上加以推壓，使基板平行移動，能有效地進行定位。 之門二Ϊ據二，/圭態様，於基板夾持於第1抵接部與第1承擋部 if ϋ %拥減部使第1減敎前進鶴停止，於 部與第2承撐部之間之狀態，第2旋轉型推壓部 義停止。__，健為第1及第2旋轉型 隱肋雜基板之第1及第2抵接部的前進移動於大致^ 201229621 壓:該=基狀態的基板施力爾 持部:依Γ—ί交佳態様，將基板於較台座上表面高的位置以支 ίίίΐϋ 有可升降的複數支持銷’支持銷之銷前端部接觸 ίί:ί 支持基板大致呈水平。χ侧使支持 呈有面低的位置，以使基板載置於台座上表面。再者， 忒ΐίΓΐίίΙ銷與旋轉型推壓部及承擔部—起升降移動之 亦為較佳的。於該構成中，可將基板透過支持部或支持 置日„雨送裝置與台座間接駁，同時也可於基板載置於支持銷上之 位。又，也可在較台座上表面為高_位^，以 ㈣獅㈣躲轉進植蚊位，籍此， 以获ΐ*依較佳恶様，其構成可為於台座上表面具有固定部， 基ϊ。於該情形中’於基板從支持部之支持 工及附’ _麵壓部使抵接部魏義以鬆板。丁” 佈^之—紐減，係賴置於纟座上之基板上表面塗 二i阻，尤其是’使用長尺型塗佈噴嘴時，具 理之處』ii。。或者，本^亦翻於在台座上對基板施以熱處 被處板定位裝置_於使支持為可於水平方向移位之 ；^鐘疏二板在水平χ方向定位，包括:旋轉軸，於鉛直方向延伸； ί轉’，利:丄=2轉轴旋轉;抵接部，與前述旋轉軸以-體地 旋轉驅動狀旋轉麟力與前述基板側面抵接， 旋轉κ 向減；㈣獅壓部，對餘_旋轉軸之 前、成;2述抵接部位置朝x方向移動；承擋部，於x方向被 | I疋尘推壓部推壓之前述基板於相反側之一定位置被承擋 201229621 住 ^月之基板定位裝置關於基板之定位 基板處理裝置同樣的作用效果，而且可以適用3 發明之 板處理裝置或者基域魏置等。 ^於不❹台座之基 <發明之效果> 依照本發明之基板處理裝置及基板定位 間且有效率地將被處理基板加以定位 “ 而且 ’能以短時間有效率地將被處理基 基板之機能及定位機能_ ^ ..且τ以兼有導引被處理 板載置於台座及定位。 【實施方式】 以下，參照附圖，說明本發明之較佳實施形能。 料乍為明基板處理裝置之:構成例的塗佈 處理糸、洗。該塗佈顯影處理系統10被設置於 =”LCD基板作為被纽基板，於咖製造處理 =之π洗、光阻塗佈、預烘、顯影及後料 者。1 光12置於與該處餘统相鄰之外部的曝串曝 卡Ε站(C/S)14為系統10之卡g送入/送出埠，包括 "^層重4之方式收納複數片之卡® #L、ri二(例如Y方向)最多並列4個而載置；及，輸送機構22， 座2G上之卡虹進出。輸補構22具有能保持 基板G之裝置，例如運送臂22a，能於χ、γ、z、0之4個轴動作， 使基板G接駁至鄰接之處理站(p/s)16側。 —於處理站(P/S)16上’各處理部依處理流程或餘順序配置於 沿者糸統長邊方向（X方向)平行且反向之—對線A、虹。更詳細 地說，於從切站(C/S)_朝向界面站㈣18側之上游部的處理線 10 201229621 A上，以橫向一列配置清洗處理部24、第1熱處理部26、塗佈處理 部28及第2熱處理部30。另一方面，從界面站⑽)18侧朝向卡匣站 (C/S) 14側之下游部的處理線B上，以橫向一列配置第2熱處理部 30、顯影處理部32、脱色處理部34及第3熱處理部36。於該線形態 中，第2熱處理部30位於上游側之處理線a的最後尾部且位於下游 側之處理線B之前端，跨越兩線a、B間。 於兩處理線A、B之間設有輔助輸送空間38，可使將基板 片為單位水平載置之穿梭裝置(shuttle) 40藉由驅動機構(未圖示)於 線方向（X方向)雙向移動。 、 一於上游部之處理線A，清洗處理部24包含刷子(scrabble)清洗單 元(SCR)42，與該擦磨清洗單元(SCR)42内之卡匣站(c/s)14鄰接之 位置配置有準分子UV照射單元(e—υγχΐ。擦磨清洗單元(scr)42 ^之清洗部能絲板G-賴纟雜輸送或輸送帶輸送，使以 線A方向輸送，-邊對基板G之上表面(被處理面)施以刷洗 與清洗處理部24之下游側鄰接之第丨熱處理部26中，於 理線A之中，設有長型的輸送機構46， ^ = 複數片葉式料單元與基板接驳騎過 少曰且層配置所構成之多層單元部或者烘烤塔(tb)44,48。 晶如圖入I示，於上游側之供烤塔(ΤΒ)44，由下而上，依序重 瓦·基板达入用之通過單元(PASS )5〇、 室 Μ ’及_單元_6。在此，通 =1，/使來自_f洗單樣寧之清输 田^ ,、、、處理部26内。下游側之烘烤塔(ΤΒ)48中 广201229621 VI. Description of the invention: [Technical field of invention] The substrate of her kiss secret [previous technique] Recently, in the manufacturing process of 'flat display H (FPD), the lithography process is not the same as the plate (for example, glass) Substrate) Large-scale advantageous photoresist coating method, which is to make the photoresist liquid continuously flow out from the thin tube to the substrate, and to make the nozzle move relative to each other, that is, paste the paste, and On the plate - coating:: Lai =, non ~ ^ = = = = upper = resistance nozzle "the direction of the long side of the nozzle is "the level = the mouth body is formed laterally extended or the ruler is strong if the coating efficiency is improved, spray [Annex 1] [Japanese Patent Laid-Open Publication No. Hei 10-156255] [Invention] [Problems to be solved by the invention] The "nozzle" requires only the long-length resist to be deviated from the upper position, and the photoresist is coated. The cloth film 201229621 cannot accurately enter the set coating area on the substrate completely, resulting in a problem that a white space may be generated, it may not be sufficiently ensured, or the film thickness may become poor in the set coating area. Previously, some methods have been used to position and mount the substrate on the pedestal. The representative flips a plurality of guiding members at the set placement position so that the substrate is guided to the set placement position (falling in) on the σ seat. However, the problem with this method is that the position setting of the guiding member is extremely difficult. That is to say, the substrate should be accurately guided to the pedestal setting position 'only need to arrange the guiding member so that the substrate is poor - the point can still pass = bit = can be' but if this is secret, the wire board will be connected Refused to transport robots. Therefore, the guiding member has to be placed in a position where a certain amount of excess empty board is left, but the larger the recording (job), the miscellaneous substrate is reversed, and the recording on the silk seat will become larger. A substrate positioning device that positions the substrate in a horizontal direction and moves the substrate in a direction in which the substrate is sandwiched from both sides is also used for each wire stop device. However, such a conventional substrate positioning device is difficult to apply to a non-resistive coating device. That is to say, the driving mechanism of the straight-through type needs to be quite large. The difficulty of using two of the two sides may cause the large-scale or re-destruction of the pedestal and the scanning mechanism for the long-length photoresist nozzle. The problem of ‘,,, to avoid processing ΐΐίίΐΐ , technology is to provide a substrate 2. The device and the substrate reading device can save space and the effective surface positions the substrate to be processed, which is both steerable and fixed, and can be processed on the substrate and the substrate to be processed <solving the problem> The first substrate processing apparatus is placed on the substrate to be processed. ^ "Substrate applied to a predetermined process" includes: a support portion supporting the aforementioned 201229621 substrate to be displaced in the horizontal x direction on the upper surface or above the pedestal; the rotating body having a vertical rotation center line; and a rotary driving portion Rotating body rotates; abuts, rotates integrally with the rotating body, and abuts against a side surface of the substrate by a rotational driving force of the rotation driving unit to press the substrate in the x direction; and a rotary pressing portion corresponds to The position of the abutting portion is moved in the X direction at a rotation angle of the rotating body, and the receiving portion is supported by the substrate that is pressed by the rotary pressing portion in the X direction at a fixed position on the opposite side. In the first substrate processing apparatus, the substrate may be placed or disposed between the rotary pressing portion and the bearing portion in a state where the abutting portion of the rotary pressing portion is retracted to the original position. Thereafter, when the rotary pressing portion causes the rotating shaft portion to actuate to rotate the rotating body about the rotation center line, the abutting portion of the rotary pressing portion moves or shifts from the original position toward the X direction. Abut At the edge or side of the substrate, and then maintaining the state, the substrate is pushed to the position in the same direction, and the opposite side of the substrate is blocked by the bearing portion. Thereby, the substrate is clamped to the rotary pressing portion. Between the receiving portions, the positioning in the X direction is completed. - According to a preferred embodiment of the first substrate processing apparatus, the substrate reaches the clip, and the abutting portion of the transformation pressing portion and the bearing state are rotated. The pressing portion of the pressing portion stops moving toward the jaw portion. With this configuration, it is not necessary to apply an excessively large or more pressure to the substrate in the clamped state, so that the safety of the substrate can be ensured. The rotating body has a tapered portion for tapering at the upper end of the wrong V-lead substrate. Further, the receiving portion may be a tapered portion for tapping the upper end of the substrate in the pure direction. In addition, the relative position of the rotating body or the bearing part of the 2 type pressing part and the substrate can make the substrate flat and red, and the green body can be rotated to the female board y. (4) The preferred secret, the rotary type push The body has a substantially circular shape to make the rotating body of the rotating type eccentricity eccentric t is used to push the substrate in the lower limit. In this case, the abutting portion can be formed on the outer surface of the body. 201229621 or 'Turning the rotating body according to the rotary type can be used for the rotating body=normal state, can be rotated The abutting portion is attached to the body. In this configuration, the outer peripheral surface of the annular member is formed so as to rotate against the rotating body, and the connecting portion is not fixed to the same position. Reduced. In addition, there is an advantage that the substrate can be changed to _L. _ 罝 and the mother is changed. Another preferred state of the rotary pressing portion is that the rotating pressing portion is connected to the cross-sectional contour shape of the ellipse, and the central axis of the rotating body is separated from the rotating core. In other words, it is also possible to provide abutting portion at the front end of the arm portion from the S' of the second door of the rotating J. The structure has a circular cross-sectional shape, and its central axis and the spiral contact ϊΓΐ ϊΓΐ any shape or configuration 'but to reduce the thickness of the substrate, preferably with the central axis as the center of rotation Column or cylindrical rotating body. In the second wire processing apparatus of the present invention, the substrate to be processed is placed on the pedestal, and the substrate is subjected to predetermined processing, and includes a support portion that supports the substrate so as to stand on the upper surface or above the pedestal in the horizontal X direction. Shifting; the second rotating body has a rotation center in a wrong direction; the first rotation driving unit rotates the second rotating body; and the first rotation and the first rotating body are rotated in a body manner, and the first domain is rotated. The driving portion driving force is in contact with the side surface of the substrate, and the substrate is pushed in the horizontal X direction by the first rotating type pressing portion, and the position of the connecting portion is set according to the rotation angle of the first rotating body. Moving in the X direction; the first receiving portion receives the substrate pressed by the ith rotary pressing portion in the X direction at a predetermined position on the opposite side; and the second rotating body has a rotation center in the wrong direction. The second twirling drive unit rotates the second rotator 2 abutting portion 'and the second yoke body integrally, and the rotational driving force of the second rotator portion abuts against the side surface of the substrate Connected to push the substrate toward the water The second rotary type pressing portion is rotated in accordance with the second rotating body, 201229621, wherein the abutting portion position moves in the γ direction, and the second receiving portion pushes the second rotating residual pressure portion. The substrate is placed in the second substrate processing apparatus at the opposite position, and the first and second rotations can be respectively performed on the fti фί-type pressing portion and the first and second receiving portions. The driving portion is actuated, and the rotations of the brothers 1 and 2 are rotated around the respective center axes of rotation; the shape of the substrate is pressed to the predetermined position, and the substrate is moved toward the substrate side in the direction of the ¥ It is erected, and the edge of the disk substrate or the side abuts the 'scales'. This state pushes the substrate in the direction of the lang, and the direction is the first to bear the stagnation of the first squad. The first and second rotary type pressing portions are sandwiched between the first and second tensile members, and the positioning in the X direction and the γ direction is completed. The beauty cup plate handle device--the preferred ride is the base plate 戦 quadrangular shape, and the first and second sides are respectively abutted against the first and second abutting portions, and the third side of the first side of the disk substrate is opposite It is pressed by the first receiving portion, and is formed by pushing the substrate side 1 (4) with the substrate; the line = the knife is the rotating support σ 卩 and the receiving portion 2 portion. In this case, it is preferable that the two second rotary type pressing portions are provided so that the second abutting portions are in contact with each other at the respective positions. Thereby, one of the substrates is pressed at two positions to move the substrates in parallel, and the positioning can be performed efficiently. According to the second, the second state, the second holding part is clamped to the first abutting portion and the first receiving portion if ϋ % 拥 部 使 第 第 第 鹤 , , , , , , , , , , , , , , , 于In the state between the two, the second rotary type pressing portion is stopped. __, the first and second abutting portions of the first and second rotating type ribbed substrates are moved forward at substantially ^ 201229621 Pressure: the substrate in the base state is applied to the base: In the best condition, the substrate is placed at a position higher than the upper surface of the pedestal. The support pin of the support pin is supported by the front end of the pin. The support substrate is substantially horizontal. The side of the crucible is placed in a low-profile position so that the substrate is placed on the upper surface of the pedestal. Further, it is preferable that the 忒ΐίΓΐίί pin and the rotary type pressing portion and the bearer portion are lifted and moved. In this configuration, the substrate can be indirectly connected by the support portion or the support device, and the substrate can be placed on the support pin. Alternatively, the substrate can be placed on the upper surface of the support. _ bit ^, to (4) lion (four) hide into the mosquito bit, by this, in order to obtain ΐ * according to better sputum, the composition can be on the upper surface of the pedestal has a fixed portion, the base. In this case 'on the substrate From the support staff of the support department and the ' _ surface pressure part to make the abutment part of Wei Yi to loose board. Ding" cloth ^ - New subtraction, is based on the upper surface of the substrate placed on the squat block, especially 'When using a long-length coating nozzle, it is reasonable. ii. . Alternatively, the present is also turned over to the pedestal to apply a heat to the substrate to be positioned on the pedestal _ so that the support can be displaced in the horizontal direction; the clock slab is positioned in the horizontal , direction, including: the rotating shaft, Extending in the vertical direction; ί turning ', profit: 丄 = 2 rotation of the shaft; the abutting portion, and the rotating shaft is rotated in a body-like manner to abut the side surface of the substrate, and the rotation κ is reduced; (4) the lion The pressing portion is moved before the rotation axis, and the position of the abutting portion is moved in the x direction. The receiving portion is pressed by the |I dust pressing portion in the x direction at a certain position on the opposite side. It is possible to apply the same effect of the substrate positioning device of the present invention to the positioning substrate processing device of the substrate in the 201229621, and it is also possible to apply the plate processing device of the invention or the base field. ^Based on the pedestal<Effect of the invention> The substrate processing apparatus and the substrate positioning according to the present invention can efficiently position the substrate to be processed "and" can efficiently process the substrate to be processed in a short time. The function and positioning function _ ^ .. and τ are guided by the processing board placed on the pedestal and positioning. [Embodiment] Hereinafter, the preferred embodiment of the present invention will be described with reference to the accompanying drawings. The plate processing apparatus is a coating treatment 糸 and washing of a configuration example. The coating development processing system 10 is provided on the "LCD substrate as a susceptor substrate, and is subjected to π washing, photoresist coating, and pre-baking. , development and after-feeders. 1 The light 12 is placed on the outside of the adjacent exposed line exposure station (C/S) 14 for the card 10 of the system 10 to be sent/sent 埠, including the "^ layer weight 4 way to accommodate the plural The card card® #L, ri2 (for example, the Y direction) is placed in a maximum of four and placed; and the transport mechanism 22, the card on the seat 2G, enters and exits. The input structure 22 has means for holding the substrate G, for example, the transport arm 22a, and can be operated on four axes of χ, γ, z, 0, and the substrate G is connected to the adjacent processing station (p/s) 16 side. - On the processing station (P/S) 16, each processing unit is arranged in parallel with the direction of the long side (X direction) along the processing flow or in the order of the line A and the rainbow. More specifically, the cleaning processing unit 24, the first heat treatment unit 26, and the coating processing unit are disposed in a row in the horizontal direction on the processing line 10 201229621 A from the cutting station (C/S)_ toward the upstream side of the interface station (four) 18 side. 28 and the second heat treatment unit 30. On the other hand, the second heat treatment unit 30, the development processing unit 32, and the decoloring processing unit 34 are arranged in a row in the horizontal direction from the interface station (10)) 18 side toward the processing line B on the downstream side of the cassette station (C/S) 14 side. And the third heat treatment unit 36. In the line form, the second heat treatment portion 30 is located at the rearmost end of the processing line a on the upstream side and at the front end of the processing line B on the downstream side, spanning between the two lines a and B. An auxiliary conveying space 38 is provided between the two processing lines A and B, so that the shuttle 40 which is placed horizontally on the substrate piece can be bidirectional in the line direction (X direction) by a driving mechanism (not shown). mobile. The cleaning processing unit 24 includes a scrabble cleaning unit (SCR) 42 adjacent to the cassette station (c/s) 14 in the scrub cleaning unit (SCR) 42. It is equipped with an excimer UV irradiation unit (e-υγχΐ. The cleaning and cleaning unit (scr) 42^ can be transported by the cleaning unit or the conveyor belt, so that it can be transported in the direction of the line A, and the side is opposite to the substrate G. The upper surface (the surface to be treated) is applied to the second heat treatment portion 26 adjacent to the downstream side of the cleaning processing unit 24, and the long conveying mechanism 46 is provided in the management line A, ^ = a plurality of leaf types The material unit and the substrate are connected to a multi-layer unit or a baking tower (tb) 44, 48 which is composed of a layer arrangement and a layer arrangement. The crystal is shown in Fig. 1, and the grilling tower (ΤΒ) 44 is provided on the upstream side. On the other hand, the pass-through unit (PASS) 5〇, the chamber Μ ' and the _ unit _6 are sequentially used for the substrate and the substrate. Here, the pass = 1, / the _f wash single sample ^ , , , , and processing unit 26 . The downstream side of the baking tower (ΤΒ) 48 wide
SiSf t用之通過單元(PASSr)60、基板溫度調整Ϊ (C〇L)62、64，及黏附單元(AD)66。在此，通過置ϋ部早兀 供空間、’以使於第1熱處理部26經過所欲熱處理^^SSf〇提 游側之塗佈處理部28。 、、 土板G送出到下 可沿著在錯直方向 圖2中，輸送機構46具有：升降輸送體7〇， 201229621 延伸之導引執道68升降移動；迴旋輪麟 70上於Θ方向旋轉或迴旋；運送臂钱二丨可在该升降輸送體 上-邊支持基板G，-邊於前後於r旋輸送體72 體7〇加以升降麟之驅動部76設於垂直^丨=於將升降輪送 於將域錄賴咖崎_動之 70 ’用於將運送臂74加以進退驅動之驅動_安裝 72。各驅動部76、78、80例如可由電動馬達等構成。、月〜_ ，上述構成之輸送機構46能於高速升㈣ 於兩鄰之烘烤塔(TB)44、48中任意的單元，士 $而接近 助輸送空間38侧之穿梭裝置40。 b、土板G接駁至辅 與第處理部26之下游_接之塗佈處理⑽， 示’沿著處理線A以-列配置細塗佈單元( (VD)84。塗佈處理部之構成於後會詳細説明。咸遠知早兀 與塗佈處理部28之下游側鄰接的第2熱處理部3〇與上 敎 處理部26具有相同的構造’於兩處理線A、B之間設有長型的輸& 機構90 ’於處理線A側(最後尾部)設有其中之一的洪烤塔(ΤΒ)δ8， 於處理線Β側(前端)設有另一個烘烤塔(ΤΒ)92。 刊圖示中雖然省略，例如，可於處理線Α側之烘烤塔(ΤΒ)88，在 最下層配置基板送入用之通過單元(PASSl)，於該通過單元之上將 預烘用之加熱單元(PREBAKE)例如重疊3層。又，可於處理線识則 之烘烤f(TB)92的最下層配置基板送出用之通過單元(PASSr)，於 該通過單元上重疊例如1層基板溫度調整用之冷卻單元(COL)，再 於該冷卻單元之上重豐2層例如預烘用之加熱單元(pr^bakE)。 弟2熱處理部3〇中之輸送機構9〇不僅透過兩洪烤塔(TB)gg、92 各自的通過單元(PASSL)、（PASSR)，能將基板G以1片為單位接驳 至塗佈處理部28及顯影處理部32，亦能將基板G以1片為單位接驳 至輔助輸送空間38内之穿梭裝置40或後述界面站(I/F)18。 ^下游部之處理線B中，顯影處理部32包含一邊將基板G以水平 安勢輸送’一邊進行一連串顯影處理製程之所謂平流方式的顯影 12 201229621 單元(DEV)94。 於顯影處理部32之下游側夾持著脱色處理部34配置有第3熱 處理部36。脱色處理部34包括i線UV照射單元(i—uv)96，用以對 基板G之被處理面照射i線(波長365nm)而進行脱色處理。 第3熱處理部36具有與上述第1熱處理部26或第2熱處理部3〇 相同的構成，沿著處理線B設有長型之輸送機構及在該輸送機 構100前後之兩侧的一對烘烤塔(TB)98、1〇2。 圖示中雖然省略’例如，可於上游側之烘烤塔(TB)98的最下 層配置基巧送入用之通過單元(PASSl)，於該通過單元之上將後烘 用之加熱單元(POBAKE)例如重疊3層。又，可於下游側之烘烤塔 (TB)102的最下層配置後烘(pobAKE)單元，於該後烘烤單元上重 疊1層基板通過•冷卻單元(PASSRCOL)，再於其上重疊2層例如後 烘用之加熱單元(POBAKE)。. 第3熱處理部36中之輸送機構100透過兩多層單元部 (TB)98、102之通過單元(PASSl)及通過•冷卻單元(PASSr · c〇L)e, 不僅能將基板G以1片為單位分別接驳至丨線^^照射單元(丨—Μ)% 及卡匣站(C/S)14，而且能將基板Gal片為單位接駁至 間38内之穿梭裝置40。 、、，界面站(M018具有與鄰接之曝光裝置12進行基板〇交換之輸 送裝置104，於其周圍配置緩衝•台座(BUF)1〇6、延伸•冷卻△ (EXT · COL)108及周邊裝置11〇。缓衝·台座㈣p)1〇6上設有定 型之缓衝卡E(未圖）。延伸•冷卻台座(ext.col)1〇8為具有A 機此之基板接駁用台座’於將基板G交換至處理站(p/s)_ 用。周邊裝置110例如可為將字幕產生器(TITLER)與 (EE)上下重疊之構成。輸送裝置刚具有能保持基板置，、 如運送臂104a，能將基板G接駁至鄰接之曝光裝置12 (BUP)l〇6、（EXT · COL)108、（TITLER/EE)ll〇。 一 ° 圖3顯示該塗佈顯影處理系統中處理的步驟。首 (C/S)14中，輸送機構22從台座20上任一_^匣C之中取出j片其板 13 201229621 G，送入處理站(p/s)l6之清洗處理部24之準分子uv照射單元(e — UV)41(步驟SJ。 於準刀子UVA?、射單元(e—UV)41内，基板G藉由紫外線照射被 施以乾式清洗(步驟S2)。該紫外線清洗主要除去基板表面之有機 物。紫外線清洗結束後，基板G藉由卡匣站(c/s)l4之輸送機構22 i 往清洗處理部24之擦磨清洗單元(SCR)42移動。 於擦磨清洗單元(SCR)42，如上所述之方式，藉由將基板〇以 滾輪輸送或輸送帶輸送，一邊以水平姿勢對於處理線A方向平流輸 送，一邊將基板G之上表面(被處理面)刷洗或吹洗，從基板表 去粒子狀之污染(步驟S3)。然後，於清洗後，亦將基板G一邊以平 流輸送，一邊施以沖洗處理，最後使用氣刀等使基板G乾燥。 方;擦磨清洗单元(SCR)42内清洗處理好的基板g以平流方式送 入第1熱處理部26之上游側烘烤塔(TB)44内的通過單元 於第1熱處理部26中，基板G藉由輸送機構46以既定順序 1 皮依 序轉運到既定之烤箱單元。例如，基板G先從通過單元(pass〇5〇 移動加熱單元(DHP)52、54之一，於此處接受脱水處理(步驟S4)。 其次，基板G被移到冷卻單元(C〇L)62、64之一，於此處冷卻至一 定的基板溫度(步驟SO。之後，基板G被移到黏附單元(AD)56，於 此接受疏水化處理(步驟S0)。該輸水化處理結束後，基板G 單元(咖)62、64之-冷卻至-定之基板溫度(步驟S7)。最後1 板G破移往下游侧烘烤塔(TB)48内之通過單元(PASSr)6〇。 如上，於第1熱處理部26内，基板G透過輸送機構46，能於上 游侧之多層烘烤塔(TB)44與下游側之烘烤塔(TB)48之間任音來 去。又’第2及第3熱處理部30、36中，也進行相同的基板輸&動 作。 於第1熱處理部26接受如上述一連串熱或熱系處理的基板G， 從下游側烘烤塔(TB)48内之通過單元(PASSr)6〇移動到塗佈處 部28之光阻塗佈單元(CT)82。 於光阻塗佈單元(CT)82中，基板G，如後述，藉由使用長尺型 14 201229621 ，阻嘴之雜轉練基板上絲(被纽面)缝佈細液。接 Ϊ處ΐΪΕ游錄赚乾鮮元(卿4，接钱壓方式之乾 、t、、,接又如上述光阻塗佈處理之基板G，從減壓乾燥單元(VD)84 被廷入相鄰之第2熱處理部3〇的上游側烘烤塔(tb)88内的通過單 凡(PASSl)。 =第2熱處理部30内，基板G藉由輸送機構9〇以既定順序依序 ΐί多Ϊ至既定的單元。例如，基板骑初由通過單元(pASSL)被送 ^加熱單元〇>趣屬如個，於該處接受預烘之加熱處理(步驟 =)。接考，基板G被移到冷卻單元(C0L)iH|i]，於該處冷卻至一 疋的基ί溫度(步驟SlQ)。之後，基板G經由下游側烘烤塔(TB)92側 之通過單元(passr)，或者不經由而被接驳至界面站(Ι/Ρ)18側之延 伸•冷卻台座(EXT · COLOUR。 、於界面站(I/F)18中，基板G從延伸•冷卻台座(Εχτ · c〇Ln〇8 巧送入周輕置110之聽曝絲置(EE) , _處接錢以於顯影 %除去附著錄板G之周邊部的光阻轉光，之後，制相鄰 光裝置12(步驟s„)。 、/於曝光裝置12巾’基板G_L之光阻上既定之電關案被曝光。 然後，圖案曝光結束之基板G當從曝光裝置12返回界面站(ι/ρ)ΐ8 (步驟sn)，首先被送入周邊裝置110之字幕產生器(TITLER)，於該 處在基板上既定之部位上既定之資訊被記入(步驟s〗2)。之後，^ 板G返回延伸•冷卻台座(ΕΧΤ · c〇L)l〇8。界面站(1/]?)18中，基& G之輸送及與曝光裝置12進行基板(3之交換係藉由輸送裝置 行。 …於處理站(P/S)16，第2熱處理部30中之輸送機構9〇藉由延伸· 冷卻α座(EXT · COL)108接過曝光好的基板〇，透過處理線jg側之 烘烤塔(TB)92内之通過單元(PASSr)接駁到顯影處理部％ :、 於顯影處理部32，從該烘烤塔(TB)92内之通過單元接 過來的基板G被送入顯影單元(DEV)94。於顯影單元(DEV)94$， 201229621 i板理線B之下游而以平流方式被輸送，於輸送之中，顯 办冲洗、乾祕-連串顯影處理製程被進行(步驟 理：;接受顯影處理之基板G往下游側鄰之脱色處 二於鱗藉由遞騎以接受脱色處理 (步驟Sh)。脱色處理好的基板〇被送入第3熱處理 烤塔(TB)98内的通過單元(PASSQ。 ' 〃 ^於fp3jf理部36中，基板G最初從該通過單元_SL)移到加 熱巧卿^广個，於該處接受後供的加熱處^步匕 人，基板被移到下游側烘烤塔(ΤΒ)Κ)2内之通過冷卻單元 =SSR · COL) ’於該處冷卻至既定的基板溫度(步驟。於 …處理部36之中’基板G之輪送藉由輸送機構1〇〇進行。 罝- 站，14側’輸送機構22從第3熱處理部36之通過冷卻 早兀(PASSR · COL)接過塗佈顯影處理之所有製 ^部 並將接過來的基板G收納於台細上之任—個卡’ 28之光阻塗佈單元(CT)82。以下，參照圖 於光阻塗佈單元(CT)82之實施形態加以説明。体發月適用 圖4顯示光阻塗佈單元(CT)82内之主要構成 一 ϊτ)!ί内設有:定置型台座112，用以使基板〇水平地載置^保持? =佈免理部116，用以對該載置於台座i 12上之 表面被 處理面)使用長尺型光阻喷仙4以非旋轉法塗佈光阻液。表面(破 塗佈處理部116具有:光崎供給部118，包含光 描部〒〇，使該光阻喷嘴m於台座m之上方在又方向7平;4動知 也就疋使其掃描’·及’喷嘴升降機構122 嘴114之高度位置。 又次捫即先阻贺 一於光阻液供給部118令，光阻喷嘴114具有狹縫狀之流 ίί主座112ΐ之基舶從―端至另—端為止覆蓋住之 長度在I方向^伸’亚且連接於來自光阻液供給源(未圖示)之来阳 液供給管124。掃描部12〇具有:支持體126，其為將光阻喷嘴叫水 16 201229621 子狀(門形）；及掃描驅動部128 ’其使該支持雕126 媒/ L又向直線移動。該掃描驅動部128也可使用滾珠螺^機 122^^ 0 J田轉螺域構所構成，不僅能調節光 置而使噴嘴下端部之流出σ與台座112 =之问= 理面)間的距離間隔，亦即缺口，之大^^上表面=處 也能使光阻喷嘴m立即上升或下降移動。彳〜'地从或调整’ ，夫ΐ布^^i ί6 ’於基板G被載置於台座112上之期間接受控制 ϊίί斷之ί式，—邊使光阻噴嘴114藉由掃描部i2Q以一定白ί速 座;給部118中之光阻喷嘴114的狹縫狀流出 #先3匕Λ之上表面以往γ方向延伸之带狀流出流提 供光阻液。此日守，從流出口滿出到基板0上 向往前進或水平移動，在光阻噴嘴 而 上對應缺口以一定的膜厚形成光阻液之塗佈膜 定的15顯示該實施職之巾，於台座112上進行基板g之固 定位的=i進灯基板0之升降支持的升降支持部及進行基板此 疋位的基板疋位部(旋轉型推壓部、承擋部)的構成。 定mmi2上’載置四角形之基板⑽位置(四角形區域)呀皮設 =有夕定的載置位置e之内側，分別以一定的間隔或密度 ί 附口130及升降銷132。該真空吸附口 130用於使 ίΐηΐ吸附力蚊在台座112上之固㈣的；而該升降銷m 糸為用以使基板⑽水平姿勢上升下降之升降支持部邮）。 真空吸附口 130，如圖6及圖7所示，透過形成台座m内部之 式:，，路134連通於外部配管或真空管136。該真空扣績真空果 或賀射裝置等真空源(未圖示)相通。 ' 升降銷132如圖6及圖7所示，以可升降移動之方式插入於台座 17 201229621 112上形成之貫通孔138，鎖前端可以突出至台座112之上方， 之中。升降銷132之下端部固定於水平的升降 σ ，升降台140透過升降驅動軸142與升降驅動部144处人。弁 氣汽叙或電動馬達等作為驅動源，^驅: σ MG使全部的升關132_或—觀升降移動，可 於任思南度位置停止或者固定。 署F夕如圖8所示，於台座112之角隅部，在接近設定的載置位 處設有構成基板定位部之複數根(例如8根)之對 ΐί Γί；/4δΒ'148c'1480'150A'150B'150C' ° ^ 設定的载置位置£之_角線L為邊界，分開成固 15〇Α、=Β、㈣、靡兩邊。犯M8D以及可動糸之對正銷 所-固各對正銷148為構成本發明之承擋部者’如圖5〜圖7 ⑽，使1不在貞通孔149，銷下端固定於升降台 μ方ϋΐ/i向(方向、γ方向)移動。最好是於旋轉方向 (可旋轉(spin))之構成。如圖8所示，各固定對正 可叙会々被配置於與設定載置位置E之各邊相接之位置。 5〜圖7及圖^ -對正銷150係構成本發明之旋轉型推壓部者，如圖 體ΐ上部具有形成為錐形之圓柱狀或圓筒狀的銷本 i52被轉驅動部152之旋轉驅絲154。旋轉驅動部 作為驅動^、类二具有例如空氣馬達(旋轉汽缸)或電動馬達 轉驅動轴154能使對正銷150之銷本體1池以 其圓動對正鎖15_ 離(偏心，ECcen^之構轉中心線(也就是旋轉驅動軸1順 銷吏旋轉驅動轴154旋轉’則該偏心可動對正 θ如圖10所不’不以中心軸〇作為旋轉中心進行自轉，而係 18 201229621 ^旋轉驅練154作為旋轉巾^，—邊被方向及丫方向移位或移 ^ -邊旋轉。例如，酬之例中，如果注意狀向之中，偏心可 '、·’正銷150之最右知部位的位置，若使旋轉驅動軸丨54旋轉丨⑽。 ϋ貝！!可it? 口會於X1(最小右端位置)〜X3(最大右端位置)之範圍 、仃^位或者移動_。各偏心可動對正銷150A〜150D於不對基板g ίίί，如圖8所示，會在與設定載置位置雎賊退避既定距離 置的原位置(往回位置)待機。The SiSf t pass unit (PASSr) 60, the substrate temperature adjustment Ϊ (C〇L) 62, 64, and the adhesion unit (AD) 66. Here, the coating processing portion 28 is provided on the upstream side of the desired heat treatment by the first heat treatment portion 26 by the nip portion. , the soil plate G is sent out to the bottom in the direction of the wrong direction in FIG. 2, the conveying mechanism 46 has: the lifting and conveying body 7〇, the 201229621 extended guiding channel 68 moves up and down; the turning wheel lining 70 rotates in the Θ direction Or the swinging arm; the transport arm money can be supported on the upper and lower sides of the lifting and transporting body G, and the driving portion 76 of the lifting and lowering body 72 is arranged in the vertical direction. The wheel is used to drive the field to drive the transport arm 74 to drive forward and backward. Each of the drive units 76, 78, 80 can be constituted by, for example, an electric motor or the like. The month-to-year, the transport mechanism 46 configured as described above can be raised at a high speed (four) to any of the two adjacent baking towers (TB) 44, 48, and close to the shuttle device 40 on the side of the assisting conveyance space 38. b. The soil plate G is connected to the coating processing (10) downstream of the auxiliary processing unit 26, and the thin coating unit ((VD) 84 is disposed in a row along the processing line A. The coating processing unit is The configuration will be described later in detail. The second heat treatment unit 3A adjacent to the downstream side of the coating processing unit 28 and the upper processing unit 26 have the same structure 'between the two processing lines A and B. The long-type transmission & mechanism 90' is provided with one of the bake towers (ΤΒ) δ8 on the processing line A side (the last tail), and another baking tower on the processing line side (front end). 92. Although omitted in the illustration, for example, the baking tower (ΤΒ) 88 on the side of the processing line may be disposed, and the passing unit (PASS1) for substrate feeding may be disposed in the lowermost layer, and the passing unit may be pre-formed on the passing unit. For example, a heating unit (PREBAKE) for baking is stacked in three layers. Further, a substrate passing unit (PASSr) can be disposed in the lowermost layer of the baking f(TB) 92 of the processing line, and the passing unit is overlapped, for example, on the passing unit. A cooling unit (COL) for adjusting the temperature of the substrate, and then heating two layers of the heating unit (pr^bakE) for pre-baking on the cooling unit. The transport mechanism 9 in the section 3 can connect the substrate G to the coating processing unit 28 in units of one piece only through the respective pass units (PASSL) and (PASSR) of the two flooding towers (TB) gg and 92. Further, the development processing unit 32 can also connect the substrate G to the shuttle device 40 in the auxiliary conveyance space 38 or the interface station (I/F) 18 to be described later in units of one piece. ^Processing line B in the downstream portion, development processing The unit 32 includes a so-called flat flow type development 12 201229621 unit (DEV) 94 that performs a series of development processing while transporting the substrate G horizontally. The decoloring processing unit 34 is disposed on the downstream side of the development processing unit 32. The third heat treatment unit 36. The decoloring treatment unit 34 includes an i-line UV irradiation unit (i-uv) 96 for performing a decoloring treatment on the surface to be processed of the substrate G by irradiating an i-line (wavelength: 365 nm). The third heat treatment unit 36 has In the same configuration as the first heat treatment unit 26 or the second heat treatment unit 3, a long conveying mechanism and a pair of baking towers (TB) 98 on both sides of the conveying mechanism 100 are provided along the processing line B. 1〇2. Although the illustration is omitted, for example, the top of the baking tower (TB) 98 on the upstream side can be The layer is configured to be fed into the pass unit (PASS1), and the heating unit (POBAKE) for post-baking on the pass unit is, for example, overlapped by three layers. Further, the baking tower (TB) 102 on the downstream side can be used. The bottom layer is configured with a post-bake unit, and a 1-layer substrate pass/cooling unit (PASSRCOL) is superposed on the post-baking unit, and then two layers of a heating unit (POBAKE) for post-baking are superposed thereon. The transport mechanism 100 in the heat treatment unit 36 transmits the pass unit (PASS1) and the pass/cool unit (PASSr · c〇L)e of the two multi-layer unit portions (TB) 98 and 102, and can not only separate the substrate G by one unit. It is connected to the ^ line ^^ illuminating unit (丨 Μ)% and the card station (C/S) 14, and the substrate Gal sheet can be connected to the shuttle device 40 in the room 38 as a unit. The interface station (M018 has a transport device 104 for exchanging the substrate with the adjacent exposure device 12, and is provided with a buffer, a pedestal (BUF) 1〇6, an extension/cooling Δ (EXT·COL) 108, and a peripheral device. 11 〇. Buffering pedestal (4) p) 1 〇 6 is equipped with a fixed buffer card E (not shown). The extension/cooling pedestal (ext.col) 1〇8 is used for the substrate connection pedestal with the A machine to exchange the substrate G to the processing station (p/s). The peripheral device 110 may be configured to overlap the caption generator (TITLER) and (EE), for example. The transport device has just been able to hold the substrate, such as the transport arm 104a, and can connect the substrate G to the adjacent exposure device 12 (BUP) 106, (EXT · COL) 108, (TITLER / EE) 〇. Figure 3 shows the steps of the treatment in the coating and development treatment system. In the first (C/S) 14, the transport mechanism 22 takes out the j-plate 13 201229621 G from any of the pedestals 20 and sends it to the excimer of the cleaning processing unit 24 of the processing station (p/s) 16 . Uv irradiation unit (e-UV) 41 (step SJ. In the quasi-knife UVA?, the emission unit (e-UV) 41, the substrate G is subjected to dry cleaning by ultraviolet irradiation (step S2). The ultraviolet cleaning is mainly removed. After the ultraviolet cleaning is completed, the substrate G is moved to the cleaning and cleaning unit (SCR) 42 of the cleaning processing unit 24 by the transport mechanism 22 i of the cassette station (c/s) 14 . In the manner described above, the SCR) 42 is conveyed by a roller conveyance or a conveyor belt while being conveyed in a horizontal posture in the direction of the processing line A, while the upper surface (processed surface) of the substrate G is brushed or blown. After washing, the particulate matter is removed from the substrate table (step S3). Then, after the cleaning, the substrate G is also conveyed in a flat flow while being subjected to a rinsing treatment, and finally the substrate G is dried using an air knife or the like. The substrate g cleaned in the cleaning unit (SCR) 42 is fed into the first heat treatment portion 26 in an advection manner. The passing unit in the side baking tower (TB) 44 is in the first heat treatment unit 26, and the substrate G is sequentially transported to a predetermined oven unit by the transport mechanism 46 in a predetermined order. For example, the substrate G is first passed from the passing unit ( Pass〇5〇 one of the mobile heating units (DHP) 52, 54 where it is subjected to dehydration treatment (step S4). Next, the substrate G is moved to one of the cooling units (C〇L) 62, 64, where Cooling to a certain substrate temperature (step SO. Thereafter, the substrate G is moved to the adhesion unit (AD) 56, where it is subjected to a hydrophobization treatment (step S0). After the water transfer treatment is completed, the substrate G unit (coffee) 62 And 64-cooled to a predetermined substrate temperature (step S7). The last plate G is broken to a pass unit (PASSr) 6 in the downstream side baking tower (TB) 48. As described above, in the first heat treatment portion 26 The substrate G passes through the transport mechanism 46 and can be placed between the multi-layer baking tower (TB) 44 on the upstream side and the baking tower (TB) 48 on the downstream side. Further, the second and third heat treatment portions 30 and 36 In the same manner, the same substrate transfer operation is performed. The first heat treatment unit 26 receives the substrate G as a series of heat or heat treatments as described above, and the downstream side baking tower ( The pass unit (PASSr) 6 in TB) 48 is moved to the photoresist coating unit (CT) 82 of the coating portion 28. In the photoresist coating unit (CT) 82, the substrate G, as will be described later, Use the long-length type 14 201229621, the miscellaneous transfer of the mating nozzle on the substrate (the quilt) is sewed with fine liquid. The Ϊ Ϊ ΐΪΕ 赚 赚 赚 赚 赚 赚 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿And the substrate G which is subjected to the photoresist coating treatment as described above, and the pressure reduction drying unit (VD) 84 is introduced into the upstream side baking tower (tb) 88 of the adjacent second heat treatment portion 3A. (PASSl). = In the second heat treatment unit 30, the substrate G is sequentially transported to a predetermined unit by the transport mechanism 9 in a predetermined order. For example, the substrate is initially sent by the pass unit (pASSL), the heating unit, and the like, where it is subjected to preheating (step =). After receiving the test, the substrate G is moved to the cooling unit (C0L) iH|i] where it is cooled to a base temperature of one turn (step S1Q). Thereafter, the substrate G is connected to the extension/cooling pedestal on the side of the interface station (Ι/Ρ) 18 via a passer on the side of the downstream side baking tower (TB) 92 or without passing therethrough (EXT · COLOUR. In the interface station (I/F) 18, the substrate G is extended from the extension/cooling pedestal (Εχτ · c〇Ln〇8 and sent to the circumference of the light to set the listening wire (EE), _ at the money to develop % The photoresist of the peripheral portion of the attachment plate G is removed, and then the adjacent optical device 12 is formed (step s). / / The predetermined electrical switch is exposed on the photoresist of the exposure device 12 of the substrate G_L. Then, the substrate G whose pattern exposure is completed is returned from the exposure device 12 to the interface station (ι/ρ) ΐ 8 (step sn), and first sent to the subtitle generator (TITLER) of the peripheral device 110, where it is predetermined on the substrate. The established information on the part is recorded (step s 2). After that, the board G returns to the extension • cooling pedestal (ΕΧΤ · c〇L) l〇8. Interface station (1/]?) 18, base & G The transport and the substrate 12 are exchanged with the exposure device 12 by the transport device. In the processing station (P/S) 16, the transport mechanism 9 in the second heat treatment portion 30 is extended and cooled by the alpha block ( E XT · COL) 108 is taken over the exposed substrate 〇, and is passed through a pass unit (PASSr) in the baking tower (TB) 92 on the processing line jg side to the development processing unit %: from the development processing unit 32, from The substrate G received by the passing unit in the baking tower (TB) 92 is sent to a developing unit (DEV) 94. It is conveyed in an advection manner downstream of the developing unit (DEV) 94$, 201229621 i the boarding line B, During the conveyance, the rinsing and drying-drying-continuous development process is carried out (step: the substrate G subjected to the development process is removed to the downstream side of the substrate, and the scale is taken by the hand to receive the decolorization process (step Sh). The decolorized substrate 〇 is sent to the pass unit in the third heat treatment baking tower (TB) 98 (PASSQ. ' 〃 ^ in the fp3jf portion 36, the substrate G is initially transferred from the pass unit _SL) Heating the Qiaoqing ^ wide, where the heating is received after the heating, the substrate is moved to the downstream side baking tower (ΤΒ) Κ) 2 through the cooling unit = SSR · COL) 'here Cooling to a predetermined substrate temperature (step: in the processing unit 36) 'Rolling of the substrate G is performed by the transport mechanism 1〇〇. 罝- Station, 14 side The transport mechanism 22 receives all the components of the coating and developing process from the third heat treatment unit 36 by cooling (PASSR · COL), and stores the received substrate G on any of the cards on the table. Photoresist coating unit (CT) 82. Hereinafter, an embodiment of a photoresist coating unit (CT) 82 will be described with reference to the drawings. Figure 4 shows the main components in the photoresist coating unit (CT) 82. A ϊ ) ! ί 设有 设有 ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί The photoresist was coated by a non-rotation method using a long-length photoresist. The surface (breaking coating processing unit 116) includes an optical supply unit 118 including a light-drawing unit 〒〇 such that the photoresist nozzle m is flat in the other direction above the pedestal m; 'The position of the height of the nozzle 114 of the nozzle lifting mechanism 122. Again, the first blocking is applied to the photoresist supply portion 118, and the photoresist nozzle 114 has a slit-like flow. The base of the main block 112ΐ is from the end to the other The length covered by the end is in the I direction and is connected to the liquid supply tube 124 from the photoresist supply source (not shown). The scanning unit 12A has a support 126 which is a light. The resistance nozzle is called water 16 201229621 sub-shape (gate shape); and the scanning drive unit 128' causes the support engraving 126 medium/L to move in a straight line. The scan driving unit 128 can also use the ball screw machine 122^^ 0 J The structure of the field-turning screw structure can not only adjust the distance between the outflow σ of the lower end of the nozzle and the pedestal 112 = the face = the face, that is, the gap, the large ^ ^ upper surface = can also The photoresist nozzle m is immediately moved up or down.彳 ' ' ' ' ' ' , ^ ^ ^ ^ ^ ^ 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于The slit-like outflow of the photoresist nozzle 114 in the portion 118 is provided. The strip-shaped outflow flowing in the gamma direction on the upper surface of the first surface is provided with a photoresist. On the day of the stipulation, the flow exit is full and the substrate 0 is moved forward or horizontally, and the coating film of the photoresist is formed on the photoresist nozzle corresponding to the gap with a certain thickness. The pedestal 112 is configured such that the fixing support portion of the fixed position of the substrate g is supported by the lifting and lowering support of the lamp substrate 0, and the substrate clamping portion (the rotary pressing portion and the receiving portion) for performing the clamping of the substrate. The position of the base plate (10) on which the square is placed on the mmi2 is placed on the inner side of the mounting position e, and the attachment 130 and the lift pin 132 are attached at a constant interval or density. The vacuum adsorption port 130 is used to make the ΐ ΐ ΐ 力 蚊 在 在 on the pedestal 112; and the lift pin m 糸 is the lift support portion for raising and lowering the horizontal posture of the substrate (10). As shown in Figs. 6 and 7, the vacuum suction port 130 passes through the inside of the pedestal m, and the path 134 communicates with the external pipe or the vacuum pipe 136. The vacuum deduction vacuum or a vacuum source (not shown) such as a glow device is connected. As shown in FIGS. 6 and 7, the lift pin 132 is inserted into the through hole 138 formed in the pedestal 17 201229621 112 so as to be movable up and down, and the lock front end can protrude above the pedestal 112. The lower end portion of the lift pin 132 is fixed to the horizontal lift σ, and the lift table 140 passes through the lift drive shaft 142 and the lift drive unit 144.弁 汽 汽 或 or electric motor as the driving source, ^ drive: σ MG to make all the lift off 132_ or - view lift movement, can be stopped or fixed in the position of Ren Sinan. As shown in Fig. 8, at the corner of the pedestal 112, a plurality of (for example, eight) pairs of constituting the substrate positioning portion are provided near the set mounting position; /4δΒ'148c'1480 '150A'150B'150C' ° ^ Set the placement position of the _ angular line L as the boundary, and separate into 15 〇Α, = Β, (4), 靡 both sides. The M8D and the movable alignment of the movable pin-fixed pin 148 are the retaining members constituting the present invention. As shown in Fig. 5 to Fig. 7 (10), 1 is not in the through hole 149, and the lower end of the pin is fixed to the lifting table μ side. Ϋΐ/i moves in the direction (direction, γ direction). It is preferably formed in the direction of rotation (spinning). As shown in Fig. 8, each of the fixed alignment guides is disposed at a position that is in contact with each side of the set placement position E. 5 to 7 and FIG. 2 - the alignment pin 150 constitutes the rotary type pressing portion of the present invention, and the pin body i52 which is formed into a tapered cylindrical shape or a cylindrical shape in the upper portion of the body is rotated by the driving portion 152. Rotate the drive wire 154. The rotary drive unit as the drive unit and the second type has, for example, an air motor (rotary cylinder) or an electric motor drive shaft 154, so that the pin body 1 of the alignment pin 150 can be locked by the circular lock 15_ (eccentricity, ECcen^ When the rotation center line (that is, the rotation drive shaft 1 is rotated, the rotation drive shaft 154 is rotated), the eccentric movable alignment θ is not rotated as the center of rotation as the center of rotation, and the system is 18 201229621 ^Rotate The 154 is used as the rotating towel ^, and the side is rotated or moved by the direction and the direction of the side. For example, in the case of the reward, if the attention is in the direction, the eccentricity can be the rightmost of the 150. Know the position of the part, if the rotation drive shaft 54 is rotated 丨 (10). Mussel!! can be? The mouth will be in the range of X1 (minimum right end position) ~ X3 (maximum right end position), 仃 ^ position or movement _. The eccentric movable alignment pins 150A to 150D are not aligned with the substrate g ίίί, as shown in Fig. 8, and stand by at the original position (return position) set at a predetermined distance from the set placement position.
It既^位安裝有®筒狀之環狀構件，例如環圈部^la〇 处士 :咏目部15Qb構成基板定位時與基秘抵接之抵接部，以對 銷本體150a可自由旋轉之方式被嵌著 又各偏心可動對正銷15〇之中，如圖9所示，於較錐形部為 作或施形態之光阻塗佈單元(CT)82之中’整體的動 ^所述，於第丨祕理部26(ffll)接受既定之熱處理的基板g G岔側烘烤塔(ΊΓΒ)48内之通過單元(PASSr)6〇(圖2)被送入光阻 :罟rHCT)82 ’再以未圖示之運送臂將其送到台座112正上方的 敎位置)處。此時，基板G之停止位置，對應於運送臂或者 往上游側之輸送Ή輸送時之基板位置精度，普通都會從 =位置偏離-些，只要該偏離在可料麵内，财如後^之 方式，沒有障礙地進行至升降銷132之接駁。 —方面，於台座112侧，至新的基板G被送進來為止前，fh ^肖^及對正銷U8AM、碰〜15G全部會先“座= 处固定部之真空吸附機構不作動，對於真空吸附口 13〇不提供真 y 4 如上所述，一旦基板G由運送臂送到台座112之正上 動部144會作動而使升降台14。從圖6之高度位置上、 攸運运’接過來。此時，對正銷H8A〜148D、150A〜150D a起上升而從基板G旁邊穿過。此時，基板g之周緣與任一個 19 201229621 或複數之對正鎖的錐形部抵接或滑接，相對地，基 職〜動、職〜咖一邊導引，一邊落入升降銷i^上銷 如圖8所不’由於原位置之偏心可動對正銷15〇A〜I5〇D與台座η〕 上之设疋載置位置E之間有形成相當的缺口，故基板〇可以平順地 落入。不過，能平順落入的程度量，於升降銷132上，基板G之位 置^叙載置位置E偏離的可能性高而且偏離的量也大。於該實施 形態中’由於具有如魏之基板定位機構，因此將基板G從運送 往升降銷132移麟，可㈣、視位置偏離而驗確實且平順的接過 來作為優先。 如上，之方式，如果將基板G從運送臂往升降銷132進行移 j ’則接著’為了使基板G於升降銷132上定位，同時進行使基板 定位部之偏心可賴正銷丨观〜咖從雜置躺前進移動位置 之運動。It is equipped with a tubular annular member, for example, a ring portion. The eye portion 15Qb constitutes an abutment portion abutting against the base when the substrate is positioned, so that the pin body 150a can be freely rotated. The method is embedded in each of the eccentric movable alignment pins 15 , as shown in FIG. 9 , in the thinner portion of the photoresist coating unit (CT) 82 in the shape of the taper. The passage unit (PASSr) 6〇 (Fig. 2) in the substrate g G岔 side baking tower (ΊΓΒ) 48 which has been subjected to the predetermined heat treatment in the first 丨 理 26 (ffll) is sent to the photoresist: 罟rHCT ) 82 ' is sent to the 敎 position directly above the pedestal 112 by a transport arm (not shown). At this time, the stop position of the substrate G corresponds to the positional accuracy of the substrate when the transport arm or the transport side of the transport side is transported, and the normal position will be deviated from the = position, as long as the deviation is within the available surface, In this way, the connection to the lift pin 132 is carried out without any obstacles. On the pedestal 112 side, until the new substrate G is fed in, the fh ^ xiao ^ and the aligning pin U8AM, the touch ~ 15G will all be "the seat = the vacuum suction mechanism at the fixed portion does not move, for the vacuum The adsorption port 13 does not provide the true y 4. As described above, once the substrate G is transported by the transport arm to the upper movable portion 144 of the pedestal 112, the lift table 14 is actuated. From the height position of Fig. 6, the transport is carried out. At this time, the positive pins H8A to 148D and 150A to 150D a rise and pass through the side of the substrate G. At this time, the periphery of the substrate g abuts any of the 19 201229621 or a plurality of tapered portions of the aligned locks. Or sliding, relatively, the basic position ~ move, job ~ coffee side guide, while falling into the lift pin i ^ on the pin as shown in Figure 8 'because of the original position of the eccentric movable alignment pin 15〇A~I5〇D There is a gap between the mounting position E and the mounting position E on the pedestal η, so that the substrate 〇 can fall smoothly. However, the amount of the falling surface can be smoothly lowered, and the position of the substrate G on the lift pin 132^ The possibility that the placement position E deviates is high and the amount of deviation is also large. In this embodiment, Since the substrate positioning mechanism is used to move the substrate G from the transporting to the lift pin 132, it is possible to give priority to the positional deviation and to check it out smoothly. As described above, if the substrate G is lifted from the transport arm to the lift pin. The movement of 132 is performed, and then, in order to position the substrate G on the lift pins 132, the eccentricity of the substrate positioning portion can be performed at the same time.
洋細地說，各旋轉驅動部152透過旋轉驅動軸154而使各偏心 可動對正銷150從圖8之原來位置旋轉約半圈。如此一來，銷本體 150a會如圖10所示，一邊進行偏心旋轉運動，一邊往與其對向之 基板G的各邊移動，而使環圈部(抵接部)15此抵接於該基板邊部 (基板側面），進一步自該處推壓基板G。藉此，和於基板〇之乂方向 延伸之其+—邊(長邊)相對向之2個偏心可動對正銷15〇八、15〇]3會 將基板G往Y方向推壓，並且另一方面，和於基板〇之丫方向延伸 之另一邊(短$)相對向之2個偏心可動對正銷丨5〇c、15〇1)會將基板 G往X方向推壓。藉此，基板G會於升降銷132上沿χ方向及γ方向 朝被推壓的方向移位或移動，而使基板G之相反側的長邊被推壓抵 住2個固定對正銷148C、148D，而基板G之相反側的短邊被推壓抵 住2個固定對正銷148A、148B。其結果為，基板G在X方向被夾持 方$偏心可動對正銷15〇C' 150D與固定對正銷148A、148B之間，同 曰才於γ方向被夾持於偏心可動對正銷15〇A、15〇B與固定對正銷 148C^48D之間。旋轉驅動部152使旋轉驅動軸154旋轉之角度係 預先没定，如上所述，當基板〇被所有的對正銷丨5〇A〜〗5〇D、148A 20 201229621 叙1夾持住之狀態下，偏心可動對正鎖i5qa〜i5〇D之運 :一 I卩〒止。這樣的話，一旦基板G之定位一結束，如圖13 所^基^之位置會與台節2上之設定載餘置狀致吻合。 干，m心7動對正銷15 〇A〜15 0D之偏心旋轉方向如圖11所 ㈣ttt協調動作而使基板0往對角、線方向推壓之方式，同為 基板方向’垂直者則設定為反向。於該例中，使將 二鐘、㈣向推壓之偏心可動對正銷1 5〇a、1通作反時針之偏心 二r時使將基板⑺主乂方向推壓之偏心可動對正銷 南内 _時針之偏心旋轉運動，藉此使基板G於對角線方 14^4^。向)直線移動’而可被推壓抵住相反侧之固定對正銷 Ί：蚀12所不’於该貫施例中之基板定位，由於各偏心可動對 入ΐΓϋ卿隱能在與基板G抵接時旋轉，故能使抵接或推 又’升降銷132之上端部132a較佳為以於定位時 地水平移喊雜之对，自躲基減料(玻璃基 ΐ It良好的材質(例如樹脂)所構成，或由可於任意方向自由 %轉之滾珠等旋轉體所構成。 方式’―旦結束基板G在升降銷132上之定位，升降驅 邛P々升降台140從圖7之高度位置下降，使升降台14〇上之 各部份下降4維持基板(5由對正〜15QD、148A〜14 夾持的狀悲下’與升降銷132—起下降。因而，基板G下降時， 之位置轉偏離：紐’如，使基板⑽載置於台 士之上表面的狀悲或被載置之前瞬間暫時停止下降運動。於談 所示’台座112側之真㈣附機構之動作開‘ 座上表面之真空_口13〇提供真空力。另—方面，各個偏心 可動對正銷150A〜150D藉由旋轉驅動部152之旋轉驅動進行鱼上 述為反方向之偏心旋轉運動而往原本位置後退移動， & 板G之推壓。之後，升降驅動部144使升降台14〇下降至圖6=高^ 位置。如該方式，由於對正銷15〇A〜15〇D、148A〜148D對 21 201229621 持，後’該等對正銷下降’因此，能防止或減低 中美:^職〜1彻及升降銷132全部都退避至台座^ “基板G被疋位*載置於台座112上之設定載置位置Ε，並且被從 真空吸著口 130接收到的真空吸附力所固定 > 如圖4所於塗佈處理部116中，光阻塗佈處理被實 仃。也就疋况，光阻噴嘴114從狭縫狀流出口對於台座ιΐ2上之美 ^之上t面，—邊以於丫方向延伸之帶狀流出流將光阻液流出; ' 邊於台座112上方在X方向縱斷，從基板G之一端至到達 一端。升降鎖132當然是如此，由於對正銷150A〜150D、148A 二彻，退避至台座m之中，因此不會妨礙塗佈掃描。該塗佈掃 :進仃％，如圖16所示’從狹缝狀流出口滿出於基板G上之光阻液 在光阻喷嘴m之下端部會平坦地延伸，而於基板G上對應於缺口 以一定的膜厚形成光阻液之塗佈膜CR (圖16)。 ^如上述之光阻塗佈處理之中，光阻噴嘴114之掃描開始點與終 ，係以台座U2上之設定較位置£作為絲加以設定。該實施形 悲中’由於储由如上述基板錄部之麟而使基板啸確地定位 於台座112上之設定載置位置E，因此能於基板G上之設定塗佈區域 大致吻合而形成光阻塗布膜CR。又，塗佈掃描之開始點希望能設 定於成為定位之基準位置的固定對正銷148A、148B側的基板端 部0 _ 一般而言，使用狹縫型之光阻喷嘴114的情形中，如圖16所 示’在光阻塗佈膜CR之開始點’基板g上會形成大的隆起部CRS。 如果該隆起部CRS進入貫質的設定塗佈區域内(線j之内側），則膜 厚之均勻性會下降。於該實施形態巾，可以使塗佈開始點之隆起 部CRS確實地位於設定塗佈區域之外，並且也可確實地在基板周 緣部確保用以使不需要邊緣沖洗用之留白部河。 於圖17中’該實施形態之中，顯示可適用偏心可動對正銷15〇A 〜150E)之微粒除去部之一構成例。各偏心可動對正銷15〇由於藉由 22 201229621 上述偏心旋轉運動一邊與基板〇 銷抵接部材質之不同，可能在摩產過生^抵f，因此，依 ，於各偏心可動對正銷15〇升降移動所穿過 或者附近，設置真空式之微粒吸入口 16〇，以使=孔 微粒’或在其周圍懸浮的微粒被真空力吸引到吸1 口 160 = = 而與 好障开疋轉驅動軸154與可動對正銷150之中心軸〇^- ίϋί 偏離。使用該種橢圓型之可動對正銷150ί情 二也/、上述同杈，使旋轉驅動部152 if ^ , 基板G之疋位。但是，由於為橢圓型，盔法 此一仃 部隱，而會有與基機接之部位目辦—個]自由=^環圈 =同限制，但是，也可以於_顏筒型之 i略=iplfb，而使銷本體論之外周面構成抵接部。 為正原理’可動對正銷150的横剖面形狀不需要 為正0或橢0 ’例如也可為具有。之中心角的圓弧。而要 於上月之技術思想的範圍内可作各種變形。例如， ，基板之定位。但是，也可於為了移載至 ί門所需時間吸收於基板移載時間之中，能使作孝 、寻間大為細紐。又，也可以將基板(}移載於台座丨 、 前瞬間，使上述基板定位部動作而進行基板之定位。2 又’上述實施職巾雜可麟正鎖⑼與基板G之—長邊在2 23 201229621 ^ 15〇B)抵接，而與基板G之一短邊亦於2處(l5〇C，150D) ji»。▲疋也可為抵接於各只有1處，或者3處以上。於固定對正 士也相同。又，於只需將基板於一方向(例如X方向）定位之 應用中、’、P使可_正_〇做基板之-邊減。 亡述實施形態之中’光阻塗佈單元((:1)82係使用長尺型之光 阻喷嘴114，但是’本發明可以_具有任意喷嘴之㈣裝置，更 且’塗佈處理裝置以外之基板處理裝置也可適用。例如，於上述 系統(圖υ之中’於熱板或冷卻板之上對基板施以熱 ίϊ ίί式烘烤單元_細)、_、(C〇L)等也能適用本 叙明。忒情形中，可將熱板或冷卻板視為台座。 又，於上述實施形態中，可動對正銷150由於在銷本體之外周 面抵接於基板’目d必要最小限度之纟有面積便足夠，適於 台座之貫通孔為可升降·可進出之設計。但是，於不需要升降移 動之應用或者對占有面積無限制之應財，例如圖2Q所示，可於 銷本體150a透過在水平方向延伸之臂部15〇c安裝抵接構件l5〇d，、 使對應於銷本體15〇a之旋轉運動之臂部丨5〇的迴旋運動，以將抵接 構件150d抵接或推壓抵住於基板〇之邊緣。 - 又，上述實施形態之中，基板定位部之可動對正銷150，兼具 有於錯直方向導引基板之機能，《了提高導引機能，設有錐形部 於不需要導引機能之應用之巾’也可以不具有錐形部。使可動對 正銷150做旋轉驅動之機構也可有各種的變形。例如，也可以帶輪 或輸送帶機構，使所有的可動對正銷15〇A〜15〇D藉由共通的驅< 源做同時驅動。本發明之基板定位裝置也可適用於不使用台座之 基板處理裝置或基板輸送裝置等。 口 ^發明之中的被處理基板不限定於LCD基板，也可為其他平 面顯示器用基板、半導體晶圓、CD基板、玻璃基板、光罩、刷 基板等。 【圖式簡單說明】 24 201229621 、酬發明可適用之塗佈_處 圖2_示上述塗佈顯影 先々構成千面圖。 圖。 充之中，祕理部之構成側面 圖3顯示上述塗佈顯影處理系 圖蝴示上述塗佈顯影處理李 ’f理步驟流程圖。 構成立體圖。 糸'、先之中，光阻塗佈單元内之主要 圖5顯示上述光阻塗佈單元φ， _貝示上述光阻塗佈單元 體圖。 圖7顯示上述光阻塗佈單元之中，主，縱剖面圖。 圖_示實施職之中，台座上設面圖。 關係概略平面圖。 戰置位置與對正銷之位置 圖9顯示實施形態之中，偏心可 圖10顯示實郷H之+，偏可動正立體圖。 跡圖。 動對正銷之偏心旋轉運動執 圖11顯示實施形態之中，偏心可動對 概略立體圖。 」動對正勒之較佳旋轉方向的 圖12顯示實施形態之中，偏心可動對 降銷作用之-部剖面概略側面圖。 自(尤/、疋％圈部)及升 圖13顯示實施形態之中，基板定位結束狀態之概略平 圖14顯示實施形態之中，使基板載置於台座二二。 縱剖面圖。 1白奴的 圖15顯示實施形態之中，使基板固定於台座上 縱剖面圖。 的 1116顯示實施形態之中’光阻、塗佈處理之作用的概 圖17顯示實施形態之中，微_去部之—構成例的縱剖=。 圖18實施形態之中，可動對正銷之一變形例的立體圖。_。 圖19顯示圖18之可動對正銷的作用的概略平面圖。^ 圖20顯示另外的實施例的可動對正銷構成立體圖。 25 201229621 【主要元件符號說明】 G〜基板 C〜卡匣 POBAKE〜後烘烤單元 PASSR . COL〜通過.冷卻單元 TITLER〜字幕產生器 EE〜周邊曝光裝置 10〜塗佈顯影處理系統 12〜曝光裝置 14〜卡匣站(C/S) 16〜處理站(P/S) 18〜界面站(I/F) 20〜卡台座 22〜輸送機構 22a〜運送臂 24〜清洗處理部 26〜第1熱處理部 28〜塗佈處理部 30〜第2熱處理部 32〜顯影處理部 34〜脫色處理部 36〜第3熱處理部 38〜輔助輸送空間 40〜穿梭裝置 41〜準分子UV照射單元(e-UV) 42〜洗滌器清洗單元(SCR) 44、48〜烘烤塔(TB) 46〜輸送機構 50〜通過單元(PASS〇 26 201229621 、 52、54〜加熱單元(DHP) 56〜黏附單元(AD) 60〜通過單元〇PASSr) 62、64〜冷卻單元(COL) 66〜黏附單元(AD) 68〜導引執道 70〜升降輸送體 72〜迴旋輸送體 74〜銷組 76〜驅動部 78〜驅動部 80〜驅動部 .82〜光阻塗佈單元(CT) 84〜減壓乾燥單元(VD) 88〜烘烤塔(TB) 90〜輸送機構 92〜烘烤塔(TB) 94〜顯影單元(DEV) 96〜i線UV照射單元(i-UV) 98〜烘烤塔(TB) 100〜輸送機構 102〜烘烤塔(TB) 104〜輸送裝置 104a〜運送臂 106〜缓衝.台座(BUF) 108〜延伸.冷卻台座(EXT . COL) 110〜周邊裝置（TITLER/EE) 112〜台座 114〜光阻喷嘴 27 201229621 116〜塗佈處理部 118〜光阻液供給部 120〜掃描部 122〜噴嘴升降機構 124〜光阻液供給管 126〜支持體 128〜掃描驅動部 130〜真空吸附口 132〜升降銷 132a〜上端部 134〜真空通路 136〜真空管 138〜貫通孔 140〜升降台 142〜升降驅動軸 144〜升降驅動部 148(148A〜148D)〜固定對正銷 149〜貫通孔 150(150A〜150D)〜可動對正銷 150a〜銷本體 150b〜環圈部 150c〜臂部 150d〜抵接構件 151〜貫通孔 152〜旋轉驅動部 154〜旋轉驅動軸 160〜吸入口 162〜通氣孔 164〜外部排氣管 28In other words, each of the rotation driving units 152 transmits the eccentric movable alignment pins 150 by about half a turn from the original position of Fig. 8 by rotating the drive shaft 154. As a result, as shown in FIG. 10, the pin main body 150a moves toward the respective sides of the substrate G opposed thereto while eccentrically rotating, and the ring portion (contact portion) 15 abuts against the substrate. The side portion (side surface of the substrate) further pushes the substrate G from there. Thereby, the two eccentric movable alignment pins 15 、 8 and 15 〇 ] 3 which are opposite to the + edge (long side) extending in the 〇 direction of the substrate 推 push the substrate G in the Y direction, and another On the other hand, the other side (short $) extending in the direction of the substrate 相对 is opposed to the two eccentric movable alignment pins 〇5〇c, 15〇1), and the substrate G is pressed in the X direction. Thereby, the substrate G is displaced or moved in the direction in which the lift pin 132 is pressed in the χ direction and the γ direction, and the long side of the opposite side of the substrate G is pressed against the two fixed alignment pins 148C. 148D, and the short side of the opposite side of the substrate G is pressed against the two fixed alignment pins 148A, 148B. As a result, the substrate G is held between the eccentrically movable alignment pin 15〇C' 150D and the fixed alignment pins 148A and 148B in the X direction, and is clamped to the eccentric movable alignment pin in the γ direction. 15〇A, 15〇B and fixed alignment pin 148C^48D. The angle at which the rotation driving portion 152 rotates the rotation driving shaft 154 is not determined in advance, and as described above, when the substrate 〇 is clamped by all the alignment pins 丨5〇A to 〇5〇D, 148A 20 201229621 Next, the eccentric movable locks the lock of i5qa~i5〇D: one I stop. In this case, once the positioning of the substrate G is completed, the position of the substrate as shown in Fig. 13 coincides with the set carrier position on the stage 2. Dry, m core 7 moving alignment pin 15 〇A~15 0D eccentric rotation direction as shown in Fig. 11 (4) ttt coordinated operation, the substrate 0 is pushed diagonally and in the line direction, and the substrate direction is vertical. For the reverse. In this example, the eccentrically movable alignment pin that pushes the substrate (7) in the direction of the main yoke when the eccentrically movable aligning pins 15 5a and 1 are pressed to the second and fourth (20) counterclockwise eccentricity r The inner _ hour hand eccentric rotation motion, thereby making the substrate G diagonally 14^4^. To the linear movement 'can be pressed against the opposite side of the fixed alignment pin 蚀: eclipse 12 does not 'the substrate position in the embodiment, since each eccentric movable pair ΐΓϋ 隐 hidden in the substrate G When the abutment rotates, it can be abutted or pushed and the upper end portion 132a of the lift pin 132 is preferably horizontally moved to the wrong position during the positioning, and the material is reduced from the base (glass-based ΐ It is a good material ( For example, it is composed of a resin, or a rotating body such as a ball that can be freely rotated in any direction. The method "ends" the positioning of the substrate G on the lift pin 132, and the lift 邛P々 lift table 140 is from FIG. The height position is lowered, and the portions of the lifting platform 14 are lowered by 4 to maintain the substrate (5 is tilted by the alignment of the 15QD, 148A~14) and the lifting pin 132. Therefore, when the substrate G is lowered , the position shifts away from: New's, such that the substrate (10) is placed on the upper surface of the board of the sorrow or temporarily stops the descending motion immediately before being placed. In the talk of the 'the pedestal 112 side of the true (four) attached mechanism action Open the vacuum on the upper surface of the seat to provide vacuum force. On the other hand, each eccentric The aligning pins 150A to 150D are driven by the rotation of the rotary driving unit 152 to perform the eccentric rotation of the fish in the opposite direction, and move backward to the original position, and the plate G is pressed. Thereafter, the lifting and lowering driving unit 144 causes the lifting table 14〇 descends to the position of Fig. 6=high^. In this way, since the positive pin 15〇A~15〇D, 148A~148D pair 21 201229621, then 'these alignment pins are lowered', therefore, can be prevented or reduced Zhongmei: ^1~1 and lift pin 132 are all retracted to the pedestal ^ "Substrate G is clamped* placed in the set mounting position 台 on the pedestal 112, and is received by the vacuum absorbing port 130 The adsorption force is fixed. As shown in Fig. 4, the photoresist coating treatment is performed in the coating processing portion 116. In other words, the photoresist nozzle 114 is above the slit-like outlet for the pedestal The t-plane, the strip-shaped effluent flow extending in the 丫 direction flows out of the photoresist; 'the longitudinal rupture in the X direction above the pedestal 112, from one end of the substrate G to the end. The lift lock 132 is of course due to The right pin 150A~150D, 148A two, retreat to the pedestal m, so it does not matter Coating scanning. The coating sweep: 仃%, as shown in FIG. 16 'The photoresist liquid on the substrate G from the slit-like flow outlet extends flatly at the lower end of the photoresist nozzle m, and The coating film CR (FIG. 16) of the photoresist is formed on the substrate G corresponding to the notch with a certain film thickness. ^ In the photoresist coating process described above, the scanning start point and the end of the photoresist nozzle 114 are The setting on the pedestal U2 is set as the wire. The embodiment is erroneously 'supplied by the lining of the substrate recording portion to position the substrate on the pedestal 112 at the set mounting position E. The set coating region on the substrate G is substantially matched to form a photoresist coating film CR. Further, it is desirable that the start point of the coating scan can be set to the substrate end portion 0 on the side of the fixed alignment pins 148A and 148B which is the reference position of the positioning. In general, in the case of using the slit type photoresist nozzle 114, A large ridge CRS is formed on the substrate g at the "starting point of the photoresist coating film CR" as shown in FIG. If the ridge portion CRS enters the inner set coating area (the inner side of the line j), the uniformity of the film thickness is lowered. In the towel of this embodiment, the ridge portion CRS at the application start point can be surely positioned outside the set application region, and the white portion river for the edge flushing can be surely secured at the peripheral portion of the substrate. In the embodiment of Fig. 17, a configuration example of the fine particle removing portion to which the eccentric movable alignment pins 15A to 150E are applicable is shown. Each of the eccentric movable alignment pins 15 is different from the material of the substrate pin-off abutment by the above-mentioned eccentric rotation motion of 22 201229621, and may be over-produced in the production of the fuse. Therefore, depending on the eccentric movable alignment pin 15 〇 〇 〇 穿过 , , , 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空The rotation drive shaft 154 deviates from the center axis of the movable alignment pin 150 〇^- ίϋί. Using the elliptical type of the movable alignment pin 150, the same as above, the rotation drive unit 152 if ^ , the substrate G is clamped. However, because it is an elliptical type, the helmet method is hidden, and there will be a part of the connection with the base machine - a free = ^ ring = the same limit, but it can also be a little =iplfb, and the outer surface of the pin ontology constitutes an abutment. For the positive principle, the cross-sectional shape of the movable alignment pin 150 need not be positive 0 or elliptical 0', for example. The arc of the center angle. It is necessary to make various changes within the scope of last month's technical ideas. For example, the positioning of the substrate. However, it can also be absorbed into the substrate transfer time for the time required to transfer to the ί门, which can make the filial piety and the search for a big bond. Further, the substrate (} may be moved to the pedestal, and the substrate positioning portion may be operated to perform positioning of the substrate. 2 Further, the long side of the above-mentioned implementation of the service uniforms (9) and the substrate G may be 2 23 201229621 ^ 15〇B) Abut, and one of the short sides of the substrate G is also at 2 (l5〇C, 150D) ji». ▲ 疋 can also be used to contact only one, or more than three. The same is true for fixed pairs. Further, in the application in which the substrate is merely positioned in one direction (e.g., the X direction), 'P' can be reduced to the side of the substrate. In the embodiment of the description, the photoresist coating unit ((:1) 82 uses a long-length photoresist nozzle 114, but the present invention can be used as a device having any nozzle, and more than the coating processing device. The substrate processing apparatus can also be applied. For example, in the above system (in the figure, 'the substrate is coated with a heat ί ί 烘烤 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The present invention can also be applied to the present invention. In the case of the above, the hot plate or the cooling plate can be regarded as a pedestal. Further, in the above embodiment, the movable alignment pin 150 is required to abut against the substrate on the peripheral surface of the pin body. The minimum area is sufficient, and the through hole for the pedestal is designed to be lifted and lowered. However, for applications that do not require lifting or moving, or for the area where there is no limit on the occupied area, as shown in Figure 2Q, The abutment member 15bd is attached to the pin body 150a through the arm portion 15〇c extending in the horizontal direction, and the arm portion 丨5〇 corresponding to the rotational movement of the pin body 15〇a is rotated to abut the abutting member. 150d abuts or pushes against the edge of the substrate. - Again, above In the embodiment, the movable alignment pin 150 of the substrate positioning portion has the function of guiding the substrate in the wrong direction, and the device for improving the guiding function and having the tapered portion for the application without the guiding function 'There may be no tapered portion. The mechanism for rotating the movable alignment pin 150 may also have various deformations. For example, a pulley or a belt mechanism may be used to make all the movable alignment pins 15A to 15 The substrate positioning device of the present invention can also be applied to a substrate processing device or a substrate transfer device that does not use a pedestal. The substrate to be processed in the invention is not limited to the LCD. The substrate may be another substrate for a flat panel display, a semiconductor wafer, a CD substrate, a glass substrate, a photomask, a brush substrate, etc. [Simplified description of the drawing] 24 201229621, coating applicable to the invention _ at the figure 2_ The above-mentioned coating and development first constituting a thousand-side view. Fig. 3 shows a configuration of the above-mentioned coating and developing treatment, and the flow chart of the above-mentioned coating and developing treatment is shown.In the first, the main photoresist layer in the photoresist coating unit shows the photoresist coating unit φ, and the above-mentioned photoresist coating unit body diagram is shown. Fig. 7 shows the above-mentioned photoresist coating unit. Figure _ shows the implementation of the position, the pedestal on the surface map. Relationship diagram. The position of the battle position and the position of the alignment pin Figure 9 shows the implementation, the eccentricity can be shown in Figure 10 The eccentric rotation motion of the aligning pin is shown in Fig. 11. In the embodiment, the eccentric movable pair is shown in a schematic perspective view. Fig. 12 showing the preferred direction of rotation of the directional alignment is shown in the embodiment. A schematic cross-sectional view of the eccentrically movable-to-sales-discharging function. In the embodiment shown in the embodiment of the present invention, the schematic plan view of the state in which the substrate positioning is completed is shown in the embodiment. The substrate is placed on the pedestal 22nd. Longitudinal section. 1 White slave Fig. 15 is a longitudinal sectional view showing the substrate fixed to the pedestal in the embodiment. 1116 shows an outline of the action of the photoresist and the coating process in the embodiment. In the embodiment, the longitudinal section of the configuration example of the micro-department is shown. Fig. 18 is a perspective view showing a modification of one of the movable alignment pins in the embodiment. _. Figure 19 is a schematic plan view showing the action of the movable alignment pin of Figure 18. Figure 20 shows a perspective view of a movable alignment pin of another embodiment. 25 201229621 [Description of main component symbols] G~substrate C~card 匣POBAKE~post-baking unit PASSR. COL~passing.cooling unit TITLER~subtitle generator EE~peripheral exposure device 10~coating development processing system 12~exposure device 14 to card station (C/S) 16 to processing station (P/S) 18 to interface station (I/F) 20 to card holder 22 to transport mechanism 22a to transport arm 24 to cleaning processing unit 26 to first heat treatment Portion 28 to coating processing unit 30 to second heat processing unit 32 to development processing unit 34 to decoloring processing unit 36 to third heat treatment unit 38 to auxiliary transport space 40 to shuttle device 41 to excimer UV irradiation unit (e-UV) 42~ scrubber cleaning unit (SCR) 44, 48~ baking tower (TB) 46~ conveying mechanism 50~ passing unit (PASS〇26 201229621, 52, 54~ heating unit (DHP) 56~adhesive unit (AD) 60 ~ Passing unit 〇PASSr) 62, 64~Cooling unit (COL) 66~Adhesive unit (AD) 68~ Guide way 70~ Elevating transport body 72~ Swirling transport body 74~ Pin set 76~ Drive unit 78~ Drive unit 80~drive unit.82~ photoresist coating unit (CT) 84~ decompression drying unit (VD) 88~ baking tower (TB) 90~ Conveying mechanism 92 to baking tower (TB) 94 to developing unit (DEV) 96 to i line UV irradiation unit (i-UV) 98 to baking tower (TB) 100 to conveying mechanism 102 to baking tower (TB) 104 ~Conveying device 104a~Transporting arm 106~Buffering pedestal (BUF) 108~Extension. Cooling pedestal (EXT. COL) 110~ Peripheral device (TITLER/EE) 112~ pedestal 114~Photoresist nozzle 27 201229621 116~Coating Processing unit 118 to photoresist liquid supply unit 120 to scanning unit 122 to nozzle elevating mechanism 124 to photoresist liquid supply tube 126 to support 128 to scanning drive unit 130 to vacuum adsorption port 132 to lift pin 132a to upper end portion 134 to vacuum Passage 136 to vacuum tube 138 to through hole 140 to lift table 142 to lift drive shaft 144 to lift drive unit 148 (148A to 148D) to fixed alignment pin 149 to through hole 150 (150A to 150D) to movable alignment pin 150a Pin body 150b to loop portion 150c to arm portion 150d to contact member 151 to through hole 152 to rotary drive portion 154 to rotary drive shaft 160 to suction port 162 to vent hole 164 to external exhaust pipe 28