CN100449408C - Substrate processing apparatus and substrate positioning device - Google Patents

Substrate processing apparatus and substrate positioning device Download PDF

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Publication number
CN100449408C
CN100449408C CN 200510092900 CN200510092900A CN100449408C CN 100449408 C CN100449408 C CN 100449408C CN 200510092900 CN200510092900 CN 200510092900 CN 200510092900 A CN200510092900 A CN 200510092900A CN 100449408 C CN100449408 C CN 100449408C
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substrate
portion
processing apparatus
rotary
contact
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CN 200510092900
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Chinese (zh)
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CN1746776A (en
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元田公男
富田龙生
立山清久
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东京毅力科创株式会社
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Abstract

本发明提供一种基板处理装置和基板定位装置,可省空间高效率地决定被处理基板的位置。 The present invention provides a substrate processing apparatus and the substrate positioning means, may be determined with high efficiency, space-saving position of the substrate to be processed. 在将基板(G)移载在提升销(132)上后,各旋转驱动部(152)经过旋转驱动轴(154)使各偏心可动定位销(150)从原来位置旋转约半圈。 After the substrate (G) on a transfer lift pin (132), each of the rotation driving unit (152) via a rotary drive shaft (154) so ​​that the movable eccentric positioning pin (150) is rotated about a half turn from its original position. 通过这样做,一面使定位销(150)偏心旋转运动一面向着与它对置的基板(G)的各边移动,套环(接触部)(150b)与基板边缘部(基板侧面)接触,进一步从那里按压基板(G)。 By so doing, one side of the positioning pin (150) eccentrically rotate with its side facing toward the substrate (G) while moving each collar (contacting portion) (150b) in contact with the edge portion of the substrate (the substrate side), further from there pressing the substrate (G). 因此,使基板(G)在按压在提升销(132)上的方向中变位或移动,将基板(G)的相反侧的长边按压到固定定位销。 Accordingly, the substrate (G) is pressed in the lift pin (132) or in the direction of the displacement movement, while pressing the opposite long side of the substrate (G) is fixed to the positioning pin. 结果,将基板(G)夹持在偏心可动定位销(150)和固定定位销之间,完成定位。 As a result, the substrate (G) held in the movable eccentric positioning pin (150) and fixed between the positioning pins, the positioning is completed.

Description

基板处理装置和基板定位装置 The substrate processing apparatus and the substrate positioning means

技术领域 FIELD

本发明涉及一般对在载物台上的被处理基板施加处理的基板处理装置,特别是涉及决定基板位置的技术。 The present invention relates to a substrate processing apparatus generally applied in the treatment on the stage of the substrate to be processed, in particular, to a technique determines the position of the substrate.

背景技术 Background technique

最近,在平面面板显示器(FPD)的制造过程中的光刻工序中,作为对被处理基板(例如玻璃基板)的大型化有利的抗蚀剂涂敷法,一面用抗蚀剂喷嘴向基板以微细直径连续地喷出抗蚀剂液, 一面通过使抗蚀剂喷嘴相对移动即扫描,不需要旋转运动地在基板上涂敷所要膜厚的抗蚀剂液的无自旋方式正在普及中。 Recently, in the manufacturing process of the flat panel display (FPD) in the photolithography process, a substrate to be processed (e.g., glass substrate) is advantageous in size of the resist coating, resist the nozzle side to the substrate continuously discharging the fine diameter of the resist solution, the resist on one side by a nozzle that is moved relative scanning mode of spin resist solution does not need to be the thickness of the rotational movement of the substrate being coated in popularity.

一般,根据无自旋方式的抗蚀剂涂敷装置,例如如专利文献l中记载的那样,水平地载置在载置台或载物台上的基板和抗蚀剂喷嘴的喷出口之间设定数百pm以下的微小间隙, 一面使抗蚀剂喷嘴沿扫描方向(一般与喷嘴长边方向正交的水平方向)在基板上方移动, 一面将抗蚀剂液喷出到基板上。 In general, the resist coating apparatus according to the embodiment of spin, for example, as described in Patent Document as l, placed horizontally between the discharge outlet of the stage or the substrate and the resist nozzle is provided on a stage given minute gap hundreds pm or less, one surface of the resist nozzle is moved above the substrate along the scanning direction (generally perpendicular to the longitudinal direction of the nozzle in the horizontal direction), the discharge side of the resist solution onto the substrate. 这种抗蚀剂喷嘴具有口径非常小(例如约10(Hmi)的喷出口,为了提高涂敷效率,喷嘴本体形成横向长或长条状的形状,在它的长边方向以一定间距的多孔构造配列直径微细的喷出口,或者形成连续的狭缝构造。 Such a resist nozzle has a very small diameter (e.g., about 10 (Hmi) of the ejection outlet, in order to improve the coating efficiency, a long nozzle body or laterally elongated shape in its longitudinal direction at a distance porous an outlet configured to discharge with the column diameter of the fine, or a continuous slit structure.

[专利文献l]日本特开平10-156255号专利公报 [Patent Document L] JP Patent Publication 10-156255

在上述那样的无自旋方式的抗蚀剂涂敷装置中,只使长条型的抗蚀剂喷嘴从基板的一端到另一端扫描1次,就能够在基板上形成所要膜厚的抗蚀剂涂敷膜。 In the resist coating apparatus as described above spinless embodiment, only the resist nozzle strip type substrate from one end to the other end of the 1st scan, it is possible to form a desired resist film thickness on the substrate agent coating film. 但是,这里成为问题的是载物台上的基板的位置精度。 However, the problem here is that the positional accuracy of the substrate on a stage. 无自旋方式的一个优点是在抗蚀剂涂敷处理阶段中在基板的周边部分余留空白区域(无抗蚀剂的区域),不需要涂敷抗蚀剂后的边缘清洗工序。 One advantage is the manner of spin coating process stage a blank area left in the resist (the resist-free area) than in the peripheral portion of the substrate, the edges do not need to resist is applied after the washing step. 然而,当在载物台上基板的位置发生偏离时,不能够使抗蚀剂涂敷膜正确地进入基板上的设定涂敷区域,不能充分确保空白区域,产生在设定涂敷区域内膜厚均匀性不良等的问题。 However, when a position deviation occurs at the stage of the substrate, can not properly resist coating film is set into the coating region on the substrate can not be sufficiently ensure an empty area of ​​the set is generated in the application region poor thickness uniformity and other problems. 至今,人们一直在决定基板在载物台上的位置进行载置方面下工夫。 So far, it has been decided to lay emphasis substrate is placed at a position on a stage. 代表性的是在设定载置位置的周围设置多根用于引导基板(使基板落入)到载物台上的设定载置位置的引导部件的构成。 Typically a plurality of configuration settings for guiding the substrate (the substrate falls) to set the guide member placement position of the stage is set around the mounting location. 但是,该方式存在着引导部件的位置设定非常困难那样的问题。 However, this way the position of the guide member there is a problem that is very difficult to set. 即,为了正确地将基板引导到载物台上的设定载置位置,可以将引导部件配置在刚好通过基板的位置上,但是当这样地紧密时与输送机器人的交接变得困难了。 That is, in order to correctly set the substrate to guide the placement position of the stage, the guide member may be disposed at a position just on the substrate by, but when this is difficult to close when the delivery of the transfer robot. 因此,只好将引导部件配置在具有某种程度的空间富裕(间隙) 使基板落入的位置中,但是存在着富裕(间隙)越大,与平滑地进行基板交接相反,在载物台上基板位置偏离变得越大那样的需要折衷的问题。 Thus, the guide member had to be arranged in a space having a certain degree of rich (gap) of the substrate falls position, but there are FE (gap) increases, and the opposite substrate transfer smoothly performed, the substrate on the stage positional deviation becomes larger as the issue requires compromise.

此外,也将用在水平方向中往复直进移动的推动机构,在x方向和/或Y方向中从两侧夹入基板决定基板位置的基板定位装置用于各种FPD用处理装置中。 Further, also in the horizontal direction with a reciprocating rectilinear movement of the driven mechanism, in the x-direction and / or Y direction of the substrate is sandwiched substrate positioning apparatus determines the position of the substrate for various FPD devices treatment from both sides. 但是,要将这种已有的基板定位装置应用于无自旋方式的抗蚀剂涂敷装置是困难的。 However, to such a conventional substrate positioning device is applied to the resist coating apparatus spinless embodiment is difficult. 即,直进型的推动机构存在着需要相当的专用空间,导致载物台周围的大型化和烦杂化,不能避免与长条型抗蚀剂喷嘴用扫描机构的干涉等的难题。 That is, the straight-type mechanism there is a need to promote the considerable space dedicated led around a stage of large-scale and complicated, and can not be avoided long resist nozzle scanning mechanism like an interference problem.

发明内容 SUMMARY

本发明就是鉴于这种已有技术的问题提出的,本发明的目的是提供能够省空间高效率地决定被处理基板位置的基板处理装置和基板定位装置。 The present invention in view of such problems of the prior art, and an object of the present invention is to provide a high efficiency can be determined by a space-saving apparatus and a substrate processing apparatus for processing a substrate positioning the substrate position.

本发明的别的目的是提供兼备引导被处理基板的功能和定位功能的基板处理装置。 Another object of the present invention is to provide a substrate processing apparatus are both guiding and positioning function processing of the substrate.

本发明的别目的是提供能够短时间高效率地将被处理基板载置到载物台上和决定基板位置的基板处理装置。 Other object of the present invention is to provide a substrate processing apparatus to counter the stage and the determined position of the substrate in a short time with high efficiency the substrate to be processed.

为了达到上述目的,本发明的第一基板处理装置是将被处理基板载置在载物台上对上述基板实施规定处理的基板处理装置,它包括: 将上述基板在水平的X方向中可以变位地支撑在上述载物台的上面或它上方的支撑部;具有铅直方向的旋转中心线的旋转体、使该旋转体旋转的旋转驱动部、和与上述旋转体一体地旋转并利用上述旋转驱动部的旋转驱动力与上述基板的侧面接触在X方向按压上述基板的接触 To achieve the above object, a first substrate processing apparatus according to the present invention is a substrate to be processed facing the substrate processing apparatus performs predetermined processing on the substrate on the stage, comprising: the above-described substrate may be changed in the horizontal direction X bit supported above said stage, or its upper support portion; rotating body having a center line in the vertical direction, the rotational driving portion of the rotary body is rotated, and the rotating member and rotates integrally using the above rotational driving force of the rotation driving portion in contact with the side surface of the substrate pressed against the substrate in the X direction in contact

部,与上述旋转体的旋转角度相应在X方向移动上述接触部的位置的 Section, corresponding to the movement position of the contact portion in the X direction and the rotation angle of the rotating body

旋转型按压部;和将在X方向由上述旋转型按压部按压的上述基板挡 Rotary pressing portion; and a rotating pressed by the pressing portion in the X direction of the substrate stopper

住在相反侧的一定位置上的挡止部。 Stopper portion on the opposite side of the living in a predetermined position.

在上述第一基板处理装置中,在旋转型按压部的接触部退避到原来位置的状态下,可以将基板载置或配置在旋转型按压部和挡止部之间。 In the first substrate processing apparatus, in a state retracted to its original position in contact with the pressing portion of the rotary portion may be placed or disposed in the substrate between the pressing portion and the rotary stopper portion. 然而,当通过旋转型按压部使旋转驱动部动作使旋转体围绕旋转 However, when the operation of the rotary drive portion by pressing the rotary portion rotating about the rotating member

中心线旋转时,旋转型按压部的接触部从原来位置向基板沿X方向移 When the centerline of rotation, a contact portion of the rotary pressing portion is shifted from its original position in the X direction toward the substrate

动或变位与基板的边缘或侧面接触,原封不动地在同一方向将基板按入到规定位置,由挡止部挡住基板的相反侧。 Or a displacement of the movable contact with the edge or side of the substrate, intact in the same direction by the substrate into a predetermined position, the stopper block opposite side of the substrate. 这样,在将基板夹持在 Thus, when the substrate is held

旋转型按压部和挡止部之间的状态中完成基板的X方向的位置决定。 State between the pressing portion and the rotary stopper portion in the X-direction to complete positioning of the substrate.

如果根据上述第一基板处理装置中的一个优先实施方式,则在将基板夹持在旋转型按压部的^^触部和挡止部之间的状态中,旋转型按压部使接触部停止往动(前进)。 According to the above first substrate processing apparatus of a preferred embodiment embodiment, the substrate is in a state sandwiched between the rotary pressing portion ^^ contact portion and the stopper portion, the rotary pressing portion to the contact portion stops move (forward). 在这种构成中,不需要在夹持状态的基板上加上过大或必要以上的压力就行,能够保证基板的安全。 In this configuration, no need to put too much or more than the necessary pressure on the substrate clamped state on the line, it is possible to ensure the safety of the substrate.

又,如果根据一个优先实施方式,则旋转型按压部的旋转体具有用于在铅直方向中引导基板,向上端直径逐渐变小的锥形部。 Further, if the embodiment according to one preferred embodiment, the rotating body rotating the pressing portion has a tapered portion for guiding the substrate in the vertical direction, the diameter becomes gradually smaller toward the upper end. 又,挡止部也可以具有用于在铅直方向中引导基板,向上端直径逐渐变小的锥形部。 Further, the stopper portion may have a tapered portion for guiding the substrate in the vertical direction, it becomes gradually smaller toward the upper diameter. 在这种构成中,在旋转型按压部的旋转体和挡止部与基板的相对位置关系中,能够使基板平滑地落入,能够使旋转体十全十美地发挥引导基板功能。 In this configuration, the relative positional relationship between the rotary member and the rotary pressing portion of the stopper portion and the substrate, it is possible to smoothly fall into the substrate, the rotating body can be exhibited perfect guiding function of the substrate.

又,如果根据一个优先实施方式,则旋转型按压部的旋转体具有大致圆形或圆弧的横截面轮廓形状,旋转体的中心轴从旋转中心线偏离。 Further, if the embodiment according to one preferred embodiment, the rotary member having a rotary pressing portion is substantially circular or arcuate cross-sectional profile shape, the central axis of the rotary body deviates from the rotation center line. 在该构成中,使旋转型按压部的旋转体进行偏心旋转运动可以自 In this configuration, the rotating body of the rotary pressing portion can rotate eccentrically from

然地进行X方向的移动,能够在必要的最小限度的占有面积中实施按压基板的功能。 Mobile X-direction naturally possible to implement the function of pressing the board at a necessary minimum in the occupied area. 这时,能够在旋转体的外周面上形成接触部。 In this case, the contact portion can be formed on the outer circumferential surface of the rotary member.

或者,作为旋转型按压部的一个优先实施方式,也可以将可以对旋转体相对旋转的环状部件安装在旋转体上,在该环状部件的外周面上形成接触部。 Alternatively, the embodiment as a preferred embodiment of the rotary pressing portion, may be of the rotating body relatively rotatable annular member is mounted on the rotating body, a contact portion is formed on an outer peripheral surface of the annular member. 在这种构成中,环状部件与基板接触按压时围绕旋转体旋转运动,能够减少摩擦。 In this configuration, the rotary body about the rotational movement of the annular member can be reduced friction contact with the substrate during the pressing. 又,具有不将与基板接触的部位固定在一个地方,每次都发生变化那样的优点。 Further, the portion having no contact with the substrate is fixed in one place, each merit that changes have occurred.

又,作为旋转型按压部的另一个优先实施方式,也可以旋转型按 Further, another preferred embodiment of a pressing portion of a rotary type embodiment, may be a rotary press

压部的旋转体具有大致椭圆的横截面轮廓形状,在旋转体的外周面上形成接触部。 Pressure rotating body portion having a generally elliptical cross-sectional contour shape, the contact portion is formed on the outer circumferential surface of the rotary member. 这时,旋转体的中心轴既可以与旋转中心线一致,也可以从旋转中心线偏离。 In this case, the central axis member may be aligned with the rotation center line may be offset from the centerline of rotation.

又,作为旋转型按压部的另一个优先实施方式,也可以形成具有从旋转体在水平方向延伸的臂部,将接触部设置在该臂部的前端的构成。 Further, another preferred embodiment of a pressing portion of the rotary embodiment may have a configuration formed from a rotating arm extending in a horizontal direction, the contact portion is provided at a front end of the arm. 该构成,取用占有空间,但是能够采用旋转体具有圆形的横截面形状,它的中心轴可以与旋转中心线一致的构造。 With this configuration, access to the occupied space, but can be a rotary member having a circular cross-sectional shape, configuration may coincide with the rotation center line on its central axis.

本发明中的挡止部可以采用任意的形状或构造,但是为了减少与基板的接触摩擦,优选具有将中心轴作为旋转中心可以自旋转的圆柱或圆筒状的旋转体。 In the present invention, the stopper portion may take any shape or configuration, but in order to reduce contact friction with the substrate, preferably with the center of the rotation axis as a rotation from the rotation center can be cylindrical or columnar.

本发明的第二基板处理装置是将被处理基板载置在载物台上对上述基板施加规定处理的基板处理装置,它包括:将上述基板在水平方向中可以变位地支撑在上述载物台的上面或它上方的支撑部;具有铅直方向的旋转中心的第一旋转体、使该第一旋转体旋转的第一旋转驱动部、和与上述第一旋转体一体地旋转并利用上述第一旋转驱动部的旋转驱动力与上述基板的侧面接触在水平的X方向按压上述基板的第一接触部,与上述第一旋转体的旋转角度相应在X方向移动上述接触部的位置的第一旋转型按压部;在X方向将由上述第一旋转型按压部按压的上述基板挡住在相反侧的一定位置上的第一挡止部;具有铅直方向的旋转中心的第二旋转体、使该第二旋转体旋转的第二旋转驱动部、和与上述第二旋转体一体地旋转并利用上述第二旋转驱动部的旋转驱动力与上述 A second substrate processing apparatus according to the present invention is a substrate to be processed disposed in a substrate processing apparatus is applied to the stage of the substrate to the predetermined processing, comprising: the above-described substrate may be changed in the horizontal direction in the above-described bit loading is supported the above table or supporting it above the portion; a first rotary member having a rotation center in the vertical direction, the rotational driving of the first portion of the first rotating body rotates, and with the first rotating member and integrally rotating by the above the first contact portion of the first rotation driving force of the rotation driving portion in contact with the side surface of the substrate pressed against the substrate in the horizontal direction X, a position corresponding movement of the contact portion with the rotation angle of the first rotating body in the X direction a rotary pressing portion; in the X-direction of the substrate by said first pressing portion pressing the rotary block on the opposite side of the predetermined position on the first stopper portion; a second rotary member having a rotation center in the vertical direction, so that second rotation driving portion of the second rotating body, and rotation of the second rotating member and integrally with a rotary driving force of the second driving portion rotating with said 板的侧面接触在水平的Y方向按压上述基板的第二接触部,与上述第二旋转体的旋转角度相应在上述Y方向移动上述接触部的位置的第二旋转型按压部;和在Y方向将由上述第二旋转型按压部按压的上述基板挡住在相反侧的一定位置上的第二挡止部。 The second contact portion of the contact pressing side panel in the Y direction of the substrate is horizontal, and the rotation angle of the second rotating body rotating the pressing portion corresponding to the second movement position of the contact portion in the Y-direction; and a direction Y said substrate by said second rotary pressing portion of the pressing block at the opposite side of the predetermined position on the second stop portion.

在上述第二基板处理装置中,在第一旋转型按压部的第一接触部和第二旋转型按压部的第二接触部分别退避到原来位置的状态下,可以将基板载置或配置在第一和第二旋转型按压部与第一和第二挡止部之间。 In the second substrate processing apparatus, when not retracted to the original position state where the second contact portion contacts a first portion and a second portion of the rotary pressing portion pressing a first rotary type, or may be arranged on the substrate placement the first and second rotary pressing portion of the first portion and the second stop between. 然而,当通过第一和第二旋转型按压部分别使第一和第二旋转驱动部动作使第一和第二旋转体围绕各自的旋转中心线旋转。 However, when the other of the first and second rotary drive unit rotating the first and second portions of the pressing operation of the first and second rotary body rotatable about a respective rotational centerline. 当这样做时,第一接触部从它的原来位置向基板侧沿X方向移动或变位与基板的边缘或侧面接触,原封不动地在同一方向将基板按入到规定位置, 另一方面第二接触部从它的原来位置向基板侧沿Y方向移动或变位与基板的边缘或侧面接触,原封不动地在同一方向将基板按入到规定位 When doing so, the first contact portion is moved from its original position toward the substrate in the X direction or the displacement of contact with the edge or side of the substrate, intact in the same direction by the substrate into a predetermined position, on the other hand the second contact portion is moved from its original position toward the substrate in the Y direction displacement or contact with the edge or side of the substrate, intact in the same direction into the substrate according to a predetermined place

置。 Home. 在X方向由第一挡止部挡住基板,在Y方向由第二挡止部挡住基板。 Blocked the substrate in the X direction by the first stop portion, in the Y direction by the second stopper block portion of the substrate. 这样,在将基板夹持在第一和第二旋转型按压部和第一和第二挡止部之间的状态中完成基板的X方向和Y方向的位置决定。 Thus, the substrate holder decided to complete the X-direction and Y-direction of the substrate in the state between the first and second rotary pressing portion and the first portion and the second stop position.

如果根据本发明的第二基板处理装置中的一个优先实施方式,则基板形成四边形,第一和第二接触部分别与基板的相邻接的第一和第二边接触,将基板的与第一边对置的第三边按压在第一挡止部上,将基板的与上述第二边对置的第四边按压在第二挡止部上。 According to one preferred embodiment, if the substrate processing apparatus of the second embodiment according to the present invention, the substrate is formed of a quadrilateral, the first and second contact portions of the first and second sides of the substrate in contact with the adjacent contact, the first substrate a third side opposite the first side is pressed against the stop portion, with the second substrate side opposing fourth side is pressed against the second stop portion. 在这种构成中,旋转型按压部和挡止部以基板的一条对角线作为境界分在两边。 In this configuration, the rotary pressing portion and a stopper portion in a diagonal of the substrate as the boundary points on both sides. 这时,以第一接触部与基板的第一边上的至少2个地方接触的方式, 设置至少2个第一旋转型按压部的构成,或者以第二接触部与基板的第二边上的至少2个地方接触的方式,设置至少2个第二旋转型按压部的构成是优选的。 In this case, as to the first contact portion and the first side of the at least two places in contact with the substrate, constituting a first set of at least two of the rotary pressing portion, or in a second side of the substrate with the second contact portion embodiment where at least two of the contact, constituting the at least two second rotary pressing portion is preferred. 这样,通过在2个地方以上按压基板的1边使基板并进地移动,能够高效率地决定位置。 Thus, by one side pressed at two places or more and thus move the substrate to the substrate, the position can be determined efficiently.

又,如果根据一个优先实施方式,则在将基板夹持在第一接触部和第一挡止部之间的状态中,第一旋转型按压部使第一接触部停止往动(向前运动、前进、在按压方向的运动),在将基板夹持在第二接触部和第二挡止部之间的状态中,第二旋转型按压部使第二接触部停止往动。 Further, if the embodiment according to one preferred embodiment, the substrate is in a state sandwiched between the first contact portion and the first stop portion, the first portion of the rotary pressing the first contact portion stops the forward movement (forward movement , forward movement in the pressing direction), the substrate sandwiched between the second contact portion and the second portion of the stopper state, the second rotary pressing portion contacting the second portion to stop forward movement. 这时,第一和第二旋转型按压部在大致相同的时刻停止用于按压基板的第一和第二接触部的往动是优选的。 In this case, the first and second rotary pressing portion at substantially the same timing for stopping the forward movement of the first and second pressing contact portion of the substrate is preferred. 即便在这种构成中,不需要在夹持状态的基板上加上过大或必要以上的压力就行,能够保证基板的安全。 Even in this configuration, no need to put too much or more than the necessary pressure on the substrate clamped state on the line, it is possible to ensure the safety of the substrate.

又,如果根据一个优先实施方式,则通过由支撑部将基板支撑在比载物台的上面高的位置上,由旋转型按压部和挡止部决定基板的位置。 Further, if the embodiment according to one preferred embodiment, the support by the substrate support portion than in the upper position of the stage, the position of the substrate is determined by the rotary stopper portion and the pressing portion. 这时,支撑部具有可以升降的多个支撑销,支撑销的销前端部托住基板的下面,大致水平地支撑基板是优选的。 In this case, the support portion having a plurality of support pins may be raised and lowered, the pin leading end portion of the support pin hold the substrate below the support substrate substantially horizontally are preferred. 又,为了将基板载置在载物台的上面,使支撑销下降到比载物台的上面低的位置是优选的。 Further, the substrate is mounted to the top of the stage, the supporting pin down to lower than the top position of the stage is preferable. 进一步,具有使支撑部的支撑销、旋转型按压部和挡止部一起升降移动的升降部是优选的。 Further, the support pin having a support portion, the pressing portion and the rotary stopper portion is moved up and down the lift unit preferably together. 在这种构成中,经过支撑部或支撑销在输送部 In this configuration, the supporting portion through the transport or support pin portion

件和载物台之间进行基板交换,并且能够在将基板载置在支撑销上的期间中决定基板的位置。 Be exchanged between the member and the substrate stage, and can determine the position of the substrate during substrate is mounted on the support pin. 又,也可以在比载物台的上面高的第一位置上将基板安置在支撑部的支撑销上,从该第一位置到载物台的上面下降基板的途中,由旋转型按压部和挡止部决定基板的位置,因此也能够縮短生产节拍时间。 Further, the support may be a support pin portion, from the first position to the upper stage of the way down in the substrate than the upper stage of the first position is disposed on a substrate, and the rotary pressing portion stop portion determines the position of the substrate, and therefore it is possible to shorten the tact time.

又,作为一个优先实施方式,也可以形成具有用于由真空吸附力将基板固定在载物台的上面的固定部的构成。 Further, as a preferred embodiment embodiment, may be configured with a fixed portion formed by a vacuum suction force for the substrate is fixed on top of the stage. 这时,能够在从支撑部的支撑销将基板实质上移载在载物台的上面后,固定部立即幵始对基板的真空吸附,旋转型按压部使接触部回动(向后运动:后退),放开上述基板。 In this case, it is possible from the support pin supporting portion of the substrate substantially above the transfer stage after the fixed portion of the vacuum suction immediately starts its substrate, the contact portion of the rotary pressing portion movable back (backward movement: backward), release of the substrate.

如果根据一个优先实施方式,则将处理液(例如抗蚀剂液)涂敷在载置在载物台上的基板的上面。 If According to one preferred embodiment, the liquid will be (e.g. resist liquid) is placed above the coated substrate in the stage of processing. 特别是,当使用长条型的涂敷喷嘴时,能够得到很大的优点。 In particular, when a long bar coating nozzle, a great advantage can be obtained. 或者,也能够将本发明适当地应用于对载物台上的基板施加热处理的处理装置。 Alternatively, the present invention can be suitably applied to the processing means applying heat to the substrate on a stage.

本发明的基板定位装置是对在水平方向可以变位地支撑着的被处理基板在水平的X方向进行定位的基板定位装置,它包括:具有沿铅直方向延伸的旋转轴、使该旋转轴旋转的旋转驱动部、和与上述旋转轴一体地旋转并利用上述旋转驱动部的旋转驱动力与上述基板的侧面接触在X方向按压上述基板的接触部,与上述旋转轴的旋转角度相应在X方向移动上述接触部的旋转型按压部;和将在X方向由上述旋转型按压部按压的上述基板挡住在相反侧的一定位置上的挡止部。 Substrate positioning apparatus according to the present invention is the positioning device of the substrate can be displaced in the horizontal direction of the support substrate to be processed is positioned in a horizontal X-direction, comprising: a rotary shaft extending in the vertical direction, so that the rotation shaft rotation driving section to rotate, and the rotation of the rotary shaft integrally, and by the contact portion of the rotational driving force of the rotation driving portion in contact with the side surface of the substrate pressed against the substrate in the X direction, the rotation angle of the rotation shaft corresponding to the X rotating direction of the contact portion of the pressing portion; and pressing the substrate by the rotation-type pressing portion in the X direction in the block opposite to the stopper portion on the side of the predetermined position.

本发明的基板定位装置在决定基板位置方面能够起到与本发明的基板处理装置同样的作用效果,也可以适用于不使用载物台的基板处理装置或基板输送装置等。 A substrate positioning device according to the present invention in determining the position of the substrate could play the same effects as the substrate processing apparatus according to the present invention can also be applied to a substrate without using a substrate transfer apparatus or a processing apparatus of the stage and the like.

如果根据本发明的基板处理装置和基板定位装置,则除了能够省空间高效率地决定被处理基板位置外,也可以并有引导被处理基板的功能和决定位置的功能。 If the substrate processing apparatus and a substrate positioning apparatus according to the present invention, the addition can be determined with high efficiency, space-saving position outside the substrate to be processed, and may guide the functions and processing functions determine the position of the substrate. 又,能够短时间高效率地将被处理基板载置到载物台上和决定基板位置。 And, a short time can be efficiently processed substrate to be opposed to the stage and the determined position of the substrate.

附图说明 BRIEF DESCRIPTION

图1是表示可以应用本发明的涂敷显像处理系统的构成的平面图。 1 is a plan view showing a coating constituting the developing processing system according to the present invention can be applied. 图2是表示上述涂敷显像处理系统中的热处理部的构成的侧面图。 FIG 2 is a side view of the configuration of the coating unit heat developing processing system.

图3是表示上述涂敷显像处理系统中的处理顺序的流程图。 FIG 3 is a flowchart showing the processing procedure of developing the coating system. 图4是表示上述涂敷显像处理系统中的抗蚀剂涂敷单元内的主要构成的立体图。 FIG 4 is a perspective view showing a main configuration of the resist coating in the coating unit developing processing system.

图5是表示上述抗蚀剂涂敷单元中的主要部分的构成的立体图。 FIG 5 is a perspective view of a main portion of the resist coating unit. 图6是表示上述抗蚀剂涂敷单元中的主要部分的构成的纵向截面图。 FIG 6 is a longitudinal sectional view showing a main part configuration of the resist coating unit.

图7是表示上述抗蚀剂涂敷单元中的主要部分的构成的纵向截面图。 FIG. 7 is a longitudinal sectional view showing a main part configuration of the resist coating unit.

图8是表示实施方式中的载物台上的设定载置位置和定位销的位 FIG 8 is a diagram showing the setting position and the mounting position of the positioning pin of the embodiment of a stage

置关系的大略平面图。 Rough plan view of the positional relationship.

图9是表示实施方式中的偏心可动定位销的立体图。 FIG 9 is a diagram showing embodiments of the movable eccentric perspective view of the positioning pin.

图IO是表示实施方式中的偏心可动定位销的偏心旋转运动的轨迹的图。 FIG IO is a diagram illustrating the trajectory embodiment eccentric positioning pin movable eccentric rotational movement.

图11是表示实施方式中的偏心可动定位销的适当的旋转方向的大略立体图。 FIG 11 is a rough perspective view illustrating the embodiment of the movable eccentric appropriate rotational direction of the positioning pin.

图12是表示实施方式中的偏心可动定位销(特别是套环)和提升 FIG 12 is a diagram showing embodiments of the movable eccentric positioning pins (particularly the collar) and lifting

销的作用的一部分截面的大略侧面图。 Rough sectional side view of a portion of the pin action.

图13是表示实施方式中完成基板定位后的状态的大略平面图。 13 is a rough plan view showing a state after the completion of the substrate positioning embodiment. 图14是表示实施方式中当将基板载置在载物台上时的一个阶段的 FIG 14 is a diagram showing embodiment when the substrate is disposed in a stage when the stage of

纵向截面图。 A longitudinal sectional view.

图15是表示实施方式中当将基板固定在载物台上时的一个阶段的纵向截面图。 FIG 15 is a longitudinal sectional view of one embodiment of phase when the substrate is fixed at the stage of the.

图16是表示实施方式中的抗蚀剂涂敷处理的作用的大略侧面图。 FIG 16 is a side view roughly showing the effect of coating process embodiment resist. 图17是表示实施方式中的粒子除去部的一个构成例的纵向截面图。 FIG 17 is a diagram showing an embodiment of the removing portion longitudinal sectional view of a particle configuration.

图18是表示实施方式中的可动定位销的一个变形例的立体图。 FIG 18 is a view showing the embodiment of a positioning pin of the movable perspective view of a modification.

图19是表示图18的可动定位销的作用的大略平面图。 FIG 19 is a plan view roughly showing the movable positioning pin 18 of the action of FIG.

图20是表示基于另外的实施方式的可动定位销的构成的立体图。 FIG 20 is a diagram showing another embodiment of the movable perspective view of a positioning pin.

标号说明:82抗蚀剂涂敷单元(CT); 112载物台;H4抗蚀剂喷嘴;116涂敷处理部;130真空吸附口; 132提升销;138贯通孔;140 Reference numeral DESCRIPTION: 82 the resist coating unit (CT); 112 stage; H4 resist nozzle; coating processing section 116; 130 vacuum suction port; lift pins 132; 138 through hole; 140

升降台;144升降驱动部;148 ( 148A〜148D)固定定位销;150 (150A〜150D)可动定位销;150a销本体;150b套环;150c臂部;画接触部件;151贯通孔;152旋转驱动部;154旋转驱动轴;160粒子 Lifts; lift driving section 144; 148 (148A~148D) fixedly positioned pin; 150 (150A~150D) positioning of the movable pin; pin body 150a; 150b collar; 150c arm; Videos contact member; through hole 151; 152 rotation driving portion; rotating drive shaft 154; 160 particles

吸入口。 suction point.

具体实施方式 Detailed ways

下面,我们一面参照附图一面说明本发明的优先实施方式。 Next, how the side description of the preferred embodiments of the present invention with reference to the accompanying drawings. 图1表示作为能够应用本发明的基板处理装置的一个构成例的涂敷显像处理系统。 FIG 1 shows a substrate processing apparatus according to the present invention can be applied to a coating system configuration example of developing processing. 该涂敷显像处理系统10,设置在清洁室内,例如将LCD基板作为被处理基板,在LCD制造过程中进行光刻工序中的洗净、抗蚀剂涂敷、预烘焙、显像和后烘焙等的一连串处理。 The coating developing processing system 10, disposed in a clean room, for example, an LCD substrate as a substrate to be processed is cleaned in a photolithography process, the resist coating, prebaked, after imaging and LCD manufacturing process baking and other series of processes. 曝光处理由与该处理系统邻接地设置的外部曝光装置12进行。 Exposing the exposure process by an external means and provided adjacent to the processing system 12.

该涂敷显像处理系统10,在中心部分配置横向长的处理台(P/S) 16,在其长边方向(X方向)两端部配置盒载置台(C/S) 14和接口台(I/F) 18。 The coating developing treatment system 10, arranged in the central portion of a laterally long processing stations (P / S) 16, in which the longitudinal direction (X-direction) of both end portions arranged on the cassette mounting table (C / S) 14 and an interface station (I / F) 18.

盒载置台(C/S) 14是系统10的盒输出输入端口,备有在水平方向例如Y方向可以直到4个地并列载置以多段重叠的方式可以收容多块方型的玻璃基板G的盒C的盒载置台20和使基板G出入该盒载置台20上的盒C的输送机构22。 Cassette mounting table (C / S) 14 is a cassette input and output ports of the system 10, with, for example, the Y direction may be up to four juxtaposed placed in an overlapping manner multistage may house a plurality of rectangular glass substrate in a horizontal direction G cartridge C on the cassette mounting table 20 and the substrate G is placed out of the cassette C on the cassette transport mechanism 20 of the stage 22 输送机构22具有能够保持基板G的部件例如输送臂22a,可以用X、 Y、 Z、 e这样4个轴进行动作,与邻接的处理台(P/S) 16—侧进行基板G的交接。 Transport mechanism 22 capable of holding a substrate having, for example, G is the transfer arm member 22a, can be operated with X, Y, Z, so that four axes e, transferring the substrates G to the processing stage (P / S) 16- adjacent to the side.

处理台(P/S) 16,以处理流程或工序的顺序将各处理部配置在系统长边方向(X方向)延伸的平行并且反向的一对直线A、 B上。 Processing station (P / S) 16, or the order of the processing flow of step portions each disposed in a parallel processing system, the longitudinal direction (X direction) and a pair of linear inverse A, the B. 更详细地说,在从盒载置台(C/S) 14—侧向着接口台(I/F) 18—侧的上游部的处理线A上横向一列地配置着洗净处理部24、第一热处理部26、 涂敷处理部28、和第二热处理部30。 More specifically, in the cassette mounting table (C / S) 14- station side to an interface (I / F) on a processing line A side of the upstream portion 18 disposed transversely with a cleaning processing section 24, a first a heat treatment unit 26, 28, 30 and the second coating processing section heat treatment. 另一方面,从接口台(I/F) 18 一侧向着盒载置台(C/S) 14 —侧的下游部的处理线B上横向一列地配置着第二热处理部30、显像处理部32、脱色处理部34和第三热处理部36。 On the other hand, from the table an interface (I / F) 18 toward the side of the cassette mounting table (C / S) 14 - 30 is disposed, heat developing processing section of the second portion laterally in a row on the downstream portion of the processing line B side 32, 34 and the third section decoloring heat treatment unit 36. 在该直线形态中,第二热处理部30位于上游侧的处理线A 的最后尾并且位于下游侧的处理线B的前头,横跨在两条直线A、 B之间。 In this aspect straight line, the second heat treatment process at the tail portion 30 located at the upstream side of the line A and the line B is located at the top of the processing downstream, spans between two straight lines A, B.

将辅助输送空间38设置在两条处理线A、 B之间,可以以1块为单位水平地载置基板G的往复器40由于图中未画出的驱动机构能够在直线方向(X方向)中双向地移动。 The auxiliary conveying space 38 is provided between the two processing lines A, B, the unit may be a horizontally placed substrate G shuttle 40 due to the driving mechanism not shown in FIG capable linear direction (X direction) bi-directional move.

在上游部的处理线A上,洗净处理部24包含擦洗洗净单元(SCR) 42,在该擦洗洗净单元(SCR) 42内的与盒载置台(C/S) 14邻接地方配置着准分子UV照射单元(e-UV) 41。 A process in the upstream portion of the line, cleaning treatment unit 24 comprises a scrubbing cleaning unit (SCR) 42, the scrubbing cleaning unit (SCR) and the cassette mounting table (C / S) 14 is disposed adjacent to the place in the 42 excimer UV irradiation unit (e-UV) 41. 擦洗洗净单元(SCR) 42 内的洗净部, 一面通过滚轴输送或传送带输送以水平姿势沿直线A方向输送基板G, 一面对基板G的上面(被处理面)施加刷子清洗或吹风清洗。 Scrub washing units (SCR) in the cleaning unit 42, the conveying roller side by a conveyor belt or conveying the substrate G in a horizontal posture in a linear direction A, a top face of the substrate G (surface to be treated) is applied to the cleaning brush or hair cleaning.

与洗净处理部24的下游侧邻接的第一热处理部26,沿处理线A 在中心部设置立式的输送机构46,在它们的前后两侧设置与交接基板用的通过单元一起多段地重叠配置多个单片式开口部的多段单元部或开口塔(TB) 44、 48。 26, disposed along the processing line A in the center portion of the vertical heat treatment of the first side portion adjacent to the downstream portion 24 of the cleaning process the transport mechanism 46, with multistage superimposed front and rear sides thereof by means provided with a transfer substrate means arranged multistage monolithic unit a plurality of openings or opening column (TB) 44, 48.

例如,如图2所示,在上游测的开口塔(TB) 44中,从下向上顺序地重叠基板运入用的通过单元(PASSL) 50、脱水烘干用的加热单元(DHP) 52、 54和粘附单元(AD) 56。 For example, as shown in FIG measured upstream of the column in the opening (TB) 44, by overlapping with the substrate carrying unit 2 sequentially from the bottom up (PASSL) 50, dewatering the dry heating unit (DHP) 52, 54 and adhesion units (AD) 56. 这里,通过单元(PASSL) 50提供用于将来自擦洗洗净单元(SCR) 42的完成洗净处理的基板G 运入到第一热处理部26内的空间。 Here, the providing unit 50 (VpassL) for scrubbing the substrate G from the cleaning unit (SCR) to complete the cleaning process is carried into the space 42 within the portion 26 of the first heat treatment. 在下游侧的开口塔(TB) 48中, 从下向上顺序地重叠基板运出用的通过单元(PASSR) 60、基板温度调整用的冷却单元(COL) 62、 64和粘附单元(AD) 66。 In the opening side of the downstream column (TB) 48, the overlap in this order from the substrate up through the cell with the shipped (PASSR) 60, the substrate temperature adjusting a cooling unit (COL) 62, 64 and adhesion unit (AD) 66. 这里,通过单元(PASSR) 60提供用于将在第一热处理部26中完成所要热处理的基板G运出到下游侧的涂敷处理部28的空间。 Here, to provide space for the coating process shipped out to the downstream side of the first heat treatment in the heat treatment section to be completed in the substrate 26 by means G 28 (PASSR) 60.

在图2中,输送机构46具有沿在铅直方向延伸的导轨68可以升降移动的升降输送体70、在该升降输送体70上可以在e方向转动或旋转的旋转输送体72、在该旋转输送体72上一面支撑基板G, 一面可以在前后方向进退或伸縮的输送臂或销组合74。 In FIG 2, the conveying mechanism 46 along the guide rail 68 extending in the vertical direction of the lift can be moved up the transport body 70 can be turned or rotated in a direction e in the elevating conveyor 70 rotating transport body 72, the rotation G side of the support substrate transport body 72, one side or forward and backward may be telescopic in the longitudinal direction or conveying arm pin 74 combination. 将用于升降驱动升降输送体70的驱动部76设置在垂直导轨68的基端侧,将用于旋转驱动旋转输送体72的驱动部78安装在升降输送体70上,将用于进退驱动输送臂74的驱动部80安装在旋转输送体72上,各驱动部76、 78、 80 例如可以由电动马达等构成。 For driving the lift driving unit 76 lift conveyer 70 provided on the base end side of the vertical guide 68, for rotationally driving the rotary drive portion 78 of body 72 is mounted on the lift conveyor 70, for driving forward and backward transport the drive unit 80 of arm 74 mounted on the rotary conveyor 72, the respective driving portions 76, 78, 80 may be constituted by an electric motor or the like.

如上所述地构成的输送机构46可以高速地升降或旋转运动地在两 The conveying mechanism 46 may be configured as described above at high speed down or rotational movement in two

邻的开口塔(TB) 44、 48中的任意部中进行存取,也能够与辅助输送空间38侧的往复器40进行基板G的交接。 Column opening (TB) 44 o, 48 of any portion of the access, it is possible with the auxiliary space 38 side of the shuttle conveyor 40 transferring the substrates G is.

与第一热处理部26的下游侧邻接的涂敷处理部28,如图1所示, 沿处理线A —列地配置着抗蚀剂涂敷单元(CT) 82和减压干燥单元(VD) 84。 Adjacent to the downstream side of the first portion 26 of the heat-treated coating process portion 28, as shown, along the processing line A 1 - row arranged with the resist coating unit (CT) 82 and a vacuum drying unit (VD) 84. 涂敷处理部28内的构成在后面详细说明。 Constituting the coating process portion 28 described in detail later.

与涂敷处理部28的下游侧邻接的第二热处理部30,具有与上述第一热处理部26同样的构成。 Adjacent to the downstream side of the coating portion 28 of the second heat treatment processing portion 30 has the same configuration as the first thermal treatment unit 26. 在两处理线A、 B之间设置立式的输送机构90,在处理线A侧(末尾)设置一方的开口塔(TB) 88,在处理线B侧(前头)设置另一方的开口塔(TB) 92。 In the two processing lines A, B is provided between the vertical transport mechanism 90, one column is provided an opening (TB) in the processing line A side (end) 88, an opening is provided in the other of the processing column line B side (top) ( TB) 92.

虽然图示中省略了,但是例如,可以在处理线A侧的开口塔(TB) 88中,将基板运入用的通过单元(PASSl)配置在最下段,在它上面例如3段重叠预烘焙干用的加热单元(PREBAKE)。 Although illustration is omitted, but for example, may be 88 in the opening column (TB) treatment line A side, through means (VpassL) substrate carrying configuration used in a lowermost, 3 sections overlap prebaked e.g. on it a heating unit (PREBAKE) dry use. 又,可以在处理线B侧的开口塔(TB) 92中,将基板运出用的通过单元(PASSR)配置在最下段,在它上面例如1段重叠基板温度调整用的冷却单元(COL),又在它上面例如2段重叠预烘焙干用的加热单元(PREBAKE)。 They may be (TB) 92, the substrate carrying-in opening of the column the processing line B side out through the cell with (PASSR) arranged in the lowermost, on top of it, for example, a segment overlaps the substrate temperature adjustment of the cooling unit (COL) , and above it, for example, two periods overlap with prebaked dry heating unit (pREBAKE).

第二热处理部30中的输送机构卯不仅能够经过两开口塔(TB) 88、 92的各个通过单元(PASSJ、 (PASSR)以1块为单位与涂敷处理部28和显像处理部32交接基板G,而且能够以1块为单位与辅助输送空间38内的往复器40和后述的接口台(I/F) 18交接基板G。 D conveyance mechanism section 30 in the second heat treatment can not only through two openings column (TB) by the respective units 88, 92 (PASSJ, (PASSR) in a unit of the coating process and the developing unit 28 transfer processing unit 32 the substrate G, but also an interface 40 described later stage (I / F) 18 to transfer the substrate 38 to reciprocate within the auxiliary unit is a conveying space G.

在下游部分的处理线B中,显像处理部32包含一面以水平姿势输送基板G, 一面进行一连串的显像处理工序的所谓的平稳方式的显像单元(DEV) 94。 In the process of the downstream portion of the line B, the processing unit 32 includes a developing unit developing a so-called stationary manner on one side in a horizontal posture conveying the substrate G, a series of one side of the developing process step (DEV) 94.

在显像处理部32的下游侧夹着脱色处理部34配置了第三热处理部36。 The downstream side portion 32 of the developing process section 34 is arranged to sandwich the decoloring processing unit 36 ​​of the third heat treatment. 脱色处理部34备有用i线(波长365nm)照射基板G的被处理面用于进行脱色处理的i线UV照射单元(i-UV) 96。 Decoloring processing unit 34 equipped with the i-line (wavelength of 365 nm), i-line UV irradiation means irradiating the substrate surface to be processed G is for performing a decolorization treatment (i-UV) 96.

第三热处理部36具有与上述第一热处理部26和第二热处理部30 同样的构成,沿处理线B设置立式输送机构100和在它前后两侧设置一对开口塔(TB) 98、 102。 The third heat treatment portion 36 has the same configuration as the first thermal treatment portion 26 and the second heat treatment section 30, disposed along the processing line B and on both sides of the vertical transport mechanism 100 is provided a pair of openings at its front and rear column (TB) 98, 102 .

虽然图示中省略了,但是例如,可以在上游侧的开口塔(TB) 98 中,将基板运入用的通过单元(PASS^配置在最下段,在它上面例如 Although illustration is omitted, but for example, the column may be open on the upstream side (TB) 98, the substrate carrying unit by using (PASS ^ arranged at the lowermost section, for example, on top of it

3段重叠后烘焙用的加热单元(POBAKE)。 3-stage heating unit (POBAKE) after overlapping the baking. 又,可以在下游侧的开口塔(TB) 102中,将后烘焙单元(POBAKE)配置在最下段,在它上面1段重叠基板运出和冷却用的通过•冷却单元(PASSR • COL),在它上面2段重叠后烘焙用的加热单元(POBAKE)。 And, may be open column downstream (TB) 102, a post-baking unit (POBAKE) arranged in the lowermost, on top of it a section overlapping the substrate removal and cooling by • cooling unit (PASSR • COL), a heating unit (POBAKE) 2 after overlapping segments of baking thereon.

第三热处理部36中的输送机构100不仅能够经过两个多段单元部(TB)98、 102的通过单元(PASSl)和通过'冷却単元(PASSr 'COL), 分别以l块为单位与i线UV照射单元(i-UV) 96和盒载置台(C/S) 14交接基板G,而且也能够以1块为单位与辅助输送空间38内的往复器40交接基板G。 36 in the third heat treatment portion of the conveying mechanism 100 not only after more than two segment element portion (TB) by means (PASSl) 98, 102, and through the 'cooling radiolabeling element (PASSr' COL), respectively, l block units and i-line UV irradiation units (i-UV) 96 and the cassette mounting table (C / S) 14 to transfer the substrate G, but also can be transferred to the shuttle 40 in units of blocks 381 and the auxiliary substrate conveying space G.

接口台(I/F) 18具有用于与邻接的曝光装置12进行基板G的交换的输送装置104,在它的周围配置着缓冲'载物台(BUF) 106、扩展•冷却载物台(EXT • COL) 108和外围装置110。 An exposure station device interface (I / F) 18 has an abutment 12 of the delivery device 104 exchange substrate G, which is disposed around the buffer 'stage (BUF) 106, extension • cooling stage ( EXT • COL) 108 and the peripheral device 110. 在缓冲•载物台(BUF) 106上设置固定型的缓冲盒(图中未画出)。 Set a fixed type buffer cassette • on the buffer stage (BUF) 106 (not shown). 扩展"冷却载物台(EXT,COL) 108是备有冷却功能的交接基板用的载物台,当与处理台(P/S) 16侧交换基板G时使用。外围装置110例如可以形成在上下重叠字幕器(TITLER)和外围曝光装置(EE)的构成。输送装置104具有能够保持基板G的部件例如输送臂104a,可以与邻接的曝光装置12、各单元(BUF) 106、 (EXT'COL) 108、 (TITLER/EE) 110 进行基板G的交接。 Extended "cooling stage (EXT, COL) 108 is provided with a cooling function by the delivery of the substrate stage, is used when switching the substrate 16 side and the processing stations G (P / S). Peripheral device 110 may be formed e.g. configuration on top of each caption unit (Titler) and a peripheral exposure apparatus (EE) of the conveying device 104 having capable of holding the substrate G components, such as the transfer arm 104a, may be adjacent to the exposure device 12, each unit (BUF) 106, (EXT ' COL) 108, (TITLER / EE) 110 for transfer of the substrate G.

图3表示在该涂敷显像处理系统中的处理顺序。 3 shows a processing procedure in the coating developing processing system. 首先,在盒载置台(C/S) 14中,输送机构22从盒载置台20上的某个盒C中取出1 块基板G,运入到处理台(P/S) 16的洗净处理部24的准分子UV照射单元(e-UV) 41中(工序S,)。 First, in the cassette mounting table (C / S) 14, the conveying mechanism 22 contained in the cassette placed a cassette C on the table 20 is taken out one substrate G, transported into the washing processing stage (P / S) 16 of the portion excimer UV irradiation unit (e-UV) 41 in (step S,) 24 in.

在准分子UV照射单元(e-UV) 41内通过紫外线照射对基板G施加干式洗净(工序S2)。 Dry cleaning is applied (Step S2) of the substrate G excimer UV irradiation unit (e-UV) 41 by ultraviolet irradiation. 用该紫外线洗净主要除去基板表面的有机物。 The ultraviolet removed by washing the main surface of the organic substrate. 在紫外线洗净结束后,通过盒载置台(C/S) 14的输送机构22将基板G移动到洗净处理部24的擦洗洗净单元(SCR) 42。 After completion of the ultraviolet washed by the cassette mounting table (C / S) 22 of the transport mechanism 14 moves the substrate into the cleaning process unit G scrub cleaning unit (SCR) 24 42

在擦洗洗净单元(SCR) 42中,如上所述通过一面用滚轴输送或传送带输送以水平姿势沿处理线A方向平稳地输送基板G, 一面对基板G的上面(被处理面)施加刷子清洗或流水清洗,从基板表面除去粒子状的污染(工序S3)。 In the scrub washing units (SCR) 42, as described above with one side by a conveyor belt or conveying roller in a horizontal posture along the processing line A direction smoothly conveyed substrate G, an upper face of the substrate G (surface to be treated) is applied brush cleaning or water washing to remove particulate contamination (step S3) from the substrate surface. 而且,在洗净后一面平稳地输送基板G, 一 Further, the cleaned substrate is transported smoothly one surface G, a

面施加冲洗处理,最后用气刀(airknife)等使基板G干燥。 Rinsing treatment is applied to the surface, and finally with an air knife (airknife) substrate G drying the like.

将在擦洗洗净单元(SCR) 42内完成洗净处理的基板G平稳地运入到第一热处理部26的上游侧开口塔(TB)44内的通过单元(PASSJ 50。 The completion of the cleaning treatment within the cleaning unit 42 in scrubbing (SCR) substrate G is smoothly carried into the upstream side of the first heat treatment section 26 by a unit (PASSJ 50 within the opening 44 column (TB).

在第一热处理部26中,由输送机构46以规定的顺序顺次地将基板G移送到规定开口单元。 In the first heat treatment section 26, a predetermined order by the transport mechanism 46 sequentially transfer the substrates G to a predetermined opening section. 例如,最初将基板G从通过单元(PASSJ 50移动到加热单元(DHP) 52、 54中的1个,在那里接受脱水处理(工序S4)。接着,将基板G移动到冷却单元(COL) 62、 64中的1个, 在那里冷却到一定的基板温度(工序Ss)。此后,将基板G移动到粘附单元(AD) 56,在那里接受疏水处理(工序S6)。在该疏水处理结束后,在冷却单元(COL) 62、 64中的1个中使基板G冷却到一定的基板温度(工序S7)。最后,将基板G移动到下游侧开口塔(TB)48内的通过单元(PASSr) 60。 For example, initially the substrate G from the passing means (PASSJ 50 is moved to the heating unit (DHP) 52, 54 in the one, where the receiving dehydration treatment (step S4). Next, the substrate G is moved to the cooling unit (COL) 62 , 64 1, where the substrate is cooled to a certain temperature (step Ss). Thereafter, the substrate G is moved to the adhesion unit (AD) 56, where the hydrophobic receiving process (step S6). in the end of the hydrophobic treatment after the cooling unit (COL) 62, 64 G 1 between the substrate cooled to a certain substrate temperature (step S7). Finally, the substrate is moved to the downstream opening G column (TB) through the cell 48 within the ( PASSr) 60.

这样,在第一热处理部26内,基板G能够经过输送机构46在上游侧的多段开口塔(TB) 44和下游侧的开口塔(TB) 48之间任意地来往。 Thus, in the first heat treatment unit 26, the substrate G can be arbitrarily between 48 and from the tower through an opening 46 in the transport mechanism 44 and a downstream side opening of the multistage column (TB) on the upstream side (TB). 此外,在第二和第三热处理部30、 36中也能够进行同样的基板输送动作。 Further, heat treatment in the second and third portions 30, 36 can be subjected to the same substrate transfer operation.

将在第一热处理部26中接受上述一连串的热或热系处理的基板G,从下游侧开口塔(TB) 48内的通过单元(PASSR) 60移动到涂敷处理部28的抗蚀剂涂敷单元(CT) 82。 The heat treatment in the first receiving portion 26 of the above series of heat or heat-based process the substrate G from the downstream opening column (TB) by means (PASSR) 48 60 moves to the resist coating process portion 28 is coated plating unit (CT) 82.

在抗蚀剂涂敷单元(CT) 82中,基板G通过如后述那样用长条型的抗蚀剂喷嘴的无自旋法,在基板上面(被处理面)涂敷抗蚀剂液。 In the resist coating unit (CT) 82, such as a substrate G by applying a resist solution process of spin, as described later resist long nozzle type, above the substrate (surface to be treated). 其次,基板G在下游侧邻的减压干燥单元(VD) 84中接受由减压产生的干燥处理(工序S8)。 Next, the substrate G acceptable drying process (step S8) generated by the reduced pressure on the downstream side adjacent to vacuum drying unit (VD) 84 in.

将接受了上述那样的抗蚀剂涂敷处理的基板G从减压干燥单元(VD) 84运入到相邻的第二热处理部30的上游侧开口塔(TB) 88内的通过单元(PASSJ。 By means (PASSJ within the substrate 88 will be accepted as a resist coating process of vacuum drying unit from G (VD) 84 transported into the adjacent upstream side of the second heat treatment portion of the opening 30 column (TB) .

在第二热处理部30内,由输送机构90以规定的顺序顺次地将基板G移送到规定的单元。 In the second heat treatment section 30, the order by the transport mechanism 90 to a predetermined substrate G is sequentially transferred to a predetermined unit. 例如,最初将基板G从通过单元(PASSl) 移动到加热单元(PREBAKE)中的1个,在那里接受预烘焙的加热处 For example, the substrate G from the first through the cell (VpassL) is moved to the heating unit (PREBAKE) in 1, where the heat receiving prebaked

理(工序S9)。 Processing (step S9). 接着,将基板G移动到冷却单元(COL)中的1个,在那里冷却到一定的基板温度(工序S1Q)。 Next, the substrate G is moved to the cooling unit (COL) in 1, where the substrate is cooled to a certain temperature (step S1Q). 此后,经过或不经过下游侧开口塔(TB) 92侧的通过单元(PASSr),进行基板G到接口台(I/F) 18侧的扩展•冷却载物台(EXT • COL) 108的交接。 Thereafter, with or without passing means (PASSr) 92 side of the downstream opening column (the TB), for the substrate G transferred 108 18 side of the extension • cooling stage (EXT • COL) to an interface units (I / F) .

在接口台(I/F) 18中,将基板G从扩展*冷却载物台(EXT *COL) 108运入到外围装置110的外围曝光装置(EE),在那里接受了用于显像时除去附着在基板G的周边部分的抗蚀剂的曝光后,输送到相邻的曝光装置12 (工序Sn)。 In the interface units (I / F) 18, extended from the substrate G * cooling stage (EXT * COL) 108 transported into the peripheral exposure device (EE) of the peripheral device 110, where he received for imaging after the exposure in the peripheral portion adhered to the substrate G resist is removed, fed to 12 (step Sn) adjacent exposure apparatus.

在曝光装置12中对基板G上的抗蚀剂进行曝光形成规定电路图案。 Resist on the substrate G to form a predetermined circuit pattern is exposed in the exposure device 12. 而且,当使结束了图案曝光的基板G从曝光装置12回到接口台(I/F) 18时(工序S„),首先运入到外围装置110的字幕器(TITLER), 在那里将规定信息记录在基板上的规定部位(工序S12)。此后,使基板G回到扩展.冷却载物台(EXT* COL) 108。由输送装置104进行在接口台(I/F) 18中的基板G的输送和与曝光装置12的基板G的交换。 Further, when the end of the pattern exposure of the substrate G back to the interface station (I / F) 18 when (Step S ") from the exposure device 12, is first transported into the peripheral device subtitle (TITLER) 110, where the predetermined information is recorded on a predetermined portion of the substrate (step S12). Thereafter, the substrate G back extension. substrate table 18 in the interface (I / F) cooling stage (EXT * COL) 108. performed by the transport means 104 exchange transport substrate G and G of the exposure device 12.

在处理台(P/S) 16中,在第二热处理部30中,输送机构90从扩展*冷却载物台(EXT'COL) 108接受完成曝光的基板G,经过处理线B侧的开口塔(TB) 92内的通过单元(PASSR)进行到显像处理部32的交接。 In the treatment station (P / S) 16, the second heat treatment section 30, the transport mechanism 90 extend from the cooling stage * (EXT'COL) 108 receiving the substrate G exposure is completed, the treated column line B-side opening by means of the (TB) 92 (PASSR) for developing the handover processing unit 32.

在显像处理部32中,将从开口塔(TB) 92内的通过单元(PASSR) 接受的基板G运入到显像单元(DEV) 94。 In the developing processing unit 32, from the column an ​​opening (TB) by means within 92 (PASSR) receiving the substrate G carried into the developing unit (DEV) 94. 在显像单元(DEV) 94中, 以平稳方式向处理线B的下游输送基板G,在该输送中进行显像、冲洗、干燥等一连串显像处理工序(工序Su)。 In the developing unit (DEV) 94 in a smooth manner conveyed to downstream processing line B of the substrate G, then developed in the conveyance, rinsing, and drying a series of development processing step (step Su).

在显像处理部32中,平稳地将接受了显像处理的基板G运入到下游侧邻的脱色处理部34,在那里接受由i线照射产生的脱色处理(工序S14)。 In the developing processing unit 32, the accept smoothly the decoloring processing unit of the imaging substrate G is carried into the downstream side of the adjacent 34, where receiving decolorization treatment (Step S14) by the irradiation of i-line. 将完成脱色处理的基板G运入到第三热处理部36的上游侧开口塔(TB) 98内的通过单元(PASSl)。 The complete decoloring substrate G is carried into the upstream portion 36 of the opening side of the third heat treatment column (TB) by means (VpassL) within 98.

在第三热处理部36中,最初将基板G从该通过单元(PASSJ移送到加热单元(POBAKE)中的1个,在那里接受后烘焙的加热处理(工序S,5)。接着,将基板G移动到下游侧开口塔(TB) 102内的通过•冷却单元(PASSR • COL),在那里冷却到规定的基板温度(工序 In the third heat treatment unit 36, the substrate G from the first through the cell (PASSJ transferred to the heating unit (POBAKE) in 1, after subjected to heat treatment where the baking (step S, 5). Subsequently, the substrate G the substrate temperature (step moves to the downstream side opening column (TB) by • cooling unit (PASSR • COL) in 102, where it is cooled to a predetermined

S16)。 S16). 由输送机构100进行第三热处理部36中的基板G的输送。 36 conveyed in the third heat treatment of the substrate G by the conveying mechanism 100.

在盒载置台(C/S)14侧,输送机构22从第三热处理部36的通过玲却单元(PASSR*COL)接受结束涂敷显像处理的全部工序的基板G, 将接受的基板G收容在盒载置台20上的某个盒C中(工序S,)。 In the cassette mounting table (C / S) 14 side, transport mechanism 22 has means (PASSR * COL) receiving the end of all steps of the coating process of developing the substrate G from the third heat treatment by ling portion 36, the receiving substrate G housed in the cassette C on the cassette mounting a table 20 (step S,).

能够将本发明应用于在该涂敷显像处理系统10中,涂敷处理部28 的抗蚀剂涂敷单元(CT) 82。 The present invention can be applied to the coating developing processing system 10, the processing unit 28 of the coating of the resist coating unit (CT) 82. 下面,我们参照图4~图16说明将本发明应用于抗蚀剂涂敷单元(CT) 82的实施方式。 Below, we refer to FIG. 4 to FIG. 16 of the present invention is applied will be described the resist coating unit (CT) 82 of the embodiment.

图4表示抗蚀剂涂敷单元(CT) 82内的主要构成。 Figure 4 shows the resist coating unit (CT) 82 in the main constituent. 在抗蚀剂涂敷单元(CT) 82内,设置用于水平地载置并保持基板G的固定型的载物台112、和用于用长条型的抗蚀剂喷嘴114用无自旋法将抗蚀剂液涂敷在载置在该载物台112上的基板G的上面(被处理面)的涂敷处理部116。 In the resist coating unit (CT) 82, is provided for horizontally placed and held stationary stage 112 of the substrate G, and a resist pattern 114 of long nozzles with spin S coating processing method a resist was applied on top placed on the stage 112 of the substrate G (surface to be treated) 116.

涂敷处理部116具有包含抗蚀剂喷嘴114的抗蚀剂液供给部118、 使该抗蚀剂喷嘴114在载物台112的上方沿X方向水平移动即进行扫描的扫描部120、和用于变更或调节抗蚀剂喷嘴114的高度位置的喷嘴升降机构122。 Coating a resist processing unit 116 comprising a portion of the resist solution supply nozzle 114 is 118, the nozzle 114 so that the resist that is 120, and the scanning unit scans the X-direction above the horizontal movement stage 112 to change or adjust the height position of the resist nozzle 114 of the nozzle elevating mechanism 122.

在抗蚀剂液供给部118中,抗蚀剂喷嘴114具有以能够从一端到另一端覆盖载物台112上的基板G的长度在Y方向延伸的缝隙状的喷出口(图中未画出),与来自抗蚀剂液供给源(图中未画出)的抗蚀剂液供给管124连接。 In the resist solution supply section 118, a resist 114 having a nozzle to cover from one end to the other end of the loading slot-shaped length of the substrate 112 on the stage G extending in the Y direction of the discharge port, not shown (FIG. ), is connected to the resist solution supply pipe 124 from the resist solution supply source (not shown) is. 扫描部120具有水平支撑抗蚀剂喷嘴114的倒二字状(门形)的支撑体126、和在X方向使该支撑体126双向直进移动的扫描驱动部128。 The scanning unit 120 has a horizontal support resist nozzle 114 of an inverted word-shaped (gate-shaped) support member 126, so that the support member 126 and a bidirectional rectilinear movement of the scan driving unit 128 in the X direction. 该扫描驱动部128也可以使用滚珠丝杠机构,但是如果从涂敷膜均匀性的观点出发,则优选用机械振动小的线性伺服马达机构构成。 The scan driving unit 128 may use a ball screw mechanism, but if from the viewpoint of uniformity of the coating film is preferably small mechanical vibration mechanism configured linear servo motors. 喷嘴升降机构122可以由滚珠丝杠机构构成,不仅能够通过调节抗蚀剂喷嘴114的高度位置而任意设定或调整喷嘴下端部的喷出口和载物台112上的基板G的上面(被处理面)之间的距离间隔即间隙的大小,而且也能够瞬时地上升或下降移动抗蚀剂喷嘴114。 A nozzle elevating mechanism 122 may be constituted by a ball screw mechanism, not only can be arbitrarily set or adjusted to a lower end portion of the discharge outlet of the nozzle and the upper substrate G loading on the station 112 (to be treated by adjusting the height position of the resist nozzle 114 the distance between the surface) i.e. the gap interval size, and can be raised or lowered instantaneously resist movement of the nozzle 114.

涂敷处理部U6在载物台112上载置基板G期间在控制部(图中未画出)的控制下进行动作。 U6 coating process unit operates under the control of the control unit (not shown) during the stage 112 placed on the substrate G. 详细地说, 一面以在X方向纵向截断载物台112的上方的方式由扫描部120以一定的速度使抗蚀剂喷嘴114 进行扫描, 一面在抗蚀剂液供给部118中由抗蚀剂喷嘴114的缝隙状 In detail, a longitudinal side cut in the X direction upward loading table 112 is scanned by the scanning unit 120 at a constant speed of the resist nozzle 114, in the side of the resist solution supply section 118 by a resist a slit-shaped nozzle 114

喷出口向载物台112上的基板G的上面以在Y方向延伸的带状喷出流供给抗蚀剂液。 Upper discharge outlet to the substrate on the loading table 112 in strip G extending in the Y direction, supplying the resist solution discharge flow. 这时,使从喷出口溢出到基板G上的抗蚀剂液在X方向朝规定方向前进或水平移动的抗蚀剂喷嘴114的下端部平坦地延伸, 在基板G上以与间隙相应的一定的膜厚形成抗蚀剂液的涂敷膜CR(图16)。 In this case, so that the overflow from the discharge outlet to the lower end portion of the resist liquid on the substrate G moves in a predetermined forward direction or in the horizontal direction X of the resist nozzle 114 extending flat, corresponding to the gap G on the substrate must CR coating film thickness of the resist solution is formed (FIG. 16).

在图5~图15中,表示在本实施方式中,将基板G固定在载物台112上的固定部、升降支撑基板G的升降支撑部和决定基板G的位置的基板定位部(旋转型按压部、挡止部)的构成。 In FIG. 5 to FIG. 15, showing the present embodiment, the substrate G is secured in the substrate positioning portion loading fixing portion 112 units, vertical position lift supporting portion and decisions substrate G supporting substrate G (the rotary type the pressing portion, the stopper portion) configuration.

在工序112,设定载置四边形基板G的位置(四边形区域)E (图8)。 In step 112, the set position of the substrate G mounted quadrilateral (quadrilateral area) E (FIG. 8). 在该设定载置位置E的内侧,以一定的间隔或密度分别设置多个用于由真空吸附力将基板G固定在载物台112上的固定部的真空吸附口130、和用于以水平姿势使基板G上下的升降支撑部的提升销132 (图5)。 Mounted inside the setting position E, or at predetermined intervals for density are provided a plurality of vacuum suction port by the vacuum suction force to the substrate G is secured in the loading station 112 on the fixing portion 130, and is used to the lifting horizontal posture G lift supporting portion 132 of the upper and lower substrates pin (FIG. 5).

真空吸附口130,如图6和图7所示,经过在载物台112内部形成的真空通路134与外部配管或真空管136相通。 Vacuum suction port 130, as shown in FIGS. 6 and 7, with the outside through the vacuum passage 134 formed in the interior of the stage 112 or pipe 136 communicates vacuum. 该真空管136与真空泵或排气装置等的真空源(图中未画出)相通。 The vacuum pump or a vacuum exhaust device 136 such as a vacuum source (not shown) is connected.

将提升32,如图6和图7所示,可以升降移动地插入到在载物台112中形成的贯通孔138中,既可以使销前端突出在载物台112的上方,也可以退避到贯通孔138中。 The lift 32, as shown in FIGS. 6 and 7, can be moved vertically inserted into the through hole 138 formed in the stage 112, the front end of the pin may be protruding above the stage 112 can be retracted to the through hole 138. 将提升销132的下端部固定在水平升降台140中,升降台140经过升降驱动轴142与升降驱动部144 结合。 The lower end portion of lift pin 132 is fixed to the horizontal lifting table 140, through the lift 140 lifts the lift shaft 142 and the driving unit 144 in combination. 升降驱动部144,将气缸或电动马达等作为驱动源,经过升降驱动轴142和升降台140同时或一体地升降移动全部提升销132,能够使它们停止或固定在任意的高度位置。 Elevation driving unit 144, the air cylinder or an electric motor as a driving source, through the lifting shaft 142 and lifting table 140 moves down simultaneously or integrally All lift pins 132, so that they can be stopped or fixed at any height position.

如图5和图8所示,在载物台112的边角部,在接近设定载置位置E的边部的位置上设置构成基板定位部的多根例如8根定位销148A、 148B、 148C、 148D、 150A、 150B、 150C、 150D。 5 and FIG. 8, the corner portion in the loading table 112 is provided a plurality of positioning pins 8 for example, a substrate positioning portion 148A is set close to the position of the mounting position of the edge E of the upper portion, 148B, 148C, 148D, 150A, 150B, 150C, 150D. 以设定载置位置E的1条对角线L为分界线将这8根定位销分成固定类的148A、 148B、 148C、 148D和可动类的150A、 150B、 150C、 150D两部分。 Is set to a diagonal placement position E as the boundary L of these positioning pins 8 into 148A, 148B, 148C, 148D and 150A fixed to the movable class class, 150B, 150C, 150D in two parts.

固定类的各定位销148构成本发明的挡止部,如图5~图7所示, 由上部形成圆锥状的圆柱体或圆筒体构成,可以升降移动地插入到在载物台112中形成的贯通孔149中,将销下端固定在升降台140上, 不能够在水平方向(X方向、Y方向)移动。 Positioning pins 148 constituting the present invention, the stopper portion fixed category, as shown in FIG. 5 to 7, formed by an upper conical cylinder or a cylindrical body, which can be moved to be inserted in the stage 112 through-hole 149 formed in the lower end of the pin is fixed to the elevating table 140, it can not be (X direction, Y direction) in the horizontal direction. 可是优选可以在旋转方 However, the rotation direction may be preferably

向(e方向)中移动(可以自旋转)地进行构成。 Moving in the (e direction) (which may be self-rotating) configured performed. 如图8所示,将各个 8, the respective

固定定位销148A〜148D配设在接近设定载置位置E的各边的位置上。 148A~148D fixed positioning pin disposed at a position close to each side of the mounting position E is set on. 可动类的各定位销150是构成本发明的旋转型按压部的部件,如图5~图7和图9所示,具有上部形成圆锥状的圆柱状或圆筒状的销本体150a,可以升降移动地插入到在载物台112中形成的贯通孔151中, 使销下端与旋转驱动部152的旋转驱动轴154结合。 The movable type of the positioning pins 150 is a rotary member constituting the pressing portion of the present invention, FIGS. 5 to 7 and 9, of cylindrical or conical shape of the cylindrical pin body having an upper portion 150a is formed to be down movably inserted into the through hole 151 formed in the stage 112, the lower end of the pin and rotation driving portion 154 of rotary drive shaft 152 binding. 将旋转驱动部152 固定在升降台140上,作为驱动源例如具有空气马达(转动气缸)或电动马达,经过旋转驱动轴154,能够以一定或任意的旋转角度旋转驱动定位销150的销本体150a。 The rotation driving portion 152 is fixed to the elevating table 140, an air source such as a driving motor (rotational cylinder) or an electric motor, through a rotary shaft 154 rotatably drives the positioning pin 150 of pin body at a constant angle of rotation or any 150a . 该可动定位销150的特征是具有该圆柱或圆筒中心轴O从旋转中心线即旋转驱动轴154偏离(偏心)的构成。 The positioning of the movable pin 150 is characterized in that the rotary drive shaft 154 that is apart (eccentric) from the center line of rotation of the cylinder or a cylindrical configuration having a center axis O. 旋转驱动部152使旋转驱动轴154旋转,该偏心可动定位销150, 如图IO所示,不将中心轴O作为旋转中心进行旋转,而将旋转驱动轴154作为旋转中心在X方向和Y方向中一面变位或移动一面旋转。 Rotation driving portion 152 of the rotary drive shaft 154 is rotated, the eccentric positioning of the movable pin 150, as shown in FIG IO, not to the central axis of rotation O as a rotation center, and the rotary drive shaft 154 as a rotation center in the X direction and Y side or direction of the displacement movement while rotating. 例如,在图IO的例子中,我们看到当着眼于在X方向中偏心可动定位销150的最右端的部位的位置和旋转驱动轴154旋转180。 For example, in the example of FIG IO, we see that when the focus on the eccentric portion in the X direction movable positioning pin 150 of the rightmost position and the rotary drive shaft 154 is rotated by 180. 以上时,在X, (最小右端位置)~X3 (最大右端位置)的范围中变位或移动。 Or more, in the X, range (minimum right end position) ~ X3 (maximum right end position) in the displacement or movement. 各个偏心可动定位销150A〜150D,当不决定对基板G的位置时,如图8所示, 在从设定载置位置E离开或退避规定距离的原位置(回动位置)上进行待机。 Each of the movable eccentric positioning pin 150A~150D, when G does not determine the position of the substrate shown in Figure 8, leaving on standby or home position retracted a predetermined distance from the set placement position E (return position) .

又,在各偏心可动定位销150中,如图9所示,将圆筒状的环状部件例如套环150b安装在比圆锥部分低的规定部位上。 Moreover, in each of the movable eccentric positioning pins 150, shown in Figure 9, the annular member, for example, a cylindrical collar 150b is mounted on the cone portion is lower than a predetermined site. 该套环150b 当决定基板位置时构成与基板G接触的接触部,相对于销本体150a可以自由旋转地嵌入。 The collar 150b constituting the contact portion with the substrate G when the determined position of the substrate relative to the pin body 150a may be rotatably fitted.

下面,我们说明该实施方式的抗蚀剂涂敷单元(CT) 82中的整体动作或作用。 Below, we illustrate the overall operation or action in the resist coating unit 82 (CT) of this embodiment.

如上所述,将在第一热处理部26 (图1)中接受规定热处理的基板G从下游测开口塔(TB) 48内的通过单元(PASSR) 60 (图2)运入到抗蚀剂涂敷单元(CT) 82中,由图中未画出的输送臂一直输送到载物台112的正上方位置(交接位置)。 As described above, the substrate will receive a predetermined heat treatment G in the first heat treatment section 26 (FIG. 1) from the downstream side opening column (TB) by means (PASSR) in 4860 (FIG. 2) is carried into the resist coating plating unit (CT) 82, it has been conveyed by a non-illustrated transfer arm just above the position (transfer position) of the stage 112. 这时的基板G的停止位置,与在输送臂或在它上游侧的输送系统中输送时的基板位置精度相应地, This time, the substrate G stop position, the positional accuracy of the substrate during transport or conveying arm in the delivery system in its upstream correspondingly,

从设定位置发生若干偏离是普通的,只要该偏离在允许范围内,如后述那样,不会妨碍到提升销132的交接。 Some deviation from the set position occurs from ordinary, as long as the deviation is within the allowable range, as described later, the transfer does not interfere with the lifting pin 132.

另一方面,提升销132和定位销148A〜148D、 150A〜150D全部退避到载物台中,固定部的真空吸附机构不动作,不将真空力供给真空吸附口130,直到将新的基板G运入到载物台112侧为止。 On the other hand, the lift pins 132 and the positioning pin 148A~148D, 150A~150D all retracted to the loading station, the fixed portion of the vacuum suction mechanism does not operate without the vacuum suction force of the vacuum supply port 130, until a new transport substrate G far into the loading station 112 side.

如上所述,当由输送臂将基板G输送到载物台112的正上方时, 升降驱动部144动作,使升降台140从图6的高度位置上升到图7的高度位置。 As described above, when the transfer arm to transport the substrate G directly above the stage 112, the elevation driving unit 144 is operated to lift up from the height position of the stage 140 of FIG. 6 to FIG. 7 of the height position. 因此,提升销132上升,以在销前端从下承担基板G的方式从输送臂接受基板G。 Thus, increased lift pins 132, so as to assume from the substrate G at the front end of the pin receiving substrate from the transfer arm G. 这时,定位销148A〜148D、 150A〜150D也一起上升通过基板G的旁边。 At this time, the positioning pin 148A~148D, 150A~150D also raised together by a next substrate G. 这时,基板G的边缘与某一个或多个定位销的圆锥部分接触或滑接,相对地一面将基板G由定位销148A〜148D、 150A〜150D引导, 一面落入到提升销132上。 At this time, the edge of the substrate G with a conical portion in contact with one or more positioning pins or sliding contact, the side opposite to the substrate G by the positioning pin 148A~148D, 150A~150D guide face lift pins 132 to fall. 如图8所示,因为原位置的偏心可动定位销150A〜150D与载物台112上的设定载置位置E之间形成有相当的间隙,所以基板G平滑地落入到载物台上。 As shown, because the home position of the movable eccentric positioning pin formed with a carrier 150A~150D considerable gap between the placement position E is set on the table 112, the substrate G falls smoothly to the stage 8 on. 只与落入的平滑程度有关,在提升销132上基板G的位置从设定载置位置E[偏离的概率高,偏离的程度也大。 Smoothness with only about falls, the position of the substrate on the lift pins 132 from G placement position set E [high probability deviation, degree of deviation is large. 在本实施方式中,因为备有后述那样的基板定位机构,所以当将基板G从输送臂移载到提升销132上时, 能够不顾位置偏离,优先进行确实并且平滑的接受。 In the present embodiment, as described above with the substrate positioning mechanism, when the substrate G is conveyed from the transfer arm to the lift pins 132, regardless of the positional deviation is possible, and indeed preferentially smooth acceptance.

如上所述,当将基板G从输送臂移载到提升销132上时,为了接着决定基板G在提升销132上的位置,基板定位部的偏心可动定位销150A〜150D同时进行从原位置到往动位置(按压位置)的运动。 As described above, when the substrate G from the transfer conveyor to the lifting arm pin 132, and then to decide the position of the substrate G on the lift pins 132, the eccentric portion of the substrate positioning the movable positioning pin from the home position simultaneously 150A~150D the forward movement position (pressing position) in the movement.

详细地说,各旋转驱动部152经过旋转驱动轴154使偏心可动定位销150从图8的原位置旋转约半圈。 More specifically, each of the rotary drive unit 152 through the eccentric rotation of the drive shaft 154 of the movable positioning pin 150 rotates from the home position of FIG. 8 about a half circle. 通过这样做,销本体150a—面进行图10所示的偏心旋转运动, 一面向着与其对置的基板G的各边移动,套环(接触部)150b与该基板边部(基板侧面)接触,进一步从那里按压基板G。 , 150a- pin body surface by doing this eccentric rotation motion shown in FIG. 10, movement of the side towards their respective sides facing substrates G of the collar (contact portion) 150b side portion in contact with the substrate (the substrate side), from there the substrate is further pressed against G. 这样一来与基板G的在X方向延伸的一方的边(长边)对置的2个偏心可动定位销150A、 150B在Y方向按压基板G, 另一方面与基板G的在Y方向延伸的一方的边(短边)对置的2个偏心可动定位销150C、 150D在X方向按压基板G。 Thus the one extending in the X direction G of the substrate side (long side) of the two opposite movable eccentric positioning pins 150A, 150B presses the substrate G in the Y direction, on the other hand extend in the Y direction of the substrate G one side (short side) of the two opposite movable eccentric positioning pin 150C, 150D in the X-direction pressing the substrate G. 因此,基板G在提升销132上在X方向和Y方向按压的方向中变位或移动,基板G的相反侧的长边被2个固定定位销148C、 148D按压,基板G的相反侧的 Therefore, the substrate G change in the lift pin 132 in the X direction and the Y direction in the pressing position or movement of, the opposite sides of the long sides of the substrate G are two fixed positioning pins 148C, 148D is pressed, the opposite side of the substrate G

短边被2个固定定位销148A、 148B按压。 2 is fixed to the short side positioning pins 148A, 148B is pressed. 结果,将基板G在X方向夹持在偏心可动定位销150C、 150D和固定定位销148A、 148B之间, 并且在Y方向夹持在偏心可动定位销150A、150B和固定定位销148C、 148D之间。 As a result, the substrate G in the X-direction movable clamping eccentric positioning pin 150C, 150D and fixed positioning pins 148A, 148B between, and clamped in the Y direction in the movable eccentric positioning pins 150A, 150B and 148C fixed positioning pins, between the 148D. 预先设定旋转驱动部152使旋转驱动轴154旋转的角度, 如上所述,在由全部的定位销150A〜150D、 148A〜148D从四方夹住基板G的状态中,停止偏心可动定位销150A〜150D的运动或压入。 Rotation driving unit 152 is set in advance the rotation angle of the rotary shaft 154, as described above, in a state all the positioning pins 150A~150D, 148A~148D sandwiching the substrate G from the four stops the movable eccentric positioning pins 150A ~150D motion or force. 这样, 当完成基板G的位置决定时,如图13所示,基板G的位置大致紧密地与载物台112上的设定载置位置重合。 Thus, upon completion of the positioning of the substrate G, as shown in FIG. 13, the position of the substrate G substantially coincides closely with the placement position set on the stage 112.

此外,优选,将偏心可动定位销150A〜150D的偏心旋转方向,如图11所示,以协作地在对角线方向压入基板G的方式,在相同的排列中设定在相同的方向上,在正交的排列中设定在相反的方向上。 Further, preferably, eccentric rotation of the eccentric direction of the movable positioning pin 150A~150D, and 11 to cooperatively pressed in a diagonal direction of the substrate G mode is set in the same direction in the same arrangement on the orthogonal arrangement in the opposite direction is set. 在本例中,通过在Y方向按压基板G的偏心可动定位销150A、 150B进行逆时钟旋转的偏心旋转运动,并且在X方向按压基板G的偏心可动定位销150C、 150D进行顺时钟旋转的偏心旋转运动,使基板G在对角线方向(箭头F的方向)直线地移动,按压在相反侧的固定定位销148A〜148D上。 In the present embodiment, by pressing the substrate G in the Y-direction of the eccentric movable positioning pins 150A, 150B rotate eccentrically counterclockwise rotation, and presses the eccentric substrate G in the X direction of the movable positioning pin 150C, 150D for clockwise rotation the eccentric rotation of the substrate G moves linearly in a diagonal direction (arrow F), the positioning pin fixed on the opposite side of the pressing 148A~148D.

如图12所示,在本实施例中的基板定位中,因为各偏心可动定位销150的套环150b当与基板G接触时能够旋转,所以能够减少接触或压入时的摩擦。 12, in the present embodiment the substrate is positioned in the embodiment, since the movable eccentric positioning pin 150b 150 of the collar when in contact with the substrate G can be rotated, it is possible to reduce the contact friction or press-fitting. 此外,提升销132的上端部分132a,按照当位置决定时基板G可以平滑地水平移动或变位的方式,优选由对基板材料(玻璃基板)滑动性优越的材质(例如树脂)构成,或者由在任意方向能够自由旋转的球等的旋转体构成。 In addition, the lift pin upper end 132 of the portion 132a, when determined in accordance with when the position of the substrate G can be smoothly manner the horizontal movement or displacement of, preferably consists of a substrate material sliding property (glass substrate) excellent material (e.g. resin), or by a in any direction freely rotatable ball rotating body configuration.

当如上述那样完成提升销132上的基板G的位置决定时,升降驱动部144使升降台140从图7的高度位置下降,使升降台140上的各部下降。 When it is decided as the position of the substrate G is completed as the lift pins 132 on the lift drive unit 144 moves down from the height of the lifting table 140 of Figure 7, so that each part 140 on the elevator lowered. 由定位销150A〜150D、 148A〜148D、从四方夹着基板G不变, 使基板G与提升销132—起下降。 A positioning pin 150A~150D, 148A~148D, unchanged from the four sandwich the substrate G, the substrate G from the lift pin 132- drop. 所以,当基板G下降时,基板G不发生位置偏离。 Therefore, when the substrate G drops, the substrate G without the positional deviation occurs. 而且,如图14所示,在基板G—旦载置在载物台112 的上面的状态或在它正前面时停止下降运动。 Further, as shown in FIG. 14, a substrate denier G- mounted above the stage 112 is lowered or stopped when it is moving in front. 在该停止状态中,如图15所示,载物台112侧的真空吸附机构开始动作,开始将真空力供给载物台上面的真空吸附口130。 In the stop state, shown in Figure 15, the loading mechanism starts operation of the vacuum suction table 112 side, a vacuum force begin feeding stage vacuum suction port 130 above. 另一方面,各个偏心可动定位销150A〜150D通过旋转驱动部152的旋转驱动,进行与上述相反方向的 On the other hand, each of the movable eccentric positioning pin 150A~150D by the rotation driving unit 152 is driven to rotate, with the direction opposite to the above

偏心旋转运动,回动到原位置,解除对基板G的按压。 An eccentric rotational movement, return to the original position, pressing of the substrate G is released. 此后,升降驱 Since then, lifting drive

动部144使升降台140下降到图6的高度位置。 Elevating table 144 movable portion 140 drops to the level position of FIG. 这样,因为在解除由定位销150A〜150D、 148A〜148D对基板G的按压或夹持后,这些定位销下降,所以能够防止或减少基板G和定位销的摩擦,能够抑制粒子的发生。 Thus, since the lift, 148A~148D after pressing or clamping the substrate G, the positioning by the positioning pin dropped pins 150A~150D, it is possible to prevent or reduce the friction of the substrate G and the positioning pin, it is possible to suppress the occurrence of particles. 这样,定位销150A〜150D、 148A〜148D和提升销132全部退避到载物台112中。 Thus, the positioning pin 150A~150D, 148A~148D and all the lift pins 132 is retracted to the loading station 112. 将基板G定位于载物台112上的设定载置位置E 上并载置于此,由从真空吸附口130接受的真空吸附力加以固定。 The substrate G is positioned on the mounting position E is set on the stage 112 is placed on this and, to be fixed by a vacuum suction from the vacuum suction force receiving port 130.

此后,如图4所示,在涂敷处理部116中实施抗蚀剂涂敷处理。 Thereafter, as shown in FIG. 4, resist coating processing section 116 in the coating process. 即, 一面抗蚀剂喷嘴114,通过缝隙状喷出口向载物台112上的基板G 的上面以在Y方向延伸的带状喷出流喷出或滴下抗蚀剂液, 一面从基板G的一端到另一端在X方向纵向截断载物台112的上方。 That is, one surface of the resist nozzle 114, through the slit-like discharge port to the upper substrate on the loading table 112 G of a strip extending in the Y direction of the discharge flow or dripping of the resist solution discharge, from one surface of the substrate G end to the other in the longitudinal direction X above the cut-off of the stage 112. 因为提升销132还有定位销150A〜150D、 148A〜148D也退避到载物台112中, 所以当然不会成为涂敷扫描的障碍。 Since the lift pins 132 as well as the positioning pin 150A~150D, 148A~148D also retracted into the stage 112, it is certainly not hinder applying scan. 当进行该涂敷扫描时,如图16所示,使从缝隙状喷出口溢出到基板G上的抗蚀剂液在抗蚀剂喷嘴114 的下端部分平坦地延伸,在基板G上以与间隙相应的一定的膜厚形成抗蚀剂液的涂敷膜CR (图16)。 When the scanning is applied, as shown in FIG. 16, the resist solution on the flat substrate G extends in the lower end portion of the resist nozzle 114 from the slit-shaped overflow outlet to discharge, on the substrate with the gap G CR certain coating film thickness corresponding to the resist solution is formed (FIG. 16).

在上述那样的抗蚀剂涂敷处理中,将载物台112上的设定载置位置E作为基准设定抗蚀剂喷嘴114的扫描的开始点和终点。 In the resist coating process described above, the loading table 112 is set on the mounting position of the start point and the end point E as the reference scan setting resist nozzle 114. 在本实施方式中,因为通过上述那样的基板定位部的动作将基板G的位置正确地定位在载物台112上的设定载置位置E上,所以与基板G上的设定涂敷区域大致紧密地重合,能够形成抗蚀剂涂敷膜CR。 In the present embodiment, since the substrate positioning portion by the operation as described above is the position of the substrate G is properly positioned on the stage 112 of setting the mounting position E, so that the set coating region on the substrate G substantially coincide closely, it is possible to form a resist coating film CR. 此外,希望将涂敷扫描的开始点设定在成为定位的基准位置的固定定位销148A、 148B侧的基板端部。 Further, it is desirable to set the starting point of scanning is applied at a reference position of the positioning pins 148A fixed positioning, the end portion 148B side of the substrate.

一般,当用缝隙型的抗蚀剂喷嘴114时,如图16所示,在抗蚀剂涂敷膜CR的开始点在基板G上形成大的隆起部分CRS。 In general, when a slit type as shown in the resist nozzle 114, FIG. 16, large raised portions are formed on the substrate G CRS at the start point of the resist coating film CR. 当该隆起部分CRS进入到实质的设定涂敷区域内(线J的内侧)时,膜厚的均匀性降低。 When the inner raised portion of the substance into the CRS setting application region (inner line J), ​​the uniformity of the film thickness decreases. 在本实施方式中,可以确实地使涂敷开始点的隆起部分CRS 位于设定涂敷区域外,而且也能够在基板周边部分中确实地保证为了不要边缘冲洗的空白部分M。 In the present embodiment, the raised portion can surely make the start point of the set of coating application region positioned outside the CRS, but it is possible to surely ensure the blank portions not flush edge in the peripheral portion of the substrate M.

图17表示在本实施方式中,可以适用于偏心可动定位销150A〜150D的粒子除去部的一个构成例。 FIG 17 shows the present embodiment can be applied to the movable eccentrically positioned to remove a portion of the particles constituting the pin 150A~150D embodiment. 各偏心可动定位销150,因 Each eccentric positioning pin 150 may be movable, by

为通过上述那样偏心旋转运动一面擦着基板G的边缘一面与基板G接 Through the eccentric rotational motion as the substrate G was wiping contact with the side edge of the substrate G

触,所以视销接触部的材料而在摩擦时可能发生粒子。 Touch, so depending on the material of the contact portion and the pin may occur during friction particles. 因此,如图17 所示,在各偏心可动定位销150升降移动中通过的贯通孔151中或近旁设置真空式的粒子吸入口160,通过真空力将附着在偏心可动定位销150上的粒子和浮游在它周围的粒子吸引到吸入口160中加以除去。 Thus, as shown in FIG. 17, the eccentric positioning of the movable pin 150 moves down through the through hole 151 provided in the vicinity of the vacuum type or particle inlet port 160 by a vacuum force may be adhered to the eccentric positioning pin 150 of the movable particles and floating particles around it in the suction inlet port 160 to be removed. 该吸入口160例如经过载物台112内的通气孔162与外部排气管164相通。 For example, the suction port 160 through the air vent 112 in the loading station 162 communicates with an external exhaust pipe 164. 该外部排气管164与真空泵或者排出器等的真空源相通。 The external exhaust pipe 164 to a vacuum pump or other vacuum source ejector in communication. 也能够将同样的粒子除去部应用于固定定位销148A〜148D。 The same can be applied to particle removal portion fixedly positioned pin 148A~148D.

图18表示在本实施方式中的可动定位销150的一个变形例。 FIG. 18 shows the embodiment according to the present embodiment is a modification of the movable positioning pin 150. 该变形例的可动定位销150的特征是具有椭圆的横截面轮廓形状。 The modification of the movable positioning pin 150 is characterized by having an oval cross-sectional shape of the profile. 这时, 旋转驱动轴154既可以与可动定位销150的中心轴O —致或同轴,也可以偏离。 At this time, the rotary drive shaft 154 may be positioned with the movable pin of the central axis O 150 - induced or coaxial, may deviate. 当用这种椭圆型的可动定位销150时,也可以与上述同样旋转驱动部152以规定的旋转角度往复地旋转旋转驱动轴154,如图19所示,能够用与上述同样的作用决定基板G的位置。 When this elliptic movable positioning pin 150 may be reciprocally rotated with the rotation angle of rotation 152 at a predetermined portion in the same rotation driving shaft 154, shown in Figure 19, can be determined with the same action of the G in position of the substrate. 不过,不能够安装椭圆型因此可以自由旋转的套环150b,将与基板G接触的部位固定在一个地方。 However, can not be mounted can be freely rotatable elliptic collar 150b, in contact with the portion of the substrate G is secured in one place.

如果用别的方法,则具有与上述那样的椭圆型的可动定位销150 同样的限制,但是也可以在圆柱或圆筒型偏心可动定位销150中省去套环150b,由销本体150a的外周面构成接触部。 If another method, the elliptic having a movable pin positioned as described above the same restriction 150, but may be movable positioning pin 150 in the collar 150b is omitted in the columnar or cylindrical eccentric, the pin body 150a contacting the outer peripheral surface constituting portion.

又,如果从本发明的原理出发,则可动定位销150的横截面形状不需要是完全的圆或椭圆,例如也可以是具有180。 And, if starting from the principles of the present invention, the movable positioning pins 150 of the cross-sectional shape need not be a complete circle or ellipse, for example, may be a 180. 的中心角的圆弧。 Arc center angle.

此外,在本发明的技术思想范围内可以进行种种变形。 Further, within the technical scope of the present invention may be variously modified. 例如,在上述实施方式中,在从输送臂接受基板G到提升销132上的高度位置上决定基板的位置。 For example, in the above embodiment, the determined position of the substrate 132 at the height position of the transfer arm receives the substrate from the lift pins to G. 但是,也可以在为了移载到载物台112上使提升销132下降的过程中使上述基板定位部动作决定基板的位置,因此将决定基板位置所要时间包括到基板移载时间中,能够缩短生产节拍时间。 However, it is also possible to transfer to the lift pin process 132 decrease manipulation of the substrate positioning unit operation determination position of the substrate on the stage 112, thus determines substrate position desired time including the substrate transfer time can be shortened tact time. 又,也可以在将基板G移载在台112上后,或者就在它前面通过使上述基板定位部动作决定基板的位置。 Further, the substrate may be in the G on the transfer stage 112, or in front of it by an operation of the substrate positioning unit determines the position of the substrate.

又,在上述实施方式中,在基板G的一个长边上安排2个可动定位销15O(150A、 150B),在基板G的一个短边上安排2个可动定位销150 (150C、 150D),但是也可以具有分别只安排1个或者安排3个以 Further, in the above-described embodiment, the movable arranged two positioning pins 15O (150A, 150B) at one long edge of the substrate G, arranged two movable positioning pin 150 (150C at a short side of the substrate G, 150D ), but it may have a separately arranged only three or arranged to

上的构成。 Constituted on. 在固定定位销148中也是同样的。 In the positioning pin 148 fixed in the same manner. 又,在需要只在一个方 Also, only one party in need

向(例如x方向)决定基板的位置的应用中,能够形成只在基板的一边上安排可动定位销150的构成。 Application of the substrate to determine the position (e.g., x-direction), the only arrangements capable of forming the movable positioning pin 150 is configured on one side of the substrate.

在上述实施方式中的抗蚀剂涂敷单元(CT) 82用长条型的抗蚀剂喷嘴114,但是本发明可以适用于具有任意喷嘴的涂敷装置,进一步也可以适用于涂敷处理装置以外的基板处理装置。 In the above-described embodiments of the resist coating unit (CT) 82 with a strip-type resist nozzle 114, but the present invention can be applied to any device having a coating nozzle, the coating may be applied to further processing means other than the substrate processing apparatus. 例如,也能够将本发明应用于在上述涂敷显像处理系统(图1)中,在热板或冷却板上对基板施加热处理的单片式的开口部(PREBAKE)、 (AD)、 (COL)等中。 For example, it is possible to apply the present invention in the coating developing processing system (FIG. 1), the opening portion of the monolithic (PREBAKE) applying a heat treatment in a hot plate or the cooling plate to the substrate, (the AD), ( COL), and the like. 这时,能够将热板或冷却板看作载物台。 At this time, a hot plate or the cooling plate can be regarded as a stage.

又,上述实施方式中的可动定位销150,因为销本体的外周面与基板接触,所以只需要最小限度的占有面积,可以升降,可以出没地设置在载物台的贯通孔中的情形是适合的。 The case further, the above-described embodiment the movable positioning pin 150, since the outer circumferential surface of the pin body contact with the substrate, so only minimal footprint, and down and can be retractably disposed in the through hole of the stage is suitable. 但是,在不需要升降移动的应用中或者占有面积没有限制的应用中,例如如图20所示,也可以经过在水平方向延伸的臂部150c将接触部件150d安装在销本体150a上, 通过与销本体150a的自旋转运动相应的臂部150的旋转运动,使接触部件150d与基板G的边缘接触或者按压在G基板的边缘上。 However, without the need for vertical movement of the area occupied by the application or applications without limitation, for example, as shown in FIG 20, may extend through the arm portion 150c in the horizontal direction of the contact member 150d is mounted on the pin body 150a, by corresponding rotational movement from the rotational movement of the pin body 150a of the arm 150, the edges of the contact member 150d and the substrate G in contact with or pressed against the edge of the substrate G.

又,上述实施方式中的基板定位部的可动定位销150兼备在铅直方向中引导基板的功能,为了提高引导功能具有圆锥部。 Further, the substrate positioning portion of the embodiment of the positioning of the movable pin 150 functions both to guide the substrate in the vertical direction in order to improve the guide function having a conical portion. 在不需要引导功能的应用中,也可以形成不持有圆锥部的构成。 In applications not requiring guidance function, the configuration may be formed without the conical portion of the holder. 旋转驱动可动定位销150的机构也可以具有种种变形。 Rotational driving means of the movable positioning pin 150 may also have various modifications. 例如,也可以形成使用滑轮和传送带机构,由共同的驱动源同时驱动全部可动定位销15OA〜150D的构成等。 For example, it may be formed using a pulley and belt mechanism, driven by a common drive source at the same time all the movable positioning pin constituting 15OA~150D the like. 本发明的基板定位装置也可以适用于不使用载物台的基板处理装置和基板输送装置等。 A substrate positioning device according to the present invention may be applied to the substrate processing apparatus without using a substrate transfer apparatus and a stage or the like.

本发明中的被处理基板不限于LCD基板,也可以是其它的平面显示器用的基板、半导体晶片、CD基板、玻璃基板、光掩模、印刷基板等。 Substrate to be processed in the present invention is not limited to a LCD substrate, the substrate may be used in other flat panel display, a semiconductor wafer, CD substrates, glass substrates, photomasks, printed circuit board and the like.

Claims (26)

1.一种基板处理装置,该基板处理装置将被处理基板载置在载物台上对所述基板实施规定的处理,其特征在于,该基板处理装置包括: 将所述基板在水平的X方向中可以变位地支撑在所述载物台的上面或它上方的支撑部; 具有铅直方向的旋转中心线的旋转体、使该旋转体旋转的旋转驱动部、和与所述旋转体一体地旋转并利用所述旋转驱动部的旋转驱动力与所述基板的侧面接触在X方向按压所述基板的接触部,与所述旋转体的旋转角度相应在X方向移动所述接触部的位置的旋转型按压部;和将在X方向由所述旋转型按压部按压的所述基板挡住在相反侧的一定位置上的挡止部。 1. A substrate processing apparatus, the substrate processing apparatus processing a substrate to be processed placed on a stage embodiment of the predetermined substrate, wherein the substrate processing apparatus comprising: the substrate in a horizontal X the direction of displacement can be supported above the stage or a portion above the support; rotating body having a center line in the vertical direction, the rotational driving portion of the rotating body, the rotating body and rotates integrally with a contact portion and said rotational driving force of the rotational driving portion in contact with the side of the substrate the substrate is pressed in the X direction, moving the contact portion with the rotation angle of the rotating body in the X direction corresponding the pressing portion of the rotary position; and a stopper portion on the substrate will be blocked by the rotary pressing portion is pressed on the opposite side of the predetermined position in the X direction.
2. 根据权利要求1所述的基板处理装置,其特征在于:在将所述基板夹持在所述旋转型按压部的接触部和所述挡止部之间的状态中,所述旋转型按压部使所述接触部停止往动。 The substrate processing apparatus according to claim 1, wherein: the substrate in a state sandwiched between the contact portion and the stopper portion of the rotary pressing portion of a rotary type the portion contacting the pressing portion stops the forward movement.
3. 根据权利要求1或权利要求2所述的基板处理装置,其特征在于:所述旋转体具有用于在铅直方向引导所述基板,向上端直径逐渐变小的锥形部。 The substrate processing apparatus according to claim 1 or 2, characterized in that, wherein: said rotary member for guiding the substrate having in the vertical direction, a tapered portion is gradually reduced in diameter toward the upper end.
4. 根据权利要求i或权利要求2所述的基板处理装置,其特征在于:所述挡止部具有用于在铅直方向引导所述基板,向上端直径逐渐变小的锥形部。 According to claim i or the substrate processing apparatus according to claim 2, wherein: said stopper has a tapered portion for guiding the substrate in the vertical direction, tapers to a smaller diameter upper end.
5. 根据权利要求1或权利要求2所述的基板处理装置,其特征在于:所述旋转体具有圆形或圆弧的横截面轮廓形状,所述旋转体的中心轴从所述旋转中心线偏离。 The substrate processing apparatus according to claim 1 or 2, characterized in that, wherein: said rotary member has a circular or arcuate cross-sectional profile shape, the central axis of the rotary body from the center line of rotation deviation.
6. 根据权利要求5所述的基板处理装置,其特征在于:所述旋转体的外周面形成所述接触部。 6. The substrate processing apparatus according to claim 5, characterized in that: the outer circumferential surface of the rotating body forming the contact portion.
7. 根据权利要求5所述的基板处理装置,其特征在于:将可以对所述旋转体相对旋转的环状部件安装在所述旋转体上,所述环状部件的外周面形成所述接触部。 The substrate processing apparatus according to claim 5, wherein: the rotating body to be relatively rotatable annular member is mounted on the rotating member, the annular member in contact with the outer peripheral surface unit.
8. 根据权利要求1或权利要求2所述的基板处理装置,其特征在于:所述旋转体具有椭圆的横截面轮廓形状,所述旋转体的外周面形成所述接触部。 The rotary body having an elliptical cross-sectional contour shape, an outer circumferential surface of the rotating body forming the contact portion: 8. The substrate processing apparatus according to claim 1 or 2, characterized in that claim.
9. 根据权利要求1或权利要求2所述的基板处理装置,其特征在于:具有从所述旋转体在水平方向延伸的臂部,将所述接触部设置在所述臂部的前端。 Has an arm extending from the rotating member in a horizontal direction, said contact portion disposed at a front end of the arm portion: 9. The substrate processing apparatus as claimed in claim 1 or 2, characterized in that claim.
10. 根据权利要求1或2所述的基板处理装置,其特征在于:所述挡止部具有将中心轴作为旋转中心可以自旋转的圆柱或圆筒状的旋转体。 10. The substrate processing apparatus of claim 1 or claim 2, wherein: the stopper member having a center axis of rotation as the rotation center from the rotating cylinder or may be cylindrical.
11 .一种基板处理装置,该基板处理装置将被处理基板载置在载物台上对所述基板施加规定的处理,其特征在于,该基板处理装置包括:将所述基板在水平方向中可以变位地支撑在所述载物台的上面或它上方的支撑部;具有铅直方向的旋转中心的第一旋转体、使该第一旋转体旋转的第一旋转驱动部、和与所述第一旋转体一体地旋转并利用所述第一旋转驱动部的旋转驱动力与所述基板的侧面接触在水平的X方向按压所述基板的第一接触部,与所述第一旋转体的旋转角度相应在X方向移动所述第一接触部的位置的第一旋转型按压部;在X方向将由所述第一旋转型按压部按压的所述基板挡住在相反侧的一定位置上的第一挡止部;具有铅直方向的旋转中心的第二旋转体、使该第二旋转体旋转的第二旋转驱动部、和与所述第二旋转体一体地旋转并利用所述第二旋转 11. A substrate processing apparatus, the substrate processing apparatus processing a substrate to be processed placed on a stage is applied to said predetermined substrate, wherein the substrate processing apparatus comprising: the substrate in a horizontal direction displacement can be supported above the stage, or its upper support portion; a first rotary member having a rotation center in the vertical direction, the rotational driving of the first portion of the first rotating body rotates, and with the said first rotating body rotates integrally with the first contact portion and the rotational driving force of the rotation driving portion contacting the first side of the substrate and pressing the substrate in a horizontal X-direction of the first rotating body a first rotation angle of the rotary movement of the respective position of the pressing portion of the first contact portion in the direction X; in the X direction by the first rotary pressing portion presses the substrate block at a predetermined position opposite to the side on a first stopper portion; a second rotating body having a vertical direction of the center of the second rotating portion of the second rotating body, and with the second rotating body rotates integrally with the second and rotation 驱动部的旋转驱动力与所述基板的侧面接触在水平的Y方向按压所述基板的第二接触部,与所述第二旋转体的旋转角度相应在所述Y方向移动所述第二接触部的位置的第二旋转型按压部;和在Y方向将由所述第二旋转型按压部按压的所述基板挡住在相反侧的一定位置上的第二挡止部。 The second contact portion of the rotating force of the drive portion driving side of the substrate in contact with the pressing of the substrate in a horizontal Y-direction, the corresponding movement of the second contact with the rotation angle of the rotating body in the second direction Y a second rotary position of the pressing portion; and the substrate in the Y direction by the second pressing portion pressing the rotary block on the opposite side of the predetermined position on the second stop portion.
12. 根据权利要求ll所述的基板处理装置,其特征在于:所述基板形成四边形,所述第一和第二接触部分别与所述基板的相邻接的第一和第二边接触,将所述基板的与所述第一边对置的第三边按压到所述第一挡止部,将所述基板的与所述第二边对置的第四边按压到所述第二挡止部。 12. The substrate processing apparatus as claimed in claim ll, wherein: said substrate is formed of a quadrilateral, the first and second edge contacting the first and second contact portions contact adjacent said substrate, the substrate and the opposing second side of the third side is pressed to stop the first portion, the second substrate and the fourth side edge opposite to the second pressing stop portion.
13. 根据权利要求12所述的基板处理装置,其特征在于:以所述第一接触部与所述基板的第一边上的至少2个地方接触的方式,设置至少2个所述第一旋转型按压部。 13. The substrate processing apparatus according to claim 12, wherein: the first side so as to place at least two of the first contact portion in contact with the substrate, the first set of at least two rotating the pressing portion.
14. 根据权利要求12或权利要求13所述的基板处理装置,其特征在于:以所述第二接触部与所述基板的第二边上的至少2个地方接触的方式,设置至少2个所述第二旋转型按压部。 14. A substrate processing apparatus according to claim 13 or claim 12, wherein: at least two ways to place the second side of the second contact portion of the substrate in contact, at least 2 the second rotary pressing portion.
15. 根据权利要求11〜13中任何一项所述的基板处理装置,其特征在于-在将所述基板夹持在所述第一接触部和所述第一挡止部之间的状态中,所述第一旋转型按压部使所述第一接触部停止往动;在将所述基板夹持在所述第二接触部和所述第二挡止部之间的状态中,所述第二旋转型按压部使所述第二接触部停止往动。 15. 11~13 claims substrate processing apparatus according to any claim, characterized in that - in the state where the substrate is sandwiched between the first contact portion and said first portion of stopper said first rotary pressing portion stops the forward movement of the first contact portion; the substrate in a state sandwiched between the second contact portion and the second stop portion, said a second rotary pressing portion stops the forward movement of the second contact portion.
16. 根据权利要求15所述的基板处理装置,其特征在于:所述第一和第二旋转型按压部在相同的时刻停止用于按压所述基板的所述第一和第二接触部的往动。 16. The substrate processing apparatus according to claim 15, wherein: said first and second rotary pressing portion is stopped at the same time for pressing the substrate in contact with said first and second portions to move.
17. 根据权利要求11~13中任何一项所述的基板处理装置,其特征在于:通过由所述支撑部将所述基板支撑在比所述载物台的上面高的位置上,由所述第一和第二旋转型按压部和所述第一和第二挡止部决定所述基板的位置。 17. The substrate processing apparatus of any one of claims 11 to 13 claims, characterized in that: the supporting portion by the substrate support in the above higher than the stage position by the said first and second rotary pressing portion and the first portion and the second stop determines the position of the substrate.
18. 根据权利要求17所述的基板处理装置,其特征在于:所述支撑部具有可以升降的多个支撑销,所述支撑销的销前端部与所述基板的下面接触,水平地支撑所述基板。 18. The substrate processing apparatus according to claim 17, wherein: said support portion having a plurality of support pins may be raised and lowered, the support pin below the contact pin tip end portion of the substrate, are supported horizontally said substrate.
19. 根据权利要求18所述的基板处理装置,其特征在于:为了将所述基板载置在所述载物台的上面,使所述支撑销下降到比所述载物台的上面低的位置。 19. The substrate processing apparatus according to claim 18, wherein: for the substrate is mounted above the stage, so that the supporting pin down to lower than the top of the stage position.
20. 根据权利要求18所述的基板处理装置,其特征在于:具有使所述支撑部的支撑销、所述第一和第二旋转型按压部和所述第一和第二挡止部一起升降移动的升降部。 20. The substrate processing apparatus according to claim 18, wherein: the support having a support portion of the pin, with said first and second rotary pressing portion and the first and second stop portions lifting the lift unit to move.
21. 根据权利要求18所述的基板处理装置,其特征在于:由所述支撑部的支撑销将所述基板安置在比所述载物台的上面高的第一位置上,在从所述第一位置到所述载物台的上面下降所述基板的途中,由所述第一和第二旋转型按压部和所述第一和第二挡止部决定所述基板的位置。 21. The substrate processing apparatus according to claim 18, wherein: the support portion by the support pin will be positioned above the substrate at a higher position than the first stage on, from the to a first position above the stage of the way down to the substrate, the substrate is determined by the position of the first and second rotary pressing portion and the first and the second stop portion.
22. 根据权利要求11~13中任何一项所述的基板处理装置,其特征在于:具有用于由真空吸附力将所述基板固定在所述载物台的上面的固定部。 22. The substrate processing apparatus of any one of claims 11 to 13 claims, characterized in that: a vacuum suction force for the substrate is fixed to the upper surface of the stage of the fixing portion.
23. 根据权利要求22所述的基板处理装置,其特征在于:紧接在在从所述支撑部的支撑销将所述基板实质上移载在所述载物台的上面之后,所述固定部开始对所述基板的真空吸附,所述第一和第二旋转型按压部使所述第一和第二接触部回动,放开所述基板。 23. The substrate processing apparatus according to claim 22, wherein: immediately from the support pin in the support portion of the substrate substantially above the transfer stage after the carrier, the fixing start vacuum portion of the substrate, said first and second rotary pressing portion of said first and second contact portions return, the release substrate.
24. 根据权利要求11~13中任何一项所述的基板处理装置,其特征在于:将处理液涂敷在载置在所述载物台上的所述基板的上面。 24. The substrate processing apparatus of any one of claims 11 to 13 claims, characterized in that: in the above process liquid coating placed on the substrate on the stage of the.
25. 根据权利要求11~13中任何一项所述的基板处理装置,其特征在于:对载置在所述载物台上的所述基板施加规定的热处理。 25. The substrate processing apparatus of any one of claims 11 to 13 claims, characterized in that: a predetermined heat treatment is applied to the substrate placed on the stage of the.
26. —种基板定位装置,该基板定位装置在水平的X方向中对在水平方向可以变位地支撑着的被处理基板进行定位,其特征在于,该基板定位装置包括:具有沿铅直方向延伸的旋转轴、使该旋转轴旋转的旋转驱动部、 和与所述旋转轴一体地旋转并利用所述旋转驱动部的旋转驱动力与所述基板的侧面接触在x方向按压所述基板的接触部,与所述旋转轴的旋转角度相应在X方向移动所述接触部的位置的旋转型按压部;和在X方向将由所述旋转型按压部按压的所述基板挡住在相反侧的一定位置上的挡止部。 26. - kind of the substrate positioning means, the substrate positioning means in the horizontal direction X of the displacement in the horizontal direction can be supported by the substrate to be processed is positioned, characterized in that the substrate positioning apparatus comprising: a vertical direction the rotation shaft extends, the rotary driving portion of the rotary shaft, the rotary shaft and integrally rotating the rotational driving force of using the side surface of the substrate rotation driving portion of the contact pressing said substrate in the x direction a contact portion, the pressing portion corresponding movement of the rotary position of the contact portion in the X direction and the rotation angle of the rotary shaft; and the substrate in the X direction by the rotary pressing portion is pressed against the opposite side of the block must the position of the stopper portion.
CN 200510092900 2004-09-06 2005-08-23 Substrate processing apparatus and substrate positioning device CN100449408C (en)

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